CN109216210A - The encapsulation of modularization hybrid circuit - Google Patents
The encapsulation of modularization hybrid circuit Download PDFInfo
- Publication number
- CN109216210A CN109216210A CN201711019670.8A CN201711019670A CN109216210A CN 109216210 A CN109216210 A CN 109216210A CN 201711019670 A CN201711019670 A CN 201711019670A CN 109216210 A CN109216210 A CN 109216210A
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- Prior art keywords
- main body
- platform
- plate
- feedthrough
- electronic packaging
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0069—Electrical connection means from the sensor to its support
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0084—Electrical connection means to the outside of the housing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Abstract
Electronic Packaging (100) includes platform (102) and the plate (104) for being installed to the platform (102), and the plate (104) is equipped with electronic device above.Feedthrough pin (136-148) passes through feedthrough main body (106) and is sealed air tight to feedthrough main body, and wire bonding is to the plate (104).Lid (110) is joined to the outer surface of feedthrough main body (106) and surrounds the outer surface of feedthrough main body, to generate the gas-tight seal chamber (111) for accommodating platform (102) and plate (104).
Description
Technical field
Various embodiments are related to Electronic Packaging.Specifically, embodiment is related to the Electronic Packaging comprising mixed electronic plate.
Background technique
Hydrid integrated circuit is the electronic circuit being made of the separate part for being installed to substrate or printed circuit board.?
After component is installed to substrate, by connecting lead wire between the pad on the conductive welding disk and component on substrate, by one
Section components wire bonding is to substrate.
In process control industry, mixed electronic device be generally positioned in corrosive environment or near, corrosive environment
The component of wire bonding or hydrid integrated circuit can be corroded.The most common use of hybrid circuit be high temperature application in, wherein if
Incorrect encapsulated hybrid, then high temperature application can aoxidize or cause formation between metal.Other application has package dimension
Limitation.
Summary of the invention
Electronic Packaging includes the plate for being installed to platform, is equipped with electronic device on the plate.At least one feedthrough main body has
Outer surface, feedthrough pin pass through feedthrough main body and gas-tight seal with feedthrough main body and be connected to the plate.Lid is attached to feedthrough main body
Outer surface, and around feedthrough main body outer surface with generate accommodate platform and plate gas-tight seal chamber.
In another embodiment, Electronic Packaging include feedthrough main body, the second main body and with feedthrough main body and the second main body phase
It engages to form the lid of gas-tight seal chamber.In sealed chamber, platform is between feedthrough main body and the second main body.Above
The plate for being equipped with electronic component is mounted on the indoor platform of the chamber.
In another embodiment, a kind of method includes: that the plate with electronic device is mounted on not electronic device
On platform, and platform and plate are placed between feedthrough main body and the second main body.Across the feedthrough pin wire bonding of feedthrough main body
Onto the plate.Then, the lid with open top and bottom is placed on around platform, and the lid is sealed to feedthrough
Main body and the second main body, to form the chamber for accommodating the plate.
In another embodiment, Electronic Packaging includes having the feedthrough main body of slot and engaging with feedthrough main body to form gas
The lid of close seal chamber.The slot that the plate that electronic component is equipped with above is arranged and is installed in feedthrough main body.
Detailed description of the invention
Fig. 1 is the sectional view of the first embodiment of hybrid circuit encapsulation.
Fig. 2 is the overhead sectional view of the hybrid circuit encapsulation of Fig. 1.
Fig. 3 is the sectional view of the second embodiment of hybrid circuit encapsulation.
Fig. 4 is the top view of the hybrid circuit encapsulation of Fig. 3.
Fig. 5 is the sectional view of the 3rd embodiment of hybrid circuit encapsulation.
Fig. 6 is the overhead sectional view of the hybrid circuit encapsulation of Fig. 5.
Fig. 7 is the sectional view of the fourth embodiment of hybrid circuit encapsulation.
Fig. 8 is the overhead sectional view of the hybrid circuit encapsulation of Fig. 7.
Fig. 9 is the front cross sectional view of the platform of the hybrid circuit encapsulation of Fig. 7.
Figure 10 is the sectional view of the 5th embodiment of hybrid circuit encapsulation.
Figure 11 is the overhead sectional view of the hybrid circuit encapsulation of Figure 10.
Figure 12 is the sectional view of the sixth embodiment of hybrid circuit encapsulation.
Figure 13 is the overhead sectional view of the hybrid circuit encapsulation of Figure 12.
Figure 14 is the sectional view of the 7th embodiment of hybrid circuit encapsulation.
Figure 15 is the overhead sectional view of the hybrid circuit encapsulation of Figure 14.
Figure 16 is the sectional view of the 8th embodiment of hybrid circuit encapsulation.
Figure 17 is the overhead sectional view of the hybrid circuit encapsulation of Figure 16.
Figure 18 is the end cross-sectional view of the hybrid circuit encapsulation of Figure 16.
Figure 19 is the end cross-sectional view of the 9th embodiment of hybrid circuit encapsulation.
Figure 20 is the method according to the manufacture hybrid circuit encapsulation of one embodiment.
Specific embodiment
In the encapsulation of many mixed electronics, the plate for carrying electronic device is installed to the lid or feedthrough main body of the encapsulation
It is external.Since lid and feedthrough main body are by with electron plate there is the material of different heat expansion characteristic to constitute, if Electronic Packaging is subjected to
Heating for multiple times and cooling cycle, then the install medium between the plate and the lid or feedthrough main body often fails.Work as electronic seal
When dress is detached from from the lid or feedthrough main body, the movement of electron plate often destroys the one or more between electron plate and feedthrough pin
Wire bonding, wherein the feeding pin passes through the feedthrough main body in Electronic Packaging.
In embodiment described here, by the thermal expansion character that electron plate is installed to thermal expansion character Yu the plate
Platform that is similar or matching, to reduce the movement for encapsulating interior electron plate.By the way that platform is arranged in the encapsulation either side
(some between main body (such as, the feedthrough main body comprising feedthrough pin and include the sensor main body of one or more sensors)
In embodiment, the platform is connected to the main body), the platform is maintained at the settling position in encapsulation.Therefore, allow
Plate is expanded and is shunk during heat cycles without being detached from from platform, and based on the feedthrough main body at the potted end
And/or the contact and/or connection of sensor main body, the platform is maintained in the position in the encapsulation.
Fig. 1 and Fig. 2 each provides the sectional view and top cross-sectional view of the Electronic Packaging 100 according to one embodiment.
Electronic Packaging 100 includes with the platform 102 for being equipped with mixed electronic plate 104 above.According to one embodiment, platform 102
There is no electronic device, for this respect, no electronic device is mounted directly to platform 102 and platform 102 does not include any
Electric trace, pad or conductor.Platform 102 has similar thermal expansion character with mixed electronic plate 104, including similar thermal expansion
Coefficient.The example of material for mixed electronic plate 104 includes aluminium oxide, aluminium nitride and common burning porcelain.According to one embodiment,
Mixed electronic plate 104 is made of low exhaust plate electron plate.
Platform 102 and mixed electronic plate 104 are located at the chamber limited by lid 110, feedthrough main body 106 and sensor main body 108
Between feedthrough main body 106 in room 111 and sensor body 108.According to one embodiment, lid 110 is hollow and has two
A open end 113 and 115, wherein sensor main body 108 is located at open end 113 and is sealed to open end 113, and feedthrough
Main body 106 is located at open end 115 and is sealed to open end 115.In the embodiment of Fig. 1 and Fig. 2, lid 110 is shown as
Cylindrical body, but in other embodiments, lid 110 can use the form of n arris column, wherein the n arris column has arbitrarily
The side n of quantity.
In this embodiment, lid 110 surrounds and contacts the outer surface 117 of feedthrough main body 106, and passes through soldering or welding
To form column sealed 158 in end 115, to be hermetically sealed to feedthrough main body 106.Similarly, lid 110 surrounds and contacts biography
The outer surface 119 of sensor main body 108, and by soldering or weld to form column sealed 160 in end 113, come airtightly
It is sealed to sensor main body 108.Sealing element 158 and 160 generates gas-tight seal chamber 111, wherein platform 102 and mixed electronic plate
104 are located in the gas-tight seal chamber.According to one embodiment, lid 110, feedthrough main body 106, sensor main body 108 and close
The external pressure that sealing 158 and 160 is able to bear between chamber 111 and the perimeter of lid 110 is poor.In addition, if process stream
Body enters the inside of sensor main body 108, then lid 110, feedthrough main body 106 and sealing element 158 and 160 be used as process fluid and
Second barrier of pressure.
According to some embodiments, chamber 111 includes vacuum or inert gas.The other embodiments being further described below
In, chamber 111 be filled with high density gas, liquid or powder, with reduce/prevent wire bonding from vibrating.
According to one embodiment, the thermal expansion character of lid 110 and the thermal expansion character of platform 102 and mixed electronic plate 104
Difference, including different heat expansion coefficient.
Mixed electronic plate 104 includes electronic component, such as is installed to the electronic component 112 of mixed electronic plate 104,114 and
116.The example of mounting technique for component to be installed to mixed electronic plate 104 includes welding, soldering, glass sintering and bonding
Agent.In addition, the wire bonding of such as wire bonding 118,120,122,124 and 126 will be formed in the gold on electronics mixed plate 104
Conductive welding disk in categoryization layer is connected to the pad on electronic component.For example, wire bonding 122 will be on electronics mixed plate 104
Pad 123 is connected to the pad on electronic component 116.Metalization layer can be by such as eNiPiG, ENiG, electroplating gold, thick film silver
It is formed with sputtered aluminum.For example, wire bonding can be made of gold or aluminium.As shown in Figure 1, in some embodiments, component is put
It sets in the two sides of mixed electronic plate 104.For the electronic component of object platform 102, groove (for example, recess portion 125) setting is flat
To accommodate electronic component in platform 102.
In this embodiment, mixed electronic plate 104 carrys out wire bonding to biography also by corresponding wire bonding 132 and 134
Sensor pads 128 and 130 on the electric connection surface 129 of sensor array 109.Sensor pads 128 and 130 are attached to hold
The one or more sensors module for the sensor array 109 being contained in sensor main body 108 or chamber 111 simultaneously connects from sensor
Receive or send to sensor the conductor of sensor signal and/or electric power.The example of possible sensor module include pressure and/or
Temperature sensor module.
Mixed electronic plate 104 is also wirebonded to feedthrough pin 136,138,140,142,144,146 and 148, passes through
Feedthrough main body 106 and by sealing material such as glass or ceramic seal to feedthrough main body 106.For example, pin 142 passes through feedthrough
Opening 154 in main body 106, and feedthrough main body 106 is sealed to by glass cylinder shape sealant 156.Such as wire bonding 150
Wire bonding with 152 is by the conductive welding disk in corresponding feedthrough pin connection to mixed electronic plate 104, such as conductive welding disk 151
With 153.
Preferably, platform 102 is installed to sensor main body 108 by fastener 162, and wherein fastener 162 passes through sensing
The cylindrical portions 163 of device main body 108 and the end 165 of platform 102.Particularly, platform 102 at end 165 otch to connect
Receive the cylindrical part 163 of sensor main body 108.In an alternative embodiment, platform 102 passes through other kinds of machanical fastener
Or welding or adhesive are attached to sensor main body 108.In this embodiment, platform 102 is also by two pins or 164 He of pin
166 support, wherein described two pins or pin extend between feedthrough main body 106 and platform 102 and enter feedthrough main body
106 and platform 102.According to one embodiment, pin 164 and 166 can be press-fitted into 106 peace of feedthrough main body in this way
In platform 102, to allow platform 102 to expand and shrink during heating with cooling cycle, while platform 102 is maintained at opposite
In the settling position of feedthrough main body 106 and sensor main body 108, so that such as wire bonding 150 and 152 and 132 and 134
Wire bonding is not damaged in the mobile period of Electronic Packaging 100.
In one embodiment, using one or more fasteners (for example, fastener 168 and 170) by mixed electronic plate
104 are installed on platform 102.According to one embodiment, fastener 168 and 170 is made of bolt 172 and nut 174.
According to one embodiment, sensor array 109 includes the reference pressure sensors being mounted in pressure chamber 111
176, so that the output of sensor may be used as the reference pressure of other sensors of sensor array 109.
Fig. 3 and Fig. 4 each provides the sectional view of Electronic Packaging 300 and cross-sectional view of bowing, and provides the second of Electronic Packaging
Embodiment.Other than using mixed electronic plate 304 and platform 302 to replace the mixed electronic plate 104 and platform 102 of encapsulation 100,
Electronic Packaging 300 is identical as Electronic Packaging 100.The thermal expansion character phase of the thermal expansion character of platform 302 and mixed electronic plate 304
Seemingly, and it is different from the thermal expansion character of lid 110.
Difference between platform 302 and platform 102 and mixed electronic plate 304 and mixed electronic plate 104 is mixed electronic
How plate 304 is installed on platform 302.Specifically, Electronic Packaging 300 uses soldering, solder, glass, epoxy resin or bonding
Mixed electronic plate 304 is installed to platform 302 by one of agent, rather than using fastener 168 and 170 come by mixed electronic plate
304 are installed to platform 302.In one embodiment, adhesive allows the thermal expansion character of plate 304 and the thermal expansion of platform 302
Characteristic is different.Due to the connection of these types, opening or groove are not needed in platform 302 and mixed electronic plate 304 to accommodate
Fastener 168 and 170.All other element of Electronic Packaging 100 and the element in the Electronic Packaging 300 of Fig. 3 and 4 are identical
's.
Fig. 5 and Fig. 6 provides the sectional view and top cross-sectional view of Electronic Packaging 500 according to the third embodiment.In addition to
Spring guide rail 508 and 510 is used in Electronic Packaging 500 rather than uses epoxy resin or adhesive by mixed electronic plate 104
It is installed to except platform 502, Electronic Packaging 500 is identical as Electronic Packaging 100.Spring guide rail 508 and 510 is processed to platform
502 a part, or be installed on platform 502 by soldering, resistance welding or other mounting techniques, so that spring guide rail is flat
It is extended parallel to each other on the opposite side of platform 502.Each of spring guide rail 508 and 510 includes leading towards opposite spring
Rail and the open channel for being positioned in mixed electronic plate 104.In some embodiments, mixed electronic plate 104 is by leading
Convex portion (for example, convex portion 512 and 514) in rail 508 and 510 is fixed in guide rail 508 and 510.508 He of guide rail
510 allow mixed electronic plate 104 mobile relative to platform 502 in a lateral direction.Although platform 502 preferably has and mixes
The similar thermal expansion character of electron plate 104, but using guide rail 508 and 510 by mixed electronic plate 104 be installed to platform 502 into
A possibility that difference that one step reduces the thermal expansion of platform 502 and plate 104 causes plate 104 to be detached from platform 502.Alternatively, bullet
The thermal expansion character that spring guide rail allows plate 104 different from platform 502.
In fig. 5 and fig., platform 502 is mounted on sensor main body 108, and with above for Fig. 1 and Fig. 2
The same way that is discussed of platform 102 of embodiment feedthrough main body 106 is connected to by pin 164 and 166.In addition, mixing electricity
Daughter board 104 with the above-mentioned same way wire bonding discussed for Electronic Packaging 100 to feedthrough pin 136-148 and sensing
Device pad 128 and 130.Lid 110, feedthrough main body 106, sensor main body 108 and sealing element 158 and 160 are in Electronic Packaging 500
In with they in Electronic Packaging 100 it is identical.
Fig. 7 and Fig. 8 provides the sectional view and top cross-sectional view of Electronic Packaging 700 according to another embodiment.In addition to
Except the removal of platform 702 and pin 164 and 166, Electronic Packaging 700 is identical as the Electronic Packaging 100 of Fig. 1 and Fig. 2.Specifically
Ground, instead of being attached to sensor main body 108, platform 702 is soldered to feedthrough main body 106 at tie point 710, and by curved
Bent flange 712 is supported on lid 110.Platform 702 does not have electronic device, and has the thermal expansion with mixed electronic plate 104
The substantially matched thermal expansion character of characteristic.The thermal expansion character of platform 702 is different from the thermal expansion character of feedthrough main body 106.For
Adapting to the difference of thermal expansion character, platform 702 includes notch or notch 714,716,718,720,722,724,726 and 728,
The notch or notch are seen in detail in the front view of platform 702 that wherein can be shown in Fig. 9.Notch 714-728 shape
At flexible member (for example, flexible member 730), wherein described flexible member one end is soldered to feedthrough main body 106 and the other end
It is continuous with platform 702 and extend from.Difference in response to feedthrough main body 106 relative to the thermal expansion of platform 702, flexible member
Bending, so that the joint between platform 702 and mixed electronic plate 104 be avoided to apply stress.Remaining member of Electronic Packaging 700
Part is identical as the encapsulation 100 of Fig. 1 and Fig. 2.
Figure 10 and Figure 11 provides the sectional view and overhead sectional view of the 5th embodiment, and feedthrough main body is shown
1006 and the Electronic Packaging 1000 that is formed by single piece of material of platform 1002.Specifically, platform 1002 is from the bottom of feedthrough main body 1006
Portion extends and including curved support ridge 1112, wherein the curved support ridge is in contact to mention for platform 1002 with lid 110
For support.According to one embodiment, the upper surface 1116 of the other parts of the upper surface 1114 and platform 1002 of support ridge 1112
In same plane.
Since platform 1002 is made of material block identical with feedthrough main body 1006, so platform 1002 and feedthrough main body
1006 have similar thermal expansion character, and the thermal expansion character is different from the thermal expansion character of mixed electronic plate 104.Since heat is swollen
The difference of swollen characteristic, by mixed electronic plate 104 is installed to platform 1002 using some adhesives and will lead to stress and be applied to bonding
In agent, this may lead to adhesive failure during heating and cooling cycle repeatedly.In order to overcome this problem, Electronic Packaging
Mixed electronic plate 104 is installed to platform 1002 using a pair of of spring guide rail 1008 and 1010 by 1000.1008 He of spring guide rail
1010 by by the column (not shown) of spring guide rail 1008 and 1010 pass through platform 1002 in hole (not shown) and be installed to it is flat
Platform 1002, so that spring guide rail extends parallel to each other on the two sides of platform 1002.It is every in spring guide rail 1008 and 1010
One includes towards opposite spring guide rail and the open channel that is positioned in mixed electronic plate 104.In some implementations
In example, mixed electronic plate 104 is consolidated by the convex portion (for example, convex portion 1012 and 1014) in guide rail 1008 and 1010
It is scheduled in guide rail 1008 and 1010.Guide rail 1008 and 1010 allows mixed electronic plate 104 in a lateral direction relative to platform
1002 expansions and contraction.
Lid 110 surrounds and contacts the outer surface 1017 of feedthrough main body 1006, and by soldering or welds in lid 110
End 115 forms column sealed 1058, to be hermetically sealed to feedthrough main body 1006.The other parts and electricity of Electronic Packaging 1000
Son encapsulation 100 is similarly operated, the outer surface including lid 110 to be sealed to sensor main body 108 by sealing element 160.
Sealing element 1058 and 160 generates gas-tight seal chamber 111, and wherein platform 1002 and mixed electronic plate 104 are located at described airtight close
It seals in chamber.According to one embodiment, lid 110, feedthrough main body 1006, sensor main body 108 and sealing element 1058 and 160 can
The external pressure born between chamber 111 and 110 outside of lid is poor.In addition, if process fluid enters the interior of sensor main body 108
Portion, then lid 110, feedthrough main body 1006 and sealing element 1058 and 160 are used as the second barrier of process fluid.Electronic Packaging 1000
Remaining element it is identical as the element of Electronic Packaging 100 of Fig. 1 and 2.
Figure 12 and Figure 13 each provides the sectional view for the sixth embodiment for showing Electronic Packaging 1200 and cross-sectional view of bowing.
In Electronic Packaging 1200, sensor main body 108 is substituted by the second feedthrough main body 1208.In the fig. 12 embodiment, platform
1202 have mounted to mixed electronic plate 104 above.Platform 1202 is not installed at feedthrough main body 106 or feedthrough main body 1208
On.On the contrary, platform 1202 includes respectively around one of the cylindrical peripheral part 1217 and 117 of feedthrough main body 1208 and 106
It is divided to two bent tabs 1210 and 1212 extended, so that lug 1210 is clipped between feedthrough main body 1208 and lid 110, and lug
1212 are clipped between feedthrough main body 106 and lid 110.Therefore, the frictional fit of lug 1210 and 1212 is in feedthrough main body 1208 and 106
And between lid 110, to limit movement of the platform 1202 in chamber 111.
Lid 110 surrounds and contacts the outer surface 117 of feedthrough main body 106, and by soldering or welds in 115 shape of end
At column sealed 158, to be hermetically sealed to feedthrough main body 106.Similarly, lid 110 surrounds and contacts feedthrough main body 1208
Outer surface 1217, and by soldering or weld to form column sealed 1260 in end 113, to be hermetically sealed to feedthrough master
Body 1208.Sealing element 158 and 1260 generates gas-tight seal chamber 111, and wherein platform 1202 and mixed electronic plate 104 are located at described
In gas-tight seal chamber.According to one embodiment, lid 110,158 and of feedthrough main body 106, feedthrough main body 1208 and sealing element
1260 external pressures that are able to bear between chamber 111 and the perimeter of lid 110 are poor.
Mixed electronic plate 104 is wirebonded to feedthrough pin 136,138,140,142,144,146 and 148, passes through feedback
Wear main body 106 and by sealing material such as glass or ceramic seal to feedthrough main body 106.For example, pin 142 passes through feedthrough master
Opening 154 in body 106, and feedthrough main body 106 is sealed to by glass cylinder shape sealant 156.Such as 150 He of wire bonding
152 wire bonding is by the conductive welding disk in corresponding feedthrough pin connection to mixed electronic plate 104, for example, 151 He of conductive welding disk
153.Mixed electronic plate 104 is also wirebonded to feedthrough pin 1236,1238,1240,1242,1244,1246 and 1248, wears
Cross feedthrough main body 1208 and by sealing material such as glass or ceramic seal to feedthrough main body 1208.For example, pin 1242 is worn
The opening 1254 in feedthrough main body 1208 is crossed, and feedthrough main body 1208 is sealed to by glass cylinder shape sealant 1256.Such as
The wire bonding of wire bonding 1250 and 1252 is by the conductive welding disk in corresponding feedthrough pin connection to mixed electronic plate 104, example
Such as, conductive welding disk 1251 and 1253.
In Electronic Packaging 1200, platform 1202 has similar thermal expansion character with mixed electronic plate 104.However, flat
Platform 1202 has different thermal expansion characters from feedthrough main body 1208 and 106.Electricity will be mixed using machanical fastener 168 and 170
Road plate 104 is installed on platform 1202.However, in other embodiments, using adhesive or epoxy resin by hybrid circuit board
104 are installed on platform 1202.
Figure 14 and 15 provides the sectional view and top cross-sectional view for showing the 7th embodiment of Electronic Packaging 1400.In addition to
It is replaced except platform 1202 using platform 1402, Electronic Packaging 1400 is identical as Electronic Packaging 1200.Platform 1402 includes soldering
To the coupling part of feedthrough main body 106 1404.Coupling part 1404 include with the notch of Electronic Packaging 700 or notch 714,716,
718,1406,1408,1410,1412,1414,1416,1418 and of the similar notch in 720,722,724,726 and 728 or notch
1420.Notch 1406-1414 provides pliable region, for example, allowing to be bent to conform to the heat of feedthrough main body 106 and platform 1402
The pliable region 1422 of the difference of expansion characteristics.Platform 1402 and mixed electronic plate 104 have similar thermal expansion special each other
Property, but their thermal expansion character is different from feedthrough main body 106 and feedthrough main body 1208.
In another embodiment, instead of platform is soldered to one of feedthrough main body, by using being press-fitted into feedthrough main body
Platform is connected to feedthrough main body with the pin in platform, to allow platform to expand and shrink during heating with cooling cycle,
Platform is maintained at the settling position relative to feedthrough main body simultaneously, so that wire bonding will not be in the shifting of electronic packing piece 100
Dynamic period is damaged.
Although above-described embodiment has been made with reference to the feedthrough pin in feedthrough main body to transmit electric power and/or signal, at it
In his embodiment, electric power and/or signal are transmitted between the electronic device outside electronic device and plate onboard by incuding.
Figure 16, Figure 17 and Figure 18 provide the sectional view of the 8th embodiment of Electronic Packaging 1600, top cross-sectional view and
End cross-sectional view.In Electronic Packaging 1600, using soldering or some other attachment devices, simultaneously by the installation of mixed electronic plate 104
It is joined in the slot 1602 in feedthrough main body 106.In addition, the side of mixed electronic plate 104 is located at the slot 1614 in lid 1610
In 1615, wherein the central part 1612 of the lid has increased thickness relative to end 1616.According to one embodiment,
Slot 1614, which has, to be applied elastic force to mixed electronic plate 104 while allowing mixed electronic plate 104 opposite during thermal expansion and contraction
In the mobile shape of lid 1610.Electronic Packaging 1600 has integrated or be welded to the closed end of lid 1610 with lid 1610
1640。
Figure 19 provides the cross-sectional end view of the 9th embodiment, wherein in addition to using lid 1910 to replace this other than 1610, the
Nine embodiments are identical as the embodiment of Figure 16-Figure 18.The thickness of the central part of lid 1910 is less than the central part of lid 1610
1612, and do not have slot.On the contrary, two guide rails 1900 and 1902 are mounted to the inside of lid 1910.The side of mixed electronic plate 104
The side of mode and mixed electronic plate 104 that face is mounted in guide rail 1900 and 1902 is mounted on the slot 1614 and 1615 of lid 1610
In mode it is identical.
According to one embodiment, using filling pipe 190 gas or powder backfill each Electronic Packaging 100,300,500,
700, the chamber 111 in 1000,1200,1400 and 1600.Pipe is filled across feedthrough main body 106 and passes through cylindrical glass layer
192 are sealed to feedthrough main body 106.Once powder filler or gas are pumped into chamber 111, as shown, by using solder
Pipe welded closure is simultaneously filled pipe 190 to close by seal pipe or pitching.Select packing material with the density phase with wire bonding
Match, to reduce the movement of wire bonding when corresponding encapsulation is mobile.This helps to prevent wire bonding impaired.In other realities
It applies in example, filling pipe can be replaced with the spherical sealed circle for being located at 110 side of lid.
Figure 20 provides the method for the manufacture Electronic Packaging according to one embodiment.In step 1800, by component leads
It is joined on mixed electronic plate.Then, mixed electronic plate is installed on the not platform of electronic device in step 1802.So
Afterwards, platform is arranged between feedthrough main body and sensor main body in step 1804.Then, the plate is engaged in step 1806
It is connected to feedthrough pin with sensor.Then, in step 1808, lid is slipped over to the end of feedthrough main body, plate and sensor main body.?
Step 1810, the lid is welded to sensor main body and feedthrough main body to form gas-tight seal chamber.In step 1812, execute
The optional step of gas-tight seal chamber is filled with material, then manages the gas-tight seal filling.
Although in other embodiments, more above embodiment illustrates the single mixed electronic plate for being installed to platform
A mixed electronic sheetpile is stacked in be stacked on platform over each other or adjacent to each other.When using multiple mixed electronic plates, mixing
Electron plate can wire bonding each other, and one or more mixed electronic plates may include notch with for being mounted on other mixing
Element vacating space on electron plate.In addition, platform can be arranged in two or more when there are multiple mixed electronic plates
Between mixed electronic plate.
Although element has been illustrated or described as embodiment separated above, the part of each embodiment can be with
All or part of combination of above-mentioned other embodiments.
Although referring to preferred embodiment, invention has been described, it will be recognized by those skilled in the art
It is that without departing from the spirit and scope of the present invention, modification in form and details may be implemented.
Claims (31)
1. a kind of Electronic Packaging, comprising:
Platform；
It is installed to the plate of the platform, electronic device is installed on the plate；
At least one feedthrough main body has outer surface；
Feedthrough pin across the feedthrough main body and is sealed air tight to the feedthrough main body, and is connected with the plate；And
Lid, is attached to the outer surface of the feedthrough main body and surrounds the outer surface of the feedthrough main body, accommodates described put down to generate
The gas-tight seal chamber of platform and the plate.
2. Electronic Packaging according to claim 1, wherein the platform passes through at least one pin and the feedthrough main body
It is connected.
3. Electronic Packaging according to claim 2 further includes sensor main body, the sensor main body surrounds at least one
Sensor and there is outer surface, wherein described cover a part for being joined to the outer surface of the sensor main body and around described
A part of the outer surface of sensor main body.
4. Electronic Packaging according to claim 3, wherein the stage+module is to the sensor main body.
5. Electronic Packaging according to claim 3, wherein when the sensor main body is installed to system of processing, the lid
The engagement between engagement and the lid and the feedthrough main body between the sensor main body is used as to the secondary of pressure
Limitation.
6. Electronic Packaging according to claim 1, wherein the lid is cylindrical.
7. Electronic Packaging according to claim 1, wherein the platform passes through one of soldering and welding and the feedthrough master
Body engagement.
8. Electronic Packaging according to claim 7, wherein the platform includes being located at close to the platform and the feedthrough
At least one the release notch for the position that main body engages.
9. Electronic Packaging according to claim 1, wherein the platform has similar thermal expansion character with the plate.
10. Electronic Packaging according to claim 1, wherein the platform is from the feedthrough main body or the lid with different
Thermal expansion character.
11. Electronic Packaging according to claim 1 further includes the second plate for being equipped with electronic component above, wherein institute
It states the second plate and is installed to the plate.
12. Electronic Packaging according to claim 11, wherein second plate includes for accommodating installation over the plates
At least one electronic component notch.
13. a kind of Electronic Packaging, comprising:
Feedthrough main body；
Second main body；
Lid, is joined to the feedthrough main body and second main body, to form gas-tight seal chamber；
Platform, in the sealed chamber between the feedthrough main body and second main body；And
Plate is equipped with electronic component above, wherein the plate is installed to the platform in the cavity.
14. Electronic Packaging according to claim 13, wherein second main body is the sensor main body comprising sensor.
15. Electronic Packaging according to claim 14, wherein the plate wire bonding is led to what the sensor was connected
Body.
16. Electronic Packaging according to claim 15, wherein the stage+module is to the sensor main body.
17. Electronic Packaging according to claim 16, wherein at least two pin press-fits extended from the feedthrough main body
Into the platform.
18. Electronic Packaging according to claim 13, wherein the plate is installed to by one of adhesive and epoxy resin
The platform.
19. Electronic Packaging according to claim 13, wherein the plate is installed to the platform using spring guide rail.
20. Electronic Packaging according to claim 13, wherein second main body includes the second feedthrough main body.
21. Electronic Packaging according to claim 13, wherein the chamber further includes filling out between the plate and the lid
Fill material.
22. Electronic Packaging according to claim 13, wherein the plate and the platform have similar thermal expansion each other
Characteristic, but the platform has different thermal expansion characters from the lid or feedthrough main body.
23. a kind of method, comprising:
Plate with electronic device is mounted on platform；
The platform and the plate are placed between feedthrough main body and the second main body；
In the feedthrough pin wire bonding to the plate for passing through the feedthrough main body；
Lid with open top and bottom is arranged in around the platform；And
The lid is sealed to the feedthrough main body and second main body, to form the chamber for accommodating the plate.
24. according to the method for claim 23, wherein the plate has similar thermal expansion coefficient with the platform.
25. the method according to claim 11, wherein the platform is from the lid or the feedthrough main body with different
Thermal expansion coefficient.
26. according to the method for claim 23, wherein second main body includes the sensor main body for accommodating sensor.
27. according to the method for claim 26, wherein the platform and the plate are placed on feedthrough main body and the second master
It include: the platform to be attached to the sensor main body, and connect the platform by least one pushpin between body
To the feedthrough main body.
28. according to the method for claim 27, further includes: before arranging the lid, by the plate wire bonding to
The connected conductor of the sensor.
29. a kind of Electronic Packaging, comprising:
Has slotted feedthrough main body；
Lid, is joined to the feedthrough main body to form gas-tight seal chamber；And
Plate is equipped with electronic component above and is arranged and is installed to the slot in the feedthrough main body.
30. Electronic Packaging according to claim 29, wherein the lid includes at least one slot, and a part of the plate
It is arranged at least one described slot.
31. Electronic Packaging according to claim 29 further includes the guide rail for being installed to the inside of the lid, wherein the plate
In the guide rail.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/636,870 | 2017-06-29 | ||
| US15/636,870 US11153985B2 (en) | 2017-06-29 | 2017-06-29 | Modular hybrid circuit packaging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109216210A true CN109216210A (en) | 2019-01-15 |
| CN109216210B CN109216210B (en) | 2023-04-21 |
Family
ID=62090079
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721399023.XU Active CN207409457U (en) | 2017-06-29 | 2017-10-26 | Modularization hybrid circuit encapsulates |
| CN201711019670.8A Active CN109216210B (en) | 2017-06-29 | 2017-10-26 | Modular hybrid circuit package |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721399023.XU Active CN207409457U (en) | 2017-06-29 | 2017-10-26 | Modularization hybrid circuit encapsulates |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11153985B2 (en) |
| EP (1) | EP3646377A1 (en) |
| JP (1) | JP6991253B2 (en) |
| CN (2) | CN207409457U (en) |
| CA (1) | CA3068397A1 (en) |
| WO (1) | WO2019005265A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11153985B2 (en) * | 2017-06-29 | 2021-10-19 | Rosemount Inc. | Modular hybrid circuit packaging |
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Also Published As
| Publication number | Publication date |
|---|---|
| US20190008062A1 (en) | 2019-01-03 |
| CN207409457U (en) | 2018-05-25 |
| JP6991253B2 (en) | 2022-01-12 |
| JP2020528213A (en) | 2020-09-17 |
| CA3068397A1 (en) | 2019-01-03 |
| EP3646377A1 (en) | 2020-05-06 |
| WO2019005265A1 (en) | 2019-01-03 |
| CN109216210B (en) | 2023-04-21 |
| US11153985B2 (en) | 2021-10-19 |
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