CN109298316A - A kind of linear voltage regulator thermo-resistance measurement method - Google Patents
A kind of linear voltage regulator thermo-resistance measurement method Download PDFInfo
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- CN109298316A CN109298316A CN201811159628.0A CN201811159628A CN109298316A CN 109298316 A CN109298316 A CN 109298316A CN 201811159628 A CN201811159628 A CN 201811159628A CN 109298316 A CN109298316 A CN 109298316A
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- voltage regulator
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- temperature
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
Abstract
The invention discloses a kind of linear voltage regulator thermo-resistance measurement methods, build linear voltage regulator junction temperature of chip test structure, linear voltage regulator chip junction temperature is tested using bath oiling, then it builds linear voltage regulator knot and carries out linear voltage regulator knot to shell thermo-resistance measurement to shell thermo-resistance measurement structure, determine the power that shell temperature and device apply, be finally calculated linear voltage regulator knot to shell thermal resistance.Thermo-resistance measurement method of the present invention is easy to operate, simple for structure, easy to accomplish and at low cost, characterizes junction temperature of chip using diode forward pressure drop, measuring accuracy is higher.
Description
Technical field
The invention belongs to Analogous Integrated Electronic Circuits the field of test technology, and in particular to a kind of linear voltage regulator thermo-resistance measurement side
Method.
Background technique
Linear voltage regulator is the important component in current electronic system, at present forward direction high current, high power density, height
The directions such as efficiency are developed, and have the characteristics that low noise, using simple, high reliablity, are always the important set of field of power management
At part.Linear voltage regulator is a kind of high-power linear integrated circuit, the characteristics of due to circuit structure, itself dissipated power compared with
Greatly, chip temperature is higher in high-power use process, and the thermal resistance of knot to shell influences the power use scope of linear voltage regulator, therefore needs
The thermal resistance that its knot arrives shell is tested, foundation is provided for Design PCB plate grade radiator in its application process, reduces use process core
The junction temperature of piece improves reliability, the service life of linear voltage regulator.Therefore power-supply management system is designed using linear voltage regulator
When, designer pays special attention to the device junction to the thermal resistance of shell.
Currently, existing test resource does not have the power of test of linear voltage regulator thermal resistance, present invention is generally directed to linear
Voltage-stablizer knot proposes a kind of linear voltage regulator thermo-resistance measurement method to shell thermo-resistance measurement problem, and the proposition of this method will be promoted
High current, high power density linear voltage regulator technical field of power management application and development, for the series high-power circuit
The high-new electronic technology industry development of serving of change provides guaranteed reliability.
Summary of the invention
In view of the above-mentioned deficiencies in the prior art, the technical problem to be solved by the present invention is that providing a kind of linear voltage stabilization
Device thermo-resistance measurement method not only can guarantee that knot arrives shell thermo-resistance measurement, but also can accurately obtain of interest using existing test equipment
Test data, and by reasonably definition and measuring method, linear voltage regulator knot is obtained to this parameter of shell thermal resistance.
The invention adopts the following technical scheme:
A kind of linear voltage regulator thermo-resistance measurement method builds linear voltage regulator junction temperature of chip test structure, using bath oiling
Linear voltage regulator chip junction temperature is tested, linear voltage regulator knot is then built and is arrived to shell thermo-resistance measurement structure progress linear voltage regulator knot
Shell thermo-resistance measurement determines the power that shell temperature and device apply, be finally calculated linear voltage regulator knot to shell thermal resistance.
Optionally, diode being set in linear voltage regulator chip junction temperature test structure, diode negative end is connected to the ground,
Forward end is connected by pressure welding silk with circuit blank pipe foot or outer test points, and scanning diode is from 20~125 DEG C of forward conduction electricity
It buckles line, junction temperature of chip is characterized according to forward conduction voltage curve under diode condition of different temperatures.
Further, linear voltage regulator junction temperature of chip test structure include constant-current source, multimeter, oil cauldron, heating device and
Point thermometer, diode and point thermometer test probe are arranged in oil cauldron, are located under pasta, heating device is arranged in oil
Pot lower part；The anode of constant-current source and diode connects, and the cathode ground connection of diode, anode and the diode cathode of multimeter connects
It connects, cathode is connect with diode cathode；Point thermometer test probe is connect with point thermometer, the positive guide of multimeter measuring diode
Be powered pressure；Heating devices heat oil stops heating and natural cooling, in cooling procedure from 125~25 DEG C every 5 DEG C to 130 DEG C
The forward conduction voltage of measuring diode, obtains the curve of diode forward conducting voltage and temperature.
Further, it is 1~10mA that constant-current source, which is diode forward end application constant current,.
Optionally, linear voltage regulator knot to shell thermo-resistance measurement structure include power supply, electronic load, multimeter, cryogenic thermostat
Slot, point thermometer and test board, first High Precision Multimeter forward direction terminate VIN, negative end ground connection；Another high-precision universal
Table forward direction terminates VOUT, negative end ground connection；Point thermometer temperature sensing termination enclosure bottom；Linear voltage regulator is placed on low temperature perseverance
In warm slot；Electronic load meets VOUT；Capacitor C1One termination VIN, other end end ground connection；Capacitor C2One termination VIN, other end end
Ground connection；Capacitor CLOne termination VOUT, other end end ground connection.
It further, is capacitor element that linear voltage regulator applies response using test board, using lead by linear voltage stabilization
Device outer lead is connected with test board, and measured device is fitted into the heat sink groove of the low temperature thermostat bath of a thermometer；It is tested
Device VINTermination power, the end GND ground connection；Load capacitance CLOne termination measured device VOUTEnd, other end ground connection；Input capacitance C1
One termination measured device VINEnd, other end ground connection；Input capacitance C2One termination measured device VINEnd, other end ground connection.
Optionally, linear stabilized power supply thermo-resistance measurement specifically: according to the characteristic of diode forward conducting voltage and temperature
Curve increases electronic load current value, to increase the power of cryogenic thermostat groove, to circuit by increasing input supply voltage
After thermal balance, linear voltage regulator junction temperature reaches 125 DEG C in cryogenic thermostat groove, using multimeter measurement linear voltage regulator input electricity
Pressure, output voltage, the power that linear voltage regulator chip applies when calculating 125 DEG C of junction temperature record shell temperature, are calculated linear steady
Thermal resistance of the depressor knot to shell.
Further, thermal resistance R of the linear voltage regulator knot to shellJCIt calculates as follows:
P=(VIN-VOUT)×IL
Wherein, TJFor linear voltage regulator junction temperature of chip, TCFor linear voltage regulator shell temperature, P is the dissipation work of linear voltage regulator
Rate, VINFor linear voltage regulator input voltage, VOUTFor linear stabilizer output voltage, ILElectric current is exported for linear voltage regulator.
Compared with prior art, the present invention at least has the advantages that
A kind of linear voltage regulator thermo-resistance measurement method of the present invention is built linear voltage regulator junction temperature of chip test structure, is used
Bath oiling tests linear voltage regulator chip junction temperature, then builds linear voltage regulator knot to shell thermo-resistance measurement structure and carries out linear voltage stabilization
Device knot determines shell temperature and the power that device applies to shell thermo-resistance measurement, be finally calculated linear voltage regulator knot to shell thermal resistance,
Cooling test diode forward pressure drop precision is higher.
Further, it is approximately linear relationship that diode forward pressure drop, which varies with temperature, can accurate characterization junction temperature of chip.
Further, linear voltage regulator junction temperature of chip test structure is by constant-current source, High Precision Multimeter (microvolt grade), oil
Pot, heating device, thermometer composition.Using under certain current condition of diode, forward conduction voltage is negative temperature characteristic, is swept
Diode is retouched from 20~125 DEG C of forward conduction voltage curves, utilizes forward conduction voltage song under the diode condition of different temperatures
Line can characterize junction temperature of chip, and the test is simple for structure, easy to accomplish and at low cost.
Further, generally about tens square microns of the diode emitter region area in chip, under 1~10mA quiescent current
Functional reliability is good.
Further, linear voltage regulator knot is (micro- by power supply, electronic load, High Precision Multimeter to shell thermo-resistance measurement structure
Lie prostrate grade), low temperature thermostat bath, point thermometer, test board composition.Determining linear stabilized power supply output end load capacitance value CLCondition
Under, based on the test macro that this method is built, in the linear voltage regulator nominal range of use, passes through and increase input supply voltage, increase
It is powered on sub- load current value, to increase the power of the device, after circuit thermal balance, junction temperature of chip reaches 125 DEG C in device, adopts
Linear voltage regulator input voltage, output voltage are measured with High Precision Multimeter,
Further, P=(V is utilizedIN-VOUT)×ILThe power that chip applies when calculating 125 DEG C of junction temperature, point of observation temperature
Evaluation records shell temperature；It utilizesThermal resistance of the calculating linear voltage regulator knot to shell；The test method extracts ginseng
Number mode is simple, intuitive, low to the integrity demands of test equipment precision and signal link, it is easy to accomplish.
In conclusion thermo-resistance measurement method of the present invention is easy to operate, and it is simple for structure, it is easy to accomplish and at low cost, using two
Pole pipe forward voltage drop characterizes junction temperature of chip, and measuring accuracy is higher.
Below by drawings and examples, technical scheme of the present invention will be described in further detail.
Detailed description of the invention
Fig. 1 is the integrated linear voltage regulator schematic diagram with separate diode；
Fig. 2 is linear voltage regulator junction temperature test schematic；
Fig. 3 is linear voltage regulator thermo-resistance measurement schematic diagram；
Fig. 4 is the characteristic curve of diode forward conducting voltage and temperature in LW5176-1.5 chip.
Specific embodiment
Thermal resistance is to characterize the parameter of device heat-sinking capability, be temperature difference under thermal equilibrium condition on device heat passage with
The ratio between the dissipated power of temperature difference, i.e. resistance on heat conduction path are generated, indicates the power for often distributing 1W in heat transfer process
Heat, the temperature difference that the both ends Re Lu need.It is defined according to knot to shell thermal resistance, needing measurement parameter includes junction temperature, case temperature
And dissipated power.Wherein case temperature can be measured directly, and dissipated power can be calculated by applying voltage with electric current.
Referring to Fig. 1, a kind of linear voltage regulator thermo-resistance measurement method of the present invention, comprising the following steps:
S1, bath oiling test linear voltage regulator chip junction temperature
Linear voltage regulator junction temperature of chip is tested structure and is filled by constant-current source, High Precision Multimeter (microvolt grade), oil cauldron, heating
It sets, thermometer composition, as shown in Fig. 2, diode and point thermometer test probe are arranged in oil cauldron, is located under pasta,
Heating device is arranged in oil cauldron lower part；The anode of constant-current source and diode connects, the cathode ground connection of diode, High Precision Multimeter
Anode connect with diode cathode, cathode is connect with diode cathode；Point thermometer test probe is connect with point thermometer.
Using under certain current condition of diode, forward conduction voltage is negative temperature characteristic, scanning diode from 20~
125 DEG C of forward conduction voltage curves can characterize chip using forward conduction voltage curve under the diode condition of different temperatures
Junction temperature.
When designing the design of linear voltage regulator chip, chip interior designs an independent diode, negative end and ground phase
Even, forward end is connected by pressure welding silk and circuit blank pipe foot (or other outsides can test point) A point；
Using constant-current source be the port linear voltage regulator A diode forward end apply constant current 1mA~10mA (with specific reference to
The size and operational characteristic of diode area apply constant circuit), negative end ground connection measures two poles using High Precision Multimeter
Pipe forward conduction voltage；Circuit is put into oil cauldron, using heating devices heat oil to 130 DEG C, stops heating, makes oil cauldron natural
It is cooling, in cooling procedure from the forward conduction voltage of 125~25 DEG C of every 5 DEG C of measuring diodes, show that diode forward is connected
The curve of voltage and temperature.
S2, linear voltage regulator knot to shell thermo-resistance measurement
Linear voltage regulator knot is to shell thermo-resistance measurement structure by power supply, electronic load, High Precision Multimeter (microvolt grade), low temperature
Thermostat, point thermometer, test board composition, as shown in figure 3, a High Precision Multimeter forward direction terminates VIN, negative end ground connection；Separately
One High Precision Multimeter forward direction terminates VOUT, negative end ground connection；Point thermometer temperature sensing termination enclosure bottom (most thermal potential
It sets)；Linear voltage regulator is placed in low temperature thermostat bath；Electronic load meets VOUT；C1Capacitor one terminates VIN, other end end ground connection；C2
Capacitor one terminates VIN, other end end ground connection；CLCapacitor one terminates VL, other end end ground connection.
It is the capacitor that linear voltage regulator applies response using test board to consider linear voltage regulator loop stability
Linear voltage regulator outer lead is connected, so that linear voltage regulator can be packed into a thermometer by part using lead with test board
In the heat sink groove of low temperature thermostat bath, which ensures that thermal resistance is very small between device outer case and environment；Tested device
Part VINTermination power, the end GND ground connection；Load capacitance CLOne termination measured device VOUTEnd, the other end are grounded (GND)；Input capacitance
C1One termination measured device VINEnd, the other end are grounded (GND)；Input capacitance C2One termination measured device VINEnd, other end ground connection
(GND)；
Based on the test macro that this method is built, in the linear voltage regulator nominal range of use, above-mentioned diode forward is compareed
The characteristic curve of conducting voltage and temperature increases electronic load current value, by increasing input supply voltage to increase the device
Power, after circuit thermal balance, junction temperature of chip reaches 125 DEG C in device, using High Precision Multimeter measure linear voltage regulator
Input voltage, output voltage utilize P=(VIN-VOUT)×ILThe power that chip applies when calculating 125 DEG C of junction temperature, point of observation temperature
Evaluation records shell temperature；It utilizesThermal resistance of the calculating linear voltage regulator knot to shell.
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.The present invention being described and shown in usually here in attached drawing is real
The component for applying example can be arranged and be designed by a variety of different configurations.Therefore, below to the present invention provided in the accompanying drawings
The detailed description of embodiment be not intended to limit the range of claimed invention, but be merely representative of of the invention selected
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are obtained without creative efforts
The every other embodiment obtained, shall fall within the protection scope of the present invention.
Carry out linear voltage regulator knot to shell thermo-resistance measurement based on above-mentioned test method
Wherein, linear voltage regulator model 771 to be measured LW5176-1.5 produced, the circuit are that a band makes can control
7.5A low pressure difference linearity regulated power supply, encapsulated using five line TD type of metal, output voltage 1.5V, output current capacity is maximum
For 7.5A, circuit diagram is as shown in Figure 1.
Three tunnels of start-up circuit point, first port meet EN, and second interface meets VIN, third interfacing ground, the 4th interface connects a point；
Work as VIN, EN is when being greater than 2.4V, start-up circuit works normally, then reference circuit work normally and entire linear stabilized power supply system just
Often work；
Junction temperature detects diode forward and terminates A point, negative end ground connection；The anode of error amplifier meets b, the end out and Qn4's
Base stage connection, cathode divides two-way, connects the emitter of Qn4 all the way, and another way is grounded through R3, the end V- ground connection, the collector of Qn4 with
The base stage of Qlp1 connects, and Qlp1 collector divides two-way, all the way with VOUTEnd connection, another way are grounded after R1 and R2, the hair of Qn4
It penetrates collection and divides two-way, be grounded all the way through R3, the base stage connection of another way and Qn3, the transmitting collection ground connection of Qn3, the base of collector and Qn4
Pole connection；The second end of overheating protection is grounded, and the base stage of third end c and Qn1 connect, the transmitting collection ground connection of Qn1, collector and mistake
The end out of poor amplifier connects；The anode of transition diode divides two-way, is grounded all the way through R4, and the base stage of another way and Qn2 connect
It connects, the transmitting collection ground connection of Qn2, the base stage of collector and Qn4 connect.
Linear voltage regulator chip A point and ground terminal diode forward conducting voltage characteristic, constant current are tested first with bath oiling
The characteristic curve of ource electric current setting 1mA, the diode forward conducting voltage and temperature is as shown in Figure 4；
By the V of LW5176-1.5INPort and the port GND are respectively connected to 2.5V power supply and ground, set output end load capacitance
Value CL=47 μ F, input capacitance C1=0.1 μ F, input capacitance C1=10 μ F；
The characteristic curve for compareing the diode forward conducting voltage and temperature that integrate in LW5176-1.5 chip, passes through increase
Input supply voltage increases electronic load current value, increases the power of LW5176-1.5 circuit, after circuit thermal balance, the device
Junction temperature of chip reaches 125 DEG C in part, measures linear voltage regulator input voltage, output voltage using High Precision Multimeter, utilizes
P=(VIN-VOUT)×IL
The power that chip applies when calculating 125 DEG C of junction temperature, point of observation temperature evaluation record shell temperature；It utilizes
Calculate linear voltage regulator knot to shell thermal resistance, shown in test data table 1.
Table 1 is LW5176-1.5 thermo-resistance measurement tables of data
The thermo-resistance measurement is simple for structure, easy to accomplish and at low cost, characterizes junction temperature of chip using diode forward pressure drop, surveys
It is higher to try precision.
The above content is merely illustrative of the invention's technical idea, and this does not limit the scope of protection of the present invention, all to press
According to technical idea proposed by the present invention, any changes made on the basis of the technical scheme each falls within claims of the present invention
Protection scope within.
Claims (8)
1. a kind of linear voltage regulator thermo-resistance measurement method, which is characterized in that build linear voltage regulator junction temperature of chip test structure, adopt
Linear voltage regulator chip junction temperature is tested with bath oiling, it is linear steady to the progress of shell thermo-resistance measurement structure then to build linear voltage regulator knot
Depressor knot determines shell temperature and the power that device applies to shell thermo-resistance measurement, be finally calculated linear voltage regulator knot to shell heat
Resistance.
2. linear voltage regulator thermo-resistance measurement method according to claim 1, which is characterized in that in linear voltage regulator chip knot
Diode is set in temperature test structure, diode negative end is connected to the ground, and forward end is by pressure welding silk and circuit blank pipe foot or outside
Portion's test point is connected, scanning diode from 20~125 DEG C of forward conduction voltage curves, according under diode condition of different temperatures just
To electric conduction buckle line characterization junction temperature of chip.
3. linear voltage regulator thermo-resistance measurement method according to claim 2, which is characterized in that linear voltage regulator junction temperature of chip
Test structure includes constant-current source, multimeter, oil cauldron, heating device and point thermometer, and diode and point thermometer test probe are equal
It is arranged in oil cauldron, is located under pasta, heating device is arranged in oil cauldron lower part；The anode of constant-current source and diode connects, and two
The cathode of pole pipe is grounded, and the anode of multimeter is connect with diode cathode, and cathode is connect with diode cathode；Point thermometer test
Probe is connect with point thermometer, multimeter measuring diode forward conduction voltage；Heating devices heat oil stops adding to 130 DEG C
Hot and natural cooling obtains diode in cooling procedure from the forward conduction voltage of 125~25 DEG C of every 5 DEG C of measuring diodes
The curve of forward conduction voltage and temperature.
4. linear voltage regulator thermo-resistance measurement method according to claim 3, which is characterized in that constant-current source is diode forward
It is 1~10mA that end, which applies constant current,.
5. linear voltage regulator thermo-resistance measurement method according to claim 1, which is characterized in that linear voltage regulator knot to shell heat
Resistance test structure includes power supply, electronic load, multimeter, low temperature thermostat bath, point thermometer and test board, first high-precision ten thousand
V is terminated with table forward directionIN, negative end ground connection；Another High Precision Multimeter forward direction terminates VOUT, negative end ground connection；Point thermometer temperature
Degree detection termination outer casing bottom；Linear voltage regulator is placed in low temperature thermostat bath；Electronic load meets VOUT；Capacitor C1A termination
VIN, other end end ground connection；Capacitor C2One termination VIN, other end end ground connection；Capacitor CLOne termination VOUT, other end end ground connection.
6. linear voltage regulator thermo-resistance measurement method according to claim 5, which is characterized in that it is linear steady for utilizing test board
Depressor applies the capacitor element of response, and linear voltage regulator outer lead is connected with test board using lead, measured device is packed into
Have in the heat sink groove of the low temperature thermostat bath of a thermometer；Measured device VINTermination power, the end GND ground connection；Load capacitance CL
One termination measured device VOUTEnd, other end ground connection；Input capacitance C1One termination measured device VINEnd, other end ground connection；Input electricity
Hold C2One termination measured device VINEnd, other end ground connection.
7. linear voltage regulator thermo-resistance measurement method according to claim 1, which is characterized in that linear stabilized power supply thermal resistance is surveyed
Examination specifically: electronics is increased by increasing input supply voltage according to the characteristic curve of diode forward conducting voltage and temperature
Load current value, to increase the power of cryogenic thermostat groove, after circuit thermal balance, linear voltage regulator knot in cryogenic thermostat groove
Temperature reaches 125 DEG C, measures linear voltage regulator input voltage, output voltage using multimeter, calculates linearly steady at 125 DEG C of junction temperature
Depressor chip apply power, record shell temperature, be calculated linear voltage regulator knot to shell thermal resistance.
8. linear voltage regulator thermo-resistance measurement method according to claim 7, which is characterized in that linear voltage regulator knot to shell
Thermal resistance RJCIt calculates as follows:
P=(VIN-VOUT)×IL
Wherein, TJFor linear voltage regulator junction temperature of chip, TCFor linear voltage regulator shell temperature, P is the dissipated power of linear voltage regulator, VIN
For linear voltage regulator input voltage, VOUTFor linear stabilizer output voltage, ILElectric current is exported for linear voltage regulator.
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| CN201811159628.0A CN109298316B (en) | 2018-09-30 | 2018-09-30 | Thermal resistance testing method for linear voltage stabilizer |
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Cited By (1)
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| CN113760033A (en) * | 2021-09-08 | 2021-12-07 | 中国电子科技集团公司第二十四研究所 | Packaging structure of voltage reference chip and output voltage temperature compensation method |
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| CN113760033A (en) * | 2021-09-08 | 2021-12-07 | 中国电子科技集团公司第二十四研究所 | Packaging structure of voltage reference chip and output voltage temperature compensation method |
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| CN109298316B (en) | 2020-10-09 |
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