CN109196453A - 一种指纹感测芯片及终端设备 - Google Patents

一种指纹感测芯片及终端设备 Download PDF

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Publication number
CN109196453A
CN109196453A CN201680001397.3A CN201680001397A CN109196453A CN 109196453 A CN109196453 A CN 109196453A CN 201680001397 A CN201680001397 A CN 201680001397A CN 109196453 A CN109196453 A CN 109196453A
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China
Prior art keywords
signal
fingerprint sensing
voltage
sensing chip
driving signal
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CN201680001397.3A
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CN109196453B (zh
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王运华
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FocalTech Systems Ltd
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FocalTech Systems Ltd
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/101—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including resistors or capacitors only

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Image Input (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)

Abstract

本申请提供一种指纹感测芯片和终端设备，包括：第一信号、第二信号和驱动信号；该指纹感测芯片由所述第一信号产生所述第二信号，并对所述第二信号进行抬地后产生所述驱动信号；所述驱动信号，用于为指纹感测提供驱动电压。其中终端设备包括：电源和所述指纹感测芯片；电源用于为所述指纹感测芯片提供电源；所述指纹感测芯片，用于感测指纹。将现有技术中第一芯片和第二芯片整合为一个芯片，降低了生产两颗芯片的复杂度，减小了整个电路所占的面积，符合用户对于终端设备越来越轻薄化的要求。而且该指纹感测芯片对指纹感测的驱动电压进行抬地，消除用户使用指纹对终端设备安全认证时的不适感。

Description

PCT国内申请，说明书已公开。

Claims (11)

  1. PCT国内申请，权利要求书已公开。
CN201680001397.3A 2016-10-28 2016-10-28 一种指纹感测芯片及终端设备 Active CN109196453B (zh)

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PCT/CN2016/103790 WO2018076283A1 (zh) 2016-10-28 2016-10-28 一种指纹感测芯片及终端设备

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CN103593077B (zh) * 2012-08-14 2017-03-08 群康科技(深圳)有限公司 触控感测单元及具有该触控感测单元的面板
US9747488B2 (en) * 2014-09-30 2017-08-29 Apple Inc. Active sensing element for acoustic imaging systems
CN106022270B (zh) * 2016-03-31 2019-08-20 深圳市奔凯安全技术股份有限公司 一种指纹检测电路及装置
TWI591548B (zh) * 2016-04-12 2017-07-11 友達光電股份有限公司 指紋感測器

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CN203480479U (zh) * 2012-04-13 2014-03-12 苹果公司 电子设备
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US20190340404A1 (en) 2019-11-07
US10943906B2 (en) 2021-03-09
WO2018076283A1 (zh) 2018-05-03
CN109196453B (zh) 2022-05-10

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