CN109287077A - A kind of electronic component insertion method and device - Google Patents
A kind of electronic component insertion method and device Download PDFInfo
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- CN109287077A CN109287077A CN201811209693.XA CN201811209693A CN109287077A CN 109287077 A CN109287077 A CN 109287077A CN 201811209693 A CN201811209693 A CN 201811209693A CN 109287077 A CN109287077 A CN 109287077A
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- 238000012966 insertion method Methods 0.000 title claims abstract description 21
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/168—Wrong mounting prevention
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Abstract
The present invention relates to electronic components to insert field, in particular to a kind of electronic component insertion method and device, characteristic parameter extraction is carried out by the image of image and circuit board to electronic component, Adaptive matching is carried out according to features above parameter, for the different placement angle of electronic component or circuit board, placement position, by carrying out the correction of position and posture to clamp device, clamp device can accurately clamp electronic component and accurately insert on circuit board, improve automation inserting efficiency.Control device can control pressure apparatus and apply pressure to electronic component, applies pressure to the electronic component for needing additional application pressure to be inserted and inserts, keeps inserting more firm.The various control combination of clamp device and pressure apparatus greatly improves versatility and adaptability towards different elements inserting process.
Description
Technical field
The present invention relates to electronic components to insert field, in particular to a kind of electronic component insertion method and device.
Background technique
With advances in technology with the high speed development of electronic industry, important carrier of the circuit board as electronic component,
Its application field and market demand increase year by year.The electronic component Program instrumentation of automation is to improve all kinds of circuit board piece yield
With the important means for reducing production cost, prior art inserting generallys use tool, and there are three rotary joint and linear joints
Industrial robot moves clamp device, after clamping electronic component, is moved down by the joint of industrial robot, by electronics member
In part inserting to circuit board.It is existing due to the features such as electronic component and circuit board have face shaping irregular, and visual identity is difficult
There is technology there are still certain deficiencies, be mainly shown as:
1) electronic component screening relies on priori knowledge mostly, needs manually in advance to set component parameters, different rulers
Very little element is matched with circuit board plate hole does not have Adaptive matching ability with screening process；
2) clamp device can not accurately clamp electronic component, can not accurately inject on circuit board；
3) not secured enough to needing the additional electronic component for applying pressure inserting to insert.
Summary of the invention
For the technical problems in the prior art, an object of the present invention is: providing a kind of electronic component inserting
Method can make electronic component and circuit board Adaptive matching, can accurately clamp electronic component and accurately insert on circuit board.
For the technical problems in the prior art, the second object of the present invention is to: a kind of inserting of electronic component is provided
Device can make electronic component and circuit board Adaptive matching, can accurately clamp electronic component and accurately insert on circuit board.
In order to achieve the above object, the present invention adopts the following technical scheme:
A kind of electronic component insertion method, includes the following steps,
S1, image collecting device is demarcated；
S2, the original template for setting electronic component and circuit board simultaneously calculate initial deviation；
S3, Image Acquisition is carried out to electronic component；Image Acquisition is carried out to circuit board；
S4, electronic component image collected in S3 is carried out by the way of mean filter, Threshold segmentation, convex closure processing
Image preprocessing, and its centre coordinate, angle direction characteristic parameter are extracted；To circuit board image collected in S3,
Threshold segmentation is carried out first, area and the round degree of characteristics is then based on and selects circuit board apertures to be inserted and carry out Connected area disposal$, to obtaining
The circuit board apertures region to be inserted taken carries out sub-pixel edge extraction, finally using the fitting process rejected based on outlier, to edge
Point is fitted, and obtains center position coordinates to jack, angle direction characteristic parameter；
S5, the S4 electronic component image feature extracted and circuit board image feature are subjected to Adaptive matching, successful match
Then turn S6, matching is unsuccessful, gives up Current electronic element, turns S3；
Matching process implementation method are as follows:
Electronic component is extracted in S4 and is inserted into dot center's line distance, and circuit board plate hole centre distance is extracted in S4,
When the two meets tolerance matching condition, it can assert that the two may be implemented effectively to insert；
S6, position and pose adjustment are carried out to clamp device, steps are as follows:
According to the electronic component image characteristic parameter that S4 is extracted, position and the Attitude estimation value of electronic component are obtained, and with
The image template value of electronic component image collection point makes the difference in S2, obtains the first translational component and the first rotational component and is transported
Dynamic learn against solution passes to joint control, to control the rotation and movement in joint, realizes position and the posture correction of clamp device；
S7, clamp device clamp electronic component；
S8, position and pose adjustment are carried out to clamp device, steps are as follows:
According to the circuit board image characteristic parameter that S4 is extracted, obtain position and the Attitude estimation value of circuit board, and in S2
The image template value of circuit board image collection point makes the difference, and obtains the second translational component and the second rotational component and carries out Inverse Kinematics
Solution passes to joint control, to control the rotation and movement in joint, realizes position and the posture correction of clamp device；
Electronic component is inserted into circuit board by S9, clamp device；
After completing an electronic component plug-in unit, step S3 to S9 is continued cycling through, forms plug-in unit assembly line.
Preferably, the step of calibration is as follows,
1) acquiring in electronic component image collection point in height is zccFigure with n infull collinear feature points in plane
Picture records each point image coordinate, obtains world coordinates of the n characteristic point under basis coordinates system by teaching machine, wherein n, which takes, to be greater than
Integer equal to 3, zccFor the height being manually set when clamping electronic component teaching, in circuit board image collection point, acquisition is in height
For zcpImage with n incomplete conllinear characteristic points in plane, records each point image coordinate, special by n of teaching machine acquisition
World coordinates of the sign point under basis coordinates system, wherein n takes the integer more than or equal to 3, wherein zcpWhen to be inserted into electronic component teaching
The height of artificial settings, basis coordinates system are the world coordinate systems established at robot base origin；
2) the corresponding image coordinate of characteristic point on electronic component and world coordinates are substituted into the transformation of two dimensional affine model respectively
Formula obtains the transformation matrix H of electronic component image collection point by least square method,
Electronic component two dimensional affine model transformation for mula is as follows:
Wherein, (xwi, ywi) be basis coordinates system under electronic component characteristic point world coordinates, (uci, vci) it is that electronic component is special
Coordinate of the sign point under image coordinate system, i=1,2 ..., n；
The corresponding image coordinate of characteristic point on circuit board and world coordinates are substituted into two dimensional affine model transformation for mula respectively,
By least square method, the transformation matrix K of circuit board image collection point is obtained,
Circuit board two dimensional affine model transformation for mula is as follows:
Wherein, (Xwi, Ywi) be basis coordinates system under circuit board features point world coordinates, (Uci, Vci) it is circuit board features point
Coordinate under image coordinate system, i=1,2 ..., n.
Preferably, it sets original template and calculates initial deviation, steps are as follows,
A width initiating electron element image is acquired, carries out image by the way of mean filter, Threshold segmentation, convex closure processing
Pretreatment, and its centre coordinate, angle direction characteristic parameter are extracted, obtain two characteristic point P1 and P2 on electronic component
Image coordinate (u1,v1), (u2,v2), center point image coordinate are as follows:
Image coordinate is converted to world coordinate system:
Clamp device is moved into (xc,yc) at, remember that current clamp device coordinate is (xc,yc,zc,θc), zcFor teaching of rectifying a deviation
When the safe altitude that sets,
The mobile clamp device center of manual teaching is overlapped with electronic component geometric center, remembers that relative movement distance and angle are inclined
Difference is (xoffset,yoffset,0,θoffset),
Wherein (xc0,yc0) and θc0The clamp device position set when teaching and rotation angle are clamped for electronic component；
Acquire a width initial circuit plate image, first progress Threshold segmentation, be then based on area and the round degree of characteristics selection to
It inserts circuit board apertures and carries out Connected area disposal$, sub-pixel edge extraction is carried out to the circuit board apertures region to be inserted of acquisition, is finally adopted
With the fitting process rejected based on outlier, edge point is fitted, it is special to obtain the center position coordinates to jack, angle direction
Parameter is levied, and its centre coordinate, angle direction characteristic parameter are extracted, obtains two characteristic point K1 and K2 on electronic component
Image coordinate (U1,V1)、(U2,V2), center point image coordinate are as follows:
Image coordinate is converted to world coordinate system:
Clamp device is moved into (Xc, Yc) at, remember that current clamp device coordinate is (Xc, Yc, Zc, ɑc), ZcFor teaching of rectifying a deviation
When the safe altitude that sets,
The mobile clamp device center of manual teaching is overlapped with circuit board geometric center, remembers relative movement distance and angular deviation
For (Xoffset, Yoffset, 0, ɑoffset),
Wherein (Xc0, Yc0) and ɑc0The clamp device position set when teaching and rotation angle are inserted for circuit board.It is preferred that
, fit procedure reject by generation to outlier, and implementation is,
Construct minimum mean-square error formula:
Wherein: (xc, yc) it is the central coordinate of circle estimated when former generation, R is radius；
By εiIt is converted to about parameter beta to be estimatediLinear forms:
Wherein: β1=-2xc, β2=-2yc,
New error formula is constructed using robust iterative method:
Take i-th of weight factor to match point are as follows:
Wherein, Enable ρ (ε) to βjLocal derviation is asked to be equal to zero:
Take the weight factor ω initially for all sampled pointsi=1, and above-mentioned solution procedure is subjected to successive ignition solution,
Contemporary optimized parameter β can be acquiredj, so that the more accurate center of circular hole coordinate of acquisition and radius, the number of iterations take 2~5 times.
Preferably, the matching condition are as follows:
Electronic component is inserted into dot center's line distance within an acceptable error range, and error range takes ec∈[-δc,
δc]；
Wherein, ec=Lc-lc, it is inserted into for electronic component inclined between the detected value and standard value of dot center's line distance
Difference, δcFor ecAcceptable error float value；lcDot center's line is inserted into for the electronic component that image detection device detects
Distance, LcThe gauged distance of dot center's line is inserted into for electronic component；
The difference of circuit board plate hole line of centres distance and standard line distance within an acceptable error range, error model
It encloses and takes eh∈[-δh,δh]；
Wherein, eh=Lh-lh, it is the deviation between the detected value and standard value of circuit board plate hole centre distance, δhFor ehIt can
The error float value of receiving；lhFor the circuit board plate hole centre distance that image detection device detects, LhFor in circuit board plate hole
The gauged distance of the heart；
The difference that electronic component is inserted between dot center's line distance and circuit board plate hole line of centres distance can connect
In the error range received, error range takes ech∈[-δch,δch]；
Wherein, ech=lc-lh, detected value and the circuit board plate hole center of dot center's line distance are inserted into for electronic component
Deviation between the detected value of distance, δchFor echAcceptable error float value；
Wherein, δc、δhAnd δchValue range it is equal are as follows: 0~0.2mm；
Wherein, the gauged distance and electronic component at circuit board plate hole center are inserted into the gauged distance of dot center's line by giving birth to
Manufacturer is produced to provide.
Preferably, the first translational component acquisition modes are as follows:
First rotational component acquisition modes are as follows:
C=θ+θoffset；
Wherein, (u1,v1), (u2,v2) be respectively two characteristic point P1 and P2 on electronic component template image image coordinate,
(u′1,v′1), (u '2,v′2) it is respectively characteristic point P1 ' corresponding with electronic component template image on institute's acquisition electronics image
And the image coordinate of P2 ', (xoffset,yoffset) be electronic component template characteristic center and the clamp device center it is initial partially
Shifting amount, θ are the angular deviation in Current electronic element characteristics direction and electronic component template characteristic direction, θoffsetFor electronic component
The initial angular offset amount of template image.
Second translational component acquisition modes are as follows:
Preferably, the second rotational component acquisition modes are as follows:
D=α+αoffset；
Wherein, (U1,V1)、(U2,V2) be respectively two characteristic point K1 and K2 on circuit board template image image coordinate,
(U1’,V1’)、(U2’,V2') be respectively on institute's collecting circuit board image characteristic point K1 ' corresponding with circuit board template image and
The image coordinate of K2 ', (Xoffset,Yoffset) be circuit board module plate features center and clamp device center initial offset, α is
The angular deviation in current signature direction and template characteristic direction, αoffsetFor the initial angular offset amount of template image.
A kind of electronic component inserting apparatus, including image collecting device, image processing apparatus, industrial robot, control dress
Set, clamp device and pressure apparatus, image processing apparatus are connect with image collecting device signal, for handling image collecting device
The image of collected electronic component and circuit board, control device control industrial robot, clamp device and pressure apparatus movement,
Industrial robot can change position and the angle of clamp device under control of the control means, and clamp device is for clamping or putting
Electronic component is set, pressure apparatus can apply pressure on the electronic component that clamp device is placed.Image processing apparatus can be right
The image for the electronic component and circuit board that image acquisition device arrives carries out characteristic parameter extraction, electronic component and circuit board root
Upper characteristic parameter is able to carry out Adaptive matching accordingly, it is not necessary that manually electronic component and circuit board parameter are set in advance,
Substantially increase the automation inserting efficiency of electronic component.For the different placement angle of electronic component or circuit board, put
Position, for industrial robot by the correction to clamp device progress position and posture, clamp device can accurately clamp electronics member
Part simultaneously accurately inserts on circuit board, improves automation inserting efficiency.Control device can control pressure apparatus to electronics
Element applies pressure, therefore can apply pressure to the electronic component for needing additional application pressure to be inserted and insert, and makes
Inserting is more firm, and the circuit board of inserting is more reliable.
Preferably, the industrial machine artificially has the industrial four-degree-of-freedom machine of three rotary joints and a linear joint
Device people, industrial robot include pedestal, first rotating arm, the second rotating arm, screw rod, and one end of the first rotating arm is articulated with
The other end of pedestal, one end of hinged second rotating arm of the other end of first rotating arm, the second rotating arm is rotatablely connected silk
Bar, screw lower end connect clamp device and pressure apparatus, and industrial robot passes through rotation first rotating arm and the second rotating arm tune
In the position of horizontal plane, screw rod, which moves up and down, adjusts clamp device and pressure apparatus and electronics member for whole clamp device and pressure apparatus
The distance between part or circuit board adjust the angle of clamp device and pressure apparatus by screw rod around the spinning movement of itself axis
Degree.By the setting of first rotating arm, the second rotating arm and screw rod, placement position that can be different with circuit board according to electronic component
And placement angle, clamp device and pressure apparatus position and angle are neatly adjusted, therefore can accurately clamp electronic component simultaneously
Accurately insert on circuit board.
Preferably, pressure apparatus includes the first pressure device of rectangular array arrangement, second pressure device, third pressure
Device and the 4th pressure apparatus, clamp device are located at the center of rectangular array.After this structure, first pressure device,
Two pressure apparatus, third pressure apparatus and the 4th pressure apparatus can apply pressure to electronic component at its center, insert
Dress scheme is richer, inserts more reliable.
Control device includes gas source, the first solenoid directional control valve, the second solenoid directional control valve and third solenoid directional control valve, clamping dress
It sets and is connected to by the first solenoid directional control valve with gas source, the second solenoid directional control valve controls simultaneously is located at rectangular array cornerwise two
Pressure apparatus, third solenoid directional control valve controls simultaneously is located at another cornerwise two pressure apparatus of rectangular array.By each
Solenoid directional control valve controls different pressure apparatus respectively or combinative movement, it will be able to make first pressure device, second pressure device,
Third pressure apparatus and the 4th pressure apparatus respectively or combine application pressure to electronic component, to meet different types of electronics
The inserting requirement of element.The various control combination of clamp device and pressure apparatus is greatly improved to be inserted towards different elements
The versatility and adaptability of process.
Generally speaking, the present invention has the advantage that
Characteristic parameter is carried out in such a way that the image to electronic component is using mean filter, Threshold segmentation, convex closure processing
It extracts, Threshold segmentation is carried out to the image of circuit board, area is then based on and selects to inserting plate hole and be connected to the round degree of characteristics
Domain processing carries out sub-pixel edge extraction to inserting plate hole region to acquisition, and carries out characteristic parameter extraction using fitting process, makes
The characteristic parameter of extraction is more accurate.Adaptive matching can be carried out according to features above parameter by algorithm, be not necessarily to artificial thing
First electronic component and circuit board parameter are set, electronic component screening without relying on priori knowledge, for electronic component or
The different placement angle of person's circuit board, placement position, by carrying out the correction of position and posture, clamp device energy to clamp device
It accurately clamps electronic component and accurately inserts on circuit board, improve automation inserting efficiency.Control device can be controlled
Pressing pressure device applies pressure to electronic component, applies pressure to the electronic component for needing additional application pressure to be inserted and carries out
Inserting keeps inserting more firm.The various control combination of clamp device and pressure apparatus is greatly improved towards different elements
The versatility and adaptability of inserting process.
Detailed description of the invention
Fig. 1 is a kind of step flow chart of electronic component insertion method of the present invention.
Fig. 2 is that a kind of electronic component insertion method of the present invention and device carry out clamp device according to the posture of electronic component
The method schematic diagram of posture correction.
Fig. 3 carries out appearance to clamp device according to the posture of circuit board for a kind of electronic component insertion method of the present invention and device
The method schematic diagram of state correction.
Fig. 4 is that a kind of electronic component insertion method of the present invention and device carry out clamp device according to the posture of electronic component
The schematic illustration of posture correction.
Fig. 5 carries out appearance to clamp device according to the posture of circuit board for a kind of electronic component insertion method of the present invention and device
The schematic illustration of state correction.
Fig. 6 is the structural schematic diagram of the pressure apparatus of a kind of electronic component insertion method of the present invention and device.
Fig. 7 is the schematic diagram in the inserting apparatus use of a kind of electronic component insertion method of the present invention and device.
Fig. 8 is the signal at another visual angle in the inserting apparatus use of a kind of electronic component insertion method of the present invention and device
Figure.
Fig. 9 is the control principle schematic diagram of the pressure apparatus of a kind of electronic component insertion method of the present invention and device.
Wherein include in Fig. 6~Fig. 9:
11 --- --- first rotating arm, 13 --- the second rotating arm, 14 --- screw rods of pedestal, 12；
21 --- clamping opening；
The 31 --- --- pressures of second pressure device, 33 --- third pressure apparatus, 34 --- the 4th of first pressure device, 32
Power device；
41 --- the first solenoid directional control valve, 42 --- the second solenoid directional control valves, 43 --- third solenoid directional control valve, 44 ---
Gas source, 45 --- speed control valve, 46 --- filtering pressure reducing valve；
51 --- the first workbench, 52 --- second workbench.
Specific embodiment
It is next below that the present invention will be further described in detail.
As shown in fig. 1~fig. 5, a kind of electronic component insertion method, includes the following steps,
S1, image collecting device is demarcated；
S2, the original template for setting electronic component and circuit board simultaneously calculate initial deviation；
S3, Image Acquisition is carried out to electronic component；Image Acquisition is carried out to circuit board；
S4, electronic component image collected in S3 is carried out by the way of mean filter, Threshold segmentation, convex closure processing
Image preprocessing, and its centre coordinate, angle direction characteristic parameter are extracted；To circuit board image collected in S3,
Threshold segmentation is carried out first, area and the round degree of characteristics is then based on and selects circuit board apertures to be inserted and carry out Connected area disposal$, to obtaining
The circuit board apertures region to be inserted taken carries out sub-pixel edge extraction, finally using the fitting process rejected based on outlier, to edge
Point is fitted, and obtains center position coordinates to jack, angle direction characteristic parameter；
S5, the S4 electronic component image feature extracted and circuit board image feature are subjected to Adaptive matching, successful match
Then turn S6, matching is unsuccessful, gives up Current electronic element, turns S3；
Matching process implementation method are as follows:
Electronic component is extracted in S4 and is inserted into dot center's line distance, and circuit board plate hole centre distance is extracted in S4,
When the two meets tolerance matching condition, it can assert that the two may be implemented effectively to insert；
S6, position and pose adjustment are carried out to clamp device, steps are as follows:
According to the electronic component image characteristic parameter that S4 is extracted, position and the Attitude estimation value of electronic component are obtained, and with
The image template value of electronic component image collection point makes the difference in S2, obtains the first translational component and the first rotational component and is transported
Dynamic learn against solution passes to joint control, to control the rotation and movement in joint, realizes position and the posture correction of clamp device；
S7, clamp device clamp electronic component；
S8, position and pose adjustment are carried out to clamp device, steps are as follows:
According to the circuit board image characteristic parameter that S4 is extracted, obtain position and the Attitude estimation value of circuit board, and in S2
The image template value of circuit board image collection point makes the difference, and obtains the second translational component and the second rotational component and carries out Inverse Kinematics
Solution passes to joint control, to control the rotation and movement in joint, realizes position and the posture correction of clamp device；
Electronic component is inserted into circuit board by S9, clamp device；
After completing an electronic component plug-in unit, step S3 to S9 is continued cycling through, forms plug-in unit assembly line.
Preferably, the step of calibration is as follows,
1) acquiring in electronic component image collection point in height is zccFigure with n infull collinear feature points in plane
Picture records each point image coordinate, obtains world coordinates of the n characteristic point under basis coordinates system by teaching machine, wherein n, which takes, to be greater than
Integer equal to 3, zccFor the height being manually set when clamping electronic component teaching, in circuit board image collection point, acquisition is in height
For zcpImage with n incomplete conllinear characteristic points in plane, records each point image coordinate, special by n of teaching machine acquisition
World coordinates of the sign point under basis coordinates system, wherein n takes the integer more than or equal to 3, wherein zcpWhen to be inserted into electronic component teaching
The height of artificial settings, basis coordinates system are the world coordinate systems established at robot base origin；
2) the corresponding image coordinate of characteristic point on electronic component and world coordinates are substituted into the transformation of two dimensional affine model respectively
Formula obtains the transformation matrix H of electronic component image collection point by least square method,
Electronic component two dimensional affine model transformation for mula is as follows:
Wherein, (xwi, ywi) be basis coordinates system under electronic component characteristic point world coordinates, (uci, vci) it is that electronic component is special
Coordinate of the sign point under image coordinate system, i=1,2 ..., n；
The corresponding image coordinate of characteristic point on circuit board and world coordinates are substituted into two dimensional affine model transformation for mula respectively,
By least square method, the transformation matrix K of circuit board image collection point is obtained,
Circuit board two dimensional affine model transformation for mula is as follows:
Wherein, (Xwi, Ywi) be basis coordinates system under circuit board features point world coordinates, (Uci, Vci) it is circuit board features point
Coordinate under image coordinate system, i=1,2 ..., n.
Preferably, it sets original template and calculates initial deviation, steps are as follows,
A width initiating electron element image is acquired, carries out image by the way of mean filter, Threshold segmentation, convex closure processing
Pretreatment, and its centre coordinate, angle direction characteristic parameter are extracted, obtain two characteristic point P1 and P2 on electronic component
Image coordinate (u1,v1), (u2,v2), center point image coordinate are as follows:
Image coordinate is converted to world coordinate system:
Clamp device is moved into (xc,yc) at, remember that current clamp device coordinate is (xc,yc,zc,θc), zcFor teaching of rectifying a deviation
When the safe altitude that sets,
The mobile clamp device center of manual teaching is overlapped with electronic component geometric center, remembers that relative movement distance and angle are inclined
Difference is (xoffset,yoffset,0,θoffset),
Wherein (xc0,yc0) and θc0The clamp device position set when teaching and rotation angle are clamped for electronic component；
Acquire a width initial circuit plate image, first progress Threshold segmentation, be then based on area and the round degree of characteristics selection to
It inserts circuit board apertures and carries out Connected area disposal$, sub-pixel edge extraction is carried out to the circuit board apertures region to be inserted of acquisition, is finally adopted
With the fitting process rejected based on outlier, edge point is fitted, it is special to obtain the center position coordinates to jack, angle direction
Parameter is levied, and its centre coordinate, angle direction characteristic parameter are extracted, obtains two characteristic point K1 and K2 on electronic component
Image coordinate (U1,V1)、(U2,V2), center point image coordinate are as follows:
Image coordinate is converted to world coordinate system:
Clamp device is moved into (Xc, Yc) at, remember that current clamp device coordinate is (Xc, Yc, Zc, ɑc), ZcFor teaching of rectifying a deviation
When the safe altitude that sets,
The mobile clamp device center of manual teaching is overlapped with circuit board geometric center, remembers relative movement distance and angular deviation
For (Xoffset, Yoffset, 0, ɑoffset),
Wherein (Xc0, Yc0) and ɑc0The clamp device position set when teaching and rotation angle are inserted for circuit board.It is preferred that
, fit procedure reject by generation to outlier, and implementation is,
Construct minimum mean-square error formula:
Wherein: (xc, yc) it is the central coordinate of circle estimated when former generation, R is radius；
By εiIt is converted to about parameter beta to be estimatediLinear forms:
Wherein: β1=-2xc, β2=-2yc,
New error formula is constructed using robust iterative method:
Take i-th of weight factor to match point are as follows:
Wherein, Enable ρ (ε) to βjLocal derviation is asked to be equal to zero:
Take the weight factor ω initially for all sampled pointsi=1, and above-mentioned solution procedure is subjected to successive ignition solution,
Contemporary optimized parameter β can be acquiredj, so that the more accurate center of circular hole coordinate of acquisition and radius, the number of iterations take 2~5 times.
Preferably, the matching condition are as follows:
Electronic component is inserted into dot center's line distance within an acceptable error range, and error range takes ec∈[-δc,
δc]；
Wherein, ec=Lc-lc, it is inserted into for electronic component inclined between the detected value and standard value of dot center's line distance
Difference, δcFor ecAcceptable error float value；lcDot center's line is inserted into for the electronic component that image detection device detects
Distance, LcThe gauged distance of dot center's line is inserted into for electronic component；
The difference of circuit board plate hole line of centres distance and standard line distance within an acceptable error range, error model
It encloses and takes eh∈[-δh,δh]；
Wherein, eh=Lh-lh, it is the deviation between the detected value and standard value of circuit board plate hole centre distance, δhFor ehIt can
The error float value of receiving；lhFor the circuit board plate hole centre distance that image detection device detects, LhFor in circuit board plate hole
The gauged distance of the heart；
The difference that electronic component is inserted between dot center's line distance and circuit board plate hole line of centres distance can connect
In the error range received, error range takes ech∈[-δch,δch]；
Wherein, ech=lc-lh, detected value and the circuit board plate hole center of dot center's line distance are inserted into for electronic component
Deviation between the detected value of distance, δchFor echAcceptable error float value；
Wherein, δc、δhAnd δchValue range it is equal are as follows: 0~0.2mm；
Wherein, the gauged distance and electronic component at circuit board plate hole center are inserted into the gauged distance of dot center's line by giving birth to
Manufacturer is produced to provide.
Preferably, the first translational component acquisition modes are as follows:
First rotational component acquisition modes are as follows:
C=θ+θoffset；
Wherein, (u1,v1), (u2,v2) be respectively two characteristic point P1 and P2 on electronic component template image image coordinate,
(u′1,v′1), (u '2,v′2) it is respectively characteristic point P1 ' corresponding with electronic component template image on institute's acquisition electronics image
And the image coordinate of P2 ', (xoffset,yoffset) be electronic component template characteristic center and the clamp device center it is initial partially
Shifting amount, θ are the angular deviation in Current electronic element characteristics direction and electronic component template characteristic direction, θoffsetFor electronic component
The initial angular offset amount of template image.
Second translational component acquisition modes are as follows:
Preferably, the second rotational component acquisition modes are as follows:
D=α+αoffset；
Wherein, (U1,V1)、(U2,V2) be respectively two characteristic point K1 and K2 on circuit board template image image coordinate,
(U1’,V1’)、(U2’,V2') be respectively on institute's collecting circuit board image characteristic point K1 ' corresponding with circuit board template image and
The image coordinate of K2 ', (Xoffset,Yoffset) be circuit board module plate features center and clamp device center initial offset, α is
The angular deviation in current signature direction and template characteristic direction, αoffsetFor the initial angular offset amount of template image.
As shown in figs. 6-9, a kind of electronic component inserting apparatus, including image collecting device, image processing apparatus, work
Industry robot, control device, clamp device and pressure apparatus are set to the first work to inserting electronic components and device, circuit board to be inserted
Make on platform 51, industrial robot is set on the second workbench 52.Image processing apparatus is connect with image collecting device signal, is used
In the image of electronic component and circuit board that processing image acquisition device arrives, control device controls industrial robot, clamping
Device and pressure apparatus movement, industrial robot can change position and the angle of clamp device under control of the control means,
Clamp device can apply pressure for clamping or placing electronic component, pressure apparatus on the electronic component that clamp device is placed
Power.Image processing apparatus can to image acquisition device to electronic component and circuit board image carry out characteristic parameter mention
It takes, electronic component and circuit board are able to carry out Adaptive matching according to features above parameter, without artificial in advance by electronic component
It is set with circuit board parameter, substantially increases the automation inserting efficiency of electronic component.For electronic component or circuit
The different placement angle of plate, placement position, industrial robot pass through the correction to clamp device progress position and posture, clamping dress
Electronic component can accurately be clamped and accurately insert on circuit board by setting, and improve automation inserting efficiency.Control device can
Apply pressure to control pressure apparatus to electronic component, therefore can be to the electronic component for needing additional application pressure to be inserted
Apply pressure to be inserted, keeps inserting more firm, the circuit board of inserting is more reliable.
Preferably, the industrial machine artificially has the industrial four-degree-of-freedom machine of three rotary joints and a linear joint
Device people, industrial robot include pedestal 11, first rotating arm 12, the second rotating arm 13, screw rod 14, the first rotating arm 12
One end is articulated with pedestal 11, one end of hinged second rotating arm 13 of the other end of first rotating arm 12, the second rotating arm 13
Other end is rotatablely connected screw rod 14, and 14 lower end of screw rod connects clamp device and pressure apparatus, and industrial robot passes through rotation the
In the position of horizontal plane, screw rod 14, which moves up and down, to be adjusted for one rotating arm 12 and the second rotating arm 13 adjustment clamp device and pressure apparatus
Whole clamp device and pressure apparatus and the distance between electronic component or circuit board, it is dynamic around the rotation of itself axis by screw rod 14
Adjust the angle of clamp device and pressure apparatus.Pass through the setting of first rotating arm 12, the second rotating arm 13 and screw rod 14, energy
According to the electronic component placement position different with circuit board and placement angle, clamp device and pressure apparatus position are neatly adjusted
And angle, therefore can accurately clamp electronic component and accurately insert on circuit board.
Preferably, pressure apparatus includes the first pressure device 31 of rectangular array arrangement, second pressure device 32, third
Pressure apparatus 33 and the 4th pressure apparatus 34, clamp device are located at the center of rectangular array.After this structure, first pressure
Device 31, second pressure device 32, third pressure apparatus 33 and the 4th pressure apparatus 34 can be to electronics at its center
Element applies pressure, and inserting scheme is richer, inserts more reliable.
Control device includes gas source 44, the first solenoid directional control valve 41, the second solenoid directional control valve 42 and third solenoid directional control valve
43, clamp device is connected to by the first solenoid directional control valve 41 with gas source 44, and first pressure device 31 and third pressure apparatus 33 divide
Not Tong Guo the second solenoid directional control valve 42 be connected to gas source 44, second pressure device 32 and the 4th pressure apparatus 34 pass through third respectively
Solenoid directional control valve 43 is connected to gas source 44.Different pressure apparatus difference or combinative movement are controlled by each solenoid directional control valve,
First pressure device 31, second pressure device 32, third pressure apparatus 33 and the 4th pressure apparatus 34 can be made to electronics member
Part is respectively or combination applies pressure, to meet the inserting requirement of different types of electronic component.
In the present embodiment, first pressure device 31, second pressure device 32, third pressure apparatus 33 and the 4th pressure apparatus
34 be respectively the first cylinder, the second cylinder, third cylinder and the 4th cylinder.By to the first solenoid directional control valve 41, the second electromagnetism
Reversal valve 42 and third solenoid directional control valve 43 input different instructing combinations, realize respectively to through-hole mounting shaped element, diagonally
Effective inserting of stress inserting heterotype element and quadrangle stress shaped element.For conventional through holes inserting element, can be pressed from both sides in element
Place is set in fetch bit, obtains the ET2 of the first solenoid directional control valve 41 electric, and ET1 power loss clamps shaped element, when the member to be inserted
When part reaches card address, obtain the ET1 of the first solenoid directional control valve 41 electric, ET2 power loss places shaped element；For right
Angle stress inserting shaped element obtains the ET1 of the first solenoid directional control valve 41 electric, ET2 power loss is to shaped element at card address
It is placed, and it is electric to obtain the ET3 of the second solenoid directional control valve 42 or the ET4 of third solenoid directional control valve 43, makes the first cylinder and
The ejection of three cylinders or the ejection of the second cylinder and the 4th cylinder, carry out the inserting of shaped element；For the abnormal shape of quadrangle stress
Element obtains the ET1 of the first solenoid directional control valve 41 electric, ET2 power loss places shaped element, and makes at card address
The ET3 of the second solenoid directional control valve 42 and ET4 of third solenoid directional control valve 43 obtains electric, makes the first cylinder, the second cylinder, third cylinder
It is ejected simultaneously with the 4th cylinder, realizes the inserting of shaped element.
The various control combination of clamp device and pressure apparatus is greatly improved towards different elements inserting process
Versatility and adaptability.
Control device further includes speed control valve 45, and speed control valve 45 is arranged in clamp device and the first solenoid directional control valve
Between 41, the speed that is opened or closed for controlling clamping opening 21.After this structure, adjusting is facilitated to clamp or place electronics member
The speed of part is conducive to the speed of control electronics inserting.
Control device further includes filtering pressure reducing valve 46, and filtering pressure reducing valve 46 is arranged close to gas source 44.46 energy of filtering pressure reducing valve
Pressure-reduced and-regulated effect is provided, makes pressure apparatus clamping, place electronic component or apply stressed process on electronic component more
Steadily.
Generally speaking, the present invention has the advantage that
Characteristic parameter is carried out in such a way that the image to electronic component is using mean filter, Threshold segmentation, convex closure processing
It extracts, Threshold segmentation is carried out to the image of circuit board, area is then based on and selects to inserting plate hole and be connected to the round degree of characteristics
Domain processing carries out sub-pixel edge extraction to inserting plate hole region to acquisition, and carries out characteristic parameter extraction using fitting process, makes
The characteristic parameter of extraction is more accurate.Adaptive matching can be carried out according to features above parameter by algorithm, be not necessarily to artificial thing
First electronic component and circuit board parameter are set, electronic component screening without relying on priori knowledge, for electronic component or
The different placement angle of person's circuit board, placement position, by carrying out the correction of position and posture, clamp device energy to clamp device
It accurately clamps electronic component and accurately inserts on circuit board, improve automation inserting efficiency.Control device can be controlled
Pressing pressure device applies pressure to electronic component, applies pressure to the electronic component for needing additional application pressure to be inserted and carries out
Inserting keeps inserting more firm.
The above embodiment is a preferred embodiment of the present invention, but embodiments of the present invention are not by above-described embodiment
Limitation, other any changes, modifications, substitutions, combinations, simplifications made without departing from the spirit and principles of the present invention,
It should be equivalent substitute mode, be included within the scope of the present invention.
Claims (10)
1. a kind of electronic component insertion method, it is characterised in that: include the following steps,
S1, image collecting device is demarcated；
S2, the original template for setting electronic component and circuit board simultaneously calculate initial deviation；
S3, Image Acquisition is carried out to electronic component；Image Acquisition is carried out to circuit board；
S4, image is carried out by the way of mean filter, Threshold segmentation, convex closure processing to electronic component image collected in S3
Pretreatment, and its centre coordinate, angle direction characteristic parameter are extracted；
To circuit board image collected in S3, first progress Threshold segmentation, it is then based on area and the round degree of characteristics selection is to be inserted
Circuit board apertures simultaneously carry out Connected area disposal$, carry out sub-pixel edge extraction to the circuit board apertures region to be inserted of acquisition, finally use
Based on the fitting process that outlier is rejected, edge point is fitted, obtains center position coordinates, the angle direction feature to jack
Parameter；
S5, the S4 electronic component image feature extracted and circuit board image feature are subjected to Adaptive matching, successful match then turns
S6, matching is unsuccessful, gives up Current electronic element, turns S3；
Matching process implementation method are as follows:
Electronic component is extracted in S4 and is inserted into dot center's line distance, circuit board plate hole centre distance is extracted in S4, when two
When person meets tolerance matching condition, it can assert that the two may be implemented effectively to insert；
S6, position and pose adjustment are carried out to clamp device, steps are as follows:
According to the electronic component image characteristic parameter that S4 is extracted, obtain position and the Attitude estimation value of electronic component, and in S2
The image template value of electronic component image collection point makes the difference, and obtains the first translational component and the first rotational component and carries out kinematics
Inverse solution passes to joint control, to control the rotation and movement in joint, realizes position and the posture correction of clamp device；
S7, clamp device clamp electronic component；
S8, position and pose adjustment are carried out to clamp device, steps are as follows:
According to the circuit board image characteristic parameter that S4 is extracted, obtain position and the Attitude estimation value of circuit board, and with circuit in S2
The image template value of plate Image Acquisition point makes the difference, and obtains the second translational component and the second rotational component and carries out Inverse Kinematics Solution biography
Joint control is passed, to control the rotation and movement in joint, realizes position and the posture correction of clamp device；
Electronic component is inserted into circuit board by S9, clamp device；
After completing an electronic component plug-in unit, step S3 to S9 is continued cycling through, forms plug-in unit assembly line.
2. a kind of electronic component insertion method described in accordance with the claim 1, it is characterised in that: the step of calibration, is as follows,
1) acquiring in electronic component image collection point in height is zccImage with n infull collinear feature points in plane, note
Each point image coordinate is recorded, world coordinates of the n characteristic point under basis coordinates system is obtained by teaching machine, wherein n takes more than or equal to 3
Integer, zccFor the height being manually set when clamping electronic component teaching, in circuit board image collection point, acquisition is z in heightcp
Image with n incomplete conllinear characteristic points in plane, records each point image coordinate, the n characteristic point obtained by teaching machine
World coordinates under basis coordinates system, wherein n takes the integer more than or equal to 3, wherein zcpIt is artificial when to be inserted into electronic component teaching
The height of setting, basis coordinates system are the world coordinate systems established at robot base origin；
2) the corresponding image coordinate of characteristic point on electronic component and world coordinates are substituted into two dimensional affine model transformation for mula respectively,
By least square method, the transformation matrix H of electronic component image collection point is obtained,
Electronic component two dimensional affine model transformation for mula is as follows:
Wherein, (xwi, ywi) be basis coordinates system under electronic component characteristic point world coordinates, (uci, vci) it is electronic component characteristic point
Coordinate under image coordinate system, i=1,2 ..., n；
The corresponding image coordinate of characteristic point on circuit board and world coordinates are substituted into two dimensional affine model transformation for mula respectively, passed through
Least square method obtains the transformation matrix K of circuit board image collection point,
Circuit board two dimensional affine model transformation for mula is as follows:
Wherein, (Xwi, Ywi) be basis coordinates system under circuit board features point world coordinates, (Uci, Vci) it is that circuit board features point is being schemed
As the coordinate under coordinate system, i=1,2 ..., n.
3. a kind of electronic component insertion method described in accordance with the claim 1, it is characterised in that: setting original template simultaneously calculates just
Beginning deviation, steps are as follows,
A width initiating electron element image is acquired, image is carried out by the way of mean filter, Threshold segmentation, convex closure processing and locates in advance
Reason, and its centre coordinate, angle direction characteristic parameter are extracted, obtain the image of two characteristic point P1 and P2 on electronic component
Coordinate (u1,v1), (u2,v2), center point image coordinate are as follows:
Image coordinate is converted to world coordinate system:
Clamp device is moved into (xc,yc) at, remember that current clamp device coordinate is (xc,yc,zc,θc), zcTo be set when correction teaching
Safe altitude,
The mobile clamp device center of manual teaching is overlapped with electronic component geometric center, remembers relative movement distance and angular deviation is
(xoffset,yoffset,0,θoffset),
Wherein (xc0,yc0) and θc0The clamp device position set when teaching and rotation angle are clamped for electronic component；
A width initial circuit plate image is acquired, first progress Threshold segmentation, is then based on area and the round degree of characteristics selection to plug-in
Road plate hole simultaneously carries out Connected area disposal$, carries out sub-pixel edge extraction to the circuit board apertures region to be inserted of acquisition, finally uses base
In the fitting process that outlier is rejected, edge point is fitted, obtains the center position coordinates to jack, angle direction feature is joined
Number, and its centre coordinate, angle direction characteristic parameter are extracted, obtain the image of two characteristic point K1 and K2 on electronic component
Coordinate (U1,V1)、(U2,V2), center point image coordinate are as follows:
Image coordinate is converted to world coordinate system:
Clamp device is moved into (Xc, Yc) at, remember that current clamp device coordinate is (Xc, Yc, Zc, ɑc), ZcTo be set when correction teaching
Safe altitude,
The mobile clamp device center of manual teaching is overlapped with circuit board geometric center, remembers relative movement distance and angular deviation is
(Xoffset, Yoffset, 0, ɑoffset),
Wherein (Xc0, Yc0) and ɑc0The clamp device position set when teaching and rotation angle are inserted for circuit board.
4. a kind of electronic component insertion method described in accordance with the claim 1, it is characterised in that: fit procedure carries out outlier
It is rejected by generation, implementation is,
Construct minimum mean-square error formula:
Wherein: (xc, yc) it is the central coordinate of circle estimated when former generation, R is radius；
By εiIt is converted to about parameter beta to be estimatediLinear forms:
Wherein: β1=-2xc, β2=-2yc, β3=xc 2+yc 2-R2；
New error formula is constructed using robust iterative method:
Take i-th of weight factor to match point are as follows:
Wherein,Enable ρ (ε) to βjLocal derviation is asked to be equal to zero:
Take the weight factor ω initially for all sampled pointsi=1, and above-mentioned solution procedure is subjected to successive ignition solution, it can acquire
Contemporary optimized parameter βj, so that the more accurate center of circular hole coordinate of acquisition and radius, the number of iterations take 2~5 times.
5. a kind of electronic component insertion method described in accordance with the claim 1, it is characterised in that: the matching condition are as follows:
Electronic component is inserted into dot center's line distance within an acceptable error range, and error range takes ec∈[-δc,δc]；
Wherein, ec=Lc-lc, the deviation between the detected value and standard value of dot center's line distance, δ are inserted into for electronic componentc
For ecAcceptable error float value；lcIt is inserted into dot center's line distance for the electronic component that image detection device detects,
LcThe gauged distance of dot center's line is inserted into for electronic component；Circuit board plate hole line of centres distance and standard line distance
Within an acceptable error range, error range takes e to differenceh∈[-δh,δh]；
Wherein, eh=Lh-lh, it is the deviation between the detected value and standard value of circuit board plate hole centre distance, δhFor ehIt is acceptable
Error float value；lhFor the circuit board plate hole centre distance that image detection device detects, LhFor circuit board plate hole center
Gauged distance；
Electronic component is inserted into the difference between dot center's line distance and circuit board plate hole line of centres distance acceptable
In error range, error range takes ech∈[-δch,δch]；
Wherein, ech=lc-lh, the detected value and circuit board plate hole centre distance of dot center's line distance are inserted into for electronic component
Detected value between deviation, δchFor echAcceptable error float value；
Wherein, δc、δhAnd δchValue range it is equal are as follows: 0~0.2mm；
Wherein, the gauged distance and electronic component at circuit board plate hole center are inserted into the gauged distance of dot center's line by factory
Quotient provides.
6. a kind of electronic component insertion method described in accordance with the claim 1, it is characterised in that: the first translational component acquisition modes
It is as follows:
First rotational component acquisition modes are as follows:
C=θ+θoffset；
Wherein, (u1,v1), (u2,v2) be respectively two characteristic point P1 and P2 on electronic component template image image coordinate, (u1′,
v′1), (u '2,v′2) it is respectively characteristic point P1 ' and P2 ' corresponding with electronic component template image on institute's acquisition electronics image
Image coordinate, (xoffset,yoffset) be electronic component template characteristic center and the clamp device center initial offset,
θ is the angular deviation in Current electronic element characteristics direction and electronic component template characteristic direction, θoffsetFor electronic component Prototype drawing
The initial angular offset amount of picture；
Second translational component acquisition modes are as follows:
Second rotational component acquisition modes are as follows:
D=α+αoffset；
Wherein, (U1,V1)、(U2,V2) be respectively two characteristic point K1 and K2 on circuit board template image image coordinate, (U1’,
V1’)、(U2’,V2') be respectively characteristic point K1 ' and K2 ' corresponding with circuit board template image on institute's collecting circuit board image figure
As coordinate, (Xoffset,Yoffset) be circuit board module plate features center and clamp device center initial offset, α is current spy
Levy the angular deviation in direction and template characteristic direction, αoffsetFor the initial angular offset amount of template image.
7. a kind of electronic component inserting apparatus, it is characterised in that: including image collecting device, image processing apparatus, industrial machine
People, control device, clamp device and pressure apparatus, image processing apparatus are connect with image collecting device signal, for handling figure
As the image of acquisition device collected electronic component and circuit board, control device controls industrial robot, clamp device and pressure
Power device action, industrial robot can change position and the angle of clamp device, clamp device under control of the control means
For clamping or placing electronic component, pressure apparatus can apply pressure on the electronic component that clamp device is placed.
8. a kind of electronic component inserting apparatus according to claim 7, it is characterised in that: the industrial machine artificially has
The industrial four-degree-of-freedom robot of three rotary joints and a linear joint, industrial robot include pedestal, first rotating arm,
Second rotating arm, screw rod, one end of the first rotating arm are articulated with pedestal, hinged second rotation of the other end of first rotating arm
One end of pivoted arm, the other end of the second rotating arm are rotatablely connected screw rod, and screw lower end connects clamp device and pressure apparatus, work
Industry robot adjusts clamp device and pressure apparatus in the position of horizontal plane, silk by rotation first rotating arm and the second rotating arm
Bar, which moves up and down, adjusts clamp device and pressure apparatus and the distance between electronic component or circuit board, by screw rod around itself
The angle of spinning movement the adjustment clamp device and pressure apparatus of axis.
9. a kind of electronic component inserting apparatus according to claim 7, it is characterised in that: pressure apparatus includes in rectangle battle array
First pressure device, second pressure device, third pressure apparatus and the 4th pressure apparatus of arrangement are arranged, clamp device is located at rectangle
The center of array.
10. a kind of electronic component inserting apparatus according to claim 9, it is characterised in that: control device includes gas source,
One solenoid directional control valve, the second solenoid directional control valve and third solenoid directional control valve, clamp device pass through the first solenoid directional control valve and gas source
Connection, the second solenoid directional control valve controls simultaneously is located at cornerwise two pressure apparatus of rectangular array, and third solenoid directional control valve is same
When control be located at another cornerwise two pressure apparatus of rectangular array.
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| CN113808067A (en) * | 2020-06-11 | 2021-12-17 | 广东美的白色家电技术创新中心有限公司 | Circuit board detection method, visual detection equipment and device with storage function |
| CN111818790A (en) * | 2020-07-30 | 2020-10-23 | 成都乐创自动化技术股份有限公司 | Method, system and device for positioning and monitoring electronic element of component inserter |
| CN111818790B (en) * | 2020-07-30 | 2021-06-15 | 成都乐创自动化技术股份有限公司 | Method, system and device for positioning and monitoring electronic element of component inserter |
| CN114841950A (en) * | 2022-04-24 | 2022-08-02 | 大连保税区星隆国际工贸有限公司 | Printed circuit board element tracking system and method based on dynamic detection |
| CN117082850A (en) * | 2023-09-15 | 2023-11-17 | 芜湖雅葆轩电子科技股份有限公司 | Same-point sequential patch device of multi-element group |
| CN117082850B (en) * | 2023-09-15 | 2024-02-20 | 芜湖雅葆轩电子科技股份有限公司 | Same-point sequential patch device of multi-element group |
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