CN109262869B - Slicing auxiliary liquid and slicing method for photovoltaic slices - Google Patents
Slicing auxiliary liquid and slicing method for photovoltaic slices Download PDFInfo
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- CN109262869B CN109262869B CN201811257415.1A CN201811257415A CN109262869B CN 109262869 B CN109262869 B CN 109262869B CN 201811257415 A CN201811257415 A CN 201811257415A CN 109262869 B CN109262869 B CN 109262869B
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Abstract
The application discloses a slicing auxiliary liquid for photovoltaic slices, which comprises 2 to 15 weight percent of bubble generating substances dissolved in water and 0.1 to 2 weight percent of surface lubricating substances, wherein the bubble generating substances are used for being adsorbed on the surfaces of the photovoltaic slices and decomposing bubbles, the surface lubricating substances are used for fixing the bubbles decomposed from the bubble generating substances on the surfaces of the photovoltaic slices, and a lubricating film containing gas is formed, so that the buoyancy of the photovoltaic slices in the water can be improved, the separable characteristic among the photovoltaic slices is improved, the proportion of adhesive sheets and connecting sheets is reduced, the operation smoothness of a slice inserting machine is improved, and the probability of fragment and edge damage is reduced; and placing the soaked photovoltaic slices in a water tank of a sheet inserting machine for slicing.
Description
Technical Field
The invention belongs to the technical field of photovoltaic slices, and particularly relates to a slicing auxiliary liquid and a slicing method of a photovoltaic slice.
Background
In the photovoltaic industry at present, a diamond wire multi-wire cutting mode has replaced sand wire cutting to become a mainstream mode of crystalline silicon slicing, because the diamond wire multi-wire cutting mode is higher in efficiency, less in silicon loss and lower in processing cost.
After the diamond wire is cut in a multi-wire mode, the silicon rod is cut into silicon wafers, cutting liquid is adhered to the silicon wafers, the silicon wafers are adhered to each other under the action of surface tension of water and the cutting liquid, meanwhile, the cutting thickness of the silicon wafers is thinner and thinner, and in addition, the crystalline silicon has hard brittleness, and is likely to be stressed unevenly in the subsequent slicing process, so that the silicon wafers are prone to collapse and crack. The existing automatic silicon wafer inserting machine has the working mode that stacked silicon wafers are placed in a water tank, the adhesion force between the silicon wafers is reduced under the action of hydraulic jet, gradual separation between the silicon wafers is achieved, then local negative pressure is formed at the bottom of an adsorption plate through a water suction pipe on the adsorption plate, the silicon wafers are conveyed to a conveying belt, and separation, transmission and insertion of the silicon wafers are completed. One specific embodiment is that through complex pipeline design and hole pattern adjustment of water outlet holes, an underwater strong jet technology is adopted to separate silicon wafers with large adhesive force forcibly, but the silicon wafers are stressed greatly in the slicing process and are easy to generate fragments and collapse, another embodiment is that high-pressure gas is mixed into a water tank of a wafer inserting machine, a large amount of gas dispersed in water is injected into stacked silicon wafers along with water flow, adhesion among the silicon wafers is damaged, compared with a common strong water jet technology, the mixing of the gas is beneficial to reducing friction among the silicon wafers, but the adsorption capacity of the gas in the water flow on the surfaces of the silicon wafers is poor, and the stability is not strong.
In conclusion, the powerful jet mode in water adopted in the prior art needs to accurately adjust the water flow direction, pressure and speed to ensure the effective separation of the adhered silicon wafers, the difference exists in the size of the adhesion force between the silicon wafers due to the fluctuation of the performance of cutting liquid and the uneven residual quantity in the actual production process, meanwhile, the water quality change caused by impurities in the water tank of the wafer inserting machine enables the water flow parameter to be continuously changed, the friction between the silicon wafers is intensified, the working quality of the wafer inserting machine is finally reduced, and the damage proportion of the edge of the silicon wafer is increased.
Disclosure of Invention
In order to solve the problems, the invention provides the auxiliary liquid for slicing the photovoltaic slices and the slicing method, which can improve the buoyancy of the photovoltaic slices in water, improve the separability of the photovoltaic slices, reduce the proportion of sticking sheets and connecting sheets, improve the operation smoothness of a sheet inserting machine and reduce the probability of fragments and edge damage.
The invention provides a slicing auxiliary liquid for a photovoltaic slice, which comprises 2 to 15 weight percent of bubble generating substance and 0.1 to 2 weight percent of surface lubricating substance dissolved in water, wherein the bubble generating substance is used for being adsorbed on the surface of the photovoltaic slice and decomposing bubbles, and the surface lubricating substance is used for fixing the bubbles decomposed from the bubble generating substance on the surface of the photovoltaic slice to form a lubricating film containing gas.
Preferably, in the auxiliary liquid for photovoltaic slice slicing, the bubble generating substance is 8%, 10% or 12% by weight.
Preferably, in the auxiliary liquid for photovoltaic slice slicing, the weight ratio of the surface lubricating substance is 0.2%, 0.3%, 0.4% or 0.5%.
Preferably, the auxiliary liquid for slicing photovoltaic slices further comprises a pH adjusting substance in an amount of 0.01 to 3% by weight.
Preferably, in the auxiliary liquid for photovoltaic slice slicing, the bubble generating substance is ammonium bicarbonate and/or ammonium carbonate and/or ammonium hypochlorite.
Preferably, in the auxiliary liquid for slicing photovoltaic slices, the surface lubricating substance is fatty alcohol polyoxyethylether or tall oil acid.
Preferably, in the auxiliary liquid for slicing photovoltaic slices, the pH adjusting substance is citric acid, and is used for controlling the pH of the auxiliary liquid to be between 2 and 7.5.
The invention provides a photovoltaic slice slicing method, which comprises the following steps:
soaking the degummed photovoltaic slices in the slicing auxiliary liquid for a preset time;
and placing the soaked photovoltaic slices in a water tank of a sheet inserting machine for slicing.
Preferably, in the above method for slicing a photovoltaic slice, the photovoltaic slice is a silicon wafer.
Preferably, in the above method for slicing a photovoltaic slice, the preset time is not less than 3 minutes.
As can be seen from the above description, the auxiliary liquid for slicing photovoltaic slices provided by the present invention comprises 2 to 15% by weight of bubble generating substance dissolved in water, and 0.1 to 2% by weight of surface lubricating substance, wherein the bubble generating substance is used for adsorbing on the surface of a photovoltaic slice and decomposing bubbles, and the surface lubricating substance is used for fixing the bubbles decomposed from the bubble generating substance on the surface of the photovoltaic slice to form a lubricating film containing gas, so that the surface of the uppermost photovoltaic slice adsorbs a large amount of bubbles, the density is relatively reduced, the uppermost photovoltaic slice can float rapidly under the action of water flow and is separated from the photovoltaic slice adjacent to the lower layer, and due to the existence of the lubricating film containing gas, the friction generated by the upper and lower photovoltaic slices under the action of water flow is significantly reduced, the breakage rate of the edge of the photovoltaic slice formed by the insert is reduced, and the operation of the slicing machine is more stable, in addition, the photovoltaic slice splitting method provided by the invention can improve the buoyancy of the photovoltaic slices in the water, improve the separable characteristic of the photovoltaic slices, reduce the probability of fragment and edge damage, reduce the proportion of the adhesive sheets and the connecting sheets, improve the operation smoothness of the photovoltaic slices in the water, improve the separable characteristic of the photovoltaic slices, reduce the proportion of the adhesive sheets and the connecting sheets, improve the operation smoothness of the photovoltaic slices and reduce the probability of fragment and edge damage by utilizing the splitting auxiliary liquid for soaking in advance.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic view of an embodiment of a method for slicing a photovoltaic slice provided by the present application.
Detailed Description
The core idea of the invention is to provide the auxiliary liquid for slicing the photovoltaic slices and the slicing method, which can improve the buoyancy of the photovoltaic slices in water, improve the separability of the photovoltaic slices, reduce the proportion of the sticking sheets and the connecting sheets, improve the operation fluency of the slice inserting machine and reduce the probability of fragments and edge damage.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The embodiment of the auxiliary liquid for slicing photovoltaic provided by the application comprises 2 to 15 weight percent of bubble generating substance dissolved in water and 0.1 to 2 weight percent of surface lubricating substance, wherein the bubble generating substance is used for being adsorbed on the surface of the photovoltaic slice and decomposing bubbles, and the surface lubricating substance is used for fixing the bubbles decomposed from the bubble generating substance on the surface of the photovoltaic slice to form a lubricating film containing gas.
It should be noted that the photovoltaic slice is used for producing solar cells, the material of the photovoltaic slice is not limited, but is not limited to silicon wafer, because the photovoltaic slice has small thickness, and is easy to break due to slicing, so the slicing auxiliary liquid provided by the present application is directed to the photovoltaic slice, and there are many bubble generating substances used herein, and the substance with better effect is easily decomposed ammonium salt, in addition, sodium carbonate, sodium bicarbonate or potassium carbonate, potassium bicarbonate and ammonium sulfide, ammonium hydrogen sulfide, ammonium chloride, etc. can be used, and these substances can also form bubbles after being decomposed on the surface of the photovoltaic slice, but the requirement on the pH value is relatively strict, the requirement on the field operation is higher, the ammonium carbonate salt formed by weak acid and weak base is the best effect, when ammonium salt is used, in order to ensure that the ammonium salt forms deposition on the surface of the photovoltaic slice, the content of ammonium salt in the auxiliary liquid for slicing needs to reach more than 2%, on the other hand, the surface lubricating substance adopted in the auxiliary liquid for slicing can be fatty alcohol-polyoxyethylene ether, also can be polyethylene glycol, polyether and other substances with better water solubility, and is not limited in the position, when the bubble generating substance in the solution reaches a certain proportion, nucleation and deposition can be carried out on the surfaces of the stacked photovoltaic slices, and then the decomposition is carried out slowly, the decomposed gas forms a large number of fine bubbles, the fine bubbles are coated on the surfaces of the photovoltaic slices and are accumulated continuously, so that the adjacent photovoltaic slices are separated under the condition of uniform stress, and the surface lubricating substance can continuously permeate into a gas-liquid interface while the bubbles expand, and finally a lubricating film is formed on the surfaces of the photovoltaic.
As can be seen from the above description, the auxiliary liquid for slicing photovoltaic slices provided by the present application includes 2% to 15% by weight of bubble generating substance dissolved in water, 0.1% to 2% by weight of surface lubricating substance, the bubble generating substance is used for adsorbing on the surface of the photovoltaic slice and decomposing out bubbles, the surface lubricating substance is used for fixing the bubbles decomposed out by the bubble generating substance on the surface of the photovoltaic slice to form a lubricating film containing gas, so that a large amount of bubbles are adsorbed on the surface of the uppermost photovoltaic slice, the density of the bubbles is relatively reduced, the bubbles can float rapidly under the action of water flow and are separated from the photovoltaic slice adjacent to the lower layer, and due to the existence of the lubricating film containing gas, the friction generated by the upper and lower photovoltaic slices under the action of water flow is significantly reduced, the breakage rate of the edge of the photovoltaic slice formed by the insert is reduced, the operation of the slicing machine is more stable, that is, the buoyancy of the photovoltaic slices in water can be improved, the separability of the photovoltaic slices can be improved, the proportion of the sticking sheets and the connecting sheets can be reduced, the operation smoothness of the sheet inserting machine can be improved, and the probability of fragment and edge damage can be reduced.
On the basis of the auxiliary liquid for slicing the photovoltaic slices, a preferable scheme is provided, wherein the weight ratio of the bubble generating substances is 8%, 10% or 12%, so that the bubble content can be ensured to be enough to realize the comprehensive coverage of the surface of the photovoltaic slices, the consumption of the bubble generating substances can be effectively controlled, and the production cost is not too high.
Meanwhile, the weight ratio of the surface lubricating substance can be further preferably 0.2%, 0.3%, 0.4% or 0.5%, and the weight ratio enables the surface lubricating substance to have strong adsorption capacity on the surface of the photovoltaic slice and better lubricating performance, and more micro bubbles can be fixed on the surface of the photovoltaic slice, so that a lubricating film with high gas content is formed on the surface of the photovoltaic slice, the floating of the photovoltaic slice is facilitated, and the friction force can be reduced.
In another embodiment, for example, when a weak acid salt of a strong base such as sodium carbonate or potassium carbonate is used as the bubble generating substance, an acidic environment must be used, otherwise the strong base generated by decomposition may corrode the photovoltaic chip, which is disadvantageous for long-term use, in this case, a pH adjusting substance of 0.01 to 3% by weight may be added, citric acid may be used, and an organic acid such as lactic acid or gluconic acid may be used, and the pH adjusting effect may be achieved because it is not completely ionized at one time as the inorganic acid is, so that hydrogen ions are continuously released as the use is consumed, which is advantageous for more stable bubbling, and the ionization degree of different acids is different, and when citric acid is added, the preferable ratio is 0.05 to 0.1%, which is only one of preferable, and in some cases, for example, when ammonium hypochlorite or ammonium hydrogen carbonate is used as the bubble generating substance, the natural decomposition can generate air bubbles without adding other pH value adjusting substances, so that the method is more advantageous.
In a specific embodiment, the bubble generating substance is ammonium bicarbonate and/or ammonium carbonate and/or ammonium hypochlorite, and the ammonium salts are unstable at normal temperature, are easy to decompose and emit gas and are adsorbed on the surface of the photovoltaic slice to realize the separation of the photovoltaic slice, and in the case of ammonium bicarbonate and ammonium carbonate, the reaction process is as follows:
NH4HCO3＝NH3↑+H2O+CO2↑
(NH4)2CO3＝2NH3↑+H2O+CO2↑
when the content of the inorganic ammonium salt in the solution reaches a certain proportion, nucleation and deposition can be formed on the surface of the stacked photovoltaic slices, the inorganic ammonium salt adsorbed on the surface of the photovoltaic slices is slowly decomposed in a weak acid environment (the pH value of the solution is controlled by citric acid), a large number of fine bubbles are formed by the released gas to coat the surface of the photovoltaic slices and are continuously accumulated, so that the photovoltaic slices and the photovoltaic slices are separated under the condition of uniform stress, the ammonia gas released after the ammonium salt decomposition and fine powder existing on the surface of the photovoltaic slices can be subjected to chemical reaction again in water to continuously release the gas, the adsorbed gas amount on the surface of the photovoltaic slices is ensured to be continuously increased, and when the bubbles expand, in order to reduce the surface energy, surface lubricating substances can continuously permeate into a gas-liquid interface, and finally a lubricating film is formed on the.
Furthermore, the surface lubricating substance used in the above-mentioned sheet separation auxiliary liquid may be fatty alcohol-polyoxyethylene ether or tall oil acid, and the fatty alcohol-polyoxyethylene ether is a large group, including AEO-7, AEO-9, etc., which can be used and is more effective, and the tall oil acid belongs to another large group, which can also be used here.
Still further, it is preferable that the pH adjusting substance is citric acid for controlling the pH of the auxiliary liquid to be 2 to 7.5, including ammonium salt, which is sensitive to the pH of the solution, and the photovoltaic slice is substantially stable under acidic conditions (except hydrofluoric acid), so that in order to ensure that the slice auxiliary liquid is effective for a long time, the pH can be further controlled to be weakly acidic between 5 and 6.5, no corrosion is caused to the photovoltaic slice, and the bubbles can be maintained for a longer time.
An embodiment of a photovoltaic slice slicing method provided by the present application is shown in fig. 1, where fig. 1 is a schematic view of an embodiment of the photovoltaic slice slicing method provided by the present application, and the method includes the following steps:
s1: soaking the degummed photovoltaic slices in the slicing auxiliary liquid for a preset time;
the photovoltaic slice is used for producing solar cells, the material is not limited, but is not limited to silicon slices, the photovoltaic slice is relatively easy to break due to slicing because the thickness of the photovoltaic slice is small, the slicing auxiliary liquid is specific to the photovoltaic slice, the bubble generating substances adopted in the photovoltaic slice are various, the good-effect one is easily decomposed ammonium salt, in addition, sodium carbonate, sodium bicarbonate or potassium carbonate, potassium bicarbonate, ammonium sulfide, ammonium hydrogen sulfide, ammonium chloride and the like can be adopted, the substances can also form bubbles after being decomposed on the surface of the photovoltaic slice, but the requirements on the pH value are relatively strict, the requirements on field operation are high, the ammonium carbonate salt formed by weak acid and weak base is the best effect, on the other hand, the surface lubricating substance adopted in the photovoltaic slice can be polyoxyethylene ether, or polyethylene glycol, fatty alcohol, fatty, Polyether and other substances with good water solubility are not limited in the position, when the content of the bubble generating substances in the solution reaches a certain proportion, nucleation and deposition can be carried out on the surfaces of the stacked photovoltaic slices, the bubble generating substances adsorbed on the surfaces of the photovoltaic slices are slowly decomposed, a large number of fine bubbles are formed by the released gas to coat the surfaces of the photovoltaic slices, and the gas is continuously accumulated and increased to enable the adjacent photovoltaic slices to be separated under the condition of uniform stress, so that the surface lubricating substances can continuously permeate into a gas-liquid interface while the bubbles expand, and finally a lubricating film is formed on the surfaces of the photovoltaic slices. It should be further noted that in the microbubble fragmentation technology in the prior art, micro bubbles of gas are firstly decomposed in water, then the photovoltaic slice is placed in the water containing the dissolved gas, the gas in the photovoltaic slice is adsorbed on the surface of the photovoltaic slice to form bubbles, the adsorbed bubbles are low in proportion and low in bonding force, the embodiment is that chemical reagents capable of decomposing and releasing the gas are firstly adsorbed on the surface of the photovoltaic slice, the volume of the gas released after the reagents are decomposed is tens of times or even hundreds of times of that of the adsorbed solid, so that the gas content on the surface of the photovoltaic slice is greatly increased, and the effect of separating the photovoltaic slice is very obvious.
S2: and placing the soaked photovoltaic slices in a water tank of a sheet inserting machine for slicing.
Because the auxiliary slicing liquid is used for soaking in advance, the buoyancy of the photovoltaic slices in water can be improved, the separability of the photovoltaic slices can be improved, the proportion of the sticking sheets to the connecting sheets can be reduced, the operation smoothness of the sheet inserting machine can be improved, and the probability of fragment and edge damage can be reduced.
Further, on the basis of the scheme, the photovoltaic slice is preferably a silicon slice.
In another embodiment, the preset time for soaking is not less than 3 minutes, it should be noted that, in the case of less than 3 minutes, the bubble decomposition and movement are not sufficient enough, and the slicing effect is not obvious, therefore, it is preferably not less than 3 minutes, but the time is not too long, because the too long time affects the production capacity of the sliced pieces, that is, the slicing effect is not greatly different after 3 minutes.
The above embodiments are described below in two specific examples:
(1) adding 35 kg of tap water into a turnover box for degumming and blanking the silicon wafer, adding 3.5 kg of accurately weighed ammonium carbonate, 105 g of AEO-9 and 75 g of citric acid into the tap water while stirring, putting the degummed silicon wafer into the above solution without waiting for complete dissolution of the ammonium carbonate, and carrying out the sheet inserting operation when the solution is required to completely submerge the silicon wafer and the soaking time is not less than 3 minutes.
(2) Adding 35 kg of tap water into a turnover box for degumming and blanking silicon wafers, adding 4.5 kg of accurately weighed ammonium bicarbonate, 200 g of AEO-9 and 150 g of citric acid into the tap water while stirring, putting the silicon wafers to be re-washed into the solution without waiting for the ammonium bicarbonate to be completely dissolved, and ensuring that the solution completely submerges the silicon wafers, wherein the wafer inserting operation can be carried out when the soaking time is not less than 3 minutes.
By adopting the method, under the action of fine bubbles, the viscous force between the silicon wafers can be eliminated, the silicon wafers can be quickly separated by weak negative pressure, meanwhile, a lubricating film between the silicon wafers reduces friction and collision generated by unbalanced water flow acting force between the upper silicon wafer and the lower silicon wafer, the quick separation under a flexible state is finally realized, the insert sheet capacity is improved by more than 5%, the cleaning edge breakage is reduced by 0.2%, the fragments are reduced by 0.1%, particularly, when the silicon wafers which are stacked together after being cleaned and dried in a certain proportion exist in the production process of the silicon wafers, when the insert sheets are required to be cleaned again due to sorting inspection, the surfaces of the silicon wafers are completely dried, after the silicon wafers are put into water, air existing between the silicon wafers is reversely emptied by liquid, the negative pressure is formed between the silicon wafers, the silicon wafers are required to be soaked in hot water for more than 3 hours for the secondary separation, the fragment rate and the edge breakage ratio are extremely high, the fragmentation auxiliary agent is added, the surface of the silicon wafer adsorbs gas again in water for separation, the soaking time of the silicon wafer is reduced to 3 minutes, and the fragment rate and the edge breakage ratio are reduced by more than 80%.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. The auxiliary liquid for slicing the photovoltaic slice is characterized by comprising 2 to 15 weight percent of bubble generating substances, 0.1 to 2 weight percent of surface lubricating substances and 0.01 to 3 weight percent of pH value adjusting substances which are dissolved in water, wherein the pH value adjusting substances are citric acid and are used for controlling the pH value of the auxiliary liquid to be between 2 and 7.5;
the bubble generating substance is ammonium bicarbonate and/or ammonium carbonate and/or ammonium hypochlorite.
2. The photovoltaic slice slicing solution as claimed in claim 1, wherein the bubble generating substance is 8%, 10% or 12% by weight.
3. The slice assist fluid according to claim 1, wherein the surface lubricant is present in an amount of 0.2%, 0.3%, 0.4% or 0.5% by weight.
4. The sheeting aid of claim 1, wherein the surface lubricant is fatty alcohol polyoxyethylether or tall oil acid.
5. A method for slicing a photovoltaic slice, comprising:
soaking the degummed photovoltaic slices in the slicing auxiliary liquid according to any one of claims 1 to 4 for a preset time;
and placing the soaked photovoltaic slices in a water tank of a sheet inserting machine for slicing.
6. The method for slicing photovoltaic of claim 5, wherein the photovoltaic slice is a silicon wafer.
7. The method for slicing photovoltaic of claim 5, wherein the predetermined time is not less than 3 minutes.
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| US8863957B2 (en) * | 2009-01-13 | 2014-10-21 | Kabushiki Kaisha Watanabe Shoko | Wafer separation apparatus, wafer separation and transfer apparatus, wafer separation method, wafer separation and transfer method, and solar cell wafer separation and transfer method |
| CN102719896A (en) * | 2011-03-30 | 2012-10-10 | 吉林庆达新能源电力股份有限公司 | Monocrystalline silicon wafer pre-cleaning method |
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