CN109244261A - A kind of display panel, display device and display panel production method - Google Patents
A kind of display panel, display device and display panel production method Download PDFInfo
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- CN109244261A CN109244261A CN201710560418.1A CN201710560418A CN109244261A CN 109244261 A CN109244261 A CN 109244261A CN 201710560418 A CN201710560418 A CN 201710560418A CN 109244261 A CN109244261 A CN 109244261A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The embodiment of the invention discloses a kind of display panel, display device and display panel production methods.The display panel includes: substrate, the non-display area including viewing area and around the viewing area；Organic light-emitting structure, in the viewing area of the substrate；Barricade in the non-display area of the substrate, and surrounds the viewing area；The material of the barricade is organosilicon material；Thin-film encapsulation layer, the thin-film encapsulation layer cover the organic light-emitting structure, and the thin-film encapsulation layer includes that successively spaced inorganic layer and organic layer, the organic layer are located in the region that the barricade surrounds.The scheme of the embodiment of the present invention improves the bending resistance and thin-film package performance of display panel.
Description
Technical field
The present embodiments relate to display technology more particularly to a kind of display panels, display device and display panel production
Method.
Background technique
Organic Light Emitting Diode (Organic Light Emitting Diode, OLED) display is that a kind of self-luminous is aobvious
Show device, compared to liquid crystal display (liquid crystal display, LCD), OLED display does not need backlight, therefore
OLED display is more frivolous, and furthermore OLED display is also because having high brightness, low-power consumption, wide viewing angle, high response speed, width to make
It is applied in various high-performance display fields more and more with the advantages that temperature range.
It is often used the method for thin-film package in the prior art to guarantee luminous organic material and electrode not by external environment
The erosion of steam and oxygen.Generally prevent organic material in thin-film package from overflowing to display panel edge in the production process,
The lateral packaging effect of display panel is influenced, barricade is usually set on a display panel to stop organic matter to outflow.
Barricade in the prior art is not resistant to bending due to organic acrylic material frequently with organic acrylic material, when
Display panel has been easy crackle generation when bending, and not only influences the bending resistance of display panel, and due to the extension of crackle,
The thin-film package performance of display panel can further be influenced.
Summary of the invention
The present invention provides a kind of display panel, display device and display panel production method, to improve the resistance to of display panel
Bending performance and thin-film package performance.
In a first aspect, the embodiment of the invention provides a kind of display panel, the display panel includes:
Substrate, the non-display area including viewing area and around the viewing area；
Organic light-emitting structure, in the viewing area of the substrate；
Barricade in the non-display area of the substrate, and surrounds the viewing area；The material of the barricade is organosilicon
Material；
Thin-film encapsulation layer, the thin-film encapsulation layer cover the organic light-emitting structure, and the thin-film encapsulation layer includes successively
Spaced inorganic layer and organic layer, the organic layer are located in the region that the barricade surrounds.
Further, it is inorganic that the thin-film encapsulation layer, which closes on the side of the substrate and the side far from the substrate,
Layer.
Further, the thin-film encapsulation layer includes the first inorganic layer, the first organic layer and the second inorganic layer；
First inorganic layer is located at the side that first organic layer closes on the substrate；Second inorganic layer is located at
The side of first organic layer far from the substrate.
Further, the barricade includes the first barricade and the second barricade；The second gear walled is around first barricade.
Further, the material of the inorganic layer is silicon nitride or silica.
Further, the material of the organic layer is epoxy, acrylate, first acrylic or methacrylic acid.
Second aspect, the embodiment of the invention also provides a kind of display device, the display device includes that the present invention is any
Display panel described in embodiment.
The third aspect, the embodiment of the invention also provides a kind of display panel production methods, which comprises
A substrate is provided, the substrate includes viewing area and the non-display area around the viewing area；
Organic light-emitting structure is formed in the viewing area of the substrate；
Barricade is formed in the non-display area of the substrate, the barricade surrounds the viewing area, and the material of the barricade is
Organosilicon material；
Thin-film encapsulation layer is formed, the thin-film encapsulation layer covers the organic light-emitting structure, and the thin-film encapsulation layer includes
Successively spaced inorganic layer and organic layer, the organic layer are located in the region that the barricade surrounds.
Further, described to include: in the step of non-display area formation barricade of the substrate
Plated film, which is carried out, using hot evaporation process, spin coating proceeding, spraying process, screen printing process or InkJet printing processes forms gear
Wall pattern；
The barricade pattern is carried out being formed by curing the barricade using UV curing process.
Further, the step of formation thin-film encapsulation layer includes:
It is formed using atom layer deposition process, chemical vapor deposition process or plasma enhanced chemical vapor deposition technique
The inorganic layer.
Further, the step of formation thin-film encapsulation layer includes:
Plated film is carried out to the organic layer using InkJet printing processes；
It carries out being formed by curing the organic layer using UV curing process.
The embodiment of the present invention uses organosilicon material by setting barricade, since organosilicon material elasticity modulus is small, bending
Functional, display panel is not likely to produce crackle when bending, and improves the bending resistance and thin-film package performance of display panel,
And organosilicon material is siliceous and oxygen, preferable with the inorganic layer adhesiveness of thin-film encapsulation layer, when display panel is bent, avoids nothing
Machine layer is separated with barricade, further enhances the lateral water-resisting ability and bending resistance of thin-film encapsulation layer.
Detailed description of the invention
Fig. 1 is a kind of schematic diagram of display panel provided in an embodiment of the present invention；
Fig. 2 be in Fig. 1 display panel along the sectional view of hatching A1-A2；
Fig. 3 is the schematic diagram of another display panel provided in an embodiment of the present invention；
Fig. 4 be in Fig. 3 display panel along the sectional view of hatching B1-B2；；
Fig. 5 is a kind of schematic diagram of display device provided in an embodiment of the present invention；
Fig. 6 is a kind of flow chart of display panel production method provided in an embodiment of the present invention.
Specific embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention rather than limiting the invention.It also should be noted that in order to just
Only the parts related to the present invention are shown in description, attached drawing rather than entire infrastructure.
A kind of display panel is present embodiments provided, Fig. 1 is a kind of signal of display panel provided in an embodiment of the present invention
Figure, Fig. 2 be in Fig. 1 display panel along hatching A1-A2 sectional view, with reference to Fig. 1 and Fig. 2, the display panel includes:
Substrate 10, including viewing area 11 and around the non-display area 12 of viewing area 11；
Organic light-emitting structure 20, in the viewing area of substrate 10 11；
Barricade 30 in the non-display area 12 of substrate 10, and surrounds viewing area 11；The material of barricade 30 is organosilicon material
Material；
Thin-film encapsulation layer 40, thin-film encapsulation layer 40 cover organic light-emitting structure 20, and thin-film encapsulation layer 40 includes successively being spaced
The inorganic layer 41 and organic layer 42 of setting, organic layer 42 are located in the region that barricade 30 surrounds.
In the present embodiment, substrate 10 is the array substrate for driving organic light-emitting structure 20 luminous, and substrate 10 includes viewing area
11 and non-display area 12, viewing area 11 is corresponding to have organic light-emitting structure 20, realizes the display of picture, non-display area 12 is corresponding
Picture is not presented in region.Substrate 10 can be transparent, translucent or opaque.
Thin-film encapsulation layer 40 is located in organic light-emitting structure 20.Thin-film encapsulation layer 40 protects shining for organic light-emitting structure 20
The influence of layer and other thin layers from outside moisture and oxygen etc..Thin-film encapsulation layer 40 may include inorganic layer 41 and organic layer 42,
Inorganic layer 41 and organic layer 42 are staggeredly stacked.Barricade 30 is set in the non-display area 12 of substrate 10, and surrounds viewing area 11, gear
Cutoff layer of the wall 30 as organic layer 42 in thin-film encapsulation layer 40, is covered, while barricade by the inorganic layer 41 of thin-film encapsulation layer 40
30 can further promote the effect of the barrier water oxygen of display panel, prevent the transmission and extension of 41 crackle of inorganic layer.
For flexible OLED display panel, positive invade with lateral steam is relatively common influence OLED display surface
The problem of plate service life.Barricade 30 is frequently with organic acrylic material in the prior art, and organic acrylic material is not resistant to bending, with
Flexible OLED display panel constantly bend, barricade 30 has been easy crackle generation, and crackle further expands, and may will affect aobvious
Show the thin-film package performance of panel, and the adhesion strength between organic acrylic material and the inorganic layer of thin-film encapsulation layer 40 41 compared with
It is weak, it when display panel is bent, can be easily separated between inorganic layer 41 and barricade 30, be easy steam and oxygen by inorganic layer 41 and gear
Enter inside display panel at the separation of wall 30, influence the lateral block-water performance of thin-film encapsulation layer, to influence the display panel longevity
Life.
In the present embodiment, barricade 30 uses organosilicon material, and since organosilicon material elasticity modulus is small, bending performance is good
Good, display panel is not likely to produce crackle when bending, and improves the bending resistance and thin-film package performance of display panel, and have
Machine silicon materials are siliceous and oxygen, preferable with 41 adhesiveness of inorganic layer of thin-film encapsulation layer 40, when display panel is bent, avoid inorganic
Layer 41 is separated with barricade 30, further enhances the lateral water-resisting ability and bending resistance of thin-film encapsulation layer.
Optionally, with reference to Fig. 2, it is inorganic that thin-film encapsulation layer 40, which closes on the side of substrate 10 and the side far from substrate 10,
Layer 41.
Specifically, inorganic layer 41 covers barricade 30, organic layer 42 has certain mobility, and barricade 30 limits organic layer 42
It is scheduled in the region that barricade 30 surrounds, avoids organic layer 42 from spreading and increase the width of non-display area 12.Base is closed on by setting
The side of plate 10 and the side of separate substrate 10 are inorganic layer 41, and inorganic layer 41 covers barricade 30, can preferably avoid
Steam and oxygen enter inside display panel, and display panel is avoided to be corroded by steam or oxygen.
Optionally, with reference to Fig. 2, thin-film encapsulation layer 40 includes the first inorganic layer 41a, the first organic layer 42a and second inorganic
Layer 41b；
First inorganic layer 41a is located at the side that the first organic layer 42a closes on substrate 10；Second inorganic layer 41b is located at first
Side of the organic layer 42a far from substrate 10.
Specifically, the first inorganic layer 41a and the second inorganic layer 41b are mainly used for that steam and oxygen is prevented to enter display panel
Inside corrosion organic light-emitting structure 20, the first organic layer 42a mainly works as a buffer, for reducing the first inorganic layer 41a and the
Stress between two inorganic layer 41b.Thin-film encapsulation layer 40 includes the first inorganic layer 41a, the first organic layer 42a and the second inorganic layer
On the one hand 41b trilamellar membrane layer can guarantee that steam and oxygen is prevented to enter inside display panel, on the other hand make thin-film package
Layer 40 has lesser thickness, meets the lightening development trend of display panel.
It should be noted that the merely exemplary thin-film encapsulation layer that shows of the present embodiment includes that two layers of inorganic layer and one layer have
The case where machine layer, not limitation of the invention, in other embodiments, thin-film encapsulation layer can also include successively interval set
The multilayer inorganic layer and multilayer organic layer set.In addition, illustrating only the organic layer of thin-film encapsulation layer in Fig. 1, do not show that inorganic
Layer and organic light-emitting structure, not limitation of the invention.
Fig. 3 is the schematic diagram of another display panel provided in an embodiment of the present invention, and Fig. 4 is that display panel edge is cutd open in Fig. 3
The sectional view of upper thread B1-B2.Optionally, with reference to Fig. 3 and Fig. 4, barricade 30 includes the first barricade 31 and the second barricade 32；Second gear
Wall 32 surrounds the first barricade 31.
Specifically, thin-film encapsulation layer 40 is located in the region that the second barricade 32 surrounds, the second barricade 32 is used for block film
The inorganic layer 41 of encapsulated layer 40, and it is used to support mask plate used in production inorganic layer 41.If also, organic in technical process
Layer 42 has overflowed the region that the first barricade 31 surrounds, and the second barricade 32 can also play further barrier effect, prevent organic
42 extension of layer, are conducive to the narrow frame of display panel.
Optionally, the material of inorganic layer 41 is silicon nitride or silica.
Specifically, being silicon nitride or silica by the material of setting inorganic layer 41, so that inorganic layer 41 and use are organic
Adhesiveness is more preferable between the barricade 30 of silicon materials, when display panel bending, is not easily stripped, mentions between barricade 30 and inorganic layer 41
The high bending resistance and thin-film package performance of display panel.In addition, the material of inorganic layer 41 can also be aluminium oxide Al2O3、
Aluminium nitride AlN, aluminum oxynitride AlON, silicon-carbon nitride SiCN, magnesia MgO, calcium oxide CaO, tungsten oxide WOx, titanium dioxide
TiO2, titanium nitride TiNx, titanium nitride ZrO2, zirconium nitride ZrNx, zinc oxide ZnO, tantalum pentoxide Ta2O5, hafnium oxide HfO2, nitrogen
Change hafnium HfNx, indium sesquioxide In2O3, cerium oxide CeOx or zirconium dioxide ZrO2Equal materials.
Optionally, the material of organic layer 42 is epoxy, acrylate, first acrylic or methacrylic acid.
Specifically, acryl-based polymer (propenyl polymer), silicon- can be used in the material of organic layer 42
Based polymer (silicon-based polymer) or epoxy-based polymer (epoxy-based polymer) etc..It is specifically as follows
Epoxy (epoxy), acrylate (acrylate), meta acrylic (first acrylic acid), meth acrylic (methyl
Propionic acid alkene), polyester (polyester), urethane acrylate (urethane acrylate), polyurea (polyureas),
Polyether (polyethers), polyurethane (polyurethane), polyacrylate (polyacrylate), polyethylene are (poly-
Ethylene), polypropylene (polypropylene), epoxy resin (epoxy resin), acryl resin (acrylic resin),
Resin (resin), polyimide resin (polyimide resin), silicon resin (silicon resin), PET
(Polyethylene terephthalate, polyethylene terephthalate), PI (Polyimide, polyimides), PC
(Polycarbonate, polycarbonate), PTCDA (Perylene-3,4,9,10-tetracarboxylic dianhydride,
Tetracarboxylic acid dianhydride), PMDA (pyromellitic dianhydride, benzenetetracarboxylic dianhydride), HMDSO
(Hexamethyldisiloxane, hexamethyldisiloxane), PMMA (polymethyl methacrylate, polymethylacrylic acid
Methyl esters), FRP (Fiber Reinforce Plastic, fibre reinforced plastics) or GFRP (glass fiber reinforced
Plastic fiberglass reinforced plastics) etc., and be not specifically limited.
The present embodiment additionally provides a kind of display device, and Fig. 5 is a kind of showing for display device provided in an embodiment of the present invention
It is intended to, with reference to Fig. 5, display device 100 includes display panel 200 described in any embodiment of that present invention.Display device 100 can be with
It is the electronic equipment of such as mobile phone, tablet computer etc.
The display device of the present embodiment uses organosilicon material by setting barricade, due to organosilicon material elasticity modulus
Small, bending performance is good, and display panel is not likely to produce crackle when bending, and improves the bending resistance and film envelope of display device
Performance is filled, and organosilicon material is siliceous and oxygen, it is preferable with the inorganic layer adhesiveness of thin-film encapsulation layer, when display device is bent,
It avoids inorganic layer to separate with barricade, further enhances the lateral water-resisting ability and bending resistance of thin-film encapsulation layer.
The present embodiment additionally provides a kind of production method of display panel, and Fig. 6 is provided in an embodiment of the present invention a kind of aobvious
Show the flow chart of panel making method.With reference to Fig. 6, the display panel production method, comprising:
Step 101 provides a substrate.
Wherein, substrate includes viewing area and the non-display area around viewing area.
Step 102 forms organic light-emitting structure in the viewing area of substrate.
Step 103, the non-display area formation barricade in substrate.
Wherein, barricade surrounds viewing area, and the material of barricade is organosilicon material.
Step 104 forms thin-film encapsulation layer.
Wherein, thin-film encapsulation layer cover organic light-emitting structure, thin-film encapsulation layer include successively spaced inorganic layer and
Organic layer, organic layer are located in the region that barricade surrounds.
The present embodiment uses organosilicon material, since organosilicon material elasticity modulus is small, bending performance by setting barricade
Well, it is not likely to produce crackle when display panel is bent, improves the bending resistance and thin-film package performance of display panel, and
Organosilicon material is siliceous and oxygen, preferable with the inorganic layer adhesiveness of thin-film encapsulation layer, when display panel is bent, avoids inorganic layer
It is separated with barricade, further enhances the lateral water-resisting ability and bending resistance of thin-film encapsulation layer.
Optionally, include: the step of the non-display area of substrate forms barricade
Plated film, which is carried out, using hot evaporation process, spin coating proceeding, spraying process, screen printing process or InkJet printing processes forms gear
Wall pattern；
Barricade pattern is carried out using UV curing process to be formed by curing barricade.
Specifically, dispensing, sputtering, vacuum deposition, electron beam evaporation, atomic layer deposition, chemical gaseous phase can also be used
Deposition, plasma enhanced chemical vapor deposition, high density plasma enhanced chemical vapor deposition, inductively coupled plasma chemical gaseous phase
Deposition, capacitance coupling plasma chemical vapor deposition, surface wave plasma chemical vapor deposition, ion beam assisted deposition etc.
Process carries out plated film and forms barricade pattern.
Optionally, the step of formation thin-film encapsulation layer includes:
It is formed using atom layer deposition process, chemical vapor deposition process or plasma enhanced chemical vapor deposition technique
Inorganic layer.
Specifically, sputtering, vacuum deposition, electron beam evaporation, high density plasma enhanced chemical vapor deposition, sense can also be used
Answer coupling plasma body chemical vapor phase growing, capacitance coupling plasma chemical vapor deposition, surface wave plasma chemistry gas
The techniques such as phase sedimentation, ion beam assisted deposition form inorganic layer.
Optionally, the step of formation thin-film encapsulation layer includes:
Plated film is carried out to organic layer using InkJet printing processes；
It carries out being formed by curing organic layer using UV curing process.
Specifically, plated film can also be carried out to organic layer using techniques such as hot evaporation, spin coating, spraying, wire marks.
The display panel that display panel production method provided in this embodiment and any embodiment of that present invention provide belongs to together
One inventive concept has corresponding beneficial effect.The not technical detail of detailed description in the present embodiment, reference can be made to the present invention appoints
The display that embodiment of anticipating provides.
Note that the above is only a better embodiment of the present invention and the applied technical principle.It will be appreciated by those skilled in the art that
The invention is not limited to the specific embodiments described herein, be able to carry out for a person skilled in the art it is various it is apparent variation,
It readjusts and substitutes without departing from protection scope of the present invention.Therefore, although being carried out by above embodiments to the present invention
It is described in further detail, but the present invention is not limited to the above embodiments only, without departing from the inventive concept, also
It may include more other equivalent embodiments, and the scope of the invention is determined by the scope of the appended claims.
Claims (11)
1. a kind of display panel characterized by comprising
Substrate, the non-display area including viewing area and around the viewing area；
Organic light-emitting structure, in the viewing area of the substrate；
Barricade in the non-display area of the substrate, and surrounds the viewing area；The material of the barricade is organosilicon material
Material；
Thin-film encapsulation layer, the thin-film encapsulation layer cover the organic light-emitting structure, and the thin-film encapsulation layer includes successively being spaced
The inorganic layer and organic layer of setting, the organic layer are located in the region that the barricade surrounds.
2. display panel according to claim 1, it is characterised in that:
It is inorganic layer that the thin-film encapsulation layer, which closes on the side of the substrate and the side far from the substrate,.
3. display panel according to claim 2, it is characterised in that:
The thin-film encapsulation layer includes the first inorganic layer, the first organic layer and the second inorganic layer；
First inorganic layer is located at the side that first organic layer closes on the substrate；Second inorganic layer is located at described
Side of first organic layer far from the substrate.
4. display panel according to claim 1, it is characterised in that:
The barricade includes the first barricade and the second barricade；The second gear walled is around first barricade.
5. display panel according to claim 2, it is characterised in that:
The material of the inorganic layer is silicon nitride or silica.
6. display panel according to claim 3, it is characterised in that:
The material of the organic layer is epoxy, acrylate, first acrylic or methacrylic acid.
7. a kind of display device, which is characterized in that including display panel described in any one of claims 1-6.
8. a kind of display panel production method characterized by comprising
A substrate is provided, the substrate includes viewing area and the non-display area around the viewing area；
Organic light-emitting structure is formed in the viewing area of the substrate；
Barricade is formed in the non-display area of the substrate, the barricade surrounds the viewing area, and the material of the barricade is organic
Silicon materials；
Thin-film encapsulation layer is formed, the thin-film encapsulation layer covers the organic light-emitting structure, and the thin-film encapsulation layer includes successively
Spaced inorganic layer and organic layer, the organic layer are located in the region that the barricade surrounds.
9. according to the method described in claim 8, it is characterized in that, the non-display area in the substrate forms the step of barricade
Suddenly include:
Plated film, which is carried out, using hot evaporation process, spin coating proceeding, spraying process, screen printing process or InkJet printing processes forms barricade figure
Case；
The barricade pattern is carried out being formed by curing the barricade using UV curing process.
10. method according to claim 8 or claim 9, which is characterized in that the step of formation thin-film encapsulation layer includes:
It is formed using atom layer deposition process, chemical vapor deposition process or plasma enhanced chemical vapor deposition technique described
Inorganic layer.
11. method according to claim 8 or claim 9, which is characterized in that the step of formation thin-film encapsulation layer includes:
Plated film is carried out to the organic layer using InkJet printing processes；
It carries out being formed by curing the organic layer using UV curing process.
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| CN112310331A (en) * | 2020-10-09 | 2021-02-02 | Oppo广东移动通信有限公司 | OLED device packaging structure, manufacturing method thereof and metal mask plate |
| CN112310317A (en) * | 2020-10-30 | 2021-02-02 | 京东方科技集团股份有限公司 | Component for display panel test and preparation method thereof |
| CN112310317B (en) * | 2020-10-30 | 2024-03-15 | 京东方科技集团股份有限公司 | Display panel testing component and preparation method thereof |
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| CN117794282A (en) * | 2023-12-27 | 2024-03-29 | 惠科股份有限公司 | Display panel, preparation method of display panel and display device |
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Application publication date: 20190118 |