CN109231154A - 一种硅-玻璃密封的黑硅表面红外光源芯片及制备方法 - Google Patents
一种硅-玻璃密封的黑硅表面红外光源芯片及制备方法 Download PDFInfo
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- CN109231154A CN109231154A CN201810978584.8A CN201810978584A CN109231154A CN 109231154 A CN109231154 A CN 109231154A CN 201810978584 A CN201810978584 A CN 201810978584A CN 109231154 A CN109231154 A CN 109231154A
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- 229910021418 black silicon Inorganic materials 0.000 title claims abstract description 36
- 238000007789 sealing Methods 0.000 title claims abstract description 22
- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 88
- 239000010703 silicon Substances 0.000 claims abstract description 88
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 85
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 81
- 229920005591 polysilicon Polymers 0.000 claims abstract description 81
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 7
- 239000011261 inert gas Substances 0.000 claims description 7
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 6
- 238000009792 diffusion process Methods 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
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- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 2
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- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00349—Creating layers of material on a substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00349—Creating layers of material on a substrate
- B81C1/00373—Selective deposition, e.g. printing or microcontact printing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Led Devices (AREA)
- Resistance Heating (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201810978584.8A CN109231154B (zh) | 2018-08-27 | 2018-08-27 | 一种硅-玻璃密封的黑硅表面红外光源芯片及制备方法 |
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CN201810978584.8A CN109231154B (zh) | 2018-08-27 | 2018-08-27 | 一种硅-玻璃密封的黑硅表面红外光源芯片及制备方法 |
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CN109231154A true CN109231154A (zh) | 2019-01-18 |
CN109231154B CN109231154B (zh) | 2024-03-15 |
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CN201810978584.8A Active CN109231154B (zh) | 2018-08-27 | 2018-08-27 | 一种硅-玻璃密封的黑硅表面红外光源芯片及制备方法 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110143567A (zh) * | 2019-05-17 | 2019-08-20 | 中国科学院上海微系统与信息技术研究所 | 一种悬空的黑介质薄膜及其制备方法以及应用 |
CN111115565A (zh) * | 2019-12-25 | 2020-05-08 | 华中科技大学 | 一种mems红外光源的制备方法及其应用 |
CN115818556A (zh) * | 2022-10-25 | 2023-03-21 | 微集电科技(苏州)有限公司 | 一种光电转换效率提升的mems红外光源 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040170110A1 (en) * | 2002-11-29 | 2004-09-02 | Young Joo Yee | Light emitting module, optical detecting module, optical pickup apparatus and manufacturing methods thereof |
CN103278270A (zh) * | 2013-06-05 | 2013-09-04 | 厦门大学 | 岛膜自封装结构的硅-玻璃微压力传感器芯片及制造方法 |
CN103604538A (zh) * | 2013-11-29 | 2014-02-26 | 沈阳工业大学 | 基于soi技术的mems压力传感器芯片及其制造方法 |
CN106185784A (zh) * | 2016-08-31 | 2016-12-07 | 中国科学院微电子研究所 | 基于湿法预释放结构的mems红外光源及其制备方法 |
CN208898498U (zh) * | 2018-08-27 | 2019-05-24 | 杭州北芯传感科技有限公司 | 一种硅-玻璃密封的黑硅表面红外光源芯片 |
-
2018
- 2018-08-27 CN CN201810978584.8A patent/CN109231154B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040170110A1 (en) * | 2002-11-29 | 2004-09-02 | Young Joo Yee | Light emitting module, optical detecting module, optical pickup apparatus and manufacturing methods thereof |
CN103278270A (zh) * | 2013-06-05 | 2013-09-04 | 厦门大学 | 岛膜自封装结构的硅-玻璃微压力传感器芯片及制造方法 |
CN103604538A (zh) * | 2013-11-29 | 2014-02-26 | 沈阳工业大学 | 基于soi技术的mems压力传感器芯片及其制造方法 |
CN106185784A (zh) * | 2016-08-31 | 2016-12-07 | 中国科学院微电子研究所 | 基于湿法预释放结构的mems红外光源及其制备方法 |
CN208898498U (zh) * | 2018-08-27 | 2019-05-24 | 杭州北芯传感科技有限公司 | 一种硅-玻璃密封的黑硅表面红外光源芯片 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110143567A (zh) * | 2019-05-17 | 2019-08-20 | 中国科学院上海微系统与信息技术研究所 | 一种悬空的黑介质薄膜及其制备方法以及应用 |
CN111115565A (zh) * | 2019-12-25 | 2020-05-08 | 华中科技大学 | 一种mems红外光源的制备方法及其应用 |
CN115818556A (zh) * | 2022-10-25 | 2023-03-21 | 微集电科技(苏州)有限公司 | 一种光电转换效率提升的mems红外光源 |
WO2024087270A1 (zh) * | 2022-10-25 | 2024-05-02 | 微集电科技(苏州)有限公司 | 一种光电转换效率提升的mems红外光源 |
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CN109231154B (zh) | 2024-03-15 |
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