CN109267017A - The method of vacuum electron beam plated film - Google Patents

The method of vacuum electron beam plated film Download PDF

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Publication number
CN109267017A
CN109267017A CN201811474639.8A CN201811474639A CN109267017A CN 109267017 A CN109267017 A CN 109267017A CN 201811474639 A CN201811474639 A CN 201811474639A CN 109267017 A CN109267017 A CN 109267017A
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China
Prior art keywords
vacuum
electron beam
plated film
chamber
postposition
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CN201811474639.8A
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Inventor
赖奇
廖先杰
赵海泉
刘翘楚
彭富昌
邹宇
钟璨宇
崔晏
肖传海
范立男
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Chengdu Tianyu Kunshi Mechanical And Electrical Equipment Co Ltd
Panzhihua University
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Chengdu Tianyu Kunshi Mechanical And Electrical Equipment Co Ltd
Panzhihua University
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Priority to CN201811474639.8A priority Critical patent/CN109267017A/en
Publication of CN109267017A publication Critical patent/CN109267017A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/28Vacuum evaporation by wave energy or particle radiation
    • C23C14/30Vacuum evaporation by wave energy or particle radiation by electron bombardment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • C23C14/16Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The invention discloses the present invention relates to a kind of method of vacuum electron beam plated film, belong to coating technique field.The technical problem to be solved in the present invention is to provide a kind of methods of at low cost, pollution-free, high efficiency, high quality coating thick film, this method uses vacuum electron beam plated film, it include: that plating filmed metals are placed in vacuum electron beam coating apparatus, using iron-based material as base material, base material temperature is heated to 400~1200 DEG C, beam power is set and is not less than 20KW, control electron beam furnace working chamber vacuum degree is 10~10 3Pa, carries out plated film, and plated film is completed, is cooled to no more than 300 DEG C, obtains plating film composite material.The method of the present invention can get that coating film thickness is big, corrosion resistant plating film composite material, have the characteristics that inexpensive, pollution-free, speed is fast and efficient.

Description

The method of vacuum electron beam plated film
Technical field
The invention belongs to coating technique fields, and in particular to a kind of method of vacuum electron beam plated film.
Background technique
Titanium is a kind of silvery white non-ferrous metal, it has many advantages, such as, and density is small, specific strength is high, corrosion-resistant, nontoxic, and belongs to life Reason inert metal can be tied well with human contact without sensitization, carcinogenic, aberration inducing phenomenon with bone tissue, epithelium, connective tissue It closes, but the metal material that biocompatibility is best.
But since there is also bigger difficulty for metallurgy and the material processing of titanium, cost is very high, so that Titanium is difficult in the people It is widely applied with industrial.Currently, by a large amount of civilian and industrial environment resistant corrosion materials be various different models not Become rusty steel.However in some places that environmental pollution is serious, even if such as etch resistant properties it is excellent 304 can get rusty.Especially curing With stainless steel is also widely used as skeletal repair material, and biocompatibility and physiological-toxicity be not also highly desirable.In view of This, stainless steel and Titanium progress is compound, upper one layer of Titanium is deposited in the surface of stainless steel as main body, it can by having It is able to achieve " with steel for titanium ", titanium is made to obtain large-scale popularization on civilian, obtain better than the better etch resistant properties of general stainless steel; And medical instrument, civil buildings, industrial products in terms of be applied.
However, the processing in iron, stainless steel surface at present is mainly electroplated or chemical plating.Chemical plating is mainly used in metal Surface carries out anti-corrosion dyeing processing, and plating operation is simple, and majority can carry out at normal temperature, the disadvantage is that investment is big, generates big Industrial wastewater is measured, it is seriously polluted, it is at high cost.Galvanization coating is thicker, and coated, Technical comparing maturation can be carried out on any substance, The disadvantage is that investment is big, seriously polluted, at high cost, operating procedure is complicated.In addition electroplate factory's investment is big, and technical stability is poor, processing Valuable product.
For overcome the problems, such as titanium iron-based material surface coating this, currently also use titanium steel complex method.It is cold including titanium steel It rolls, hot rolling, titanium steel explosion welding connects, the methods of titanium steel electron beam welding.However, titanium steel rolling is difficult to compound, titanium steel explosion welding is connect Quality is difficult to control, and titanium steel electron beam welding requires two kinds of materials extremely thick.
Therefore, developing a kind of advanced metal surface treatment technology substitution conventional plating process is trend of the times, will be Thus titanium application extension frontier will also generate huge economic and social benefit.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of at low cost, pollution-free, high efficiency, high quality coating thick films Method.
The technical proposal adopted by the invention to solve the above technical problems is that providing a kind of side of vacuum electron beam plated film Method, method includes the following steps:
Plating filmed metals are placed in vacuum electron beam coating apparatus, base material temperature is heated to 400~1200 DEG C, if Beam power is set not less than 20KW, control electron beam furnace working chamber vacuum degree is 10~10-3Pa carries out plated film, and plated film is completed, It is cooled to and is no more than 300 DEG C, obtain plating film composite material.
Wherein, in the method for vacuum electron beam plated film described above, the electron beam furnace contains 1~3 working chamber, often It is a working chamber setting 1~2, electron gun, every 20~200KW of electron gun power.
Preferably, in the method for vacuum electron beam plated film described above, the beam power is 20~1200KW.
Wherein, in the method for vacuum electron beam plated film described above, it is described base material temperature is heated to 400~ 1200 DEG C of mode are as follows: plate is arranged in preposition 1~4 vacuum chamber in vacuum electron beam coating apparatus, each vacuum chamber Base material temperature is heated to 400~1200 DEG C by single-stage or Multi-stage heating by vacuum heater.
Wherein, in the method for vacuum electron beam plated film described above, the control electron beam furnace working chamber vacuum degree is 10~10-3The mode of Pa are as follows: 2~8 vacuum of preposition 2~8 vacuum chambers and/or postposition in vacuum electron beam coating apparatus Planar vacuum device is arranged in chamber, each vacuum chamber, by multi-stage vacuum, control electron beam furnace working chamber vacuum degree be 10~ 10-3Pa。
Wherein, in the method for vacuum electron beam plated film described above, the mode being cooled to no more than 300 DEG C are as follows: Planar vacuum water cooling plant is arranged in 2~4 vacuum chambers of postposition in vacuum electron beam coating apparatus, each vacuum chamber, leads to Multistage cooling is crossed, is cooled to no more than 300 DEG C.
Wherein, in the method for vacuum electron beam plated film described above, the plating filmed metals are titanium, zirconium, hafnium, nickel, cobalt, chromium Or vanadium.
Preferably, in the method for vacuum electron beam plated film described above, the plating filmed metals are titanium.
Wherein, in the method for vacuum electron beam plated film described above, the purity of the plating filmed metals is 98~ 99.999%.
Wherein, in the method for vacuum electron beam plated film described above, the base material is stainless steel, copper or aluminium.
Preferably, in the method for vacuum electron beam plated film described above, the base material is stainless steel.
Wherein, in the method for vacuum electron beam plated film described above, the mode of the plated film is using oblique angle injection side Formula.
Wherein, in the method for vacuum electron beam plated film described above, the angle that the oblique angle is injected is 10~40 °.
Wherein, in the method for vacuum electron beam plated film described above, the speed of the plated film is 5~200m/min.
Wherein, in the method for vacuum electron beam plated film described above, the time of the plated film is 1~100min.
Wherein, in the method for vacuum electron beam plated film described above, the coating film thickness of the plating film composite material is 0.01~200 μm.
In conjunction with above-mentioned vacuum electron beam film plating process, present invention employs vacuum electron beam coating apparatus as shown in Figure 1, Including electron beam furnace 1, forvacuum room 2, hot donut 4, postposition vacuum chamber 3 and cooling vacuum room 5, forvacuum room 2 connects Lead to the input end in electron beam furnace 1, hot donut 4 is connected to the postposition vacuum chamber 3 between forvacuum room 2 and electron beam furnace 1 Connection is connected between postposition vacuum chamber 3 and electron beam furnace 1 in the outlet end of electron beam furnace 1, cooling vacuum room 5.
When carrying out plated film work, workpiece 6 to be coated is first fed in forvacuum room 2, and forvacuum room 2 is by 2 The forvacuum chamber 21 of~8 connections forms, and is designed with planar vacuum device in each forvacuum chamber 21, passes through planar vacuum Device realizes multi-stage vacuum;It is sent after the completion of 6 plated film of workpiece from postposition vacuum chamber 3, what postposition vacuum chamber 3 was connected to by 2~8 Postposition vacuum chamber 31 forms, and is designed with planar vacuum device in each postposition vacuum chamber 31, is realized by planar vacuum device more Grade vacuum;It is 10~10 by the vacuum degree that forvacuum room 2 and/or postposition vacuum chamber 3 control electron beam furnace 1-3Pa。
When carrying out plated film work, the heating before plated film is carried out to workpiece 6 by hot donut 4, and by cooling true Empty room 5 carries out the cooling after plated film to workpiece 6.The heating, vacuum chamber 41 that hot donut 4 is connected to by 1~4 forms, and heating is true Planar vacuum heating device is equipped in cavity 41 to control the temperature of workpiece 6 by the single-stage or Multi-stage heating to workpiece 6 System, is heated to proper temperature for the temperature of workpiece 6, plating membrane efficiency can be improved, and step up film plating layer and the combination of workpiece 6 more It is close, to improve the quality of film plating layer;The cooling vacuum chamber 51 that cooling vacuum room 5 is connected to by 2~4 forms, cooling vacuum chamber Planar vacuum water cooling plant is equipped in 51, by carrying out multistage cooling to the workpiece 6 after the completion of plated film, to internal grain structure knot Structure is adjusted, and further avoids film plating layer and is oxidized, while rapid cooling is conducive to workpiece 6 and takes out as early as possible, can effectively shorten Plated film time.
The working chamber 11 that electron beam furnace 1 is connected to by 1~3 forms, and 1~2 is equipped in each working chamber 11 electron gun 12, Coating Materials is heated using the electron beam that electron gun 12 issues, the surface of workpiece 6 is deposited on after evaporating Coating Materials Form film plating layer.The mode being obliquely installed can be used in electron gun 12, and 10~40 ° of injection angle is provided for electron gun 12.
Beneficial effects of the present invention:
The method of the present invention uses great-power electronic beam furnace, and cooling using single-stage or Multi-stage heating, multi-stage vacuum and multistage Plating conditions are controlled, can obtain that coating film thickness is big, corrosion resistant plating film composite material, coating film thickness reaches 0.01~200 μ m;The method of the present invention have inexpensive, pollution-free, speed fastly, high efficiency, object qualitative diversity, good film performance can be plated etc. Feature is worthy of popularization.
Detailed description of the invention
Fig. 1 is the schematic diagram for the vacuum electron beam coating apparatus that the present invention uses.
In the figure, it is marked as 1- electron beam furnace, 11- working chamber, 12- electron gun, 2- forvacuum room, 21- forvacuum chamber, 3- postposition vacuum chamber, 31- postposition vacuum chamber, 4- hot donut, 41- heating, vacuum chamber, 5- cooling vacuum room, 51- are cooling true Cavity, 6- workpiece.
Specific embodiment
Specifically, a kind of method of vacuum electron beam plated film, method includes the following steps:
Plating filmed metals are placed in vacuum electron beam coating apparatus, using iron-based material as base material, by base material temperature Degree is heated to 400~1200 DEG C, and setting beam power is not less than 20KW, and control electron beam furnace working chamber vacuum degree is 10~ 10-3Pa, carries out plated film, and plated film is completed, is cooled to no more than 300 DEG C, obtains plating film composite material.
Contain 1~3 working chamber in the method for the present invention in vacuum electron beam coating apparatus, electron gun is arranged in each working chamber It is 1~2, every 20~200KW of electron gun power;It is every that electron gun can be switched in plated film, control beam power (every power adduction electron gun is beam power), thus the present invention beam power can be controlled 20~ 1200KW, so that a variety of base materials are carried out plated film using multiple coating films metal, be had wide range of applications.
In the method for the present invention, preposition 1~4 vacuum chamber, each vacuum chamber are set in vacuum electron beam coating apparatus Base material temperature is heated to 400~1200 DEG C by single-stage or Multi-stage heating by horizontalization plate vacuum heater,;Using list Grade or Multi-stage heating, convenient for control base material temperature, and base material is heated to proper temperature, and film plating layer combination can be made tighter It is close.
In the method for the present invention, preposition 2~8 vacuum chambers and/or postposition 2~8 in vacuum electron beam coating apparatus Planar vacuum device is arranged in vacuum chamber, each vacuum chamber, and by multi-stage vacuum, controlling electron beam furnace working chamber vacuum degree is 10~10-3Pa avoids the plating filmed metals such as titanium, zirconium from, at oxide, losing metallicity in air oxidation.
In the method for the present invention, 2~4 vacuum chambers of postposition, each vacuum chamber are set in vacuum electron beam coating apparatus Horizontalization plate vacuum water cooling plant, it is cooling by multistage, base material is cooled to no more than 300 DEG C;It is cooling using multistage, favorably It in adjusting material internal grain structure structure, carries out that plated film is avoided to aoxidize, while rapid cooling is conducive to product and takes out as early as possible, contract The short working time.
The multiple coating films such as titanium, zirconium, hafnium, nickel, cobalt, chromium or vanadium gold can be used by the screening to each parameter in the method for the present invention Belong to and carry out plated film, the purity of plating filmed metals is 98~99.999%;And it can be for a variety of base materials such as stainless steel, copper or aluminium To carry out plated film, base material can be the forms such as piece, volume.
In the method for the present invention when plated film, mode is injected using 10~40 ° of oblique angles, facilitates whole beat of electron beam and is needing On the material of plated film, plating membrane efficiency is improved.
The method of the present invention uses great-power electronic beam furnace, and base material temperature is heated to 400~1200 DEG C, makes electron beam Power is not less than 20KW, and controlling electron beam furnace working chamber vacuum degree by multi-stage vacuum is 10~10-3Pa carries out plated film, plated film Speed is 5~200m/min, and plated film is high-efficient, therefore plated film time of the invention only needs 1~100min;After the completion of plated film, Base material is cooled to no more than 300 DEG C by the way that multistage is cooling again, plated film is made to have the characteristics that thickness is big, corrosion resistant, The coating film thickness of plating film composite material reaches 0.01~200 μm.
Preferably, a kind of method of vacuum electron beam plated film, method includes the following steps:
Plating filmed metals are placed in vacuum electron beam coating apparatus, in vacuum electron beam coating apparatus preposition 1~4 it is true Plenum chamber, each vacuum chamber setting planar vacuum heating device are heated base material temperature by single-stage or Multi-stage heating To 400~1200 DEG C, setting beam power is 20~1200KW, preposition 2~8 vacuum in vacuum electron beam coating apparatus Planar vacuum device is arranged in 2~8 vacuum chambers of chamber and postposition, each vacuum chamber, by multi-stage vacuum, controls electron beam Furnace working chamber vacuum degree is 10~10-3Pa carries out plated film, and coating speed is 5~200m/min, and plated film time is 1~100min, Plated film is completed, and by 2~4 vacuum chambers of postposition in vacuum electron beam coating apparatus, each vacuum chamber setting plate is true Air water cooling device, it is cooling by multistage, it is cooled to and obtains the plated film composite wood that coating film thickness is 0.01~200 μm no more than 300 DEG C Material.
Below by embodiment, invention is further described in detail, but does not therefore limit the scope of the present invention Among the embodiment described range.
Embodiment 1
In the vacuum electron beam coating apparatus of the present embodiment: electron beam furnace contains 2 working chambers, each working chamber setting electricity 2, sub- rifle;
Set 1 vacuum work chamber, vacuum chamber setting etching dress before working chamber again in vacuum electron beam coating apparatus It sets while preheating;
Set 3 vacuum chambers before working chamber again in vacuum electron beam coating apparatus, each vacuum chamber setting plate is true Empty device carries out multi-stage vacuum;
Planar vacuum is arranged in 3 vacuum chambers of working chamber postposition in vacuum electron beam coating apparatus, each vacuum chamber Water cooling plant carries out multistage cooling;
The method of the present embodiment vacuum electron beam plated film the following steps are included:
TA1 Titanium board is placed in electron beam furnace, using 304 stainless steel substrates as substrate, by single-stage or Multi-stage heating, makes electricity Beamlet furnace foundation bottom material temperature reaches 600 DEG C, and it is 20KW (i.e. beam power is 80KW) that every power electron gun, which is arranged, leads to Crossing multi-stage vacuum makes electron beam furnace working chamber vacuum degree reach 2.6 × 10-2Pa, coating speed 22m/min, plated film 4min, plating Film is completed, cooling by multistage, so that electron beam furnace base material temperature is dropped to 200 DEG C, 41 microns of titanium film thickness of thickness of acquisition Titanium film iron base composite material.
Embodiment 2
In the vacuum electron beam coating apparatus of the present embodiment: electron beam furnace contains 1 working chamber, and electron gun is arranged in working chamber 2;
Set 1 vacuum work chamber again before electron beam furnace working chamber, vacuum chamber setting etching device preheats simultaneously;
Set 4 vacuum chambers before working chamber again in vacuum electron beam coating apparatus, each vacuum chamber setting plate is true Empty device carries out multi-stage vacuum;
Planar vacuum is arranged in 3 vacuum chambers of working chamber postposition in vacuum electron beam coating apparatus, each vacuum chamber Water cooling plant carries out multistage cooling;
The method of the present embodiment vacuum electron beam plated film the following steps are included:
TA0 Titanium board is placed in electron beam furnace, using 304 stainless steel substrates as substrate, by single-stage or Multi-stage heating, makes electricity Beamlet furnace foundation bottom material temperature reaches 500 DEG C, and it is 30KW (i.e. beam power is 60KW) that every power electron gun, which is arranged, leads to Crossing multi-stage vacuum makes electron beam furnace working chamber vacuum degree reach 2.9 × 10-2Pa, coating speed 26m/min, plated film 3min, plating Film is completed, cooling by multistage, so that electron beam furnace base material temperature is dropped to 280 DEG C, the titanium film thickness of acquisition is up to 98 microns Thick titanium film iron base composite material.
Embodiment 3
In the vacuum electron beam coating apparatus of the present embodiment: electron beam furnace contains 3 working chambers, each working chamber setting electricity 2, sub- rifle;
Set 1 vacuum chamber before working chamber again in vacuum electron beam coating apparatus, it is same that etching device is arranged in vacuum chamber When preheat;
Set 5 vacuum chambers before working chamber again in vacuum electron beam coating apparatus, each vacuum chamber setting plate is true Empty device carries out multi-stage vacuum;
Planar vacuum is arranged in 3 vacuum chambers of working chamber postposition in vacuum electron beam coating apparatus, each vacuum chamber Water cooling plant carries out multistage cooling;
The method of the present embodiment vacuum electron beam plated film the following steps are included:
TA1 Titanium board is placed in electron beam furnace, using 304 stainless steel substrates as substrate, by single-stage or Multi-stage heating, makes electricity Beamlet furnace foundation bottom material temperature reaches 600 DEG C, and it is 75KW (i.e. beam power is 150KW) that every power electron gun, which is arranged, Electron beam furnace working chamber vacuum degree is set to reach 6.1 × 10 by multi-stage vacuum-2Pa, coating speed 27m/min, plated film 10min, Plated film is completed, cooling by multistage, so that electron beam furnace base material temperature is dropped to 200 DEG C, the titanium film thickness of acquisition is up to 112 microns Thick titanium film iron base composite material.

Claims (10)

1. the method for vacuum electron beam plated film, it is characterised in that: the following steps are included:
Plating filmed metals are placed in vacuum electron beam coating apparatus, base material temperature are heated to 400~1200 DEG C, setting electricity Beamlet power is not less than 20KW, and control electron beam furnace working chamber vacuum degree is 10~10-3Pa carries out plated film, and plated film is completed, cooling To being no more than 300 DEG C, plating film composite material is obtained.
2. the method for vacuum electron beam plated film according to claim 1, it is characterised in that: the electron beam furnace contains 1~3 A working chamber, it is each working chamber setting 1~2, electron gun, every 20~200KW of electron gun power.
3. the method for vacuum electron beam plated film according to claim 1 or 2, it is characterised in that: the beam power is 20~1200KW.
4. the method for vacuum electron beam plated film according to claim 1, it is characterised in that: described to add base material temperature The mode of heat to 400~1200 DEG C are as follows: preposition 1~4 vacuum chamber, each vacuum chamber in vacuum electron beam coating apparatus Planar vacuum heating device is set, base material temperature is heated to 400~1200 DEG C by single-stage or Multi-stage heating.
5. the method for vacuum electron beam plated film according to claim 1, it is characterised in that: the control electron beam furnace work Chamber vacuum degree is 10~10-3The mode of Pa are as follows: preposition 2~8 vacuum chambers and/or postposition in vacuum electron beam coating apparatus Planar vacuum device is arranged in 2~8 vacuum chambers, each vacuum chamber, and by multi-stage vacuum, it is true to control electron beam furnace working chamber Reciprocal of duty cycle is 10~10-3Pa。
6. the method for vacuum electron beam plated film according to claim 1, it is characterised in that: described to be cooled to no more than 300 DEG C mode are as follows: planar vacuum is arranged in 2~4 vacuum chambers of postposition in vacuum electron beam coating apparatus, each vacuum chamber Water cooling plant, it is cooling by multistage, it is cooled to no more than 300 DEG C.
7. the method for vacuum electron beam plated film according to claim 1, it is characterised in that: the plating filmed metals be titanium, zirconium, Hafnium, nickel, cobalt, chromium or vanadium;The purity of the plating filmed metals is 98~99.999%;The base material is stainless steel, copper or aluminium.
8. the method for vacuum electron beam plated film according to claim 1, it is characterised in that: at least meet following one:
The mode of the plated film is to inject mode using oblique angle;The angle that the oblique angle is injected is 10~40 °;
The speed of the plated film is 5~200m/min, and the time is 1~100min.
9. the method for vacuum electron beam plated film according to claim 1, it is characterised in that: the plating of the plating film composite material Film thickness is 0.01~200 μm.
10. the method for described in any item vacuum electron beam plated films according to claim 1~9, it is characterised in that: the vacuum electric Beamlet coating apparatus includes that electron beam furnace (1), forvacuum room (2), hot donut (4), postposition vacuum chamber (3) and cooling are true Empty room (5);Forvacuum room (2) connection is in the input end of electron beam furnace (1), and hot donut (4) connection is preposition true Between empty room (2) and electron beam furnace (1);Postposition vacuum chamber (3) connection is in the outlet end of electron beam furnace (1), cooling vacuum Room (5) is connected between postposition vacuum chamber (3) and electron beam furnace (1);The working chamber that the electron beam furnace (1) is connected to by 1~3 (11) it forms, 1~2 is equipped in each working chamber (11) electron gun (12);What the forvacuum room (2) was connected to by 2~8 Forvacuum chamber (21) composition, the postposition vacuum chamber (31) that the postposition vacuum chamber (3) is connected to by 2~8 forms, described preposition Planar vacuum device is designed in vacuum chamber (21) and postposition vacuum chamber (31);The hot donut (4) is connected to by 1~4 Heating, vacuum chamber (41) composition, planar vacuum heating device is equipped in heating, vacuum chamber (41);The cooling vacuum room (5) by Cooling vacuum chamber (51) composition of 2~4 connections, cooling vacuum chamber (51) is interior to be equipped with planar vacuum water cooling plant.
CN201811474639.8A 2018-12-04 2018-12-04 The method of vacuum electron beam plated film Pending CN109267017A (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101649448A (en) * 2009-08-26 2010-02-17 兰州大成自动化工程有限公司 Continuous surface vacuum coater of metal sheet strip
CN201648512U (en) * 2010-03-24 2010-11-24 深圳森丰真空镀膜有限公司 Continuous vacuum coating device
CN104694903A (en) * 2014-02-26 2015-06-10 陈庆丰 Continuous physical vacuum coating equipment

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101649448A (en) * 2009-08-26 2010-02-17 兰州大成自动化工程有限公司 Continuous surface vacuum coater of metal sheet strip
CN201648512U (en) * 2010-03-24 2010-11-24 深圳森丰真空镀膜有限公司 Continuous vacuum coating device
CN104694903A (en) * 2014-02-26 2015-06-10 陈庆丰 Continuous physical vacuum coating equipment

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Application publication date: 20190125