CN109266280A - A kind of high-intensity and high-tenacity glue - Google Patents
A kind of high-intensity and high-tenacity glue Download PDFInfo
- Publication number
- CN109266280A CN109266280A CN201811041251.9A CN201811041251A CN109266280A CN 109266280 A CN109266280 A CN 109266280A CN 201811041251 A CN201811041251 A CN 201811041251A CN 109266280 A CN109266280 A CN 109266280A
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- China
- Prior art keywords
- intensity
- acid
- tenacity
- tenacity glue
- resin
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
- C09J167/08—Polyesters modified with higher fatty oils or their acids, or with natural resins or resin acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
A kind of high-intensity and high-tenacity glue, the component including following weight percent: resin acid 20-35%, fatty acid 2-5%, rosin acid anhydrides 2-5%, n-docosane 20-35%, positive octacosane 20-35%, stearic acid 1-5%, polyethylene wax 0.1-0.5%, thermosol 0.1-0.5%, gelatin 0.1-0.5%, silicone resin 0.1-0.5%, maleic anhydride 0.1-0.5%, phthalic anhydride 0.1-0.5%, ethylene glycol 0.1-0.5%, propylene glycol 0.1-0.5%；The sum of weight percent of each component is 100%.The high-intensity and high-tenacity glue of the present invention under the premise of not cutting down glue adhesive strength while can be improved toughness, be more suitable for needed for product.
Description
Technical field
The present invention relates to quartz, hardware, ceramic sapphire material bond processing technical field, and in particular to it is a kind of high-strength
Spend high tenacity glue.
Background technique
Currently, the bonding in quartz, hardware, ceramics, sapphire material adds field, it is basic using high-intensitive, low tenacity
Solid gum or liquid glue carry out bond processing.
Needed for better meeting product, i.e., to ensure the hardness of glue, ensure the toughness of glue again, reach simultaneously
Labile effect needs under the premise of one kind does not cut down glue adhesive strength while can be improved the glue of toughness.
Summary of the invention
The technical problem to be solved by the present invention is to provide one kind and be more suitable for product institute needed for overcoming certain product speciality
The high-intensity and high-tenacity glue needed.
The technical solution adopted by the present invention to solve the technical problems is: a kind of high-intensity and high-tenacity glue, including following
The component of weight percent: resin acid 20-35%, fatty acid 2-5%, rosin acid anhydrides 2-5%, n-docosane 20-35%, just
Octacosane 20-35%, stearic acid 1-5%, polyethylene wax 0.1-0.5%, thermosol 0.1-0.5%, gelatin 0.1-0.5%,
Silicone resin 0.1-0.5%, maleic anhydride 0.1-0.5%, phthalic anhydride 0.1-0.5%, ethylene glycol 0.1-0.5%,
Propylene glycol 0.1-0.5%；The sum of weight percent of each component is 100%.
Preferably, the resin acid is 30-33%.
Preferably, the fatty acid is 3-4%.
Preferably, the rosin acid anhydrides is 2.5-4%.
Preferably, the n-docosane is 28-32%.
Preferably, the positive octacosane is 28-32%.
Preferably, the stearic acid is 1.5-3%.
Preferably, the polyethylene wax is 0.2-0.3%.
Preferably, the thermosol is 0.2-0.3%.
Preferably, the gelatin is 0.2-0.3%.
Preferably, the maleic anhydride is 0.2-0.3%.
Preferably, the phthalic anhydride is 0.2-0.3%.
The preparation method of the high-intensity and high-tenacity glue, comprising the following steps:
Step 1: container is heated up under the conditions of 50 ± 5 DEG C, and resin acid, fatty acid, rosin acid anhydrides are added by predetermined ratio
All melt in container；
Step 2: it takes n-docosane, positive octacosane, stearic acid to be added in container by predetermined ratio and melts together；
Step 3: polyethylene wax, thermosol, gelatin, silicone resin, maleic anhydride, O-phthalic are taken by predetermined ratio
Acid anhydrides, ethylene glycol, propylene glycol are added in the above solution melts together；
Step 4: liquid curing under natural temperature,.
Application method: after the substance needed for preparing is prepared thawing in proportion, the workpiece (product) of required bonding is heated
Afterwards, workpiece (product) is impregnated 1-2 seconds in solution, reuses special fixture and is squeezed, is bonded.Because of institute's bonding work pieces
Hardness, the flatness difference of (product), different workpieces (product) are using different bonding jigs and bonding dynamics better effect.
The present invention is more suitable for applying in this field by the hardness and strength of promotion glue.By the hardness of glue and tough
The change of property, the finish for processing product to rear process, flatness, verticality etc. are more accurate, can largely solve
Certainly product unfilled corner, crack, rupture, it is discrete the problems such as, while product can be made to be more easier to decompose, cleanliness is higher.
Specific embodiment
The invention will be further described with reference to embodiments.
Embodiment 1
A kind of high-intensity and high-tenacity glue, the component including following weight percent: resin acid 31%, fatty acid 3%, pine
Resin acid acid anhydride 2.5%, n-docosane 30%, positive octacosane 30%, stearic acid 1.6%, polyethylene wax 0.25%, thermosol
0.25%, gelatin 0.25%, silicone resin 0.25%, maleic anhydride 0.25%, phthalic anhydride 0.25%, ethylene glycol
0.2%, propylene glycol 0.2%.
The preparation method of the high-intensity and high-tenacity glue, comprising the following steps:
Step 1: container is heated up under the conditions of 50 DEG C, and resin acid 31%, fatty acid 3%, rosin acid anhydrides 2.5% are added
All melt in container；
Step 2: it takes n-docosane 30%, positive octacosane 30%, stearic acid 1.6% to be added in container and melts together；
Step 3: polyethylene wax 0.25%, thermosol 0.25%, gelatin 0.25%, silicone resin 0.25%, maleic two are taken
Acid anhydrides 0.25%, phthalic anhydride 0.25%, ethylene glycol 0.20%, propylene glycol 0.20% are added in the above solution and melt together
Change；
Step 4: liquid curing under natural temperature,.
Each component described in preparation method can be purchased by disclosed Sales Channel and be obtained, and industry environmental protection requirement is all met.
Embodiment 2
A kind of high-intensity and high-tenacity glue, the component including following weight percent: resin acid 29%, fatty acid 3%, pine
Resin acid acid anhydride 2.5%, n-docosane 31%, positive octacosane 31%, stearic acid 1.6%, polyethylene wax 0.25%, thermosol
0.25%, gelatin 0.25%, silicone resin 0.25%, maleic anhydride 0.25%, phthalic anhydride 0.25%, ethylene glycol
0.2%, propylene glycol 0.2%.
The preparation method of the high-intensity and high-tenacity glue, comprising the following steps:
Step 1: container is heated up under the conditions of 50 DEG C, and resin acid 29%, fatty acid 3%, rosin acid anhydrides 2.5% are added
All melt in container；
Step 2: it takes n-docosane 31%, positive octacosane 31%, stearic acid 1.6% to be added in container and melts together；
Step 3: polyethylene wax 0.25%, thermosol 0.25%, gelatin 0.25%, silicone resin 0.25%, maleic two are taken
Acid anhydrides 0.25%, phthalic anhydride 0.25%, ethylene glycol 0.20%, propylene glycol 0.20% are added in the above solution and melt together
Change；
Step 4: liquid curing under natural temperature,.
Each component described in preparation method can be purchased by disclosed Sales Channel and be obtained, and industry environmental protection requirement is all met.
Embodiment 3
A kind of high-intensity and high-tenacity glue, the component including following weight percent: resin acid 33%, fatty acid 3%, pine
Resin acid acid anhydride 2.5%, n-docosane 29%, positive octacosane 29%, stearic acid 1.6%, polyethylene wax 0.25%, thermosol
0.25%, gelatin 0.25%, silicone resin 0.25%, maleic anhydride 0.25%, phthalic anhydride 0.25%, ethylene glycol
0.2%, propylene glycol 0.2%.
The high-intensity and high-tenacity glue is made as Preparation Method, comprising the following steps:
Step 1: container is heated up under the conditions of 50 DEG C, and resin acid 23%, fatty acid 3%, rosin acid anhydrides 2.5% are added
All melt in container；
Step 2: it takes n-docosane 29%, positive octacosane 29%, stearic acid 1.6% to be added in container and melts together；
Step 3: polyethylene wax 0.25%, thermosol 0.25%, gelatin 0.25%, silicone resin 0.25%, maleic two are taken
Acid anhydrides 0.25%, phthalic anhydride 0.25%, ethylene glycol 0.20%, propylene glycol 0.20% are added in the above solution and melt together
Change；
Step 4: liquid curing under natural temperature,.
Each component described in preparation method can be purchased by disclosed Sales Channel and be obtained, and industry environmental protection requirement is all met.
Implementation result
For proof implementation result of the present invention, contrast test is carried out:
Environmental-protecting performance, test, production and user are responsible for impression；
Heat stability testing: normal temperature storage has seen whether discoloration, softening phenomenon, has been repeated 3 times and is averaged in 7 days；
Solidification test: normal temperature condition lower 30 minutes, confirming curing time for the glue taking-up after thawing under normal temperature conditions,
It is repeated 3 times and is averaged；
Just dry test: normal temperature condition lower 15 minutes；It takes 10 workpiece to be bonded, measures the just dry time, be repeated 5 times and make even
Mean value；
Cooling test: normal temperature condition lower 15 minutes；It takes 10 workpiece to be bonded, measures cooling time, be repeated 5 times and make even
Mean value；
Water resistance test: taking 2 submerging tests of bonding work pieces progress, bonding work pieces after cooling soaked 72 hours,
It is repeated 10 times；
Product test: processing technology is pressed, takes 10 workpiece to carry out processing confirmation, is repeated 3 times.
Comparative example 1 and the specific test result of embodiment 1-3 are shown in Table 1.
Table 1
| Testing index | Comparative example 1 | Embodiment 1 | Embodiment 2 | Embodiment 3 |
| Environmental-protecting performance | It is flavoursome | It is flavoursome | It is flavoursome | Slight taste |
| Thermal stability | It is poor | Normally | Normally | Normally |
| Solidification test | It is poor | 45 minutes | 39 minutes | 30 minutes |
| Just dry test | 45 minutes | 37 minutes | 22 minutes | 15 minutes |
| Cooling test | 27 minutes | 22 minutes | 23 minutes | 15 minutes |
| Water resistance test | 49 hours | 56 hours | 68 hours | > 72 hours |
| Product test | There is rupture | There is rupture | Slight rupture | Without breakage |
Claims (9)
1. a kind of high-intensity and high-tenacity glue, which is characterized in that the component including following weight percent: resin acid 20-35%,
Fatty acid 2-5%, rosin acid anhydrides 2-5%, n-docosane 20-35%, positive octacosane 20-35%, stearic acid 1-5% gather
Ethylene waxes 0.1-0.5%, thermosol 0.1-0.5%, gelatin 0.1-0.5%, silicone resin 0.1-0.5%, maleic anhydride
0.1-0.5%, phthalic anhydride 0.1-0.5%, ethylene glycol 0.1-0.5%, propylene glycol 0.1-0.5%；The each component
The sum of weight percent is 100%.
2. high-intensity and high-tenacity glue according to claim 1, which is characterized in that the resin acid is 30-33%.
3. high-intensity and high-tenacity glue according to claim 1 or 2, which is characterized in that the fatty acid is 3-4%.
4. high-intensity and high-tenacity glue according to claim 1 or 2, which is characterized in that the rosin acid anhydrides is 2.5-
4%.
5. high-intensity and high-tenacity glue according to claim 1 or 2, which is characterized in that the n-docosane is 28-
32%.
6. high-intensity and high-tenacity glue according to claim 1 or 2, which is characterized in that the positive octacosane is 28-
32%.
7. high-intensity and high-tenacity glue according to claim 1 or 2, which is characterized in that the stearic acid is 1.5-3%.
8. high-intensity and high-tenacity glue according to claim 1 or 2, which is characterized in that the polyethylene wax is 0.2-
0.3%；The thermosol is 0.2-0.3%；The gelatin is 0.2-0.3%；The maleic anhydride is 0.2-0.3%；
The phthalic anhydride is 0.2-0.3%.
9. a kind of preparation method of the high-intensity and high-tenacity glue as described in claim 1-8 any claim, which is characterized in that
The following steps are included:
Step 1: container is heated up under the conditions of 50 ± 5 DEG C, and container is added in resin acid, fatty acid, rosin acid anhydrides by predetermined ratio
It is interior all to melt；
Step 2: it takes n-docosane, positive octacosane, stearic acid to be added in container by predetermined ratio and melts together；
Step 3: by predetermined ratio take polyethylene wax, thermosol, gelatin, silicone resin, maleic anhydride, phthalic anhydride,
Ethylene glycol, propylene glycol are added in the above solution melts together；
Step 4: liquid curing under natural temperature,.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811041251.9A CN109266280A (en) | 2018-09-07 | 2018-09-07 | A kind of high-intensity and high-tenacity glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811041251.9A CN109266280A (en) | 2018-09-07 | 2018-09-07 | A kind of high-intensity and high-tenacity glue |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109266280A true CN109266280A (en) | 2019-01-25 |
Family
ID=65188643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811041251.9A Pending CN109266280A (en) | 2018-09-07 | 2018-09-07 | A kind of high-intensity and high-tenacity glue |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109266280A (en) |
Citations (10)
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|---|---|---|---|---|
| CN85105449A (en) * | 1985-07-11 | 1987-01-14 | 成都科技大学 | Solvent type adhesive for adhering polyolefing |
| CN1609157A (en) * | 2003-04-11 | 2005-04-27 | 国家淀粉及化学投资控股公司 | Process for making pressure sensitive adhesive tapes from cationic cure adhesives |
| CN101001920A (en) * | 2004-08-11 | 2007-07-18 | 小西株式会社 | Reactive hot-melt resin composition and reactive hot-melt adhesive |
| CN101154058A (en) * | 2006-09-28 | 2008-04-02 | 富士胶片株式会社 | Image recording material, method for producing the same, and image forming method |
| CN101187713A (en) * | 2006-11-21 | 2008-05-28 | 富士胶片株式会社 | Method for manufacturing products with birefringent pattern |
| CN101248133A (en) * | 2005-06-24 | 2008-08-20 | 埃克森美孚化学专利公司 | Functionalized propylene copolymer adhesive composition |
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| CN102443243A (en) * | 2011-09-22 | 2012-05-09 | 际华三五三七制鞋有限责任公司 | Ultra-micro-emulsion high-viscosity resin, its preparation method and application |
| CN104046309A (en) * | 2013-03-12 | 2014-09-17 | 日东电工株式会社 | Adhesive, adhesive layer, adhesive sheet, and touch panel |
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-
2018
- 2018-09-07 CN CN201811041251.9A patent/CN109266280A/en active Pending
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|---|---|---|---|---|
| CN85105449A (en) * | 1985-07-11 | 1987-01-14 | 成都科技大学 | Solvent type adhesive for adhering polyolefing |
| CN1609157A (en) * | 2003-04-11 | 2005-04-27 | 国家淀粉及化学投资控股公司 | Process for making pressure sensitive adhesive tapes from cationic cure adhesives |
| CN101001920A (en) * | 2004-08-11 | 2007-07-18 | 小西株式会社 | Reactive hot-melt resin composition and reactive hot-melt adhesive |
| CN101248133A (en) * | 2005-06-24 | 2008-08-20 | 埃克森美孚化学专利公司 | Functionalized propylene copolymer adhesive composition |
| CN101248135A (en) * | 2005-06-24 | 2008-08-20 | 埃克森美孚化学专利公司 | Plasticized functionalized propylene copolymer adhesive composition |
| CN101154058A (en) * | 2006-09-28 | 2008-04-02 | 富士胶片株式会社 | Image recording material, method for producing the same, and image forming method |
| CN101187713A (en) * | 2006-11-21 | 2008-05-28 | 富士胶片株式会社 | Method for manufacturing products with birefringent pattern |
| CN102443243A (en) * | 2011-09-22 | 2012-05-09 | 际华三五三七制鞋有限责任公司 | Ultra-micro-emulsion high-viscosity resin, its preparation method and application |
| CN104046309A (en) * | 2013-03-12 | 2014-09-17 | 日东电工株式会社 | Adhesive, adhesive layer, adhesive sheet, and touch panel |
| CN104119826A (en) * | 2014-06-26 | 2014-10-29 | 安徽图强文具股份有限公司 | Environment-friendly hot-melt adhesive for notebook adhesion |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190125 |
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