CN109283046B - Non-contact automatic measuring system for elastic stress and strain of material - Google Patents
Non-contact automatic measuring system for elastic stress and strain of material Download PDFInfo
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- G01N2203/0075—Strain-stress relations or elastic constants
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
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Abstract
The invention relates to a non-contact automatic measuring system for elastic stress and strain of a material, which is characterized in that: at least comprises the following steps: the internal-regulation type semiconductor laser is divided into a first collimated fiber coupling output device and a second collimated fiber coupling output device by a beam splitter, and the first collimated fiber coupling output device is vertically irradiated on a sample clamped by a sample fixing frame through a focusing lens group; and a photothermal infrared radiation stress strain measurement module is arranged on the other side of the sample, acquires a photothermal infrared radiation image when the sample is strained, and transmits the photothermal infrared radiation image to the calculation unit. The non-contact automatic measuring system for the elastic stress strain of the material can measure average/local, tensile/compressive, torsional stress, strain and deformation of the material and can realize effective inversion and reconstruction of a visual stress-strain field through digital image processing.
Description
Technical Field
The invention relates to industrial nondestructive testing and mechanical measurement and evaluation of elastic materials, in particular to a non-contact automatic measuring system for elastic stress and strain of materials.
Background
In an industrial production process, the mechanical strength of a material is an important detection index, and the characterization of the mechanical strength can be quantitatively described by stress-strain characteristics. For the produced raw materials, the materials are generally processed into columnar samples and placed on a tensile testing machine to complete tensile testing, and the characteristics of elasticity and plastic deformation and the mechanical strength of the samples are evaluated by recording the deformation of the samples and the change of tensile stress in the tensile process in real time.
There are three limitations to conventional tensile stress strain measurement systems: firstly, the stress and the strain of the material are recorded in the form of the average value of the whole sample, so that the distribution of the stress and the strain on the sample cannot be obtained, and the imaging is more difficult to realize; secondly, the material needs to be processed into a cylinder shape to ensure the accuracy of parameter measurement, and the measurement cannot be realized for material samples in other shapes; third, the measurement system generally provides only axial tensile loads and does not allow for comprehensive analysis of both normal (strain) and shear (strain) stresses.
Thus, improvements to stress-strain measurement systems can be made in two ways: (1) the stress-strain field distribution in the sample is obtained by scanning and measuring the sample under test on the premise of not contacting the material under test by researching and adopting a full non-contact local stress-strain measurement technology. (2) And a bending and torsion load applying module is added to realize the comprehensive mechanical strength test of the sample material.
For the full non-contact stress-strain measurement, the photo-thermal infrared radiation imaging technology can be adopted for quantitative characterization. Recent domestic and foreign researches show that local stress strain of the material can change local thermal diffusion characteristics of the material to form an anisotropic diffusion field, so that local stress strain parameters can be obtained by measuring and analyzing a thermal wave field generated by modulating laser incidence. On the other hand, the deformation of the sample under load in a single direction can be achieved by a fully contactless laser deflection measurement. The full non-contact measurement module can not only represent the local stress-strain parameter distribution of the sample, but also effectively test the mechanical strength of the sample in special environments (such as high temperature, high pressure, vacuum and the like), and has great practical value in military and civil industries.
At present, no relevant report that the full-contactless optical measurement system is applied to a material tensile mechanical strength measurement system exists.
Disclosure of Invention
The invention aims to provide a non-contact automatic measuring system for elastic stress-strain of a material, which can measure average/local, tensile/compressive, torsional stress, strain and deformation of the material and can realize effective inversion and reconstruction of a visual stress-strain field through digital image processing.
The invention aims to realize the purpose, and the non-contact automatic measuring system for the elastic stress strain of the material is characterized in that: at least comprises the following steps: the internal-regulation type semiconductor laser is divided into a first collimated fiber coupling output device and a second collimated fiber coupling output device by a beam splitter, and the first collimated fiber coupling output device is vertically irradiated on a sample clamped by a sample fixing frame through a focusing lens group; the other side of the sample is provided with a photo-thermal infrared radiation stress-strain measuring module, and the photo-thermal infrared radiation stress-strain measuring module acquires a photo-thermal infrared radiation image when the sample is strained and transmits the photo-thermal infrared radiation image to the computing unit; the second fiber coupling output device with collimation irradiates on the sample at an incidence angle smaller than 90 degrees through the collimation lens group, a light deflection deformation measuring module is arranged in an emergent angle direction symmetrical to the normal, and the light deflection deformation measuring module outputs light deflection information generated by sample strain and transmits the light deflection information to the computing unit; and the calculation unit performs information processing according to the light deflection information generated by sample strain and the photo-thermal infrared radiation image information generated by sample strain to obtain the deformation, stress and strain characteristic quantity of the sample measuring point.
The second collimating optical fiber coupling output device irradiates the sample at the incident angle smaller than 90 degrees through the collimating lens group at the same time, and the scanning unit is moved to irradiate different measuring irradiation points so as to obtain the deformation, stress and strain characteristic quantities of the different measuring points of the sample.
The first collimating optical fiber coupling output device obtains more than 70% of energy of the internal-regulation type semiconductor laser device for output; and the second fiber coupling output device with collimation obtains less than 30% of energy of the internal-regulation semiconductor laser device for output.
The beam splitter or the optical fiber coupler is used for splitting the internal-adjusting semiconductor laser into more than 70% of energy output and less than 30% of energy output through the optical fiber by the optical fiber beam splitter.
The internal modulation type semiconductor laser is controlled by a signal generation module, the signal generation module is controlled by a calculation unit, and the signal generation module sends a laser modulation signal to the internal modulation type semiconductor laser; the computing unit sends a signal source control signal to the signal generating module.
The signal generation module outputs two paths of reference signals at the same time, one path of reference signal is connected with the light deflection deformation measurement module, and the other path of reference signal is connected with the photo-thermal infrared radiation stress-strain measurement module.
The light deflection deformation measurement module comprises: the laser is output by an optical fiber output coupler with collimation, and the sample surface is irradiated after being collimated by a lens group and is used as induced laser of a light deflection measuring system; the reflected light generated by the surface of the sample passes through an optical knife edge, a small amount of light of the reflected light irradiates a photoelectric detector to generate an electric signal, and the electric signal is amplified by a preamplifier, detected by a phase locking module and transmitted to a computing unit; when the sample deforms under the action of load, the reflected light changes correspondingly, and the light energy penetrating through the knife edge is directly related to the deformation amount, so that the converted signal has the deformation information of the material sample.
The photo-thermal infrared radiation stress-strain measuring module comprises: mid-infrared CCD camera, germanium glass, mid-infrared thermal radiation; more than 70% of energy of the internal modulation type semiconductor laser is focused and irradiated to the surface of the sample through the focusing lens to be used as induced laser of a photo-thermal red thermal radiation signal; the irradiated sample locally generates periodic thermal diffusion waves and diffuses towards the back of the sample, the stray part of incident laser is effectively filtered after the intermediate infrared thermal radiation passes through the germanium glass, the scattered part is detected as a thermal radiation image by the intermediate infrared CCD camera, the thermal radiation image signal is output after the phase-locking detection of the phase-locking detection module, and the radiation image signal is transmitted to the computing unit.
The mobile scanning unit comprises: the device comprises a guide rail set and a motor set, wherein the guide rail set comprises two groups of straight guide rails and a group of rotary guide rails, the motor set comprises two groups of linear motors, a first collimating optical fiber coupling output device, a collimating lens set and a light deflection deformation measuring module are fixed in a guide rail seat on the guide rail set, the guide rail seat is connected with a motor set shaft, a computing unit drives the motor set to generate a motor control signal, and loads (stretching, bending and twisting) with different strengths, directions and types are applied to a sample through the motor set; the sample fixing frame is matched with a guide rail set and a motor set to realize continuous stress-strain loading, wherein two guide rails in the guide rail set are straight guide rails, and can provide axial tensile load and bending moment load vertical to the axial direction of the sample to be measured by matching with the motor; the third guide rail is a rotary guide rail and is matched with a large-torque motor to apply torsional load; the loads in the three directions can be applied sequentially or simultaneously, and the deformation and internal stress strain conditions of the material sample under the action of various external forces can be simulated.
The non-contact automatic measuring system for elastic stress and strain of the material only depends on a single light source, the light source is in an internal modulation mode, the laser output adopts harmonic modulation, and frequency domain optical signals are extracted for evaluation in a phase-locked detection mode in both the light deflection deformation measuring unit and the photo-thermal infrared radiation stress and strain measuring unit.
The reference signal of the phase locking module of the non-contact material elastic stress strain automatic measuring system provided by the invention is the same as the laser energy modulation signal, the reference signal is provided by the automatic control module of the computing unit, the detection signal is output to the data acquisition module of the computing unit, and the subsequent data processing and effective feature extraction are completed by the computing unit.
Drawings
FIG. 1 is a structural diagram of an automatic measuring system for elastic stress strain of a non-contact material according to the present invention;
FIG. 2 is a schematic diagram of an automatic measuring system for elastic stress strain of non-contact material according to the present invention;
FIG. 3 is a schematic diagram of a light deflection deformation measurement module according to the present invention;
FIG. 4 is a schematic diagram of a photothermal infrared radiation stress measurement module of the present invention.
The reference numbers and parts in the figures are specifically: 1-a fixed base, 2-a sample fixing frame, 3-a guide rail set (two groups of straight guide rails and one group of rotating guide rails), 4-a motor set (two groups of straight motors and one group of torque motors), 5-a stress sensor unit (a normal stress sensor and a shear stress sensor), 6-an all-optical measuring unit, 61-an internal adjusting semiconductor laser, 62-a signal generating module, 63-an optical fiber, 64-a beam splitter, 65A-a first collimating optical fiber coupling output device, 65B-a second collimating optical fiber coupling output device, 66-a focusing lens set, 67-a collimating lens set, 68-a light deflection deformation measuring module, 69-a light heat infrared radiation stress strain measuring module, 610-a reference signal, 611-a laser modulation signal and 681-an optical knife edge, 682-photodetector, 683-preamplifier, 684-phase-locked detection module, 685-modulated laser, 691-intermediate infrared CCD camera, 692-germanium glass, 693-intermediate infrared thermal radiation, 7-sample, 8-calculation unit, 9-light deflection signal, 91-signal source control signal, 92-light deflection measurement signal, 93-photothermal infrared radiation measurement signal, 10-stress sensor reading, 11-motor control signal.
Detailed Description
As shown in fig. 2, an automatic non-contact system for measuring elastic stress and strain of a material at least includes: the internal-regulation type semiconductor laser 61 is divided into a first output device 65A with collimation optical fiber coupling and a second output device 65B with collimation optical fiber coupling by a beam splitter 64, and the first output device 65A with collimation optical fiber coupling is vertically irradiated on a sample 7 clamped by a sample fixing frame 2 through a focusing lens group 66; the photo-thermal infrared radiation stress-strain measuring module 69 is arranged on the other side of the sample 7, and the photo-thermal infrared radiation stress-strain measuring module 69 acquires a photo-thermal infrared radiation image when the sample 7 is strained and transmits the photo-thermal infrared radiation image to the computing unit 8; the second fiber coupling output device with collimation 65B irradiates on the sample 7 at an incident angle smaller than 90 ° through the collimation lens group 67, and the emergent angle symmetrical to the normal is provided with the light deflection deformation measuring module 68, and the light deflection deformation measuring module 68 outputs the light deflection information 9 generated by the strain of the sample 7 and transmits the light deflection information to the calculating unit 8; the calculation unit 8 performs information processing according to the light deflection information generated by the strain of the sample 7 and the photo-thermal infrared radiation image information when the sample 7 is strained, and obtains the deformation, stress and strain characteristic quantity 10 of the measurement point of the sample 7.
The second collimated fiber coupler and follower 65B irradiates the sample 7 at an incident angle smaller than 90 ° through the collimating lens group 67, and irradiates the sample 7 at different measuring points by moving the scanning unit, so as to obtain the deformation, stress and strain characteristic quantities of the different measuring points of the sample 7.
The 65A of the first band collimation optical fiber coupling output device obtains more than 70% of energy of the internal modulation semiconductor laser 61 for output; the second collimated fiber coupler 65B obtains less than 30% of the energy of the internal modulation semiconductor laser 61 and outputs the energy.
The beam splitter 64 or the optical fiber beam splitter, and the internal adjusting semiconductor laser 61 is split into more than 70% energy output and less than 30% energy output by the optical fiber 63 through the optical fiber beam splitter.
The internal modulation type semiconductor laser 61 is controlled by a signal generating module 62, the signal generating module 62 is controlled by the calculating unit 8, and the signal generating module 62 sends a laser modulation signal 611 to the internal modulation type semiconductor laser 61; the calculation unit 8 sends a signal source control signal 91 to the signal generation module 62.
The signal generating module 62 simultaneously outputs two paths of information reference information 610, one path of reference information is electrically connected with the light deflection deformation measuring module 68, and the other path of reference information is connected with the photo-thermal infrared radiation stress-strain measuring module 69.
As shown in fig. 3, the light deflection deformation measurement module 68 includes: the modulated laser 685 is led out to the beam splitter 64 through the optical fiber 63, wherein the energy of one path is lower than 30%, preferably 10%, and is output through the optical fiber output coupler with collimation, and the collimated laser is irradiated on the surface of the sample 7 by the lens group 67 and is used as the induced laser of the light deflection measuring system; the reflected light generated by the surface of the sample 7 passes through the optical knife edge 681, and a small amount of light is irradiated to the photodetector 682 to generate an electric signal, which is amplified by the preamplifier 683 and then detected by the phase lock module 684 and transmitted to the computing unit 8. When the sample deforms under the action of load, the reflected light changes correspondingly, and the light energy penetrating through the knife edge is directly related to the deformation amount, so that the output signal 92 has the deformation information of the material sample.
As shown in fig. 4, the photothermal infrared radiation stress strain measurement module 69 includes: mid-infrared CCD camera 691, germanium glass 692, mid-infrared thermal radiation 693; more than 70% of the energy (90% in the best scheme) of the internal modulation type semiconductor laser 61 is focused and irradiated to the surface of the sample 7 through the focusing lens 66 to be used as induction laser of a photo-thermal red thermal radiation signal; the irradiated sample 7 locally generates periodic thermal diffusion waves and diffuses towards the back surface of the sample, the stray part of incident laser 685 is effectively filtered after the mid-infrared thermal radiation 693 passes through germanium glass 692, the stray part is detected as a thermal radiation image by a mid-infrared CCD camera 691, the thermal radiation image signal is output as a radiation image signal 93 after the phase-lock detection by a phase-lock detection module 684, and the radiation image signal is transmitted to a calculation unit 8.
As shown in fig. 1, the mobile scanning unit includes: the device comprises a guide rail set 3 and a motor set 4, wherein the guide rail set 3 comprises two groups of straight guide rails and a group of rotary guide rails, the motor set 4 comprises two groups of linear motors, a first collimating optical fiber coupling follower 65A, a collimating lens set 67 and a light deflection deformation measuring module 68 are fixed in a guide rail seat on the guide rail set 3, the guide rail seat is connected with a motor set 4 shaft, a calculating unit 8 drives the motor set 4 to generate a motor control signal 11, and a mobile scanning unit is used for detecting different positions of a sample 7 through the movement of the motor set 4 shaft.
The guide rail group 3 and the motor group 4 realize continuous strain detection of different strain points, wherein two guide rails in the guide rail group 3 are straight guide rails and can provide axial tensile load of a detected sample and bending moment load perpendicular to the axial direction by matching with a motor; the third guide rail is a rotary guide rail and is matched with a large-torque motor to apply torsional load; the loads in the three directions can be applied sequentially or simultaneously, and the deformation and internal stress strain conditions of the material sample under the action of various external forces can be simulated.
The working principle of the invention is shown in fig. 1, a material sample 7 is fixed on a sample fixing frame 2, and the test is started. The calculating unit 8 outputs a motor control signal 11 to apply a certain load to the sample to be measured and keep the load stable, and the actual average value of the applied load can be measured by the stress sensing unit 5 and transmitted to the calculating unit through a signal flow 10; then, the computing unit modulates the output energy of the laser through a signal source control signal 91, and the signal generator outputs a reference signal 610; the modulated laser 685 is led out to the beam splitter 64 through the optical fiber 63, wherein one path of energy is lower (10%) and is output through the optical fiber output coupler with collimation, and the collimated laser is irradiated on the surface of a sample by the lens group 67 and is used as induced laser of the light deflection measuring system; the reflected light from the sample surface passes through the optical knife edge, and a small amount of light is irradiated to the photodetector 682 to generate an electrical signal, which is amplified by the preamplifier 683 and then detected by the phase lock module 684 and transmitted to the computing unit. When the sample deforms under the action of load, the reflected light changes correspondingly, and the light energy penetrating through the knife edge is directly related to the deformation amount, so that the output signal 92 has the deformation information of the material sample. The other path of laser with higher energy (90%) is output and then is focused and irradiated to the surface of the sample through a focusing lens 66 to be used as induced laser of a photo-thermal red thermal radiation signal; the irradiated sample locally generates periodic thermal diffusion waves and diffuses towards the back surface of the sample, the stray part of incident laser 685 in the infrared thermal radiation signal 693 is effectively filtered after passing through germanium glass, the infrared thermal radiation signal is detected as a thermal radiation image by the mid-infrared CCD camera 691, the thermal radiation image signal is output as a radiation image signal 93 after being detected by the two-dimensional phase lock, and the radiation image signal is transmitted to the computing unit. When stress and strain exist in the material sample, the thermal diffusion performance of the material sample changes, so that the radiation signal 93 carries the information of local stress and strain near the laser irradiation point, and the test can be completed after the data analysis and the characteristic quantity extraction are completed by the computing unit. The non-contact all-optical detection system is arranged on the guide rail 3 to realize scanning test along the axial direction of the sample so as to obtain the deformation, stress and strain characteristics of different measurement points.
The motor set 4 generates multiple stress loads under the action of the control signal 11, the sample 7 can be deformed such as elongation, necking and torsion, and the local deformation of the sample is measured according to the optical deflection system provided by the invention. The light source used for deflection measurement and the photo-thermal excitation source are the same light source, a small part of energy is led out to be incident to the position of the sample to be measured for deformation after being collimated/focused, and the deformation induced light deflection signal 9 is detected at the rear end through the knife edge mask and the photoelectric detector.
The motor set 4 generates multiple stress loads under the action of the control signal 11, corresponding stress strain can be accumulated in the sample 7, and the photothermal infrared radiation stress measurement system provided by the invention is used for measuring the local stress strain. Most of energy in the multimode high-power laser is output through the coupler, focused and irradiated on a local part of a sample, and the size of a light spot is variable. The back of the sample is imaged by a mid-infrared CCD camera, effective thermal diffusion parameters are extracted by a corresponding algorithm, the quantitative relation between the thermal diffusion parameters and stress strain is established, and finally the purpose of full-contact-free stress strain measurement is achieved.
The components and structures of the present embodiments that are not described in detail are well known in the art and do not constitute essential structural elements or elements.
Claims (6)
1. A non-contact automatic measuring system for elastic stress and strain of materials is characterized in that: at least comprises the following steps: the internal-regulation type semiconductor laser is divided into a first collimated fiber coupling output device and a second collimated fiber coupling output device by a beam splitter, and laser output by the first collimated fiber coupling output device vertically irradiates a sample clamped by a sample fixing frame through a focusing lens group; the other side of the sample is provided with a photo-thermal infrared radiation stress-strain measuring module, and the photo-thermal infrared radiation stress-strain measuring module acquires a photo-thermal infrared radiation image when the sample is strained and transmits the photo-thermal infrared radiation image to the computing unit; the laser output by the second fiber coupling output device with collimation passes through the collimation lens group and then irradiates on the sample at the same time at the incidence angle smaller than 90 degrees relative to the normal direction of the surface of the sample, a light deflection deformation measuring module is arranged at the emergent angle symmetrical to the normal, and the light deflection deformation measuring module outputs the light deflection information generated by the strain of the sample and transmits the light deflection information to the computing unit at the same time; the calculation unit carries out information processing according to light deflection information generated by sample strain and photo-thermal infrared radiation image information when the sample is strained, and deformation, stress and strain characteristic quantities of a sample measuring point are obtained;
the light deflection deformation measurement module comprises: the laser is output by an optical fiber output coupler with collimation, and the sample surface is irradiated after being collimated by a lens group and is used as induced laser of a light deflection measuring system; the reflected light generated by the surface of the sample passes through an optical knife edge, a small amount of light of the reflected light irradiates a photoelectric detector to generate an electric signal, and the electric signal is amplified by a preamplifier, detected by a phase locking module and transmitted to a computing unit; when the sample deforms under the action of load, the reflected light changes correspondingly, and the light energy penetrating through the knife edge is directly related to the deformation amount, so that the output signal has the deformation information of the material sample;
the photo-thermal infrared radiation stress-strain measuring module comprises: mid-infrared CCD camera, germanium glass, mid-infrared thermal radiation; more than 70% of energy of the internal-modulation semiconductor laser is focused and irradiated to the surface of the sample through the focusing lens to be used as induced laser of a photo-thermal infrared radiation signal; the irradiated sample locally generates periodic thermal diffusion waves and diffuses towards the back surface of the sample, after the intermediate infrared thermal radiation passes through the germanium glass, the stray part of incident laser is filtered, effective radiation is detected by the intermediate infrared CCD camera to be a thermal radiation image, the thermal radiation image is output as a radiation image signal after the phase-locking detection by the phase-locking detection module, and the radiation image signal is transmitted to the calculation unit;
still include stress application unit, stress application unit includes: the guide rail set consists of two groups of straight guide rails and a group of rotary guide rails, and the motor set consists of a group of linear motors and a group of rotary motors; two guide rails in the guide rail group are straight guide rails, are matched with the motor and provide axial tensile load and bending moment load vertical to the axial direction of the tested sample under the motor control signal generated by the calculation unit; the third guide rail is a rotary guide rail and is matched with a large-torque motor to apply torsional load; the loads in the three directions are applied sequentially or simultaneously, and the deformation and internal stress strain conditions of the material sample under the action of various external forces are simulated.
2. The system of claim 1, wherein the system comprises: the laser output by the second collimating optical fiber coupling output device passes through the collimating lens group and then irradiates the sample at the same time at an incidence angle smaller than 90 degrees relative to the normal direction of the surface of the sample, and the laser is realized on different measuring irradiation points by moving the scanning unit so as to obtain the deformation, stress and strain characteristic quantities of the different measuring points of the sample.
3. The system of claim 1, wherein the system comprises: the first collimating optical fiber coupling output device obtains more than 70% of energy of the internal-regulation type semiconductor laser device for output; and the second fiber coupling output device with collimation obtains less than 30% of energy of the internal-regulation semiconductor laser device for output.
4. The system of claim 1, wherein the system comprises: the beam splitter is an optical fiber beam splitter, and the internally-adjusted semiconductor laser is split into more than 70% of energy output and less than 30% of energy output through the optical fiber by the optical fiber beam splitter.
5. The system of claim 1, wherein the system comprises: the internal modulation type semiconductor laser is controlled by a signal generation module, the signal generation module is controlled by a calculation unit, and the signal generation module sends a laser modulation signal to the internal modulation type semiconductor laser; the computing unit sends a signal source control signal to the signal generating module.
6. The system of claim 5, wherein the system comprises: the signal generation module outputs two paths of reference signals at the same time, one path of reference signal is connected with the light deflection deformation measurement module, and the other path of reference signal is electrically connected with the photo-thermal infrared radiation stress strain measurement module.
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| CN110308042B (en) * | 2019-07-10 | 2022-02-11 | 河海大学常州校区 | Mechanical damage detection device and method for LED fluorescent glue |
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| CN115206331B (en) * | 2022-06-13 | 2024-04-05 | 华南理工大学 | Voice super-resolution method based on conical residual dense network |
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| JPH0835821A (en) * | 1994-07-22 | 1996-02-06 | Shimadzu Corp | Non-contact displacement meter or strain gauge |
| JP2692599B2 (en) * | 1994-07-27 | 1997-12-17 | 株式会社島津製作所 | Laser non-contact extensometer |
| JPH08233542A (en) * | 1995-02-27 | 1996-09-13 | Shimadzu Corp | Non-contact displacement meter for sample in heated or cooled state |
| CN102393370B (en) * | 2011-11-08 | 2014-04-09 | 中国科学院上海光学精密机械研究所 | Measuring device and measuring method for film photo-thermal property |
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