CN109216840A - A kind of waveguide load component in vacuum environment - Google Patents
A kind of waveguide load component in vacuum environment Download PDFInfo
- Publication number
- CN109216840A CN109216840A CN201811126863.8A CN201811126863A CN109216840A CN 109216840 A CN109216840 A CN 109216840A CN 201811126863 A CN201811126863 A CN 201811126863A CN 109216840 A CN109216840 A CN 109216840A
- Authority
- CN
- China
- Prior art keywords
- waveguide
- water
- channel
- passage
- cooled plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 35
- 238000001816 cooling Methods 0.000 claims abstract description 19
- 239000006096 absorbing agent Substances 0.000 claims description 22
- 239000004020 conductor Substances 0.000 claims description 21
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims description 7
- 238000003032 molecular docking Methods 0.000 claims description 6
- 230000003247 decreasing effect Effects 0.000 claims description 5
- 238000010521 absorption reaction Methods 0.000 claims description 4
- 229910052786 argon Inorganic materials 0.000 claims description 4
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 230000008901 benefit Effects 0.000 abstract description 9
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 208000002925 dental caries Diseases 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 210000000515 tooth Anatomy 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/24—Terminating devices
- H01P1/26—Dissipative terminations
- H01P1/264—Waveguide terminations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Non-Reversible Transmitting Devices (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811126863.8A CN109216840B (en) | 2018-09-26 | Waveguide load assembly used in vacuum environment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811126863.8A CN109216840B (en) | 2018-09-26 | Waveguide load assembly used in vacuum environment |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109216840A true CN109216840A (en) | 2019-01-15 |
CN109216840B CN109216840B (en) | 2024-07-02 |
Family
ID=
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112935738A (en) * | 2021-03-02 | 2021-06-11 | 奥瑞凯机械制造(昆山)有限公司 | Large-width high-precision heating plate machining process |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0579269U (en) * | 1992-03-18 | 1993-10-29 | 株式会社東芝 | Radiator |
JP2004360774A (en) * | 2003-06-04 | 2004-12-24 | Nissan Motor Co Ltd | Method of manufacturing energy absorbing member |
CN101431291A (en) * | 2008-10-11 | 2009-05-13 | 中国科学院近代物理研究所 | Processing method for high-power switch power supply commutation bridge and water cooling board |
CN202254559U (en) * | 2011-09-08 | 2012-05-30 | 合肥海天电子科技有限公司 | Water-cooled device of waveguide under working environment of high-power continuous wave |
CN202282438U (en) * | 2011-09-23 | 2012-06-20 | 宜宾红星电子有限公司 | Novel dry type waveguide dummy load |
CN202759002U (en) * | 2012-09-06 | 2013-02-27 | 深圳市禹龙通电子有限公司 | A coaxial load having multiple absorbers |
CN205161010U (en) * | 2015-11-23 | 2016-04-13 | 深圳市正仁电子有限公司 | Water -cooling board |
CN106785282A (en) * | 2016-12-07 | 2017-05-31 | 中国航天时代电子公司 | A kind of large power waveguide load |
CN208862140U (en) * | 2018-09-26 | 2019-05-14 | 深圳市禹龙通电子有限公司 | A kind of waveguide load component in vacuum environment |
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0579269U (en) * | 1992-03-18 | 1993-10-29 | 株式会社東芝 | Radiator |
JP2004360774A (en) * | 2003-06-04 | 2004-12-24 | Nissan Motor Co Ltd | Method of manufacturing energy absorbing member |
CN101431291A (en) * | 2008-10-11 | 2009-05-13 | 中国科学院近代物理研究所 | Processing method for high-power switch power supply commutation bridge and water cooling board |
CN202254559U (en) * | 2011-09-08 | 2012-05-30 | 合肥海天电子科技有限公司 | Water-cooled device of waveguide under working environment of high-power continuous wave |
CN202282438U (en) * | 2011-09-23 | 2012-06-20 | 宜宾红星电子有限公司 | Novel dry type waveguide dummy load |
CN202759002U (en) * | 2012-09-06 | 2013-02-27 | 深圳市禹龙通电子有限公司 | A coaxial load having multiple absorbers |
CN205161010U (en) * | 2015-11-23 | 2016-04-13 | 深圳市正仁电子有限公司 | Water -cooling board |
CN106785282A (en) * | 2016-12-07 | 2017-05-31 | 中国航天时代电子公司 | A kind of large power waveguide load |
CN208862140U (en) * | 2018-09-26 | 2019-05-14 | 深圳市禹龙通电子有限公司 | A kind of waveguide load component in vacuum environment |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112935738A (en) * | 2021-03-02 | 2021-06-11 | 奥瑞凯机械制造(昆山)有限公司 | Large-width high-precision heating plate machining process |
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Legal Events
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---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information |
Inventor after: Shi Ming Inventor after: Xie Hua Inventor after: Wei Qiang Inventor after: Liu Xun Inventor after: Gu Ya Inventor before: Liu Xun Inventor before: Gu Ya |
|
CB03 | Change of inventor or designer information | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20200903 Address after: Courtyard 104, Youyi Road, Haidian District, Beijing 100089 Applicant after: China Academy of Space Technology Applicant after: SHENZHEN YULONGTONG ELECTRON Co.,Ltd. Address before: 518000 Guangdong city of Shenzhen province Nanshan District Chiwan Shekou Shao Di Road No. 1 Chiwan Industrial Park D building four floor Applicant before: SHENZHEN YULONGTONG ELECTRON Co.,Ltd. |
|
TA01 | Transfer of patent application right | ||
CB02 | Change of applicant information |
Address after: Courtyard 104, Youyi Road, Haidian District, Beijing 100089 Applicant after: China Academy of Space Technology Applicant after: Shenzhen yulongtong Electronic Co.,Ltd. Address before: Courtyard 104, Youyi Road, Haidian District, Beijing 100089 Applicant before: China Academy of Space Technology Applicant before: SHENZHEN YULONGTONG ELECTRON Co.,Ltd. |
|
CB02 | Change of applicant information | ||
GR01 | Patent grant |