CN109216840B - Waveguide load assembly used in vacuum environment - Google Patents
Waveguide load assembly used in vacuum environment Download PDFInfo
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- CN109216840B CN109216840B CN201811126863.8A CN201811126863A CN109216840B CN 109216840 B CN109216840 B CN 109216840B CN 201811126863 A CN201811126863 A CN 201811126863A CN 109216840 B CN109216840 B CN 109216840B
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 88
- 238000001816 cooling Methods 0.000 claims abstract description 56
- 239000006096 absorbing agent Substances 0.000 claims description 43
- 238000010521 absorption reaction Methods 0.000 claims description 16
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 10
- 210000001503 joint Anatomy 0.000 claims description 7
- 230000007704 transition Effects 0.000 claims description 7
- 229910052786 argon Inorganic materials 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 5
- 239000000565 sealant Substances 0.000 claims description 4
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 230000003247 decreasing effect Effects 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 14
- 230000008901 benefit Effects 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 230000005855 radiation Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/24—Terminating devices
- H01P1/26—Dissipative terminations
- H01P1/264—Waveguide terminations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Non-Reversible Transmitting Devices (AREA)
Abstract
The invention relates to the technical field of waveguide load, in particular to a waveguide load assembly used in a vacuum environment, which comprises the following components: the waveguide loading device comprises a water cooling plate and a plurality of waveguide loads arranged on the water cooling plate; the water cooling plate is provided with a water inlet and a water outlet, wherein the water inlet and the water outlet are communicated with an external water source to form a water circulation cooling system. According to the waveguide load assembly for the vacuum environment, the waveguide loads are arranged on the water cooling plate, and the water circulation cooling system is used for cooling the waveguide loads, so that the heat dissipation performance of the waveguide loads is effectively guaranteed, and compared with free heat dissipation of the waveguide loads in the prior art, the waveguide load assembly has the advantages of being high in heat dissipation efficiency and stable in waveguide load performance.
Description
Technical Field
The invention relates to the technical field of waveguide load, in particular to a waveguide load assembly used in a vacuum environment.
Background
The main function of the waveguide load is to absorb microwave energy of a radio frequency signal transmission path, improve the matching performance of a circuit, be widely applied to a microwave system, and be an important passive device in radar equipment, accurate guidance and a microwave test system.
The waveguide load mainly depends on an absorber in a waveguide cavity to absorb the energy of the microwave signal, and the absorption of the energy leads to high temperature of the absorber, so that the heat dissipation performance of the waveguide load is directly related to the load performance and reliability of the waveguide load.
The existing waveguide load has poor heat radiation performance, especially in a vacuum environment, the heat radiation performance is not guaranteed, and therefore the load performance of the waveguide load is seriously affected.
Disclosure of Invention
The invention aims to provide a waveguide load assembly used in a vacuum environment, and aims to solve the technical problem that the waveguide load in the prior art is poor in heat dissipation.
In order to achieve the above purpose, the invention adopts the following technical scheme: a waveguide load assembly for use in a vacuum environment, comprising: the waveguide loading device comprises a water cooling plate and a plurality of waveguide loads arranged on the water cooling plate;
The water cooling plate is a rectangular plate and comprises left and right side surfaces, front and rear viewing surfaces, and upper and lower surfaces;
N first channels with sequentially decreasing lengths are drilled on the left side surface of the water cooling plate at intervals, wherein n is an odd number;
M second channels communicated with the first channels are sequentially drilled at one end, far away from the left side surface, of the front view surface of the water cooling plate, wherein m=1/2 (n-1), and the number of the second channels communicated with the first channels is two and is not overlapped;
p third channels communicated with the first channels are sequentially drilled at one end, close to the left side surface, of the rear view surface of the water cooling plate, wherein p=1/2 (n-1), and the number of the third channels communicated with the first channels is in a whole multiple relation of 2;
the first channels with the longest length are through holes, the end faces of the n-1 first channels on the left side face are plugged by first plugs, the end faces of the second channels are plugged by second plugs, and the end faces of the third channels are plugged by third plugs, so that the first channels, the second channels and the third channels form a water flow channel with a water inlet and a water outlet in the water cooling plate;
The end face of the first channel with the shortest length is a water inlet, and the end face of the first channel on the right side face of the water cooling plate is a water outlet;
the water inlet and the water outlet are communicated with an external water source through pipelines to form a water circulation cooling system.
Further: the first plug, the second plug and the third plug are plugged in a threaded connection and argon arc welding mode.
Further: and the first plug, the second plug and the third plug are respectively provided with a thread locking sealant.
Further: the waveguide load includes: a connection flange, a waveguide body and an absorber; the waveguide body is provided with a waveguide cavity with a rectangular cross section; the absorber comprises a first absorption plate and a second absorption plate, wherein the cross sections of the first absorption plate and the second absorption plate are U-shaped, the first absorption plate and the second absorption plate are closely assembled in the waveguide cavity after being in butt joint, and the first absorption plate and the second absorption plate are provided with an absorption cavity with a rectangular cross section after being in butt joint; the connecting flange is connected with the waveguide body through a locking piece so as to limit the absorber body in the waveguide cavity.
Further: the cross section of the waveguide body is rectangular, and the waveguide body comprises: the waveguide cavity is provided with a cavity body with two adjacent side openings, and a cover plate which is fixedly connected with the cavity body through a locking piece and is used for closing the opening at one side of the waveguide cavity.
Further: the connecting flange is provided with a transition cavity, and the transition cavity and the absorption cavity are arranged on the same central line and have the same cross section area.
Further: the absorber is made of silicon carbide material.
Further: the absorber is made of ceramic materials.
Further: the connecting flange is an FBP120 standard waveguide flange.
The invention has the beneficial effects that: according to the waveguide load assembly for the vacuum environment, the waveguide loads are arranged on the water cooling plate, and the water circulation cooling system is used for cooling the waveguide loads, so that the heat dissipation performance of the waveguide loads is effectively guaranteed, and compared with free heat dissipation of the waveguide loads in the prior art, the waveguide load assembly has the advantages of being high in heat dissipation efficiency and stable in waveguide load performance.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of an overall structure for a vacuum environment according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of a water-cooled panel according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a waveguide load according to an embodiment of the present invention;
fig. 4 is a schematic diagram of an explosion structure of a waveguide load according to an embodiment of the present invention.
Reference numerals: 1. a heat sink; 2. a water cooling plate; 21. a first channel; 22. a second channel; 23. a third channel; 24. a water inlet; 25. a water outlet; 26. a first plug; 27. a second plug; 28. a third plug; 3. a waveguide load; 31. a connecting flange; 311. a transition chamber; 312. a through hole; 32. a waveguide; 321. a waveguide cavity; 322. a cavity; 323. a cover plate; 33. an absorber; 331. a first absorption plate; 332. a second absorption plate; 333. an absorption chamber.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present invention and should not be construed as limiting the invention.
In the description of the present invention, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
Referring now to fig. 1-4, a waveguide load assembly in accordance with the present invention will be described. The waveguide load assembly includes: the device comprises a water cooling plate 2, a plurality of waveguide loads 3 arranged on the water cooling plate 2, and cooling fins 1 arranged on each waveguide load 3; wherein the water cooling plate 2 is a rectangular plate, and the water cooling plate 2 includes left and right side surfaces, front and rear viewing surfaces, and upper and lower surfaces.
N first channels 21 with sequentially decreasing lengths are drilled on the left side surface of the water cooling plate 2 at intervals, wherein n is an odd number greater than 1; m second channels 22 communicated with the first channels 21 are sequentially drilled at one end, far away from the left side surface, of the front view surface of the water cooling plate 2, wherein m=1/2 (n-1), and the number of the second channels 22 communicated with the first channels 21 is two and is not overlapped; p third channels 23 are drilled in turn in the end of the rear view surface of the cooling plate, which is close to the left side surface, and are communicated with the first channels 21, wherein p=1/2 (n-1), and the number of the third channels 23 communicated with the first channels 21 is in an integral multiple relation of 2.
The first channels 21 with the longest length are through holes, the rest of the first channels 21 are blind holes, the second channels 22 and the third channels 23 are blind holes, the end faces of the n-1 first channels 21 on the left side face are plugged by using first plugs 26, the end faces of the second channels 22 are plugged by using second plugs 27, and the end faces of the third channels 23 are plugged by using third plugs 28, so that the first channels 21, the second channels 22 and the third channels 23 form a water flow channel with a water inlet 24 and a water outlet 25 in the water cooling plate 2.
The end face of the first channel 21 with the shortest length is a water inlet 24, and the end face of the first channel 21 on the right side face of the water cooling plate 2 is a water outlet 25; the water inlet 24 and the water outlet 25 are used for communicating with an external water source through pipes to form a water circulation cooling system.
According to the waveguide load assembly provided by the invention, the waveguide loads 3 are arranged on the water cooling plate 2, the water circulation cooling system is utilized for cooling the waveguide loads 3, and meanwhile, the heat dissipation performance of the waveguide loads 3 is effectively ensured through the heat dissipation effect of the heat dissipation fins 1, and compared with the free heat dissipation of the waveguide loads 3 in the prior art, the waveguide load assembly has the advantages of high heat dissipation efficiency and stable performance of the waveguide loads 3.
In this embodiment, the water cooling plate 2 is integrally formed, the water inlet 24 and the water outlet 25 are communicated with a water source through a pipeline, wherein the water inlet 24 is positioned on the left side surface of the water cooling plate 2, the water outlet 25 is positioned on the right side surface of the water cooling plate 2, each surface of the water cooling plate 2 is a finished plane, and the flatness is +/-0.01 mm.
In other embodiments, the water cooling plate 2 includes a bottom plate, metal pipes disposed on the bottom plate, and a sealing plate covering the bottom plate. A first placing groove for placing the metal pipeline is formed in the bottom plate, a second placing groove for placing the metal pipeline is formed in the sealing plate, the metal pipeline, the bottom plate and the sealing plate are welded with each other by adopting an argon arc welding process, and the water inlet 24 and the water outlet 25 of the metal pipeline are positioned on the same side of the water cooling plate 2.
Specifically, as shown in fig. 1 and 2, in this embodiment, the first plug 26, the second plug 27 and the third plug 28 respectively plug the first channel 21, the second channel 22 and the third channel 23 in a threaded connection and argon arc welding manner, and the threaded connection and the argon arc welding manner are adopted, so that the sealing performance is good, the pressure resistance is strong, and the water and pressure resistance of the water cooling plate 2 is effectively ensured.
Specifically, in this embodiment, screw locking sealant is disposed on each of the first plug 26, the second plug 27, and the third plug 28; the screw thread locking sealant is filled at the screw thread connection parts of the first plug 26, the second plug 27, the third plug 28 and the water cooling plate 2, so that the sealing performance of the water cooling plate is further improved.
In the present embodiment, the number n of the first channels 21 is 7, the number m of the second channels 22 is 3, and the number p of the third channels 23 is 3, in the present embodiment, 3 second channels 22 are respectively connected to two adjacent different first channels 21, and 2/4/6 of the 3 third channels 23 are respectively connected to adjacent first channels 21.
In this embodiment, the number of the first plugs 26 is 6, the sizes of the first plugs 26 are the same, the number of the second plugs 27 and the third plugs 28 is 3, the lengths of the 3 second plugs 27 and the third plugs 28 decrease in sequence, and the directions in which the lengths of the second plugs 27 and the third plugs 28 decrease in sequence are opposite.
As shown in fig. 1,3, 4, in the present embodiment, the waveguide load 3 includes: a connection flange 31, a waveguide body 32 and an absorber 33. Wherein the waveguide body 32 has a waveguide cavity 321 having a rectangular cross section; the absorber 33 comprises a first absorber plate 331 and a second absorber plate 332 with U-shaped cross sections, wherein the first absorber plate 331 is tightly assembled in the waveguide cavity 321 after being in butt joint with the second absorber plate 332, and the first absorber plate 331 is provided with an absorber cavity 333 with rectangular cross section after being in butt joint with the second absorber plate 332; wherein the connection flange 31 and the waveguide body 32 are connected by a locking member such as a screw to restrict the absorber 33 within the waveguide cavity 321.
According to the waveguide load 3 provided by the invention, the absorber 33 is formed by the first absorber plate 331 and the second absorber plate 332 with the U-shaped cross sections, so that the absorber 33 has the advantage of convenience in processing, meanwhile, the first absorber plate 331 and the second absorber plate 332 are assembled in the waveguide cavity 321 in a butt joint manner, the waveguide load 3 has the advantage of convenience in installation, and the absorber 33 is limited in the waveguide cavity 321 after being assembled with the waveguide body 32 through the connecting flange 31.
In the present embodiment, the first absorbing plate 331 is identical in structure to the second absorbing plate 332, which facilitates mass production of the absorber 33, and also facilitates assembly of the absorber 33. In other embodiments, the first absorbing plate 331 and the second absorbing plate 332 are not identical in depth of the grooves formed in the cross section, but the absorbing chamber 333 is not changed in size in cross section.
Specifically, in the present embodiment, the cross section of the waveguide body 32 is rectangular, wherein the waveguide body 32 includes: the waveguide cavity 321 is provided with a cavity 322 adjacent to the opening on both sides, and a cover plate 323 fixedly connected with the cavity 322 by a locking member such as a screw to close the opening on one side of the waveguide cavity 321. The waveguide body 32 is divided into the cavity 322 and the cover plate 323, so that the waveguide cavity 321 is convenient to process, and on the other hand, after the absorber 33 is assembled in the waveguide cavity 321, the cover plate 323 is fixedly connected with the cavity 322 through the locking piece, so that the firmness of the absorber 33 assembled in the waveguide cavity 321 is further improved, and the performance of the waveguide load 3 is effectively guaranteed.
Specifically, in the present embodiment, the connection flange 31 has the transition chamber 311, wherein the transition chamber 311 is disposed concentrically with the absorption chamber 333 and has the same cross-sectional area. One end of the connection flange 31 is connected to the component, and the other end is connected to the waveguide body 32 by a screw.
Specifically, in this embodiment, the absorber 33 is made of a silicon carbide material, which has the advantages of good high temperature resistance, low density, excellent mechanical properties, low price, and the like, and is a good wave-absorbing and heating material, so that the performance of the waveguide load 3 can be effectively ensured.
In other embodiments, the absorber 33 is made of a ceramic material.
Specifically, the heat sink 1 is located on a side of the waveguide load 3 away from the water cooling plate 2, and the heat sink 1 is used to improve the heat radiation performance of the waveguide load 3 so that the performance of the waveguide load 3 does not fail due to high temperature. In other implementations, the waveguide load 3 is cooled by air cooling, such as a blower, and a cooling fan provides a source of air.
In this embodiment, the heat sink 1 is made of an aluminum material having a plurality of heat dissipating teeth, and the heat sink 1 is fixed to the waveguide load 3 using a locking member such as a screw. In other embodiments, the heat sink 1 is a rectangular aluminum plate and the heat sink 1 is secured to the waveguide load 3 by a locking member such as a screw.
Specifically, in the present embodiment, a heat-conducting silica gel is disposed between the heat sink 1 and the waveguide body 32, and the heat-conducting silica gel has good heat conductivity, so that heat on the waveguide body 32 can be well conducted to the heat sink 1, thereby accelerating the heat dissipation speed.
Specifically, in the present embodiment, the connection flange 31 is an FBP120 type standard waveguide flange, wherein an end surface of the connection flange 31 far from the waveguide 32 is provided with through holes 312, the number of the through holes 312 is four, and in other embodiments, the number of the through holes may be 5 or 6 or 7 or 8.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (8)
1. A waveguide load assembly for use in a vacuum environment, comprising:
the device comprises a water cooling plate (2) and a plurality of waveguide loads (3) arranged on the water cooling plate (2);
The water cooling plate (2) is a rectangular plate, the water cooling plate (2) comprises left and right side surfaces, front and rear viewing surfaces, upper and lower surfaces,
N first channels (21) with sequentially decreasing lengths are drilled on the left side surface of the water cooling plate (2) at intervals, wherein n is an odd number;
M second channels (22) which are communicated with the first channels (21) are sequentially drilled at one end, far away from the left side surface, of the front view surface of the water cooling plate (2), wherein m=1/2 is (n-1), and the number of the second channels (22) communicated with the first channels (21) is two and is not overlapped;
p third channels (23) communicated with the first channels (21) are sequentially drilled at one end, close to the left side surface, of the rear view surface of the water cooling plate (2), wherein p=1/2 is (n-1), and the number of the third channels (23) communicated with the first channels (21) is in a whole multiple relation of 2;
The first channels (21) with the longest length are through holes, the end faces of n-1 first channels (21) on the left side face are blocked by first plugs (26), the end faces of the second channels (22) are blocked by second plugs (27), and the end faces of the third channels (23) are blocked by third plugs (28), so that the first channels (21), the second channels (22) and the third channels (23) form a water flow channel with a water inlet (24) and a water outlet (25) in the water cooling plate (2);
the end face of the first channel (21) with the shortest length is a water inlet (24), and the end face of the first channel (21) on the right side face of the water cooling plate (2) is a water outlet (25);
the water inlet (24) and the water outlet (25) are communicated with an external water source through pipelines to form a water circulation cooling system;
The waveguide load (3) comprises: a connection flange (31), a waveguide body (32) and an absorber body (33); the waveguide body (32) is provided with a waveguide cavity (321) with a rectangular cross section; the absorber (33) comprises a first absorber plate (331) and a second absorber plate (332) with U-shaped cross sections, the first absorber plate (331) is tightly assembled in the waveguide cavity (321) after being in butt joint with the second absorber plate (332), and the first absorber plate (331) is provided with an absorber cavity (333) with a rectangular cross section after being in butt joint with the second absorber plate (332); the connecting flange (31) is connected with the waveguide body (32) through a locking piece so as to limit the absorber (33) in the waveguide cavity (321).
2. A waveguide load assembly for use in a vacuum environment as claimed in claim 1, wherein: the first plug (26), the second plug (27) and the third plug (28) are respectively plugged in the first channel (21), the second channel (22) and the third channel (23) in a threaded connection and argon arc welding mode.
3. A waveguide load assembly for use in a vacuum environment as claimed in claim 1, wherein: screw locking sealant is arranged on each of the first plug (26), the second plug (27) and the third plug (28).
4. A waveguide load assembly for use in a vacuum environment as claimed in claim 1, wherein: the cross section of the waveguide body (32) is rectangular, and the waveguide body (32) comprises: the waveguide cavity (321) is provided with a cavity body (322) with two adjacent side openings, and a cover plate (323) fixedly connected with the cavity body (322) through a locking piece so as to close one side opening of the waveguide cavity (321).
5. A waveguide load assembly for use in a vacuum environment as claimed in claim 1, wherein: the connecting flange (31) has a transition chamber (311), the transition chamber (311) and the absorption chamber (333) being arranged concentrically and having the same cross-sectional area.
6. A waveguide load assembly for use in a vacuum environment as claimed in claim 1, wherein: the absorber (33) is made of silicon carbide material.
7. A waveguide load assembly for use in a vacuum environment as claimed in claim 1, wherein: the absorber (33) is made of ceramic material.
8. A waveguide load assembly for use in a vacuum environment as claimed in claim 1, wherein: the connecting flange (31) is an FBP120 standard waveguide flange.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811126863.8A CN109216840B (en) | 2018-09-26 | 2018-09-26 | Waveguide load assembly used in vacuum environment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811126863.8A CN109216840B (en) | 2018-09-26 | 2018-09-26 | Waveguide load assembly used in vacuum environment |
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| Publication Number | Publication Date |
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| CN109216840A CN109216840A (en) | 2019-01-15 |
| CN109216840B true CN109216840B (en) | 2024-07-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811126863.8A Active CN109216840B (en) | 2018-09-26 | 2018-09-26 | Waveguide load assembly used in vacuum environment |
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| CN112935738B (en) * | 2021-03-02 | 2022-06-14 | 奥瑞凯机械制造（昆山）有限公司 | Large-width high-precision heating plate machining process |
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|---|---|---|---|---|
| CN101431291A (en) * | 2008-10-11 | 2009-05-13 | 中国科学院近代物理研究所 | Processing method for high-power switch power supply commutation bridge and water cooling board |
| CN208862140U (en) * | 2018-09-26 | 2019-05-14 | 深圳市禹龙通电子有限公司 | A kind of waveguide load component in vacuum environment |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0579269U (en) * | 1992-03-18 | 1993-10-29 | 株式会社東芝 | Radiator |
| JP2004360774A (en) * | 2003-06-04 | 2004-12-24 | Nissan Motor Co Ltd | Method of manufacturing energy absorbing member |
| CN202254559U (en) * | 2011-09-08 | 2012-05-30 | 合肥海天电子科技有限公司 | Water-cooled device of waveguide under working environment of high-power continuous wave |
| CN202282438U (en) * | 2011-09-23 | 2012-06-20 | 宜宾红星电子有限公司 | Novel dry type waveguide dummy load |
| CN202759002U (en) * | 2012-09-06 | 2013-02-27 | 深圳市禹龙通电子有限公司 | A coaxial load having multiple absorbers |
| CN205161010U (en) * | 2015-11-23 | 2016-04-13 | 深圳市正仁电子有限公司 | Water -cooling board |
| CN106785282B (en) * | 2016-12-07 | 2020-12-08 | 中国航天时代电子公司 | High-power waveguide load |
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2018
- 2018-09-26 CN CN201811126863.8A patent/CN109216840B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101431291A (en) * | 2008-10-11 | 2009-05-13 | 中国科学院近代物理研究所 | Processing method for high-power switch power supply commutation bridge and water cooling board |
| CN208862140U (en) * | 2018-09-26 | 2019-05-14 | 深圳市禹龙通电子有限公司 | A kind of waveguide load component in vacuum environment |
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| CN109216840A (en) | 2019-01-15 |
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