CN109195355A - A kind of pcb board and the connection structure of plastic parts and preparation method thereof - Google Patents
A kind of pcb board and the connection structure of plastic parts and preparation method thereof Download PDFInfo
- Publication number
- CN109195355A CN109195355A CN201811124597.5A CN201811124597A CN109195355A CN 109195355 A CN109195355 A CN 109195355A CN 201811124597 A CN201811124597 A CN 201811124597A CN 109195355 A CN109195355 A CN 109195355A
- Authority
- CN
- China
- Prior art keywords
- plastic parts
- hole
- pcb board
- pad
- connection structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004033 plastic Substances 0.000 title claims abstract description 121
- 238000002360 preparation method Methods 0.000 title description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000011248 coating agent Substances 0.000 claims abstract description 27
- 238000000576 coating method Methods 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims description 7
- 239000006071 cream Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- 238000009864 tensile test Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses the connection structures of a kind of pcb board and plastic parts, two pcb boards including plastic parts and side disposed thereon and downside, wherein, the plastic parts offers multiple through-holes along its short transverse, each through-hole includes a big opening and a small opening, the plastic parts includes the second surface of the first surface of the pcb board towards upside and the pcb board towards downside, the big opening of a part of through-hole is located at the first surface of the plastic parts, and the big opening of through-hole described in another part is located at the second surface of the plastic parts；Each through-hole is corresponded on each pcb board equipped with pad；And, scolding tin is set between the surface of the big opening or the small parameatal plastic parts of the pad of the pcb board and the through-hole of the plastic parts and the through-hole, the pcb board and the plastic parts to be attached, and the contact surface of the plastic parts and the scolding tin is equipped with and changes coating pad.
Description
Technical field
The present invention relates to the connectors of pcb board in consumer electronics sector, and in particular to pcb board in a kind of electronic product
With the connection structure of plastic parts and preparation method thereof.
Background technique
Referring to Figure 1, in current electronic product, plastic parts carry out LDS (Laser DirectStructuring,
Laser direct structuring technique) after process, using the method for chemical plating, so that the coat of metal is deposited on plastic rubber member surface, then
It passes sequentially through the coat of metal, scolding tin and PCB pad plastic parts is connected and is connected with pcb board.
However, in such connection structure, due to the adhesive force of the coat of metal and plastic parts deficiency, when by external force or
In reliability test, since the binding force of the coat of metal and scolding tin is greater than the binding force of the coat of metal and plastic parts, cause
Part metals coating often falls off from plastic rubber member surface, and then leads to the fracture of conducting wire, specific as shown in Figure 2.
Summary of the invention
The present invention provides a kind of pcb board and connection structure of plastic parts and preparation method thereof, to solve the company of the prior art
The hypodynamic defect of the attachment of the coat of metal and plastic parts in binding structure.
Technical scheme is as follows:
A kind of connection structure of pcb board and plastic parts, two pcb boards including plastic parts and side disposed thereon and downside,
Wherein, the plastic parts offers multiple through-holes along its short transverse, and each through-hole includes a big opening and one small
Opening, the plastic parts includes the second table of the first surface of the pcb board towards upside and the pcb board towards downside
Face, the big opening of a part of through-hole are located at the first surface of the plastic parts, the big opening position of through-hole described in another part
In the second surface of the plastic parts；
Each through-hole is corresponded on each pcb board equipped with pad；Also,
The big opening or small opening week of the pad of the pcb board and the through-hole of the plastic parts and the through-hole
Scolding tin is set between the surface of the plastic parts enclosed, the pcb board and the plastic parts are attached, and the modeling
The contact surface of glue part and the scolding tin, which is equipped with, changes coating pad.
On the one hand the present invention increases scolding tin and changes the contact area of coating pad, separately by getting through hole on plastic parts
On the one hand, through-hole the radial dimension in one end close to the pcb board is shaped to be less than in the separate pcb board
The radial dimension of one end, so that scolding tin is difficult to take off from the direction of pull of pcb board.
In further preferred embodiment, the through-hole is bellmouth.By such structure, change coating scolding tin by
It, can be on disperses force to the circular cone inclined-plane for changing coating scolding tin when to upward pulling force, it is ensured that changing coating pad will not draw
It falls off under power effect.
The present invention does not have considered critical, the determination of the taper of the preferably described bellmouth and plastic parts to the taper of bellmouth
Thickness it is related, additionally influenced by prior art is horizontal.
The present invention does not have considered critical to the arrangement mode of multiple through-holes, and the arrangement mode of the multiple through-hole can be one
It arranges multiple rows of or random.
Preferably, the through-hole is laser hole.
The present invention also provides the connection methods of a kind of pcb board and plastic parts, include the following steps:
The plastic parts for being equipped with through-hole is provided, the plastic parts includes first surface and the face of the pcb board towards upside
To the second surface of the pcb board of downside, each through-hole include a big opening and a small opening, a part described in
The big opening of through-hole is located at the first surface of the plastic parts, and the big opening of through-hole described in another part is located at the plastic parts
Second surface；
Each of described plastic parts through-hole is arranged in the settingization coating pad on plastic parts, describedization coating pad
The big opening of the interior and described through-hole and the edge of small opening；
Upper tin cream will be all put on the pad on plastic parts two sides, be then arranged in the upper surface of described plastic parts and separately below
Pcb board fits together plastic parts and pcb board, and realizes being welded and fixed for pcb board and plastic parts by Reflow Soldering mode,
Thus use upper layer and lower layer pcb board that plastic parts packet in centre, is formd a kind of structure of similar sandwich.
The present invention also provides the connection structure of a kind of pcb board and plastic parts, including plastic parts and it is located on the plastic parts
Two pieces of pcb boards of lower two sides, wherein
The plastic parts is equipped with multiple circular cone through-holes, and a part of circular cone through-hole is up big and down small, described in another part
Circular cone through-hole is up-small and down-big, and the arrangement mode of the multiple through-hole is a row or multi-row or random；
Each through-hole is corresponded on each pcb board equipped with pad；Also,
The big opening or small opening week of the pad of the pcb board and the through-hole of the plastic parts and the through-hole
Scolding tin is set between the surface of the plastic parts enclosed, the pcb board and the plastic parts are attached, and the modeling
The contact surface of glue part and the scolding tin, which is equipped with, changes coating pad.
Preferably, the determination of the taper of the bellmouth and the thickness of plastic parts are related.
Preferably, the circular cone through-hole is laser hole.
In a preferred embodiment, the up big and down small through-hole and the up-small and down-big through-hole interval setting.
Compared with prior art, beneficial effects of the present invention are as follows:
The present invention increases the contact area of scolding tin and pad, it is often more important that pass through by getting through hole on plastic parts
Close to the setting difference of the both ends radial direction of pcb board and separate pcb board, gradient laser via is more optimizedly set, so that weldering
Tin is difficult to take off from direction of pull；
The binding force of usual scolding tin and PCB pad is stronger, and the change coating pad on plastic parts is only then one layer of coating, phase
To being easy to fall off, but the present invention is arranged by the pyramidal structure of laser hole, and scolding tin is when by upward pulling force, strength
It is distributed on the conical surface of scolding tin, it is ensured that changing coating pad will not fall off under a stretching force.
Certainly, it implements any of the products of the present invention and does not necessarily require achieving all the advantages described above at the same time.
Detailed description of the invention
Fig. 1 is the attachment structure schematic diagram of pcb board in the prior art and plastic parts；
Fig. 2 is in the connection structure of pcb board in the prior art and plastic parts, and the coat of metal falls off from plastic rubber member surface
Schematic diagram；
Fig. 3 is the pcb board of the embodiment of the present invention and the attachment structure schematic diagram of plastic parts；
Fig. 4 is the comparative example of the embodiment of the present invention without the welded serial section figure of through-hole；
Fig. 5 has the welded serial section figure of through-hole for the embodiment of the present invention；
Fig. 6 is the welded stress diagram of the comparative example of the embodiment of the present invention；
Fig. 7 is the photo of the welded Pad off of the comparative example of the embodiment of the present invention；
Fig. 8 is the welded stress diagram of the embodiment of the present invention；
Fig. 9 is the welded cross-sectional slice picture of the embodiment of the present invention；
Figure 10 is the position when welding structure of the embodiment of the present invention does tensile test from the other end；
Figure 11 is the cross-sectional slice photo when welding structure of the embodiment of the present invention does tensile test from the other end；
Figure 12 is that the welding structure laser hole opening direction of the embodiment of the present invention distinguishes staggered schematic diagram.
Specific embodiment
The present invention provides the connection structure of a kind of pcb board and plastic parts, mainly enhancing LDS plastic parts and metallization coating
The adhesive force of pad reduces the failure rate of product to improve the reliability of consumption electronic product wiring board connection.
Following embodiment makes the connection structure of pcb board and plastic parts by the following method:
The plastic parts for being equipped with through-hole is provided, the plastic parts includes first surface and the face of the pcb board towards upside
To the second surface of the pcb board of downside, each through-hole include a big opening and a small opening, a part described in
The big opening of through-hole is located at the first surface of the plastic parts, and the big opening of through-hole described in another part is located at the plastic parts
Second surface；
Each of described plastic parts through-hole is arranged in the settingization coating pad on plastic parts, describedization coating pad
The big opening of the interior and described through-hole and the edge of small opening；
Upper tin cream will be all put on the pad on plastic parts two sides, be then arranged in the upper surface of described plastic parts and separately below
Pcb board fits together plastic parts and pcb board, and realizes being welded and fixed for pcb board and plastic parts by Reflow Soldering mode,
Thus use upper layer and lower layer pcb board that plastic parts packet in centre, is formd a kind of structure of similar sandwich.
Below with specific embodiment, the present invention will be further described.
Embodiment 1
In order to verify connection structure of the invention for the effect of enhancing adhesive force, the present invention is distinguished with following two ways
Do comparative experiments:
For comparative example using the connection structure in currently available technology shown in FIG. 1, scolding tin is direct and changes coating pad solder
Together, Fig. 4 is the welded serial section figure of no through-hole.
Embodiment 1 use the connection structure equipped with laser hole of the invention shown in Fig. 3, the basal diameter of the laser hole and
The ratio between height is 1:17.For technical solution of the present invention, it is also an option that other tapers, the determination of the taper and plastic cement
The thickness of part is related.
Apply a pulling force, on the pad of comparative example and embodiment 1 respectively to examine connection structure of the invention to increase
The validity of adhesive force.
Data are obtained for convenience, are soldered on pad with a copper wire, Pad off can be measured on measurer for pulling force
Maximum pull.
Different results has been respectively obtained after test:
In the scheme for the prior art without laser hole that comparative example uses, from the stress diagram and weldering shown in Fig. 7 of Fig. 6
Surface picture after disk falls off can see, and pad directly falls off under a stretching force, and stress size is 2.3N at this time.
In the connection structure scheme for having laser hole that embodiment 1 uses, schematic diagram and section of Fig. 9 are broken from the copper wire of Fig. 8
Face slice picture then can see, copper wire is pulled off, and can further be seen that copper wire breaks inside tin cream from Fig. 9, and scolding tin and
Pad is all intact, and stress size is 5.8N at this time.
But when the connection structure for embodiment 1 does tensile test from other end, signal shown in Figure 10
Figure and cross-sectional slice picture shown in Figure 11, when copper wire is by upward pulling force, because providing corresponding pressure without tapered surface
Power, scolding tin and pad can be deviate from from other end.
Above-described embodiment is used when two surfaces up and down of plastic parts are required to setting pcb board based on drawbacks described above
Then there is problem in connection structure, in this regard, the present invention provides the schemes of following embodiments 2.
Embodiment 2
Referring to Figure 12, the present embodiment provides the connection structure of a kind of pcb board and plastic parts, including plastic parts and it is located at institute
Two pieces of pcb boards of plastic parts or more two sides are stated, the plastic parts is equipped with multiple through-holes, and the multiple through-hole includes up big and down small
Through-hole and up-small and down-big through-hole, and in the present embodiment, the up big and down small through-hole and described up-small and down-big logical
The setting of hole interval；The through-hole is cone-shaped hole；
Each through-hole is corresponded on each pcb board equipped with pad；Also,
The big opening or small opening week of the pad of the pcb board and the through-hole of the plastic parts and the through-hole
Scolding tin is set between the surface of the plastic parts enclosed, the pcb board and the plastic parts are attached, and the modeling
The contact surface of glue part and the scolding tin, which is equipped with, changes coating pad.Describedization coating pad is metallization coating.The through-hole can
Think laser hole.
In other embodiments, the up big and down small through-hole and the up-small and down-big through-hole can also be other
Arrangement mode, such as arrangement in a row, or at multiple rows of arrangement or random arrangement.
The present invention increases the contact area of scolding tin and pad, it is often more important that pass through by getting through hole on plastic parts
Close to the setting difference of the both ends radial direction of pcb board and separate pcb board, such as gradient laser via is set, so that scolding tin is very
Difficulty takes off from direction of pull；The binding force of usual scolding tin and PCB pad is stronger, and the change coating pad on plastic parts is only then
One layer of coating, relatively easily falls off, but the present invention is arranged by the pyramidal structure of laser hole, and scolding tin is by upward pulling force
When, on the conical surface disperses force to scolding tin, it is ensured that changing coating pad will not fall off under a stretching force.
Present invention disclosed above preferred embodiment is only intended to help to illustrate the present invention.There is no detailed for preferred embodiment
All details are described, are not limited the invention to the specific embodiments described.Obviously, according to the content of this specification,
It can make many modifications and variations.These embodiments are chosen and specifically described to this specification, is in order to better explain the present invention
Principle and practical application, so that skilled artisan be enable to better understand and utilize the present invention.The present invention is only
It is limited by claims and its full scope and equivalent.
Claims (10)
1. the connection structure of a kind of pcb board and plastic parts, which is characterized in that two including plastic parts and side disposed thereon and downside
A pcb board, wherein the plastic parts offers multiple through-holes along its short transverse, and each through-hole includes a big opening
With a small opening, the plastic parts includes the first surface of the pcb board towards upside and the pcb board towards downside
Second surface, the big opening of a part of through-hole is located at the first surface of the plastic parts, through-hole described in another part
Big opening is located at the second surface of the plastic parts；
Each through-hole is corresponded on each pcb board equipped with pad；Also,
The big opening or small parameatal of the pad of the pcb board and the through-hole of the plastic parts and the through-hole
Scolding tin is set between the surface of the plastic parts, the pcb board and the plastic parts are attached, and the plastic parts
It is equipped with the contact surface of the scolding tin and changes coating pad.
2. the connection structure of pcb board according to claim 1 and plastic parts, which is characterized in that the through-hole is bellmouth.
3. the connection structure of pcb board according to claim 2 and plastic parts, which is characterized in that the taper of the bellmouth
Determination it is related with the thickness of plastic parts.
4. the connection structure of pcb board according to claim 1 and plastic parts, which is characterized in that the row of the multiple through-hole
Column mode is a row or multi-row or random.
5. the connection structure of pcb board according to claim 1 and plastic parts, which is characterized in that the through-hole is laser hole.
6. the connection method of a kind of pcb board and plastic parts, which comprises the steps of:
The plastic parts for being equipped with through-hole is provided, the plastic parts includes the first surface and downwards of the pcb board towards upside
The second surface of the pcb board of side, each through-hole include a big opening and a small opening, a part of through-hole
Big opening be located at the first surface of the plastic parts, the big opening of through-hole described in another part is located at the second of the plastic parts
Surface；
The settingization coating pad on plastic parts, describedization coating pad be arranged in each of described plastic parts through-hole and
The edge of the big opening of the through-hole and small opening；
Upper tin cream will be all put on the pad on plastic parts two sides, and in the upper surface of described plastic parts and pcb board is then set separately below,
Plastic parts and pcb board are fit together, and being welded and fixed for pcb board and plastic parts is realized by Reflow Soldering mode.
7. the connection structure of a kind of pcb board and plastic parts, which is characterized in that including plastic parts and be located at the plastic parts or more two
Two pieces of pcb boards of side, wherein
The plastic parts is equipped with multiple circular cone through-holes, and a part of circular cone through-hole is up big and down small, circular cone described in another part
Through-hole is up-small and down-big, and the arrangement mode of the multiple through-hole is a row or multi-row or random；
Each through-hole is corresponded on each pcb board equipped with pad；Also,
The big opening or small parameatal of the pad of the pcb board and the through-hole of the plastic parts and the through-hole
Scolding tin is set between the surface of the plastic parts, the pcb board and the plastic parts are attached, and the plastic parts
It is equipped with the contact surface of the scolding tin and changes coating pad.
8. the connection structure of pcb board according to claim 7 and plastic parts, which is characterized in that the taper of the bellmouth
Determination it is related with the thickness of plastic parts.
9. the connection structure of pcb board according to claim 7 and plastic parts, which is characterized in that the circular cone through-hole is sharp
Unthreaded hole.
10. the connection structure of pcb board according to claim 7 and plastic parts, which is characterized in that described up big and down small leads to
Hole and the up-small and down-big through-hole interval setting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811124597.5A CN109195355A (en) | 2018-09-26 | 2018-09-26 | A kind of pcb board and the connection structure of plastic parts and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811124597.5A CN109195355A (en) | 2018-09-26 | 2018-09-26 | A kind of pcb board and the connection structure of plastic parts and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109195355A true CN109195355A (en) | 2019-01-11 |
Family
ID=64907381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811124597.5A Pending CN109195355A (en) | 2018-09-26 | 2018-09-26 | A kind of pcb board and the connection structure of plastic parts and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109195355A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030174484A1 (en) * | 2002-03-14 | 2003-09-18 | General Dynamics Advanced Information Systems, Inc | Lamination of high-layer-count substrates |
| JP2004356564A (en) * | 2003-05-30 | 2004-12-16 | Murata Mfg Co Ltd | Ceramic multilayered circuit board and its manufacturing method |
| CN102422414A (en) * | 2009-04-28 | 2012-04-18 | 株式会社藤仓 | Device mounting structure and device mounting method |
| US20140353018A1 (en) * | 2013-05-28 | 2014-12-04 | Hitachi, Ltd. | Interlayer connection substrate and its manufacturing method |
| CN210609915U (en) * | 2018-09-26 | 2020-05-22 | 上海安费诺永亿通讯电子有限公司 | Connecting structure of PCB and plastic part |
-
2018
- 2018-09-26 CN CN201811124597.5A patent/CN109195355A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030174484A1 (en) * | 2002-03-14 | 2003-09-18 | General Dynamics Advanced Information Systems, Inc | Lamination of high-layer-count substrates |
| JP2004356564A (en) * | 2003-05-30 | 2004-12-16 | Murata Mfg Co Ltd | Ceramic multilayered circuit board and its manufacturing method |
| CN102422414A (en) * | 2009-04-28 | 2012-04-18 | 株式会社藤仓 | Device mounting structure and device mounting method |
| US20140353018A1 (en) * | 2013-05-28 | 2014-12-04 | Hitachi, Ltd. | Interlayer connection substrate and its manufacturing method |
| CN210609915U (en) * | 2018-09-26 | 2020-05-22 | 上海安费诺永亿通讯电子有限公司 | Connecting structure of PCB and plastic part |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103811449A (en) | Solder ball bump structure and method for forming the same | |
| US20030178132A1 (en) | Method for manufacturing connection structure | |
| CN208798267U (en) | A kind of printed circuit board and its electronic equipment | |
| JP2008545248A (en) | Printed circuit board type translator for connector-pad conversion and manufacturing method | |
| JP2006108523A (en) | Method of connecting electrical component using anisotropic conductive film | |
| JP4361161B2 (en) | Anisotropic conductive connector | |
| CN109195355A (en) | A kind of pcb board and the connection structure of plastic parts and preparation method thereof | |
| CN105033387A (en) | Manufacturing method of welding pull pins | |
| CN210609915U (en) | Connecting structure of PCB and plastic part | |
| US20160005504A1 (en) | Electroconductive microparticles, anisotropic electroconductive material, and electroconductive connection structure | |
| CN101626011B (en) | Base plate having pad-free type conductive traces and using for encapsulation | |
| JP2015137418A (en) | Wiring board and production method of wiring board | |
| TWI410637B (en) | Area array probe card | |
| CN110876235A (en) | Electronic device and method for manufacturing the same | |
| JP6133664B2 (en) | Manufacturing method of electronic equipment | |
| CN100591193C (en) | Wiring substrate, wiring material, copper-clad laminate, and method of manufacturing the wiring substrate | |
| CN204545646U (en) | The nozzle of selective wave-soldering | |
| JP6328284B2 (en) | Electronics | |
| CN204090290U (en) | There is the flexible circuit board of BGA pad | |
| Frisk et al. | Reliability of ACF interconnections on FR-4 substrates | |
| US20120103668A1 (en) | Chip Package | |
| CN102006720A (en) | PCB (Printed Circuit Board) | |
| JP2010174322A (en) | Elastic contact and method of manufacturing the same, and contact substrate and method of manufacturing the same | |
| US20240074047A1 (en) | Conductive bump structure of circuit board and manufacturing method thereof | |
| CN211184419U (en) | Low-cost tin-connection-preventing PCB |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |