CN109287077B - Electronic component inserting method and device - Google Patents
Electronic component inserting method and device Download PDFInfo
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- CN109287077B CN109287077B CN201811209693.XA CN201811209693A CN109287077B CN 109287077 B CN109287077 B CN 109287077B CN 201811209693 A CN201811209693 A CN 201811209693A CN 109287077 B CN109287077 B CN 109287077B
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- 238000000034 method Methods 0.000 title claims abstract description 57
- 238000003780 insertion Methods 0.000 claims abstract description 26
- 230000037431 insertion Effects 0.000 claims abstract description 26
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- 238000012545 processing Methods 0.000 claims description 26
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/168—Wrong mounting prevention
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Image Analysis (AREA)
Abstract
The invention relates to the field of electronic component inserting, in particular to an electronic component inserting method and device, which are characterized in that through extracting characteristic parameters of an image of an electronic component and an image of a circuit board, self-adaptive matching is carried out according to the characteristic parameters, and correction of positions and postures is carried out on clamping devices aiming at different placing angles and placing positions of the electronic component or the circuit board, the clamping devices can accurately clamp the electronic component and accurately insert the electronic component onto the circuit board, and the automatic inserting efficiency is improved. The control device can control the pressure device to apply pressure to the electronic component, and the electronic component which needs to be additionally applied with pressure for insertion is subjected to insertion, so that the insertion is more stable. The universality and the adaptability of the clamping device and the pressure device for different component inserting processes are greatly improved by various control combination modes.
Description
Technical Field
The present invention relates to the field of electronic component mounting, and in particular, to a method and an apparatus for mounting an electronic component.
Background
With the progress of technology and the high-speed development of the electronic industry, the application field and market demand of circuit boards as important carriers of electronic components are increasing year by year. The automated electronic component inserting technology is an important means for improving the yield of various circuit board pieces and reducing the production cost, and the prior art inserting technology generally adopts an industrial robot with three rotary joints and one movable joint to move the clamping device, and after clamping the electronic component, the electronic component is inserted onto the circuit board by downward movement of the joints of the industrial robot. Because the electronic component and the circuit board have the characteristics of irregular appearance shape, difficult visual identification and the like, the prior art still has certain defects, and mainly shows that:
1) Most of electronic component screening relies on priori knowledge, component parameters are required to be set manually in advance, and components with different sizes are matched with circuit board holes and the screening process does not have self-adaptive matching capability;
2) The clamping device cannot accurately clamp the electronic element and cannot be accurately inserted into the circuit board;
3) The electronic component requiring additional pressure insertion is not sufficiently firmly inserted.
Disclosure of Invention
Aiming at the technical problems existing in the prior art, one of the purposes of the invention is as follows: an electronic component mounting method is provided, which can adaptively match an electronic component with a circuit board, and accurately clamp the electronic component and mount the electronic component onto the circuit board.
Aiming at the technical problems in the prior art, the second purpose of the invention is as follows: an electronic component mounting apparatus is provided which can adaptively match an electronic component with a circuit board, and which can accurately pick up the electronic component and mount the electronic component onto the circuit board.
In order to achieve the above purpose, the invention adopts the following technical scheme:
an electronic component mounting method comprises the following steps,
s1, calibrating an image acquisition device;
s2, setting an initial template of the electronic element and the circuit board and calculating initial deviation;
S3, image acquisition is carried out on the electronic element; image acquisition is carried out on the circuit board;
s4, carrying out image preprocessing on the electronic element image acquired in the S3 in a mode of mean value filtering, threshold segmentation and convex hull processing, and extracting central coordinates and angular direction characteristic parameters; firstly, threshold segmentation is carried out on the circuit board image acquired in the step S3, then a circuit board hole to be inserted is selected based on the area and roundness characteristics, connected domain processing is carried out, sub-pixel edge extraction is carried out on the obtained circuit board hole area to be inserted, finally, fitting is carried out on edge points by adopting a fitting method based on outlier elimination, and the central position coordinate and angle direction characteristic parameters of the to-be-inserted hole are obtained;
s5, carrying out self-adaptive matching on the image features of the electronic element extracted in the step S4 and the image features of the circuit board, if the matching is successful, turning to the step S6, and if the matching is unsuccessful, discarding the current electronic element, and turning to the step S3;
the matching process comprises the following steps:
extracting the center connecting line distance of the point to be inserted of the electronic element in S4, extracting the center distance of the hole of the circuit board in S4, and recognizing that the two can realize effective insertion when the two meet tolerance matching conditions;
s6, adjusting the position and the posture of the clamping device, wherein the steps are as follows:
Acquiring position and posture estimation values of the electronic element according to the electronic element image characteristic parameters extracted in the step S4, and making a difference with an image template value of an electronic element image acquisition point in the step S2, acquiring a first translation component and a first rotation component, and transmitting the first translation component and the first rotation component to a joint controller through kinematic inverse solution so as to control rotation and movement of a joint and realize position and posture correction of the clamping device;
s7, clamping the electronic element by the clamping device;
s8, adjusting the position and the posture of the clamping device, wherein the steps are as follows:
according to the characteristic parameters of the circuit board image extracted in the step S4, acquiring the position and posture estimated values of the circuit board, and making a difference with the image template values of the circuit board image acquisition points in the step S2, acquiring a second translational component and a second rotational component, and transmitting the second translational component and the second rotational component to a joint controller through kinematic inverse solution so as to control the rotation and the movement of the joint and realize the position and posture correction of the clamping device;
s9, inserting the electronic element into the circuit board by the clamping device;
after completing an electronic component package, continuing to circulate the steps S3 to S9 to form a package assembly line.
Preferably, the calibration is performed as follows,
1) The image acquisition point of the electronic element is acquired at the height z cc The method comprises the steps of recording image coordinates of each point of an image with n non-collinear characteristic points on a plane, and obtaining world coordinates of the n characteristic points under a basic coordinate system by a demonstrator, wherein n is an integer greater than or equal to 3, and z is cc The height manually set during teaching of the electronic component is acquired at the image acquisition point of the circuit board at the height z cp An image with n non-collinear characteristic points on a plane, recording the coordinates of each point image, and acquiring the world coordinates of the n characteristic points under a basic coordinate system by a demonstrator, wherein n is an integer greater than or equal to 3, and z is cp The base coordinate system is a world coordinate system established at the origin of the robot base, and is the height manually set during teaching of inserting the electronic component;
2) Substituting the image coordinates and world coordinates corresponding to the characteristic points on the electronic element into a two-dimensional affine model transformation formula respectively, obtaining a transformation matrix H of the image acquisition points of the electronic element by a least square method,
the two-dimensional affine model transformation formula of the electronic component is as follows:
wherein, (x) wi ，y wi ) Is the world coordinates of the characteristic points of the electronic element in the basic coordinate system, (u) ci ，v ci ) I=1, 2,..n, for coordinates of the feature points of the electronic component in the image coordinate system;
substituting the image coordinates and world coordinates corresponding to the feature points on the circuit board into a two-dimensional affine model transformation formula respectively, obtaining a transformation matrix K of the circuit board image acquisition points through a least square method,
the two-dimensional affine model transformation formula of the circuit board is as follows:
Wherein, (X wi ，Y wi ) Is the world coordinates of the characteristic points of the circuit board in the basic coordinate system, (U) ci ，V ci ) Is the coordinates of the circuit board feature points in the image coordinate system, i=1, 2,..n.
Preferably, the initial template is set and the initial deviation is calculated, as follows,
an initial electronic element image is collected, image preprocessing is carried out by adopting mean value filtering, threshold value segmentation and convex hull processing, and characteristic parameters of the central coordinates and the angle direction are extracted to obtain image coordinates (u) of two characteristic points P1 and P2 on the electronic element 1 ,v 1 )，(u 2 ,v 2 ) Center of the coreThe dot image coordinates are:
converting the image coordinates into a world coordinate system:
move the gripping device to (x) c ,y c ) The coordinates of the current clamping device are recorded as (x) c ,y c ,z c ,θ c )，z c In order to set safety height during correction teaching,
the center of the manual teaching mobile clamping device coincides with the geometric center of the electronic element, and the relative movement distance and the angle deviation are recorded as (x) offset ,y offset ,0,θ offset )，
Wherein (x) c0 ,y c0 ) And theta c0 The position and the rotation angle of a clamping device set during the clamping teaching of the electronic element are set;
acquiring an initial circuit board image, firstly performing threshold segmentation, then selecting a circuit board hole to be inserted based on area and roundness characteristics, performing connected domain processing, extracting sub-pixel edges of the obtained circuit board hole area to be inserted, finally fitting edge points by adopting a fitting method based on outlier elimination, obtaining central position coordinates and angle direction characteristic parameters of the hole to be inserted, extracting central position coordinates and angle direction characteristic parameters of the hole to be inserted, and obtaining image coordinates (U) of two characteristic points K1 and K2 on an electronic element 1 ,V 1 )、(U 2 ,V 2 ) The coordinates of the central point image are:
converting the image coordinates into a world coordinate system:
move the gripping device to (X) c ，Y c ) The coordinates of the current clamping device are recorded as (X) c ，Y c ，Z c ，ɑ c )，Z c In order to set safety height during correction teaching,
the center of the manual teaching mobile clamping device coincides with the geometric center of the circuit board, and the relative movement distance and the angle deviation are recorded as (X) offset ，Y offset ，0，ɑ offset )，
Wherein (X) c0 ，Y c0 ) Sum alpha c0 The clamping device is set for the circuit board insertion teaching and the position and the rotation angle of the clamping device. Preferably, the fitting process eliminates outliers generation by generation in a manner that,
constructing a least square error formula:
wherein: (x) c ，y c ) The circle center coordinate estimated for the current generation is R is the radius;
will epsilon i Conversion to parameters beta to be estimated i Linear form of (c):
wherein: beta 1 ＝-2x c ，β 2 ＝-2y c ，
A new error formula is constructed by adopting a robust estimation method:
the weight factor of the ith point to be fitted is taken as follows:
wherein, let ρ (ε) vs. β j The offset is equal to zero:
taking the weight factor omega of all sampling points i =1, and performing multiple iterative solutions to obtain the current optimal parameter β j Thereby obtaining more accurate center coordinates and radius of the round hole, and the iteration times are 2-5 times.
Preferably, the matching condition is:
The distance between the center connecting lines of the points to be inserted of the electronic element is within an acceptable error range, and the error range is e c ∈[-δ c ,δ c ]；
Wherein e c ＝L c -l c Is the deviation delta between the detection value and the standard value of the center connecting line distance of the point to be inserted of the electronic element c E is c Acceptable error float values; l (L) c For the center connecting line distance L of the point to be inserted of the electronic element detected by the image detection device c Is an electronStandard distance of element to be inserted into point center line;
the difference between the center connecting line distance of the circuit board hole and the standard connecting line distance is within an acceptable error range, and the error range is e h ∈[-δ h ,δ h ]；
Wherein e h ＝L h -l h Is the deviation delta between the detection value and the standard value of the center distance of the hole of the circuit board h E is h Acceptable error float values; l (L) h For the center distance L of the circuit board hole detected by the image detection device h The standard distance is the center of the hole of the circuit board;
the difference between the center wiring distance of the point to be inserted into the electronic element and the center wiring distance of the hole of the circuit board is within an acceptable error range, and the error range is e ch ∈[-δ ch ,δ ch ]；
Wherein e ch ＝l c -l h Is the deviation delta between the detection value of the center connecting line distance of the point to be inserted of the electronic element and the detection value of the center distance of the hole of the circuit board ch E is ch Acceptable error float values;
Wherein delta c 、δ h And delta ch The value ranges of the (a) are as follows: 0 to 0.2mm;
the standard distance between the centers of the holes of the circuit board and the standard distance between the center wires of the points where the electronic components are to be inserted are provided by the manufacturer.
Preferably, the first translational component is obtained as follows:
the first rotation component is acquired as follows:
C＝θ+θ offset ；
wherein, (u) 1 ,v 1 )，(u 2 ,v 2 ) The coordinates of two feature points P1 and P2 on the template image of the electronic component are respectively (u' 1 ,v′ 1 )，(u′ 2 ,v′ 2 ) Respectively image coordinates (x) of feature points P1 'and P2' corresponding to the electronic component template image on the acquired electronic component image offset ,y offset ) For the initial offset between the characteristic center of the electronic component template and the center of the clamping device, theta is the angle deviation between the characteristic direction of the current electronic component and the characteristic direction of the electronic component template offset Is the initial angular offset of the electronic component template image.
The second translational component is obtained as follows:
preferably, the second rotation component is acquired as follows:
D＝α+α offset ；
wherein, (U) 1 ,V 1 )、(U 2 ,V 2 ) The coordinates of two feature points K1 and K2 on the template image of the circuit board are respectively, (U) 1 ’,V 1 ’)、(U 2 ’,V 2 ' is the image coordinates of the feature points K1' and K2' corresponding to the circuit board template image on the acquired circuit board image, (X) offset ,Y offset ) Is characterized by the center of the circuit board template and the center of the clamping device An initial offset, alpha is the angle deviation between the current characteristic direction and the template characteristic direction, alpha offset Is the initial angular offset of the template image.
The utility model provides an electronic component cartridge device, including image acquisition device, image processing device, industrial robot, controlling means, press from both sides and get device and pressure device, image processing device and image acquisition device signal connection for handle the image of electronic component and circuit board that image acquisition device gathered, controlling means control industrial robot, press from both sides and get device and pressure device action, industrial robot can change under controlling means's control and press from both sides the position and the angle of getting the device, press from both sides and get the device and be used for pressing from both sides and get or place electronic component, pressure device can apply pressure on the electronic component that the device was placed to the clamp. The image processing device can extract characteristic parameters of the images of the electronic element and the circuit board acquired by the image acquisition device, the electronic element and the circuit board can be adaptively matched according to the characteristic parameters, the parameters of the electronic element and the circuit board are not required to be set in advance manually, and the automatic inserting efficiency of the electronic element is greatly improved. Aiming at different placing angles and placing positions of electronic elements or circuit boards, the industrial robot corrects the position and the gesture by the clamping device, the clamping device can accurately clamp the electronic elements and accurately insert the electronic elements onto the circuit boards, and the automatic inserting efficiency is improved. The control device can control the pressure device to apply pressure to the electronic element, so that the electronic element which needs to be additionally applied with pressure for insertion can be subjected to insertion, the insertion is more stable, and the inserted circuit board is more reliable.
Preferably, the industrial robot is an industrial four-degree-of-freedom robot with three rotary joints and one movable joint, the industrial robot comprises a base, a first rotary arm, a second rotary arm and a screw rod, one end of the first rotary arm is hinged to the base, the other end of the first rotary arm is hinged to one end of the second rotary arm, the other end of the second rotary arm is rotationally connected with the screw rod, the lower end of the screw rod is connected with a clamping device and a pressure device, the industrial robot adjusts the positions of the clamping device and the pressure device on a horizontal plane by rotating the first rotary arm and the second rotary arm, the screw rod moves up and down to adjust the distance between the clamping device and the pressure device and an electronic element or a circuit board, and the angle of the clamping device and the pressure device is adjusted by rotating the screw rod around a self shaft. Through the setting of first swinging boom, second swinging boom and lead screw, can be according to electronic component and the different position and the angle of putting of circuit board, adjust in a flexible way and press from both sides and get device and pressure device position and angle, consequently can accurately press from both sides and get electronic component and accurately cartridge to the circuit board.
Preferably, the pressure device comprises a first pressure device, a second pressure device, a third pressure device and a fourth pressure device which are arranged in a rectangular array, and the clamping device is positioned at the center of the rectangular array. After the structure is adopted, the first pressure device, the second pressure device, the third pressure device and the fourth pressure device can apply pressure to the electronic element positioned in the center of the first pressure device, the second pressure device, the third pressure device and the fourth pressure device, so that the plugging scheme is richer and the plugging is more reliable.
The control device comprises an air source, a first electromagnetic directional valve, a second electromagnetic directional valve and a third electromagnetic directional valve, the clamping device is communicated with the air source through the first electromagnetic directional valve, the second electromagnetic directional valve simultaneously controls two pressure devices positioned on the diagonal line of the rectangular array, and the third electromagnetic directional valve simultaneously controls two pressure devices positioned on the other diagonal line of the rectangular array. The first pressure device, the second pressure device, the third pressure device and the fourth pressure device can apply pressure to the electronic elements respectively or in combination by controlling different pressure devices to act respectively or in combination through the electromagnetic directional valves so as to meet the inserting requirements of the electronic elements of different types. The universality and the adaptability of the clamping device and the pressure device for different component inserting processes are greatly improved by various control combination modes.
In general, the invention has the following advantages:
the method comprises the steps of extracting characteristic parameters of an image of an electronic element in a mode of mean value filtering, threshold segmentation and convex hull processing, threshold segmentation of the image of a circuit board, selection of a hole to be inserted into the circuit board based on area and roundness characteristics, connected domain processing, sub-pixel edge extraction of an obtained hole area to be inserted into the circuit board, and characteristic parameter extraction by adopting a fitting method, so that the extracted characteristic parameters are more accurate. The electronic component and the circuit board parameters can be adaptively matched according to the characteristic parameters through the algorithm, manual setting of the electronic component and the circuit board parameters is not needed, priori knowledge is not needed to be relied on in screening of the electronic component, and the electronic component or the circuit board is placed at different angles and positions. The control device can control the pressure device to apply pressure to the electronic component, and the electronic component which needs to be additionally applied with pressure for insertion is subjected to insertion, so that the insertion is more stable. The universality and the adaptability of the clamping device and the pressure device for different component inserting processes are greatly improved by various control combination modes.
Drawings
Fig. 1 is a flowchart illustrating steps of an electronic component mounting method according to the present invention.
Fig. 2 is a schematic diagram of a method and apparatus for correcting the posture of a clamping device according to the posture of an electronic component according to the present invention.
Fig. 3 is a schematic diagram of a method and apparatus for correcting the posture of a clamping device according to the posture of a circuit board according to the present invention.
Fig. 4 is a schematic diagram of a method and an apparatus for plugging an electronic component according to the principle of correcting the posture of a clamping device according to the posture of the electronic component.
Fig. 5 is a schematic diagram of a method and an apparatus for plugging electronic components according to the present invention, wherein the method and the apparatus are used for correcting the posture of a clamping device according to the posture of a circuit board.
Fig. 6 is a schematic structural diagram of a press device of an electronic component mounting method and apparatus according to the present invention.
Fig. 7 is a schematic diagram of an electronic component mounting method and apparatus according to the present invention in use.
Fig. 8 is a schematic view of another view angle of the electronic component mounting method and apparatus according to the present invention in use.
Fig. 9 is a schematic diagram of a control principle of a pressure device of the electronic component mounting method and apparatus of the present invention.
Fig. 6 to 9 include:
11-a base, 12-a first rotating arm, 13-a second rotating arm and 14-a screw rod;
21-clamping opening;
31-first pressure device, 32-second pressure device, 33-third pressure device, 34-fourth pressure device;
41-first electromagnetic directional valve, 42-second electromagnetic directional valve, 43-third electromagnetic directional valve, 44-air source, 45-speed control valve, 46-filtering pressure reducing valve;
51-first work table, 52-second work table.
Detailed Description
The present invention will be described in further detail below.
As shown in fig. 1 to 5, an electronic component mounting method includes the steps of,
s1, calibrating an image acquisition device;
s2, setting an initial template of the electronic element and the circuit board and calculating initial deviation;
s3, image acquisition is carried out on the electronic element; image acquisition is carried out on the circuit board;
s4, carrying out image preprocessing on the electronic element image acquired in the S3 in a mode of mean value filtering, threshold segmentation and convex hull processing, and extracting central coordinates and angular direction characteristic parameters; firstly, threshold segmentation is carried out on the circuit board image acquired in the step S3, then a circuit board hole to be inserted is selected based on the area and roundness characteristics, connected domain processing is carried out, sub-pixel edge extraction is carried out on the obtained circuit board hole area to be inserted, finally, fitting is carried out on edge points by adopting a fitting method based on outlier elimination, and the central position coordinate and angle direction characteristic parameters of the to-be-inserted hole are obtained;
S5, carrying out self-adaptive matching on the image features of the electronic element extracted in the step S4 and the image features of the circuit board, if the matching is successful, turning to the step S6, and if the matching is unsuccessful, discarding the current electronic element, and turning to the step S3;
the matching process comprises the following steps:
extracting the center connecting line distance of the point to be inserted of the electronic element in S4, extracting the center distance of the hole of the circuit board in S4, and recognizing that the two can realize effective insertion when the two meet tolerance matching conditions;
s6, adjusting the position and the posture of the clamping device, wherein the steps are as follows:
acquiring position and posture estimation values of the electronic element according to the electronic element image characteristic parameters extracted in the step S4, and making a difference with an image template value of an electronic element image acquisition point in the step S2, acquiring a first translation component and a first rotation component, and transmitting the first translation component and the first rotation component to a joint controller through kinematic inverse solution so as to control rotation and movement of a joint and realize position and posture correction of the clamping device;
s7, clamping the electronic element by the clamping device;
s8, adjusting the position and the posture of the clamping device, wherein the steps are as follows:
according to the characteristic parameters of the circuit board image extracted in the step S4, acquiring the position and posture estimated values of the circuit board, and making a difference with the image template values of the circuit board image acquisition points in the step S2, acquiring a second translational component and a second rotational component, and transmitting the second translational component and the second rotational component to a joint controller through kinematic inverse solution so as to control the rotation and the movement of the joint and realize the position and posture correction of the clamping device;
S9, inserting the electronic element into the circuit board by the clamping device;
after completing an electronic component package, continuing to circulate the steps S3 to S9 to form a package assembly line.
Preferably, the calibration is performed as follows,
1) The image acquisition point of the electronic element is acquired at the height z cc The method comprises the steps of recording image coordinates of each point of an image with n non-collinear characteristic points on a plane, and obtaining world coordinates of the n characteristic points under a basic coordinate system by a demonstrator, wherein n is an integer greater than or equal to 3, and z is cc To clamp the electronic component, the image of the circuit board is acquiredThe collection points are collected at the height z cp An image with n non-collinear characteristic points on a plane, recording the coordinates of each point image, and acquiring the world coordinates of the n characteristic points under a basic coordinate system by a demonstrator, wherein n is an integer greater than or equal to 3, and z is cp The base coordinate system is a world coordinate system established at the origin of the robot base, and is the height manually set during teaching of inserting the electronic component;
2) Substituting the image coordinates and world coordinates corresponding to the characteristic points on the electronic element into a two-dimensional affine model transformation formula respectively, obtaining a transformation matrix H of the image acquisition points of the electronic element by a least square method,
The two-dimensional affine model transformation formula of the electronic component is as follows:
wherein, (x) wi ，y wi ) Is the world coordinates of the characteristic points of the electronic element in the basic coordinate system, (u) ci ，v ci ) I=1, 2,..n, for coordinates of the feature points of the electronic component in the image coordinate system;
substituting the image coordinates and world coordinates corresponding to the feature points on the circuit board into a two-dimensional affine model transformation formula respectively, obtaining a transformation matrix K of the circuit board image acquisition points through a least square method,
the two-dimensional affine model transformation formula of the circuit board is as follows:
wherein, (X wi ，Y wi ) Is the world coordinates of the characteristic points of the circuit board in the basic coordinate system, (U) ci ，V ci ) Is the coordinates of the circuit board feature points in the image coordinate system, i=1, 2,..n.
Preferably, the initial template is set and the initial deviation is calculated, as follows,
an initial electronic component image is acquired by mean value filtering and threshold valueImage preprocessing is carried out in a value segmentation and convex hull processing mode, and central coordinates and angle direction characteristic parameters are extracted to obtain image coordinates (u) of two characteristic points P1 and P2 on the electronic element 1 ,v 1 )，(u 2 ,v 2 ) The coordinates of the central point image are:
converting the image coordinates into a world coordinate system:
move the gripping device to (x) c ,y c ) The coordinates of the current clamping device are recorded as (x) c ,y c ,z c ,θ c )，z c In order to set safety height during correction teaching,
the center of the manual teaching mobile clamping device coincides with the geometric center of the electronic element, and the relative movement distance and the angle deviation are recorded as (x) offset ,y offset ,0,θ offset )，
Wherein (x) c0 ,y c0 ) And theta c0 The position and the rotation angle of a clamping device set during the clamping teaching of the electronic element are set;
acquiring an initial circuit board image, firstly performing threshold segmentation, then selecting a circuit board hole to be inserted based on area and roundness characteristics, performing connected domain processing, extracting sub-pixel edges of the obtained circuit board hole area to be inserted, finally fitting edge points by adopting a fitting method based on outlier elimination, obtaining central position coordinates and angle direction characteristic parameters of the hole to be inserted, extracting central position coordinates and angle direction characteristic parameters of the hole to be inserted, and obtaining image coordinates (U) of two characteristic points K1 and K2 on an electronic element 1 ,V 1 )、(U 2 ,V 2 ) The coordinates of the central point image are:
converting the image coordinates into a world coordinate system:
move the gripping device to (X) c ，Y c ) The coordinates of the current clamping device are recorded as (X) c ，Y c ，Z c ，ɑ c )，Z c In order to set safety height during correction teaching,
the center of the manual teaching mobile clamping device coincides with the geometric center of the circuit board, and the relative movement distance and the angle deviation are recorded as (X) offset ，Y offset ，0，ɑ offset )，
Wherein (X) c0 ，Y c0 ) Sum alpha c0 The clamping device is set for the circuit board insertion teaching and the position and the rotation angle of the clamping device. Preferably, the fitting process eliminates outliers generation by generation in a manner that,
constructing a least square error formula:
wherein: (x) c ，y c ) The circle center coordinate estimated for the current generation is R is the radius;
will epsilon i Conversion to parameters beta to be estimated i Linear form of (c):
wherein: beta 1 ＝-2x c ，β 2 ＝-2y c ，
A new error formula is constructed by adopting a robust estimation method:
the weight factor of the ith point to be fitted is taken as follows:
wherein, let ρ (ε) vs. β j The offset is equal to zero:
taking the weight factor omega of all sampling points i =1, and performing multiple iterative solutions to obtain the current optimal parameter β j Thereby obtaining more accurate center coordinates and radius of the round hole, and the iteration times are 2-5 times.
Preferably, the matching condition is:
the distance between the center connecting lines of the points to be inserted of the electronic element is within an acceptable error range, and the error range is e c ∈[-δ c ,δ c ]；
Wherein e c ＝L c -l c Is electricDeviation delta between detection value and standard value of center line distance of point to be inserted of sub element c E is c Acceptable error float values; l (L) c For the center connecting line distance L of the point to be inserted of the electronic element detected by the image detection device c The standard distance is the center connecting line of the point to be inserted into the electronic element;
the difference between the center connecting line distance of the circuit board hole and the standard connecting line distance is within an acceptable error range, and the error range is e h ∈[-δ h ,δ h ]；
Wherein e h ＝L h -l h Is the deviation delta between the detection value and the standard value of the center distance of the hole of the circuit board h E is h Acceptable error float values; l (L) h For the center distance L of the circuit board hole detected by the image detection device h The standard distance is the center of the hole of the circuit board;
the difference between the center wiring distance of the point to be inserted into the electronic element and the center wiring distance of the hole of the circuit board is within an acceptable error range, and the error range is e ch ∈[-δ ch ,δ ch ]；
Wherein e ch ＝l c -l h Is the deviation delta between the detection value of the center connecting line distance of the point to be inserted of the electronic element and the detection value of the center distance of the hole of the circuit board ch E is ch Acceptable error float values;
wherein delta c 、δ h And delta ch The value ranges of the (a) are as follows: 0 to 0.2mm;
the standard distance between the centers of the holes of the circuit board and the standard distance between the center wires of the points where the electronic components are to be inserted are provided by the manufacturer.
Preferably, the first translational component is obtained as follows:
the first rotation component is acquired as follows:
C＝θ+θ offset ；
wherein, (u) 1 ,v 1 )，(u 2 ,v 2 ) The coordinates of two feature points P1 and P2 on the template image of the electronic component are respectively (u' 1 ,v′ 1 )，(u′ 2 ,v′ 2 ) Respectively image coordinates (x) of feature points P1 'and P2' corresponding to the electronic component template image on the acquired electronic component image offset ,y offset ) For the initial offset between the characteristic center of the electronic component template and the center of the clamping device, theta is the angle deviation between the characteristic direction of the current electronic component and the characteristic direction of the electronic component template offset Is the initial angular offset of the electronic component template image.
The second translational component is obtained as follows:
preferably, the second rotation component is acquired as follows:
D＝α+α offset ；
wherein, (U) 1 ,V 1 )、(U 2 ,V 2 ) The coordinates of two feature points K1 and K2 on the template image of the circuit board are respectively, (U) 1 ’,V 1 ’)、(U 2 ’,V 2 ' is the image coordinates of the feature points K1' and K2' corresponding to the circuit board template image on the acquired circuit board image, (X) offset ,Y offset ) For the initial offset of the characteristic center of the circuit board template and the center of the clamping device, alpha is the angle deviation between the current characteristic direction and the characteristic direction of the template offset Is the initial angular offset of the template image.
As shown in fig. 6 to 9, an electronic component inserting apparatus includes an image pickup device, an image processing device, an industrial robot, a control device, a gripping device, and a pressure device, an electronic component to be inserted and a circuit board to be inserted are disposed on a first table 51, and an industrial robot is disposed on a second table 52. The image processing device is in signal connection with the image acquisition device and is used for processing images of the electronic components and the circuit board acquired by the image acquisition device, the control device controls the industrial robot, the clamping device and the pressure device to act, the industrial robot can change the position and the angle of the clamping device under the control of the control device, the clamping device is used for clamping or placing the electronic components, and the pressure device can apply pressure on the electronic components placed by the clamping device. The image processing device can extract characteristic parameters of the images of the electronic element and the circuit board acquired by the image acquisition device, the electronic element and the circuit board can be adaptively matched according to the characteristic parameters, the parameters of the electronic element and the circuit board are not required to be set in advance manually, and the automatic inserting efficiency of the electronic element is greatly improved. Aiming at different placing angles and placing positions of electronic elements or circuit boards, the industrial robot corrects the position and the gesture by the clamping device, the clamping device can accurately clamp the electronic elements and accurately insert the electronic elements onto the circuit boards, and the automatic inserting efficiency is improved. The control device can control the pressure device to apply pressure to the electronic element, so that the electronic element which needs to be additionally applied with pressure for insertion can be subjected to insertion, the insertion is more stable, and the inserted circuit board is more reliable.
Preferably, the industrial robot is an industrial four-degree-of-freedom robot with three rotary joints and one movable joint, the industrial robot comprises a base 11, a first rotary arm 12, a second rotary arm 13 and a screw rod 14, one end of the first rotary arm 12 is hinged to the base 11, the other end of the first rotary arm 12 is hinged to one end of the second rotary arm 13, the other end of the second rotary arm 13 is rotatably connected with the screw rod 14, the lower end of the screw rod 14 is connected with a clamping device and a pressure device, the positions of the clamping device and the pressure device on a horizontal plane are adjusted by rotating the first rotary arm 12 and the second rotary arm 13, the distance between the clamping device and the pressure device and an electronic element or a circuit board is adjusted by the up-down movement of the screw rod 14, and the angles of the clamping device and the pressure device are adjusted by the rotation action of the screw rod 14 around a self shaft. Through the arrangement of the first rotating arm 12, the second rotating arm 13 and the screw rod 14, the positions and the angles of the clamping device and the pressure device can be flexibly adjusted according to different placing positions and placing angles of the electronic components and the circuit board, so that the electronic components can be accurately clamped and accurately inserted on the circuit board.
Preferably, the pressure means comprises a first pressure means 31, a second pressure means 32, a third pressure means 33 and a fourth pressure means 34 arranged in a rectangular array, the gripping means being located in the centre of the rectangular array. After the structure is adopted, the first pressure device 31, the second pressure device 32, the third pressure device 33 and the fourth pressure device 34 can apply pressure to the electronic element positioned in the center of the electronic element, so that the plugging scheme is richer and the plugging is more reliable.
The control device comprises an air source 44, a first electromagnetic directional valve 41, a second electromagnetic directional valve 42 and a third electromagnetic directional valve 43, the clamping device is communicated with the air source 44 through the first electromagnetic directional valve 41, the first pressure device 31 and the third pressure device 33 are respectively communicated with the air source 44 through the second electromagnetic directional valve 42, and the second pressure device 32 and the fourth pressure device 34 are respectively communicated with the air source 44 through the third electromagnetic directional valve 43. By controlling the different pressure devices to act respectively or in combination through the electromagnetic directional valves, the first pressure device 31, the second pressure device 32, the third pressure device 33 and the fourth pressure device 34 can apply pressure to the electronic components respectively or in combination so as to meet the insertion requirements of the electronic components of different types.
In the present embodiment, the first pressure device 31, the second pressure device 32, the third pressure device 33, and the fourth pressure device 34 are a first cylinder, a second cylinder, a third cylinder, and a fourth cylinder, respectively. By inputting different instruction combinations to the first electromagnetic directional valve 41, the second electromagnetic directional valve 42 and the third electromagnetic directional valve 43, effective insertion of the through hole insertion special-shaped element, the diagonal stress insertion special-shaped element and the four corner stress special-shaped element is realized respectively. Aiming at the conventional through hole inserting element, the ET2 of the first electromagnetic directional valve 41 can be powered on at an element clamping position, the ET1 is powered off to clamp the special-shaped element, and when the element to be inserted reaches an inserting position, the ET1 of the first electromagnetic directional valve 41 is powered on, and the ET2 is powered off to place the special-shaped element; aiming at the diagonally stressed inserting special-shaped elements, at the position of the inserting part, enabling ET1 of the first electromagnetic directional valve 41 to be electrified and ET2 to be deenergized to place the special-shaped elements, enabling ET3 of the second electromagnetic directional valve 42 or ET4 of the third electromagnetic directional valve 43 to be electrified, enabling ejection of the first cylinder and the third cylinder or ejection of the second cylinder and the fourth cylinder, and inserting the special-shaped elements; aiming at the special-shaped elements stressed at four corners, at the position of the plug-in, the ET1 of the first electromagnetic directional valve 41 is electrified, the ET2 is deenergized to place the special-shaped elements, the ET3 of the second electromagnetic directional valve 42 and the ET4 of the third electromagnetic directional valve 43 are electrified, and the first cylinder, the second cylinder, the third cylinder and the fourth cylinder are ejected simultaneously, so that the plug-in mounting of the special-shaped elements is realized.
The universality and the adaptability of the clamping device and the pressure device for different component inserting processes are greatly improved by various control combination modes.
The control device further includes a speed control valve 45, the speed control valve 45 being provided between the pinching device and the first electromagnetic directional valve 41 for controlling the speed at which the pinching mouth 21 is opened or closed. After the structure is adopted, the speed for clamping or placing the electronic element is convenient to adjust, and the speed for inserting the electronic element is beneficial to control.
The control device also includes a filter relief valve 46, the filter relief valve 46 being disposed proximate the air source 44. The filter relief valve 46 provides a pressure relief and stabilization function that allows the pressure device to grip, place, or apply pressure to the electronic component more smoothly.
In general, the invention has the following advantages:
the method comprises the steps of extracting characteristic parameters of an image of an electronic element in a mode of mean value filtering, threshold segmentation and convex hull processing, threshold segmentation of the image of a circuit board, selection of a hole to be inserted into the circuit board based on area and roundness characteristics, connected domain processing, sub-pixel edge extraction of an obtained hole area to be inserted into the circuit board, and characteristic parameter extraction by adopting a fitting method, so that the extracted characteristic parameters are more accurate. The electronic component and the circuit board parameters can be adaptively matched according to the characteristic parameters through the algorithm, manual setting of the electronic component and the circuit board parameters is not needed, priori knowledge is not needed to be relied on in screening of the electronic component, and the electronic component or the circuit board is placed at different angles and positions. The control device can control the pressure device to apply pressure to the electronic component, and the electronic component which needs to be additionally applied with pressure for insertion is subjected to insertion, so that the insertion is more stable.
The above examples are preferred embodiments of the present invention, but the embodiments of the present invention are not limited to the above examples, and any other changes, modifications, substitutions, combinations, and simplifications that do not depart from the spirit and principle of the present invention should be made in the equivalent manner, and the embodiments are included in the protection scope of the present invention.
Claims (7)
1. An electronic component mounting method is characterized in that: comprises the following steps of the method,
s1, calibrating an image acquisition device;
s2, setting an initial template of the electronic element and the circuit board and calculating initial deviation;
s3, image acquisition is carried out on the electronic element; image acquisition is carried out on the circuit board;
s4, carrying out image preprocessing on the electronic element image acquired in the S3 in a mode of mean value filtering, threshold segmentation and convex hull processing, and extracting central coordinates and angular direction characteristic parameters;
firstly, threshold segmentation is carried out on the circuit board image acquired in the step S3, then a circuit board hole to be inserted is selected based on the area and roundness characteristics, connected domain processing is carried out, sub-pixel edge extraction is carried out on the obtained circuit board hole area to be inserted, finally, fitting is carried out on edge points by adopting a fitting method based on outlier elimination, and the central position coordinate and angle direction characteristic parameters of the to-be-inserted hole are obtained;
S5, carrying out self-adaptive matching on the image features of the electronic element extracted in the step S4 and the image features of the circuit board, if the matching is successful, turning to the step S6, and if the matching is unsuccessful, discarding the current electronic element, and turning to the step S3;
the matching process comprises the following steps:
extracting the center connecting line distance of the point to be inserted of the electronic element in S4, extracting the center distance of the hole of the circuit board in S4, and recognizing that the two can realize effective insertion when the two meet tolerance matching conditions;
s6, adjusting the position and the posture of the clamping device, wherein the steps are as follows:
acquiring position and posture estimation values of the electronic element according to the electronic element image characteristic parameters extracted in the step S4, and making a difference with an image template value of an electronic element image acquisition point in the step S2, acquiring a first translation component and a first rotation component, and transmitting the first translation component and the first rotation component to a joint controller through kinematic inverse solution so as to control rotation and movement of a joint and realize position and posture correction of the clamping device;
s7, clamping the electronic element by the clamping device;
s8, adjusting the position and the posture of the clamping device, wherein the steps are as follows:
according to the characteristic parameters of the circuit board image extracted in the step S4, acquiring the position and posture estimated values of the circuit board, and making a difference with the image template values of the circuit board image acquisition points in the step S2, acquiring a second translational component and a second rotational component, and transmitting the second translational component and the second rotational component to a joint controller through kinematic inverse solution so as to control the rotation and the movement of the joint and realize the position and posture correction of the clamping device;
S9, inserting the electronic element into the circuit board by the clamping device;
after completing an electronic component package, continuing to circulate the steps S3 to S9 to form a package assembly line.
2. An electronic component mounting method according to claim 1, wherein: the steps of the calibration are as follows,
1) The image acquisition point of the electronic element is acquired at the height z cc The method comprises the steps of recording image coordinates of each point of an image with n non-collinear characteristic points on a plane, and obtaining world coordinates of the n characteristic points under a basic coordinate system by a demonstrator, wherein n is an integer greater than or equal to 3, and z is cc The height manually set during teaching of the electronic component is acquired at the image acquisition point of the circuit board at the height z cp An image with n non-collinear characteristic points on a plane, recording the coordinates of each point image, and acquiring the world coordinates of the n characteristic points under a basic coordinate system by a demonstrator, wherein n is an integer greater than or equal to 3, and z is cp The base coordinate system is a world coordinate system established at the origin of the robot base, and is the height manually set during teaching of inserting the electronic component;
2) Substituting the image coordinates and world coordinates corresponding to the feature points on the electronic element into a two-dimensional affine model transformation formula respectively, and obtaining a transformation matrix H of the image acquisition points of the electronic element by a least square method, wherein the two-dimensional affine model transformation formula of the electronic element is as follows:
Wherein, (x) wi ，y wi ) Is the world coordinates of the characteristic points of the electronic element in the basic coordinate system, (u) ci ，v ci ) I=1, 2,..n, for coordinates of the feature points of the electronic component in the image coordinate system;
substituting the image coordinates and world coordinates corresponding to the feature points on the circuit board into a two-dimensional affine model transformation formula respectively, obtaining a transformation matrix K of the circuit board image acquisition points through a least square method,
the two-dimensional affine model transformation formula of the circuit board is as follows:
wherein, (X wi ，Y wi ) Is the world coordinates of the characteristic points of the circuit board in the basic coordinate system, (U) ci ，V ci ) Is the coordinates of the circuit board feature points in the image coordinate system, i=1, 2,..n.
3. An electronic component mounting method according to claim 1, wherein: an initial template is set and an initial deviation is calculated, as follows,
an initial electronic element image is collected, image preprocessing is carried out by adopting mean value filtering, threshold value segmentation and convex hull processing, and characteristic parameters of the central coordinates and the angle direction are extracted to obtain image coordinates (u) of two characteristic points P1 and P2 on the electronic element 1 ,v 1 )，(u 2 ,v 2 ) The coordinates of the central point image are:
converting the image coordinates into a world coordinate system:
move the gripping device to (x) c ,y c ) The coordinates of the current clamping device are recorded as (x) c ,y c ,z c ,θ c )，z c In order to set safety height during correction teaching,
the center of the manual teaching mobile clamping device coincides with the geometric center of the electronic element, and the relative movement distance and the angle deviation are recorded as (x) offset ,y offset ,0,θ offset )，
Wherein (x) c0 ,y c0 ) And theta c0 The position and the rotation angle of a clamping device set during the clamping teaching of the electronic element are set; acquiring an initial circuit board image, firstly performing threshold segmentation, then selecting a circuit board hole to be inserted based on area and roundness characteristics, performing connected domain processing, extracting sub-pixel edges of the obtained circuit board hole area to be inserted, finally fitting edge points by adopting a fitting method based on outlier elimination, obtaining central position coordinates and angle direction characteristic parameters of the hole to be inserted, extracting central position coordinates and angle direction characteristic parameters of the hole to be inserted, and obtaining image coordinates (U) of two characteristic points K1 and K2 on an electronic element 1 ,V 1 )、(U 2 ,V 2 ) The coordinates of the central point image are:
converting the image coordinates into a world coordinate system:
move the gripping device to (X) c ，Y c ) The coordinates of the current clamping device are recorded as (X) c ，Y c ，Z c ，ɑ c )，Z c In order to set safety height during correction teaching,
the center of the manual teaching mobile clamping device coincides with the geometric center of the circuit board, and the relative movement distance and the angle deviation are recorded as (X) offset ，Y offset ，0，ɑ offset )，
Wherein (X) c0 ，Y c0 ) Sum alpha c0 The clamping device is set for the circuit board insertion teaching and the position and the rotation angle of the clamping device.
4. An electronic component mounting method according to claim 1, wherein: the fitting process eliminates the outliers generation by generation in the implementation manner that,
constructing a least square error formula:
wherein: (x) c ，y c ) The circle center coordinate estimated for the current generation is R is the radius;
will epsilon i Conversion to parameters beta to be estimated i Linear form of (c):
wherein: beta 1 ＝-2x c ，β 2 ＝-2y c ，β 3 ＝x c 2 +y c 2 -R 2 ；
A new error formula is constructed by adopting a robust estimation method:
the weight factor of the ith point to be fitted is taken as follows:
wherein,let ρ (ε) vs. β j The offset is equal to zero:
taking the weight factor omega of all sampling points i =1, and performing multiple iterative solutions to obtain the current optimal parameter β j Thereby obtaining more accurate center coordinates and radius of the round hole, and the iteration times are 2-5 times.
5. An electronic component mounting method according to claim 1, wherein: the matching conditions are as follows:
the distance between the center connecting lines of the points to be inserted of the electronic element is within an acceptable error range, and the error range is e c ∈[-δ c ,δ c ]；
Wherein e c ＝L c -l c Is the deviation delta between the detection value and the standard value of the center connecting line distance of the point to be inserted of the electronic element c E is c Acceptable error float values; l (L) c For the center connecting line distance L of the point to be inserted of the electronic element detected by the image detection device c The standard distance is the center connecting line of the point to be inserted into the electronic element; the difference between the center connecting line distance of the circuit board hole and the standard connecting line distance is within an acceptable error range, and the error range is e h ∈[-δ h ,δ h ]；
Wherein e h ＝L h -l h Is the deviation delta between the detection value and the standard value of the center distance of the hole of the circuit board h E is h Acceptable error float values; l (L) h For the center distance L of the circuit board hole detected by the image detection device h The standard distance is the center of the hole of the circuit board;
the difference between the center wiring distance of the point to be inserted into the electronic element and the center wiring distance of the hole of the circuit board is within an acceptable error range, and the error range is e ch ∈[-δ ch ,δ ch ]；
Wherein e ch ＝l c -l h Is the deviation delta between the detection value of the center connecting line distance of the point to be inserted of the electronic element and the detection value of the center distance of the hole of the circuit board ch E is ch Acceptable error float values;
wherein delta c 、δ h And delta ch The value ranges of the (a) are as follows: 0 to 0.2mm;
the standard distance between the centers of the holes of the circuit board and the standard distance between the center wires of the points where the electronic components are to be inserted are provided by the manufacturer.
6. An electronic component mounting method according to claim 1, wherein: the first translational component is obtained as follows:
The first rotation component is acquired as follows:
C＝θ+θ offset ；
wherein, (u) 1 ,v 1 )，(u 2 ,v 2 ) The coordinates of two feature points P1 and P2 on the template image of the electronic component are respectively (u' 1 ,v′ 1 )，(u′ 2 ,v′ 2 ) Respectively image coordinates (x) of feature points P1 'and P2' corresponding to the electronic component template image on the acquired electronic component image offset ,y offset ) The initial offset between the characteristic center of the electronic component template and the center of the clamping device is that theta is the current characteristic direction of the electronic component and the electronic componentAngular deviation of template feature direction, θ offset An initial angular offset for the electronic component template image;
the second translational component is obtained as follows:
the second rotation component is acquired as follows:
D＝α+α offset ；
wherein, (U) 1 ,V 1 )、(U 2 ,V 2 ) The coordinates of two feature points K1 and K2 on the template image of the circuit board are respectively, (U) 1 ’,V 1 ’)、(U 2 ’,V 2 ' is the image coordinates of the feature points K1' and K2' corresponding to the circuit board template image on the acquired circuit board image, (X) offset ,Y offset ) For the initial offset of the characteristic center of the circuit board template and the center of the clamping device, alpha is the angle deviation between the current characteristic direction and the characteristic direction of the template offset Is the initial angular offset of the template image.
7. An electronic component mounting apparatus, characterized in that: the device comprises an image acquisition device, an image processing device, an industrial robot, a control device, a clamping device and a pressure device, wherein the image processing device is in signal connection with the image acquisition device and is used for processing images of electronic elements and circuit boards acquired by the image acquisition device, the control device controls the industrial robot, the clamping device and the pressure device to act, the industrial robot can change the position and the angle of the clamping device under the control of the control device, the clamping device is used for clamping or placing the electronic elements, and the pressure device can apply pressure on the electronic elements placed by the clamping device; the industrial robot is an industrial four-degree-of-freedom robot with three rotary joints and one movable joint, the industrial robot comprises a base, a first rotary arm, a second rotary arm and a screw rod, one end of the first rotary arm is hinged to the base, the other end of the first rotary arm is hinged to one end of the second rotary arm, the other end of the second rotary arm is rotationally connected with the screw rod, the lower end of the screw rod is connected with a clamping device and a pressure device, the industrial robot adjusts the positions of the clamping device and the pressure device on a horizontal plane by rotating the first rotary arm and the second rotary arm, the screw rod moves up and down to adjust the distance between the clamping device and the pressure device and an electronic element or a circuit board, and the angle of the clamping device and the pressure device is adjusted by the rotating action of the screw rod around a self shaft; the pressure device comprises a first pressure device, a second pressure device, a third pressure device and a fourth pressure device which are arranged in a rectangular array, and the clamping device is positioned at the center of the rectangular array; the control device comprises an air source, a first electromagnetic directional valve, a second electromagnetic directional valve and a third electromagnetic directional valve, the clamping device is communicated with the air source through the first electromagnetic directional valve, the second electromagnetic directional valve simultaneously controls two pressure devices positioned on the diagonal line of the rectangular array, and the third electromagnetic directional valve simultaneously controls two pressure devices positioned on the other diagonal line of the rectangular array.
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| CN113808067B (en) * | 2020-06-11 | 2024-07-05 | 广东美的白色家电技术创新中心有限公司 | Circuit board detection method, visual detection equipment and device with storage function |
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