CN109285964B - Flexible display panel, preparation method thereof and flexible display device - Google Patents
Flexible display panel, preparation method thereof and flexible display device Download PDFInfo
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- CN109285964B CN109285964B CN201811141122.7A CN201811141122A CN109285964B CN 109285964 B CN109285964 B CN 109285964B CN 201811141122 A CN201811141122 A CN 201811141122A CN 109285964 B CN109285964 B CN 109285964B
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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Abstract
The invention discloses a flexible display panel, a preparation method thereof and a flexible display device, wherein the flexible display panel comprises the following components: a flexible substrate; a plurality of pixel isolation columns and a plurality of organic light-emitting units are formed on the flexible substrate, and each organic light-emitting unit is positioned between two adjacent pixel isolation columns; a first inorganic thin film layer is formed on one side, far away from the flexible substrate, of each pixel isolation column and each organic light emitting unit; an organic thin film layer is formed on one side, far away from the flexible substrate, of the first inorganic thin layer in the area corresponding to each organic light-emitting unit; and a second inorganic thin film layer is formed on one side, far away from the flexible substrate, of the first inorganic thin layer in the area corresponding to each pixel isolation column. The flexible display panel has good packaging effect and is beneficial to prolonging the service life of the OLED device formed on the flexible display panel.
Description
Technical Field
The invention relates to the technical field of display, in particular to a flexible display panel, a preparation method thereof and a flexible display device.
Background
Organic light-emitting diodes (OLEDs) have the advantages of self-luminescence, wide viewing angle, low power consumption and the like, OLED devices can be used as light-emitting elements of a display panel to manufacture an OLED display panel, and a substrate in the OLED display panel can be a flexible substrate to manufacture the flexible display panel.
Because the electrode material and the luminescent material in the OLED device are sensitive to oxygen and water vapor, the OLED device needs to be effectively packaged, so that the OLED device is fully separated from the components such as water vapor, oxygen and the like in the atmosphere, and the service life of the OLED display panel can be prolonged.
For the flexible OLED display panel, a Thin Film Encapsulation (TFE) method may be adopted, where the Thin film encapsulation is to cover a whole Thin film encapsulation layer composed of an inorganic Thin film layer and an organic Thin film layer on the surface of the OLED device, so that moisture and oxygen are difficult to penetrate into the OLED device.
The film packaging mode is that a whole layer of film packaging layer is used for packaging, the elasticity of the inorganic thin film layer is low, mechanical stress is not favorably dispersed, and the organic thin film layer and the inorganic thin film layer are easily separated or broken in the process of long-time curling or folding and bending, so that the packaging failure of the film packaging layer is caused, and water vapor and oxygen enter the OLED device to cause the failure of the OLED device.
Disclosure of Invention
The invention provides a flexible display panel, a preparation method thereof and a flexible display device, and aims to overcome the defects in the related art.
According to a first aspect of embodiments of the present invention, there is provided a flexible display panel including:
a flexible substrate;
a plurality of pixel isolation columns and a plurality of organic light-emitting units are formed on the flexible substrate, and each organic light-emitting unit is positioned between two adjacent pixel isolation columns;
a first inorganic thin film layer is formed on one side, far away from the flexible substrate, of each pixel isolation column and each organic light emitting unit;
an organic thin film layer is formed on one side, far away from the flexible substrate, of the first inorganic thin layer in the area corresponding to each organic light-emitting unit;
and a second inorganic thin film layer is formed on one side, far away from the flexible substrate, of the first inorganic thin layer in the area corresponding to each pixel isolation column.
Optionally, the first inorganic thin film layer and the second inorganic thin film layer are further formed on a side surface of each pixel isolation pillar near an edge position of the flexible substrate.
Optionally, a surface of each organic thin film layer on a side away from the flexible substrate and a surface of each second inorganic thin film layer on a side away from the flexible substrate are in the same plane.
Optionally, each organic thin film layer and each second inorganic thin film layer are further covered with a protective film.
Optionally, the protective membrane is an organic membrane or a glass membrane.
According to a second aspect of the embodiments of the present invention, there is provided a method for manufacturing a flexible display panel, including:
providing a flexible substrate;
forming a plurality of pixel isolation columns and a plurality of organic light-emitting units on the flexible substrate, wherein each organic light-emitting unit is positioned between two adjacent pixel isolation columns;
forming a first inorganic thin film layer on the pixel isolation column and one side of the organic light-emitting unit far away from the flexible substrate;
forming an organic thin film layer on one side, far away from the flexible substrate, of the first inorganic thin layer in a region corresponding to each organic light emitting unit;
and forming a second inorganic thin film layer on one side, far away from the flexible substrate, of the first inorganic thin film layer in the region corresponding to each pixel isolation column.
Optionally, the first inorganic thin film layer and the second inorganic thin film layer are further formed on a side surface of each pixel isolation pillar near an edge position of the flexible substrate.
Optionally, the method further includes:
and forming a protective membrane on one side of each organic thin film layer and each second inorganic thin film layer far away from the flexible substrate.
Optionally, the protective film is bonded to each of the second inorganic thin layers under a temperature lower than a set temperature.
According to a third aspect of embodiments of the present invention, there is provided a flexible display device including: the flexible display panel of any of the above.
According to the technical scheme, the flexible display panel is characterized in that a double-layer thin film structure consisting of the first inorganic thin film layer and the organic thin film layer is formed on each organic light emitting unit, so that water vapor and oxygen in the air can be effectively prevented from entering the organic light emitting units, and a double-layer thin film structure consisting of the first inorganic thin film layer and the second thin film inorganic layer is formed on the pixel isolation column, so that water oxygen can be further prevented from entering the organic light emitting units from the edges of the two sides of the organic light emitting units, and a better packaging effect is achieved on the organic light emitting units.
Moreover, when the flexible display panel is curled or bent, the organic thin film layer can play a role in stress release, and due to the fact that the organic thin film layer is not of a structure covered by the whole layer, the organic thin film layer and the first inorganic thin film layer can be effectively prevented from being separated due to curling or bending, and the OLED device is prevented from losing efficacy due to packaging failure of the thin film packaging layer; furthermore, the organic thin film layers are respectively formed above the organic light-emitting units, when one organic thin film layer is broken or separated from the first organic thin film layer, the organic thin film layers of other parts cannot be influenced, the packaging effect is favorably improved, and the service life of the OLED device is prolonged.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic cross-sectional structure diagram of a flexible display panel according to an embodiment of the present invention;
fig. 2 is a schematic cross-sectional structure diagram of a flexible display panel according to another embodiment of the present invention;
fig. 3 is a flowchart illustrating a method for manufacturing a flexible display panel according to an embodiment of the present invention.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the invention, as detailed in the appended claims.
At present, a flexible display panel packaged by a film is adopted, the flexible display panel is repeatedly curled or folded and bent for many times, and an organic thin film layer and an inorganic thin film in a film packaging layer are easily separated, so that the packaging of the film packaging layer is invalid.
Accordingly, an embodiment of the present invention provides a flexible display panel, which, as shown in fig. 1, includes:
a flexible substrate 10;
a plurality of pixel isolation columns 20 and a plurality of organic light emitting units 30 are formed on the flexible substrate 10, and each organic light emitting unit 30 is located between two adjacent pixel isolation columns 20;
a first inorganic thin film layer 41 is formed on the side of each pixel isolation column 20 and each organic light emitting unit 30 away from the flexible substrate 10;
an organic thin film layer 42 is formed on a side of the first inorganic thin layer 41 away from the flexible substrate 10 in a region corresponding to each organic light emitting unit 30;
a second inorganic thin film layer 43 is formed on a side of the first inorganic thin layer 41 away from the flexible substrate 10 in a region corresponding to each pixel isolation pillar 20.
The flexible substrate is a substrate made of flexible material such as polyimide PI
A Polymer (PI), a Polycarbonate PC (PC) resin, also referred to as PC plastic, a Polyethylene terephthalate (PET) plastic, and the like.
The flexible substrate is used for bearing various structures arranged on the flexible substrate, such as various pixel isolation columns, various organic light emitting units, a first inorganic thin film layer, an organic thin film layer, a second inorganic thin film layer and the like.
The organic light-emitting units are the minimum light-emitting units formed on the flexible substrate, each organic light-emitting unit can emit light with a single color, for the flexible display panel for color picture display, a plurality of organic light-emitting units with different light-emitting colors can be combined into one pixel unit, and the required color can be displayed by controlling one or more organic light-emitting units in the pixel unit to emit light, so that the color picture display can be realized.
As shown in fig. 1, the organic light emitting unit 30 may include layers of an organic light emitting diode OLED 31, and may further include a thin film transistor array layer 32, where the thin film transistor array layer is a layer of a thin film transistor for controlling light emission of the organic light emitting diode, the organic light emitting diode includes, for example, an anode, an organic light emitting layer, a cathode, and the like, the organic light emitting layer may include a light emitting layer, and may further include one or a combination of layers of a hole injection layer, a hole transport layer, an electron blocking layer, a hole blocking layer, an electron transport layer, and an electron injection layer; the thin film transistor array layer includes, for example, a gate electrode layer, a gate insulating layer, an active layer, a source/drain electrode layer, a planarization layer, and the like.
The pixel isolation columns are used for limiting the area where the organic light-emitting unit is located, an organic light-emitting unit is formed between every two adjacent pixel isolation columns, and the area where the organic light-emitting unit is located is a light-emitting area.
The pixel isolation layer and the organic light-emitting unit are covered with a first inorganic thin film layer, the first inorganic thin film layer is formed on the surface of one side, away from the flexible substrate, of the pixel isolation layer and the organic light-emitting unit, the first inorganic thin film layer covers on each pixel isolation layer and the organic light-emitting unit, the first inorganic thin film layer is of a whole-layer covering type structure and is formed on the whole flexible substrate.
The organic thin film layer is located on the first inorganic thin film in the area corresponding to each organic light-emitting unit, namely the organic thin film layer is located on the surface of one side, away from the flexible substrate, of the first inorganic thin film and is located in the area where each organic light-emitting unit is located.
The second inorganic thin film layer is located on the first inorganic thin film in the area corresponding to each pixel isolation column, namely the second inorganic thin film layer is located on the surface of one side, away from the flexible substrate, of the first inorganic thin film and located in the area where each pixel isolation column is located.
For the organic light emitting diode OLED, an organic light emitting layer is sensitive to water vapor and oxygen, and an inorganic thin film layer has good water and oxygen resistance, so that the pixel isolation column and the organic light emitting unit are covered with the whole first inorganic thin film layer to play a role in blocking water vapor and oxygen so as to protect an OLED device.
The organic thin film layer has better toughness and elasticity, is beneficial to dispersing deformation stress during curling or bending, and plays roles of releasing stress and wrapping dust, so that the organic thin film layer is further formed above each organic light-emitting unit, is not a structure covered by the whole layer and is only arranged above the organic light-emitting units; and a second inorganic thin film layer is formed above the corresponding area of the pixel isolation column, and the second inorganic thin film layer and the organic thin film layer form a structure distributed at intervals because two adjacent organic light-emitting units are spaced by the pixel isolation column, and the organic thin film layer is divided by the second inorganic thin film layer.
As can be seen from the above description, in the flexible display panel of this embodiment, each organic light emitting unit is formed with a double-layer thin film structure composed of a first inorganic thin film layer and an organic thin film layer, so that water vapor and oxygen in the air can be effectively prevented from entering the organic light emitting unit, and the pixel isolation column is formed with a double-layer thin film structure composed of a first inorganic thin film layer and a second thin film inorganic layer, so that water and oxygen can be further prevented from entering the organic light emitting unit from the edges of the two sides of the organic light emitting unit, thereby performing a better encapsulation effect on the organic light emitting unit.
Moreover, when the flexible display panel is curled or bent, the organic thin film layer can play a role in stress release, and due to the fact that the organic thin film layer is not of a structure covered by the whole layer, the organic thin film layer and the first inorganic thin film layer can be effectively prevented from being separated due to curling or bending, the organic thin film layer is not prone to fracture, and the OLED device is prevented from being failed due to packaging failure of the thin film packaging layer; furthermore, the organic thin film layers are respectively formed above the organic light-emitting units, when one organic thin film layer is broken or separated from the first organic thin film layer, the organic thin film layers of other parts cannot be influenced, the packaging effect is favorably improved, and the service life of the OLED device is prolonged.
In an alternative embodiment, referring to fig. 1, the first and second inorganic thin film layers 41 and 43 are further formed on the side of each pixel isolation pillar 20 near the edge position of the flexible substrate 10.
The pixel isolation pillars near the edge of the flexible substrate refer to pixel isolation pillars located at the outermost peripheral edge among all the isolation pillars formed on the flexible substrate, for example, as shown in fig. 1, the pixel isolation pillars 20 located at the leftmost side and the rightmost side of the flexible substrate 10, the material of the pixel isolation pillars 20 is usually an organic material, although the organic material has a barrier effect on moisture and oxygen to some extent, but the organic material has a limited water and oxygen blocking effect, and by forming the first inorganic thin film layer and the second inorganic thin film layer on the side surfaces of the pixel isolation pillars near the edge of the flexible substrate, moisture and oxygen can be effectively prevented from entering the interior of the OLED device through the side edges of the flexible display panel to cause failure of the OLED device, thereby further improving the encapsulation effect.
The surface of the pixel isolation pillar on the side away from the flexible substrate may be referred to as an upper surface, and the side surface of the pixel isolation pillar refers to a surface located on the side surface of the pixel isolation pillar, as shown in fig. 1, the side surfaces of the pixel isolation pillars 20 except for the outermost peripheral edge pixel isolation pillar 20 may contact with the layers of the organic light emitting diode 31, and the first inorganic thin film layer 41 and the second inorganic thin film layer 43 may not be formed, and thus, the first inorganic thin film layer 41 and the second inorganic thin film layer 43 may be formed only on the side surface of each pixel isolation pillar 20 near the edge of the flexible substrate 10.
The side of the pixel isolation pillar 20 near the edge position of the flexible substrate 10 is a surface closer to the side of the edge of the flexible substrate 10, for example, the side is the position shown by the dotted line box a in fig. 1.
The materials of the first inorganic thin film layer and the second inorganic thin film layer can be selected from one or more of aluminum oxide, zinc oxide, titanium oxide, silicon dioxide, silicon nitride and zirconium oxide; the material of the organic thin film layer can be selected from one or a combination of several of polyvinyl alcohol, polyurethane acrylate polymer and polyimide resin.
In some examples, as shown in fig. 2, the sides of each organic thin film layer 42 and each second inorganic thin film layer 43 away from the flexible substrate 10 are further covered with a protective film 50.
The pixel isolation layer and the organic light-emitting unit are covered with a first inorganic thin film layer, the first inorganic thin film layer is located on the surface of one side, away from the flexible substrate, of the pixel isolation layer and the organic light-emitting unit, the first inorganic thin film layer covers on each pixel isolation layer and each organic light-emitting unit, the first inorganic thin film layer is of a whole-layer covering type structure and is formed on the whole flexible substrate.
The organic thin film layer is formed in the area, corresponding to each organic light-emitting unit, of the first inorganic thin film layer, the second inorganic thin film layer is formed in the area, corresponding to each pixel isolation column, of the first inorganic thin film layer, the protection film covers the organic thin film layers and the second inorganic thin film layers, the protection film is of a whole-layer covering structure and is formed on the whole flexible substrate, the protection film is arranged, the organic light-emitting units can be protected, and water vapor and oxygen are further prevented from entering the OLED device.
The protective film can be an organic film or a glass film (such as ultrathin glass), the thickness of the protective film is usually thinner and is in the order of microns, the flexible effect of the flexible display panel can be ensured, cover plate glass can be omitted by arranging the protective film, the preparation process of the display panel is simplified, and the cost is reduced.
The protective film with a certain thickness can be bonded with the surface of each second inorganic thin film layer under the condition of lower than a set temperature (for example, lower than 100 ℃), namely, a low-temperature bonding mode is adopted, so that the influence of the temperature on the OLED device during bonding is reduced.
In an alternative embodiment, as shown in fig. 2, the surface of each organic thin film layer 42 on the side away from the flexible substrate 10 and the surface of each second inorganic thin film layer 43 on the side away from the flexible substrate 10 are in the same plane.
In this embodiment, as shown in fig. 2, the upper surface of each organic thin film layer 42 and the upper surface of each second inorganic thin film layer 43 are in the same plane, that is, the upper surface of each organic thin film layer 42 and the upper surface of each second inorganic thin film layer 43 are flush, so as to form a flat surface, which helps to ensure the effect of forming other film structures on the flat surface, for example, ensure the adhesion effect between each second inorganic thin film layer 43 and the protective film 50.
It should be noted that fig. 1 and fig. 2 only schematically show several pixel isolation pillars and several organic light emitting units, in practical applications, a relatively large number of pixel isolation pillars and organic light emitting units are usually formed on a substrate in a matrix arrangement, and the specific number of pixel isolation pillars and organic light emitting units is not limited in the present invention.
Other necessary film layers may be further included on the flexible display panel, and as shown in fig. 2, for example, other film layers 60, such as a buffer layer or other film layers, may be further formed between the flexible substrate 10 and each organic light emitting unit and each pixel isolation pillar.
The embodiment of the invention also provides a preparation method of the flexible display panel, as shown in fig. 3, the method comprises the following steps:
step S10, providing a flexible substrate;
step S20, forming a plurality of pixel isolation columns and a plurality of organic light-emitting units on the flexible substrate, wherein each organic light-emitting unit is positioned between two adjacent pixel isolation columns;
specifically, a pixel isolation layer can be formed on the flexible substrate, then the pixel isolation layer is patterned, the pixel isolation layer of each organic light-emitting unit area is removed, the pixel isolation layer of other parts is reserved, and each pixel isolation column is formed;
the organic light emitting unit may include each layer of the organic light emitting diode OLED, and may further include a thin film transistor array layer, and the step of forming each organic light emitting unit may be implemented by using an existing method and process, which is described in detail herein.
Step S30, forming a first inorganic thin film layer on the side of each pixel isolation column and each organic light-emitting unit far away from the flexible substrate;
specifically, an inorganic material layer may be formed on each pixel isolation pillar and each organic light emitting unit by coating, printing, or the like, and then the inorganic material layer may be cured to form the first inorganic thin film layer.
Step S40, forming an organic thin film layer on the side, far away from the flexible substrate, of the first inorganic thin film layer in the area corresponding to each organic light-emitting unit;
specifically, an organic material layer may be formed on the first inorganic thin layer, and then the organic material layer may be patterned, the organic material layer on the first inorganic thin layer in a region corresponding to each organic light emitting unit may be remained, and the organic material layer in the other region may be removed, such that an organic thin layer may be formed on the first inorganic thin layer in a region corresponding to each organic light emitting unit.
Or directly printing and forming an organic thin film layer on the first inorganic thin layer of the area corresponding to each organic light emitting unit.
Step S50, forming a second inorganic thin film layer on one side, far away from the flexible substrate, of the first inorganic thin film layer in the area corresponding to each pixel isolation column;
specifically, an inorganic material layer may be formed on each of the first inorganic thin layers and each of the organic thin layers, and then the inorganic material layer may be patterned, the inorganic material layer on the first inorganic thin layer in a region corresponding to each of the pixel isolation pillars may be remained, and the inorganic material layer in another region may be removed, so that a second inorganic thin layer may be formed on the first inorganic thin layer in a region corresponding to each of the pixel isolation pillars.
Or directly printing the second inorganic thin film layer on the first inorganic thin film layer in the area corresponding to each pixel isolation column.
Optionally, the first inorganic thin film layer and the second inorganic thin film layer are further formed on a side surface of each pixel isolation pillar near an edge position of the flexible substrate.
In some examples, the method further comprises:
and forming a protective membrane on one side of each organic thin film layer and each second inorganic thin film layer far away from the flexible substrate.
Further, the protective membrane is bonded with each second inorganic thin layer under the condition of lower than the set temperature.
The above processes for forming the pixel isolation pillar, the organic light emitting unit, the first inorganic thin film layer, the organic thin film layer, and the second inorganic thin film layer on the flexible substrate can be implemented by using existing processes, for example, for forming the pixel isolation pillar, the first inorganic thin film layer, the organic thin film layer, the second inorganic thin film layer, and the anode and the cathode in the organic light emitting unit, a patterning process or a printing process can be used, and the patterning process includes, for example: coating, exposing, developing, etching and/or stripping the photoresist; the process of forming the organic light emitting layer in the organic light emitting unit may adopt a vacuum evaporation process or printing, and the detailed process is not described herein.
An embodiment of the present invention further provides a flexible display device, including: the flexible display panel according to any of the above embodiments.
The OLED display device described above includes the flexible display panel described in the above embodiment. The display device can be used as any product or component with a display function, such as electronic paper, a mobile phone, a tablet personal computer, a television, a display, a notebook computer, a digital photo frame, a navigator, wearable equipment and the like.
Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.
Claims (9)
1. A flexible display panel, comprising:
a flexible substrate;
a plurality of pixel isolation columns and a plurality of organic light-emitting units are formed on the flexible substrate, and each organic light-emitting unit is positioned between two adjacent pixel isolation columns;
a first inorganic thin film layer is formed on one side, far away from the flexible substrate, of each pixel isolation column and each organic light emitting unit;
an organic thin film layer is formed on one side, far away from the flexible substrate, of the first inorganic thin layer in the area corresponding to each organic light-emitting unit;
a second inorganic thin film layer is formed on one side, far away from the flexible substrate, of the first inorganic thin layer in the area corresponding to each pixel isolation column;
the surface of the organic thin film layer far away from the flexible substrate and the surface of the second inorganic thin film layer far away from the flexible substrate are in the same plane.
2. Panel according to claim 1,
the first inorganic thin film layer and the second inorganic thin film layer are further formed on a side surface of each of the pixel isolation pillars at a position close to an edge of the flexible substrate.
3. Panel according to claim 1,
and one side of each organic thin film layer and each second inorganic thin film layer far away from the flexible substrate is also covered with a protective membrane.
4. Panel according to claim 3,
the protective membrane is an organic membrane or a glass membrane.
5. A method for manufacturing a flexible display panel, comprising:
providing a flexible substrate;
forming a plurality of pixel isolation columns and a plurality of organic light-emitting units on the flexible substrate, wherein each organic light-emitting unit is positioned between two adjacent pixel isolation columns;
forming a first inorganic thin film layer on the pixel isolation column and one side of the organic light-emitting unit far away from the flexible substrate;
forming an organic thin film layer on one side, far away from the flexible substrate, of the first inorganic thin layer in a region corresponding to each organic light emitting unit;
forming a second inorganic thin film layer on one side, far away from the flexible substrate, of the first inorganic thin film layer in the region corresponding to each pixel isolation column;
the surface of the organic thin film layer far away from the flexible substrate and the surface of the second inorganic thin film layer far away from the flexible substrate are in the same plane.
6. The method of claim 5, wherein:
the first inorganic thin film layer and the second inorganic thin film layer are further formed on a side surface of each of the pixel isolation pillars at a position close to an edge of the flexible substrate.
7. The method of manufacturing according to claim 5, further comprising:
and forming a protective membrane on one side of each organic thin film layer and each second inorganic thin film layer far away from the flexible substrate.
8. The production method according to claim 7,
and bonding the protective membrane with each second inorganic thin layer under the condition of lower than the set temperature.
9. A flexible display device, comprising: the flexible display panel of any one of claims 1-4.
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| CN105789262A (en) * | 2016-04-29 | 2016-07-20 | 京东方科技集团股份有限公司 | Flexible display substrate and manufacturing method thereof, and flexible display device |
| CN107732025A (en) * | 2017-09-25 | 2018-02-23 | 上海九山电子科技有限公司 | A kind of organic electroluminescence display panel and organic light-emitting display device |
| CN108258149B (en) * | 2018-01-19 | 2020-05-19 | 京东方科技集团股份有限公司 | Organic electroluminescent display panel, manufacturing method thereof and display device |
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