CN110308042B - Mechanical damage detection device and method for LED fluorescent glue - Google Patents
Mechanical damage detection device and method for LED fluorescent glue Download PDFInfo
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- CN110308042B CN110308042B CN201910617259.3A CN201910617259A CN110308042B CN 110308042 B CN110308042 B CN 110308042B CN 201910617259 A CN201910617259 A CN 201910617259A CN 110308042 B CN110308042 B CN 110308042B
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- 239000003292 glue Substances 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000001514 detection method Methods 0.000 title claims abstract description 12
- 238000005424 photoluminescence Methods 0.000 claims abstract description 60
- 238000002474 experimental method Methods 0.000 claims abstract description 30
- 239000002131 composite material Substances 0.000 claims abstract description 21
- 239000000843 powder Substances 0.000 claims abstract description 8
- 239000000523 sample Substances 0.000 claims description 63
- 238000012360 testing method Methods 0.000 claims description 36
- 238000010438 heat treatment Methods 0.000 claims description 13
- 238000006073 displacement reaction Methods 0.000 claims description 12
- 230000008859 change Effects 0.000 claims description 8
- 230000009471 action Effects 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000741 silica gel Substances 0.000 abstract description 2
- 229910002027 silica gel Inorganic materials 0.000 abstract description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000009864 tensile test Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 230000003760 hair shine Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
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- 238000012512 characterization method Methods 0.000 description 1
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- 230000007547 defect Effects 0.000 description 1
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- 230000032798 delamination Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
- G01N21/64—Fluorescence; Phosphorescence
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/02—Details
- G01N3/06—Special adaptations of indicating or recording means
- G01N3/068—Special adaptations of indicating or recording means with optical indicating or recording means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0014—Type of force applied
- G01N2203/0016—Tensile or compressive
- G01N2203/0017—Tensile
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0058—Kind of property studied
- G01N2203/0069—Fatigue, creep, strain-stress relations or elastic constants
- G01N2203/0075—Strain-stress relations or elastic constants
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/026—Specifications of the specimen
- G01N2203/0262—Shape of the specimen
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/04—Chucks, fixtures, jaws, holders or anvils
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/06—Indicating or recording means; Sensing means
- G01N2203/0641—Indicating or recording means; Sensing means using optical, X-ray, ultraviolet, infrared or similar detectors
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- Health & Medical Sciences (AREA)
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- Life Sciences & Earth Sciences (AREA)
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- General Physics & Mathematics (AREA)
- Immunology (AREA)
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- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
The invention discloses a mechanical damage detection device and method for LED fluorescent glue, which comprises a tensile experiment device, a laser emission device and a photoluminescence collection device, wherein the tensile experiment device is connected with the laser emission device; the clamp of the tensile experiment device fixes two ends of a sample for a sample tensile experiment; the laser emitting device is used for emitting laser to irradiate the sample, and when the sample is irradiated by the laser, the fluorescent powder of the sample can be excited to carry out photoluminescence; the photoluminescence collection device is used for collecting photoluminescence reflected light signals; the invention reflects the mechanical damage evolution process by simultaneously collecting the photoluminescence signal and the photoluminescence signal of the fluorescent powder/silica gel composite material under the condition of external load, and has the advantages of simple device operation, high flexibility and low experiment cost.
Description
Technical Field
The invention discloses a mechanical damage detection device and method for LED fluorescent glue, and relates to the technical field of composite material mechanical property characterization research.
Background
The LED has the advantages of good lighting effect, high efficiency, long service life, high reliability and the like, is widely applied to various illumination fields, and has wide development prospect. The LED fluorescent glue is used as an important composite material for packaging white light LEDs, and is generally applied to various industries due to excellent material characteristics. The mechanical properties of the composite material are deeply researched, and the application of the material is designed according to the properties of the composite material, so that the use reliability and safety performance of the composite material are improved. The LED fluorescent glue is usually coated on an LED blue light chip and is an important packaging material for light conversion of a white light LED. When the LED works, due to the fact that the thermal expansion coefficients of the LED fluorescent glue and the LED blue light chip are not matched, thermal-mechanical stress is inevitably formed and accumulated in the LED fluorescent glue and on an interface of the LED fluorescent glue and the LED blue light chip, and the stress can cause damage of a composite material and failure of interface delamination and the like. Cracks and voids in the LED phosphor gel begin to delaminate around the material interface so that ambient air and moisture can penetrate the LED phosphor gel to form various interface regions, the creation of which can lead to degradation of the tube cavity and cracking of the material, ultimately affecting the performance and reliability of the white LED package. Therefore, research on the mechanical property of the LED fluorescent glue under external load is an important means for improving the performance and reliability of the white light LED package.
With the development of the LED lighting technology, most of the current technical means for researching the mechanical damage of the LED fluorescent glue are to utilize mechanical experiment measurement (such as tensile, compressive, shearing and other experiments) and macro-microscopic multi-scale coupling finite element experiment devices, establish a three-dimensional model of the composite material by using finite element software, perform grid division and constraint on the model, simulate the tensile deformation behavior of the composite material, extract a stress-strain curve and accurately predict the mechanical property of the composite material in the plastic deformation process. The photoluminescence and photoluminescence characteristics of the LED fluorescent glue are rarely used for representing the mechanical damage of the LED fluorescent glue.
Disclosure of Invention
Aiming at the defects in the background art, the invention provides a device and a method for detecting the mechanical damage of an LED fluorescent glue, which are used for measuring photoluminescence and photoluminescence characteristics of the LED fluorescent glue under the condition of stress action, calculating the Young modulus and tensile strength of the mechanical property of a sample by combining tensile force and displacement experimental data obtained by a tensile experiment at the same moment, and deeply researching the evolution process of the mechanical property of a composite material.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows: a mechanical damage detection device of LED fluorescent glue includes: the device comprises a tensile experiment device, a laser emission device and a photoluminescence collection device; the photoluminescence acquisition device comprises an integrating sphere test system and a sleeve, wherein a square through hole is formed in the bottom of the sleeve, a tensile experiment device is arranged below the square through hole of the sleeve, the integrating sphere test system is arranged at the right end of the sleeve, and a laser emission device is arranged at the right end of the integrating sphere test system; the clamp of the tensile experiment device fixes two ends of a sample for a sample tensile experiment, the middle part of the sample is positioned in the square through hole of the sleeve, and the center of the sample is superposed with the laser irradiation point; the laser emitting device is used for emitting laser to irradiate the sample, and when the sample is irradiated by the laser, the fluorescent powder of the sample can be excited to carry out photoluminescence; the photoluminescence collection device is used for collecting photoluminescence reflected light signals.
Furthermore, the circular through hole in telescopic right side cooperatees with the left side through hole of integrating sphere test system, constitutes leak protection light device, and the left side through hole size is the same with sleeve excircle diameter size, leak protection light device be used for the harmless propagation of reflection laser.
Further, the system also comprises a photoinduced heating acquisition device, wherein the photoinduced heating acquisition device comprises a thermal infrared imager; the circular through hole on the left side of the sleeve is matched with the thermal infrared imager, the size of the circular through hole on the left side is the same as the diameter of a probe of the thermal infrared imager, and the photoinduced heating acquisition device is used for acquiring photoinduced heating signals of the laser irradiation sample.
Furthermore, the thermal infrared imager is fixed on the displacement table, the displacement table is used for moving and adjusting in the direction perpendicular to the horizontal plane, the support frame is further used for supporting the sleeve, the support frame and the thermal infrared imager are mounted on the displacement table, the positions of the thermal infrared imager and the sleeve are adjusted through the displacement table, and the thermal infrared imager and the sleeve are located on the same light path during testing.
Furthermore, the laser emitting device comprises a laser diode, laser beams emitted by the laser diode irradiate the central part of an I-shaped sample in the sleeve along the central line direction of a through hole on the right side of the integrating sphere testing system, the size of the through hole on the right side of the integrating sphere is matched with the diameter of the laser beams, reflected lasers irradiated on the surface of the sample propagate in the sleeve and the integrating sphere testing system, and photoluminescence signals are acquired by a spectrum radiometer in the integrating sphere testing system.
The laser device further comprises a cushion block, wherein the cushion block is arranged below the laser diode and used for adjusting the position of the laser diode for emitting laser.
Furthermore, the inner side surfaces of the sleeve and the integrating sphere testing system are coated with diffuse reflection coatings, and the right end of the sleeve is matched with a through hole in the left side of the integrating sphere testing system.
Further, the sample is in an I shape.
A mechanical damage detection method of LED fluorescent glue comprises the following steps: s1: an I-shaped LED fluorescent glue sample passes through the square through hole of the sleeve, and two ends of the I-shaped LED fluorescent glue sample are fixed in a clamp of a tensile experiment device;
s2: installing a photoluminescence collecting device;
s3: starting a stretching experimental device to stretch a sample;
s4: adjusting the laser emission device to be tightly attached to one side of the photoluminescence collection device, starting the laser emission device, and controlling laser to irradiate the sample along the central line direction of the photoluminescence collection device;
s5: and starting the photoluminescence acquisition device, and acquiring a photoluminescence signal of the laser irradiation sample from the other side of the photoluminescence acquisition device.
Further, the method comprises the following steps: the photoluminescence collection device comprises an integrating sphere test system and a sleeve, wherein the sleeve is provided with a square through hole, and a sample passes through the square through hole; the tensile experiment device is characterized in that a clamp of the tensile experiment device clamps two ends of an I-shaped sample, a right circular through hole of the sleeve is matched with a left through hole of the integrating sphere testing system, and a laser emitting device is arranged at the right end of the integrating sphere testing system.
The method mainly uses a tensile experimental device to obtain the displacement-load experimental data of a tensile sample in real time, calculates the Young modulus and the tensile strength of the composite material according to the experimental data, realizes the test of various mechanical properties of the composite material sample, uses a thermal infrared imager to measure the change of the photoluminescence signals of the composite material sample under the action of tensile load and laser irradiation in real time, and uses an integrating sphere testing system to measure the photoluminescence signals of laser reflected on the surface of the sample in real time.
Has the advantages that: the invention provides an experimental device and method for mechanical damage detection of LED fluorescent glue, the experimental device provides a comprehensive, rapid and flexible device for researching mechanical properties of the LED fluorescent glue, tension-displacement experimental data can be rapidly obtained through a tensile experimental device, the Young modulus, tensile strength and other mechanical properties of a composite material are calculated according to the experimental data, photoluminescence and photoluminescence characteristics of the LED fluorescent glue under the stress action condition are measured through a photoluminescence acquisition device and a photoluminescence acquisition device, the mechanical failure mechanism of the LED fluorescent glue is deeply researched, a hardware basis is provided for researching the mechanical properties of the LED fluorescent glue, and the device is simple to operate, high in flexibility and low in experimental cost.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the sleeve construction of the present invention;
FIG. 3 is a schematic diagram of the mechanical damage detection experiment of the present invention.
Detailed Description
The following describes the embodiments in further detail with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
As shown in FIGS. 1 to 3: one embodiment of the present invention provides: a mechanical damage detection device of LED fluorescent glue includes: a tensile experiment device 7, a laser emission device and a photoluminescence collection device; the device comprises a tensile experiment device 7, a laser emission device and a photoluminescence acquisition device, wherein the photoluminescence acquisition device is arranged on an experiment platform 1 and comprises an integrating sphere test system 8 and a sleeve 5, a square through hole is formed in the bottom of the sleeve 5, the tensile experiment device 7 is arranged below the square through hole of the sleeve 5, the integrating sphere test system 8 is arranged at the right end of the sleeve 5, and the laser emission device is arranged at the right end of the integrating sphere test system 8; the clamp of the tensile experiment device 7 fixes two ends of a sample 6, the sample 6 is I-shaped, and the middle part of the sample 6 is positioned in the square through hole of the sleeve 5 and is used for the tensile experiment of the sample 6; the laser emitting device is used for emitting laser to irradiate the sample 6, and when the sample 6 is irradiated by the laser, the fluorescent powder of the sample 6 can be excited to carry out photoluminescence; the photoluminescence collection device is used for collecting photoluminescence reflected light signals.
The circular through-hole in right side of sleeve 5 cooperatees with the left side through-hole of integrating sphere test system 8, and the left side through-hole size is the same with 5 excircle diameters of sleeve size, and the laser that shines on 6 surfaces of sample propagates through sleeve 5 and integrating sphere test system 8, is carried out photoluminescence signal collection by the spectral radiometer in integrating sphere test system 8.
The system also comprises a photoinduced heating acquisition device, wherein the photoinduced heating acquisition device comprises a thermal infrared imager 4; the circular through hole on the left side of the sleeve 5 is matched with the thermal infrared imager 4, the size of the circular through hole on the left side is the same as the diameter of a probe of the thermal infrared imager 4, and the photoinduced heating acquisition device is used for acquiring photoinduced heating signals of the laser irradiation sample 6.
The thermal infrared imager 4 is fixed on the displacement table 2, the displacement table 2 is adjusted in a moving mode in the direction perpendicular to the horizontal plane, and the support frame 3 is further used for supporting the sleeve 5.
The laser emitting device comprises a laser diode 10, laser beams emitted by the laser diode 10 irradiate the sample 6 in the sleeve 5 along the central line direction of a through hole on the right side of the integrating sphere testing system 8, and the size of the through hole on the right side is matched with the diameter of the laser beams.
The laser device is characterized by further comprising a cushion block 9, wherein the cushion block 9 is arranged below the laser diode 10, and the position of the laser diode 10 for emitting laser is adjusted.
The inner side surfaces of the sleeve 5 and the integrating sphere testing system 8 are coated with diffuse reflection coatings, and the right end of the sleeve 5 is matched with a through hole in the left side of the integrating sphere testing system 8.
The embodiment provides a mechanical damage detection method of LED fluorescent glue, which comprises the following steps: s1: fixing two ends of an I-shaped LED fluorescent glue sample in a clamp of a tensile experiment device, wherein the I-shaped sample passes through the square through hole and the middle part of the I-shaped sample is positioned in the square through hole;
s2: installing a photoluminescence collecting device;
s3: starting a stretching experimental device to stretch a sample;
s4: adjusting a laser emission device to be tightly attached to one side of a central through hole on the right side of an integrating sphere in a photoluminescence acquisition device, starting the laser emission device, and controlling laser to irradiate to a sample along the central line direction of the photoluminescence acquisition device;
s5: and starting the photoluminescence acquisition device, and acquiring a photoluminescence signal of the laser irradiation sample from the other side of the photoluminescence acquisition device.
Furthermore, the photoluminescence collection device comprises an integrating sphere test system and a sleeve, wherein the sleeve is provided with a square through hole, so that a sample can conveniently pass through the square through hole; a tensile experiment device is arranged below the square through hole of the sleeve, the round through hole on the right side of the sleeve is matched with the through hole on the left side of the integrating sphere testing system, and a laser emitting device is arranged at the right end of the integrating sphere testing system.
The LED fluorescent glue is made by mixing phosphor powder granule and silica gel, can arouse the phosphor powder when the laser shines the sample and carry out photoluminescence, simultaneously under the additional load condition, sample among the tensile experiment can take place deformation, the phosphor powder granule of laser irradiation point department keeps away from the laser irradiation point because of the deformation of sample, the photoluminescence signal can change along with tensile sample mechanical properties's change, gather the photoluminescence characteristic of LED fluorescent glue under stress action condition through photoluminescence collection system, it changes to express combined material mechanical properties. On the other hand, the composite material can generate thermal change due to laser irradiation and a tensile test, a sample in the tensile test can deform under the condition of external loading, a photo-induced heating signal can change along with the change of the mechanical property of the tensile sample, the photo-induced heating characteristic of the LED fluorescent glue under the stress action condition is measured through a photo-induced heating collecting device to express the change of the mechanical property of the composite material, and the Young modulus and the tensile strength of the mechanical property of the composite material sample of the sample are calculated by combining tensile force and displacement test data obtained by the tensile test at the same moment, so that the evolution process of the mechanical property of the composite material is deeply researched.
The invention provides an experimental device and method for mechanical damage detection of LED fluorescent glue, wherein the experimental device provides a comprehensive, rapid and flexible device for researching the mechanical property of the LED fluorescent glue, tension-displacement experimental data can be rapidly obtained through a tensile experimental device, the Young modulus, tensile strength and other mechanical properties of a composite material are calculated according to the experimental data, photoluminescence and photoluminescence characteristics of the LED fluorescent glue under the stress action condition are measured through a photoluminescence acquisition device and a photoluminescence acquisition device, the mechanical failure mechanism of the LED fluorescent glue is deeply researched, and a hardware basis is provided for researching the mechanical property of the LED fluorescent glue.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (7)
1. The utility model provides a mechanics damage detection device of LED fluorescent glue which characterized in that includes: the device comprises a tensile experiment device, a laser emission device and a photoluminescence collection device; the photoluminescence acquisition device comprises an integrating sphere test system and a sleeve, wherein a square through hole is formed in the bottom of the sleeve, a tensile experiment device is arranged below the square through hole of the sleeve, the integrating sphere test system is arranged at the right end of the sleeve, and a laser emission device is arranged at the right end of the integrating sphere test system; the clamp of the tensile experiment device fixes two ends of a sample for a sample tensile experiment, the sample passes through the square through hole, and the middle part of the sample is positioned in the sleeve; the laser emitting device is used for emitting laser to irradiate the sample, and when the sample is irradiated by the laser, the fluorescent powder of the sample can be excited to carry out photoluminescence; the photoluminescence collection device is used for collecting photoluminescence reflected light signals and comprises a photoluminescence collection device, and the photoluminescence collection device comprises a thermal infrared imager; the thermal infrared imager is characterized in that the circular through hole in the left side of the sleeve is matched with the thermal infrared imager, the size of the circular through hole in the left side is the same as the diameter of a probe of the thermal infrared imager, the photoinduced heating acquisition device is used for acquiring photoinduced heating signals of a laser irradiation sample, the thermal infrared imager is fixed on the displacement table, the displacement table is adjusted in a moving mode in a direction perpendicular to the horizontal plane, and the support frame is further used for supporting the sleeve.
2. The device for detecting the mechanical damage of the LED fluorescent glue according to claim 1, wherein a right circular through hole of the sleeve is matched with a left through hole of an integrating sphere testing system, and the size of the left through hole is the same as the diameter of an outer circle of the sleeve.
3. The device for detecting the mechanical damage of the LED fluorescent glue according to claim 1, wherein the laser emitting device comprises a laser diode, a laser beam emitted by the laser diode irradiates the sample in the sleeve along the central line direction of a right through hole of the integrating sphere testing system, and the size of the right through hole is matched with the diameter of the laser beam.
4. The device for detecting the mechanical damage of the LED fluorescent glue according to claim 3, further comprising a cushion block, wherein the cushion block is arranged below the laser diode and used for adjusting the position of the laser diode for emitting laser.
5. The device for detecting the mechanical damage of the LED fluorescent glue according to claim 1, wherein the inner side surfaces of the sleeve and the integrating sphere testing system are coated with the diffuse reflection coating, and the right end of the sleeve is matched with a left through hole of the integrating sphere testing system.
6. The device for detecting the mechanical damage of the LED fluorescent glue according to claim 1, wherein the sample is I-shaped.
7. The method for detecting the mechanical damage of the LED fluorescent glue based on the device for detecting the mechanical damage of the LED fluorescent glue of claim 1 is characterized by comprising the following steps of: the method comprises the steps of measuring the change of a photoluminescence signal of a composite material sample under the action of tensile load and laser irradiation in real time by using a thermal infrared imager, and measuring the photoluminescence signal on the surface of the sample in real time by using an integrating sphere testing system.
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CN106525778A (en) * | 2015-09-14 | 2017-03-22 | 常州市武进区半导体照明应用技术研究院 | Apparatus and method for measuring performance of fluorescent glue |
CN107271294A (en) * | 2017-07-27 | 2017-10-20 | 太原理工大学 | Material properties test device and material properties test system |
CN109827850A (en) * | 2019-01-15 | 2019-05-31 | 广东工业大学 | A kind of fexible film stretch bending device |
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