CN109252143A - A kind of chip bench - Google Patents
A kind of chip bench Download PDFInfo
- Publication number
- CN109252143A CN109252143A CN201710570149.7A CN201710570149A CN109252143A CN 109252143 A CN109252143 A CN 109252143A CN 201710570149 A CN201710570149 A CN 201710570149A CN 109252143 A CN109252143 A CN 109252143A
- Authority
- CN
- China
- Prior art keywords
- slide glass
- chip bench
- glass dish
- temperature
- rotary shaft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Control Of Temperature (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a kind of chip bench, including slide glass dish and for measuring the temperature sensor of substrate temperature, chip bench further includes fluid input tube, fluid output tube and temperature control device, thermal conductive cavity is provided in the slide glass dish, described fluid input tube one end is connect with the delivery outlet of the temperature control device, the other end is connected to the thermal conductive cavity, and described fluid output tube one end is connected to the thermal conductive cavity, and the other end is connect with the refluxing opening of the temperature control device.The present invention has many advantages, such as that structure is simplified, temperature control precision is high, chip bench temperature is continuously adjustable.
Description
Technical field
The present invention relates to vacuum coating equipments, refer in particular to a kind of chip bench.
Background technique
In vacuum coating equipment field, substrate surface is to measure film quality and filming equipment at film uniformity, adhesive force
The key index of performance.Film quality is determined by very various factors, such as magnetic-controlled sputtering coating equipment, point of electromagnetic field
Cloth uniformity, reasonability, target-substrate distance, the motion mode of substrate and the being heated evenly property of substrate of gas distribution etc. can all influence
The quality of film forming.For substrate, the temperature of main motion mode and substrate including substrate controls two aspects.
The temperature of substrate is to determine the essential condition of membrane structure in the growth course of film, its crystallization to film
Degree, uniformity, growth rate and internal stress of film etc. impact.The temperature of substrate and the uniformity of Temperature Distribution are to prepare
High performance thin film and the key for controlling film thickness uniformity.Conventional chip bench generally passes through resistance heating or infrared heating, by
Substrate temperature is had certain rising by ion beam effect when deposition, and chip bench needs to have refrigerating function, otherwise cannot
Meet certain technique requirements, it is cooling generally to use water cooling such as the low temperature depositing of mercury cadmium telluride infrared device metallization process.Part work
Skill requires chip bench that need to be provided simultaneously with heating function and refrigerating function.Require have 200 DEG C, 400 in terms of specific temperature value
DEG C or be not higher than 80 DEG C etc., but for some special techniques requirements, temperature requirement continuously may be used in room temperature to 150 DEG C of high temperature
It adjusts, existing heating method and water-cooling pattern is used to can not achieve (boiling point of the water under standard pressure is 100 DEG C).And it is existing
Heating method not can guarantee the uniformity of substrate temperature distribution.
In order to accurately control the temperature of substrate, it is also necessary to temperature detection is carried out, since chip bench is in rotation in technical process
Turn motion state, generally using thermocouple as temperature element, thermocouple can only be close to the top and bottom of substrate, in other words
A kind of contactless temperature-measuring, therefore the actual temperature of measured temperature not instead of substrate surface, a reduced value will lead to
The difference of chip bench temperature and substrate surface temperature is larger, and temperature controlled accuracy and stability are affected.
For the motion mode of substrate, widespread practice is rotated exactly when substrate is smaller and when being monolithic using substrate；
When substrate larger (such as 6 inches, 8 inches even more big), chip bench is only capable of in the case where loading monolithic, generally uses chip bench
Two kinds of aggregate motions of rotation and swing；The case where for loading more substrate, just using chip bench revolution plus substrate rotation.But
Latter two motion structure is obviously more complicated, and volume becomes larger, and the volume of coating chamber is caused to become larger, and equipment cost increase is not
It is few.
In addition, the delivered payload capability of chip bench is limited, needs to open process chamber after being sequentially completed technical process, be loaded and unloaded
Then piece is established vacuum again, completes technical process, recycled with this, a large amount of time, which is wasted in, establishes in vacuum, can serious shadow
Manufacturing schedule is rung, production cost is also increased.
Summary of the invention
The technical problem to be solved by the present invention is to overcome the deficiencies in the prior art, provide that a kind of structure is simplified, temperature control
The chip bench that precision is high, chip bench temperature is continuously adjustable.
In order to solve the above technical problems, the invention adopts the following technical scheme:
A kind of chip bench, including slide glass dish and for measuring the temperature sensor of substrate temperature, chip bench further includes stream
Body input pipe, fluid output tube and temperature control device, are provided with thermal conductive cavity in the slide glass dish, described fluid input tube one end with
The delivery outlet of the temperature control device connects, and the other end is connected to the thermal conductive cavity, described fluid output tube one end with it is described thermally conductive
Chamber connection, the other end are connect with the refluxing opening of the temperature control device.
As a further improvement of the above technical scheme:
The temperature sensor is installed in the slide glass dish and contacts with substrate, and the rotary shaft of the slide glass dish is equipped with
Electric slip ring, the lead of the temperature sensor is connected with the mover of the electric slip ring and the stator through electric slip ring is drawn.
The temperature sensor is contacted by an elastic component with substrate resilience.
Chip bench is also equipped with heat-conducting gas input pipe, and heat-conducting gas input pipe one end is connected to gas source, the other end
The substrate is extended to close to the one side of the slide glass dish.
The rotary shaft of the slide glass dish is hollow shaft and is equipped with rotary joint, the stream in one end far from the slide glass dish
Body input pipe and fluid output tube are arranged in the rotary shaft and are connected to by the rotary joint with the temperature control device；Institute
The lead for stating temperature sensor is arranged in the rotary shaft；The heat-conducting gas input pipe is arranged in the rotary joint and institute
It states in rotary shaft and is arranged with concentric rotation axis.
The rotation axis horizontal of the slide glass dish is installed on a mounting plate, and the slide glass dish is set to a handling piece transition chamber
Interior, the volume of the handling piece transition chamber is less than process chamber, is provided with isolating valve between the handling piece transition chamber and process chamber
Door, the rotary shaft are equipped with the driven in translation for driving slide glass dish to move back and forth between handling piece transition chamber and process chamber
Mechanism.
Device for sealing magnetic fluid is additionally provided in the rotary shaft of the slide glass dish, the periphery of the device for sealing magnetic fluid is set
It is equipped with connecting flange, the electric slip ring is between the mounting plate and the device for sealing magnetic fluid, the mounting plate and institute
It states and is equipped with seal bellows between connecting flange.
The translational drive mechanism includes stepper motor, shaft coupling and lead screw, and the lead screw passes through the connecting flange simultaneously
It is threadedly engaged with connecting flange, the stepper motor is connect by the shaft coupling with the lead screw.
The lead of the temperature sensor is successively drawn by the stator of the electric slip ring and the connecting flange.
The rotary shaft of the slide glass dish is driven by a rotary drive mechanism to be rotated, and the rotary drive mechanism includes servo electricity
Machine, driving gear and driven gear, the driving gear are set on the output shaft of the servo motor, and the driven gear is set to
It is engaged in the rotary shaft and with the driving gear.
Compared with the prior art, the advantages of the present invention are as follows: chip bench disclosed by the invention, it is thermally conductive using fluid circulation
Mode is heated and is freezed to substrate, and using the temperature of temperature sensor real-time detection substrate, temperature control device is according to detecting
Temperature and technical process needed for temperature control enter the temperature of the fluid in thermal conductive cavity, by the heating of substrate and cooling concentrate
To fluid, structure is simplified, improves temperature control precision, since fluid temperature (F.T.) connection is adjustable and then can realize chip bench temperature
Degree continuously adjusts.
Further, temperature sensor is contacted with substrate, realizes contact temperature-measuring, measured temperature is the reality of substrate surface
Border temperature, temperature measurement accuracy are higher；Temperature sensor is installed in slide glass dish to rotate with rotary shaft around its axle center, and temperature passes
The mover that the lead of sensor then passes through electric slip ring realize with the synchronous rotary of rotary shaft, avoid in lead rotary course with rotation
Axis, slide glass dish etc. are wound, so that contact temperature-measuring becomes feasible.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of chip bench of the present invention.
Fig. 2 is structural schematic diagram of the chip bench of the present invention in concrete application embodiment.
Each label indicates in figure:
1, slide glass dish；10, process chamber；11, thermal conductive cavity；12, rotary shaft；13, rotary joint；2, temperature sensor；20, every
From valve；21, lead；22, elastic component；3, fluid input tube；30, translational drive mechanism；301, stepper motor；302, shaft coupling
Device；303, lead screw；4, fluid output tube；40, device for sealing magnetic fluid；401, connecting flange；5, temperature control device；50, wave is sealed
Line pipe；6, heat-conducting gas input pipe；60, rotary drive mechanism；601, servo motor；602, driving gear；603, driven gear；
7, mounting plate；70, substrate；8, electric slip ring；80, bottom plate；9, piece transition chamber is loaded and unloaded.
Specific embodiment
Below in conjunction with Figure of description and specific embodiment, invention is further described in detail.
As depicted in figs. 1 and 2, the chip bench of the present embodiment, including slide glass dish 1 and for measuring the temperature of 70 temperature of substrate
Sensor 2 is spent, chip bench further includes fluid input tube 3, fluid output tube 4 and temperature control device 5, is provided with and leads in slide glass dish 1
Hot chamber 11,3 one end of fluid input tube are connect with the delivery outlet of temperature control device 5, and the other end is connected to thermal conductive cavity 11, fluid output tube
4 one end are connected to thermal conductive cavity 11, and the other end is connect with the refluxing opening of temperature control device 5.Wherein, fluid preferably uses liquid, liquid
The characteristic substrate 70 that need to meet technique requirement temperature it is continuously adjustable to 150 DEG C of high temperature in room temperature；Temperature sensor 2 can be used
Common thermocouple sensor.
Chip bench disclosed by the invention is heated and is freezed to substrate 70 in such a way that fluid circulation is thermally conductive, is utilized
The temperature of 2 real-time detection substrate 70 of temperature sensor, the temperature according to needed for the temperature and technical process that detect of temperature control device 5
Control enters the temperature of the fluid in thermal conductive cavity 11, and by the way that the heating of substrate 70 and cooling to be concentrated on fluid, simplification finishes
Structure improves temperature control precision, since fluid temperature (F.T.) connects adjustable and then can realize continuously adjusting for chip bench temperature.
As further preferred technical solution, in the present embodiment, temperature sensor 2 is installed in slide glass dish 1 and and base
Piece 70 contacts, and the rotary shaft 12 of slide glass dish 1 is equipped with electric slip ring 8, the mover phase of the lead 21 and electric slip ring 8 of temperature sensor 2
Even and through the stator of electric slip ring 8 draw.Temperature sensor 2 is contacted with substrate 70, realizes contact temperature-measuring, measured temperature is base
The actual temperature on 70 surface of piece, temperature measurement accuracy are higher；Temperature sensor 2 be installed in slide glass dish 1 with rotary shaft 12 around
The rotation of its axle center, the lead 21 of temperature sensor 2 are then realized the synchronous rotary with rotary shaft 12 by the mover of electric slip ring 8, are led to
Stator extraction is crossed, avoids in 21 rotary course of lead and is wound with rotary shaft 12, slide glass dish 1 etc., so that contact temperature-measuring
Become feasible.
Temperature sensor 2 realizes Elastic Contact with substrate 70 by an elastic component 22.In the present embodiment, elastic component 22 is used
Compressed spring.Setting elastic component 22 ensure that temperature sensor 2 is contacted with substrate 70 always, while can avoid rotary course in because
Temperature sensor 2 and substrate 70 lead to the two rigid contact with respect to bounce, improve reliability.
As further preferred technical solution, in the present embodiment, chip bench is also equipped with heat-conducting gas input pipe 6, leads
6 one end of hot gas input pipe is connected to gas source, and the other end extends to substrate 70 close to the one side of slide glass dish 1, the i.e. right side in attached drawing
Face, the also known as back side of substrate 70.Wherein, gas source is not shown, preferably noble gas source, such as helium.Pass through heat-conducting gas
Input pipe 6 inputs micro helium and improves the temperature of substrate 70 using the diffusion of gas uniformly in all directions to the back side of substrate 70
Uniformity is spent, and then improves quality of forming film.
In the present embodiment, the rotary shaft 12 of slide glass dish 1 is hollow shaft and is equipped with rotary joint in one end far from slide glass dish 1
13, rotary joint 13 is set to the right end of rotary shaft 12 in attached drawing, and slide glass dish 1 is set to the left end of rotary shaft 12,3 He of fluid input tube
Fluid output tube 4 is arranged in rotary shaft 12 and is connected to by rotary joint 13 with temperature control device 5；The lead of temperature sensor 2
21 are arranged in rotary shaft 12；Heat-conducting gas input pipe 6 is arranged in rotary joint 13 and rotary shaft 12 is interior and same with rotary shaft 12
Axis arrangement.Further, fluid input tube 3 is then parallel with fluid output tube 4, is symmetrically arranged at 6 liang of heat-conducting gas input pipe
Side.The lead 21 of fluid input tube 3, fluid output tube 4, heat-conducting gas input pipe 6 and temperature sensor 2 is set to rotary shaft
In 12, on the one hand make more compact structure, reduces space hold and equipment cost, another aspect rotary shaft 12 can also be each pipe, line
Protection is provided, aesthetics is also improved.Wherein, rotary shaft 12 is driven by a rotary drive mechanism 60 and is rotated, in the present embodiment, rotation
Turning driving mechanism 60 includes servo motor 601, driving gear 602 and driven gear 603, and driving gear 602 is set to servo motor
On 601 output shaft, driven gear 603 is set in rotary shaft 12 and engages with driving gear 602.Servo motor 601 starts, according to
It is secondary rotary shaft 12 to be driven to rotate by driving gear 602 and driven gear 603.In other embodiments, gear drive
The substitution such as sprocket wheel transmission, belt wheel transmission can be used.
In the present embodiment, the rotary shaft 12 of slide glass dish 1 is horizontal to be installed on a mounting plate 7, and mounting plate 7 is then fixed on bottom
On plate 80, slide glass dish 1 is set in a handling piece transition chamber 9, and the volume of handling piece transition chamber 9 is less than process chamber 10, loads and unloads piece mistake
It crosses and is equipped with separation valve door 20 between room 9 and process chamber 10, rotary shaft 12 is equipped for driving slide glass dish 1 in handling piece transition chamber
The translational drive mechanism 30 moved back and forth between 9 and process chamber 10.Setting loads and unloads piece transition chamber thereof 9 and by translational drive mechanism 30
Drive slide glass dish 1 handling piece transition chamber 9 and process chamber 10 between move back and forth, can greatly reduce every time establish vacuum when
Between, production efficiency is improved, production cost is also in a disguised form reduced.
Device for sealing magnetic fluid 40 is additionally provided in the rotary shaft 12 of slide glass dish 1, the periphery of device for sealing magnetic fluid 40 is set
It is equipped with connecting flange 401, electric slip ring 8 is between mounting plate 7 and device for sealing magnetic fluid 40, mounting plate 7 and connecting flange 401
Between be equipped with seal bellows 50.In the present embodiment, 50 both ends of seal bellows are respectively welded in 7 connecting flange 401 of mounting plate
On；Correspondingly, the lead 21 of temperature sensor 2 is successively drawn by the stator of electric slip ring 8 and connecting flange 401.It is arranged close
Envelope bellows 50 can realize the vacuum insulation in handling piece transition chamber 9 and seal bellows 50 with external environment.
In the present embodiment, translational drive mechanism 30 includes stepper motor 301, shaft coupling 302 and lead screw 303, and lead screw 303 is worn
It crosses connecting flange 401 and is threadedly engaged with connecting flange 401, stepper motor 301 is connect by shaft coupling 302 with lead screw 303.?
In other embodiments, linear motor is can also be used in translational drive mechanism 30, is transported by linear motor direct drive connecting flange 401
It is dynamic.
The working principle of chip bench of the invention is as follows:
Firstly, handling piece transition chamber 9 is evacuated to vacuum, when process chamber 10 reaches true after substrate 70 is mounted in slide glass dish 1
When empty, separation valve door 20 is opened, translational drive mechanism 30 starts, and shifts the slide glass dish 1 equipped with substrate 70 onto process chamber 10 and carries out
Technical process.
Then fluid is sent to the thermal conductive cavity of slide glass dish 1 by temperature control device 5 by rotary joint 13, fluid input tube 3
In 11, the real time temperature of substrate 70 is fed back by temperature sensor 2, during carrying out technique, slide glass dish 1 is driven by rotation
Uniform speed rotation is in the drive of motivation structure 60, and the temperature certainly in technical process due to substrate 70 can change, temperature control dress
The temperature of 5 adjustable fluids is set, so that substrate 70 is in set temperature.In order to improve the temperature uniformity of substrate 70, from leading
Micro helium is passed through in hot gas input pipe 6 to the back side of substrate 70 (it should be noted that in order to visually show helium in figure
Gas and elastic component 22 etc., increase the distance between substrate 70 and slide glass dish 1 intentionally, both actually in being bonded substantially
State).
After the completion of technique, slide glass dish 1 returns to handling piece transition chamber 9, is then shut off separation valve door 20, and to handling piece mistake
It crosses room 9 and is filled with nitrogen until atmospheric pressure, opens mounting plate 7, can load and unload substrate 70.
Although the present invention has been disclosed as a preferred embodiment, however, it is not intended to limit the invention.It is any to be familiar with ability
The technical staff in domain, without deviating from the scope of the technical scheme of the present invention, all using the technology contents pair of the disclosure above
Technical solution of the present invention makes many possible changes and modifications or equivalent example modified to equivalent change.Therefore, all
Without departing from the content of technical solution of the present invention, according to the present invention technical spirit any simple modification made to the above embodiment,
Equivalent variations and modification, all shall fall within the protection scope of the technical scheme of the invention.
Claims (10)
1. a kind of chip bench, including slide glass dish (1) and for measuring the temperature sensor (2) of substrate (70) temperature, feature
Be: chip bench further includes fluid input tube (3), fluid output tube (4) and temperature control device (5), is set on the slide glass dish (1)
It is equipped with thermal conductive cavity (11), described fluid input tube (3) one end is connect with the delivery outlet of the temperature control device (5), the other end and institute
Thermal conductive cavity (11) connection is stated, described fluid output tube (4) one end is connected to the thermal conductive cavity (11), and the other end and the temperature control fill
Set the refluxing opening connection of (5).
2. chip bench according to claim 1, it is characterised in that: the temperature sensor (2) is installed on the slide glass dish
(1) it is contacted on and with substrate (70), the rotary shaft (12) of the slide glass dish (1) is equipped with electric slip ring (8), the temperature sensor
(2) lead (21) is connected with the mover of the electric slip ring (8) and draws through the stator of electric slip ring (8).
3. chip bench according to claim 2, it is characterised in that: the temperature sensor (2) passes through an elastic component (22)
With substrate (70) Elastic Contact.
4. chip bench according to claim 1 or 2 or 3, it is characterised in that: chip bench is also equipped with heat-conducting gas input pipe
(6), described heat-conducting gas input pipe (6) one end is connected to gas source, and the other end extends to the substrate (70) close to the slide glass
The one side of disk (1).
5. chip bench according to claim 4, it is characterised in that: the rotary shaft (12) of the slide glass dish (1) is hollow shaft
And rotary joint (13), the fluid input tube (3) and fluid output tube (4) are equipped in one end far from the slide glass dish (1)
It is arranged in the rotary shaft (12) and is connected to by the rotary joint (13) with the temperature control device (5)；The temperature passes
The lead (21) of sensor (2) is arranged in the rotary shaft (12)；The heat-conducting gas input pipe (6) is arranged in the rotation and connects
It is in head (13) and the rotary shaft (12) and coaxially arranged with rotary shaft (12).
6. chip bench according to claim 2 or 3, it is characterised in that: rotary shaft (12) level of the slide glass dish (1)
It is installed on a mounting plate (7), the slide glass dish (1) is set in handling piece transition chamber (9), the handling piece transition chamber (9)
Volume be less than process chamber (10), it is described equipped with separation valve door (20) between the handling piece transition chamber (9) and process chamber (10)
Rotary shaft (12) is equipped for driving slide glass dish (1) to move back and forth between handling piece transition chamber (9) and process chamber (10)
Translational drive mechanism (30).
7. chip bench according to claim 6, it is characterised in that: also set up in the rotary shaft (12) of the slide glass dish (1)
Have device for sealing magnetic fluid (40), the periphery of the device for sealing magnetic fluid (40) is provided with connecting flange (401), and the electricity is sliding
Ring (8) is between the mounting plate (7) and the device for sealing magnetic fluid (40), the mounting plate (7) and the connection method
Seal bellows (50) are equipped between blue (401).
8. chip bench according to claim 7, it is characterised in that: the translational drive mechanism (30) includes stepper motor
(301), shaft coupling (302) and lead screw (303), the lead screw (303) pass through the connecting flange (401) and and connecting flange
(401) it is threadedly engaged, the stepper motor (301) is connect by the shaft coupling (302) with the lead screw (303).
9. chip bench according to claim 7, it is characterised in that: the lead (21) of the temperature sensor (2) successively passes through
The stator and the connecting flange (401) for crossing the electric slip ring (8) are drawn.
10. chip bench according to claim 1 or 2 or 3, it is characterised in that: the rotary shaft (12) of the slide glass dish (1) by
One rotary drive mechanism (60) driving rotation, the rotary drive mechanism (60) includes servo motor (601), driving gear
(602) and driven gear (603), the driving gear (602) is set on the output shaft of the servo motor (601), it is described from
Moving gear (603) is set on the rotary shaft (12) and engages with the driving gear (602).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710570149.7A CN109252143B (en) | 2017-07-13 | 2017-07-13 | Substrate table |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710570149.7A CN109252143B (en) | 2017-07-13 | 2017-07-13 | Substrate table |
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| Publication Number | Publication Date |
|---|---|
| CN109252143A true CN109252143A (en) | 2019-01-22 |
| CN109252143B CN109252143B (en) | 2020-12-11 |
Family
ID=65051759
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710570149.7A Active CN109252143B (en) | 2017-07-13 | 2017-07-13 | Substrate table |
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Cited By (4)
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| WO2020207578A1 (en) * | 2019-04-10 | 2020-10-15 | Applied Materials, Inc. | Apparatus for moving a substrate, deposition apparatus, and processing system |
| CN112501589A (en) * | 2020-11-06 | 2021-03-16 | 北京印刷学院 | Atomic layer deposition device |
| CN114277355A (en) * | 2021-12-28 | 2022-04-05 | 深圳优普莱等离子体技术有限公司 | Double-cavity system and equipment for chemical vapor deposition diamond |
| CN115443346A (en) * | 2020-07-01 | 2022-12-06 | 应用材料公司 | Apparatus for moving a substrate, deposition apparatus and processing system |
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| CN113646464A (en) * | 2019-04-10 | 2021-11-12 | 应用材料公司 | Apparatus for moving substrate, deposition apparatus and processing system |
| CN115443346A (en) * | 2020-07-01 | 2022-12-06 | 应用材料公司 | Apparatus for moving a substrate, deposition apparatus and processing system |
| CN112501589A (en) * | 2020-11-06 | 2021-03-16 | 北京印刷学院 | Atomic layer deposition device |
| CN114277355A (en) * | 2021-12-28 | 2022-04-05 | 深圳优普莱等离子体技术有限公司 | Double-cavity system and equipment for chemical vapor deposition diamond |
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