Printed circuit board and display module
Technical Field
The invention relates to the field of liquid crystal display, in particular to a printed circuit board and a display module.
Background
The display module of the conventional liquid crystal display panel has two main types, one of which is a flat display module (flat type), the front view of which is shown in fig. 1, the left view of which is shown in fig. 2, the printed circuit board 03 is disposed below the display panel 01, and two ends of the flat flexible circuit board 02(FPC) are electrically connected to the terminals at the edge of the display panel 01 and the gold fingers 031 on the printed circuit board 03(PCB), respectively. The other is a bending type display module (bend type), a front view of which is shown in fig. 3, a left view of which is shown in fig. 4, a printed circuit board 03 is disposed on the back of the display panel 01, and a bent U-shaped flexible circuit board 02 electrically connects terminals on the edge of the display panel 01 with gold fingers 031 on the printed circuit board 03. The flat display module has a low thickness, and the bending display module can effectively reduce the length of the module and reduce the space occupancy rate of the module, but can increase the thickness of the module.
The binding means that anisotropic conductive Adhesive (ACF) is coated between the gold finger 03 and the conductive terminal of the external device, and then the conductive particles in the ACF are broken after the processes of false pressing, local pressing and the like, so that the gold finger 03 and the conductive terminal of the external device are electrically connected.
In the printed circuit board 03 adapted to the flat display module, the gold fingers 031 for bonding and the electronic components are located on different sides of the circuit substrate; in the printed circuit board suitable for the foldable display module, the gold finger 031 and the electronic component are located on the same side of the circuit substrate.
Therefore, if a display module structure needs to be changed into another display module structure in the design process, even if the same display panel and circuit design are maintained, two different printed circuit board designs are still needed, the design amount is increased, materials need to be created again, and model verification is performed again, so that the time consumption is increased, and the cost is increased.
Disclosure of Invention
In order to solve the technical problems, the invention provides a printed circuit board, which is universally used for a flat display module and a bending display module by arranging golden fingers on two sides of a binding area of the printed circuit board; the invention also discloses a display module comprising the printed circuit board.
The technical scheme provided by the invention is as follows:
the invention discloses a printed circuit board, comprising:
the circuit board is provided with a first surface and a second surface which are opposite, and comprises a binding area and an element area except the binding area;
the electronic element is arranged on the first surface of the circuit substrate and is positioned in the element area;
the first golden finger is arranged on the second surface of the circuit substrate and is positioned in the binding region;
and the second golden finger is arranged on the first surface of the circuit substrate and is positioned in the binding region.
Preferably, the first gold finger includes a plurality of first contact points, the second gold finger includes a plurality of second contact points corresponding to the first contact points one to one, and the corresponding first contact points and the corresponding second contact points have the same electrical structure.
Preferably, the first gold finger and the second gold finger are opposite in position, and the first contact point is opposite to the corresponding second contact point.
Preferably, the circuit board includes a plurality of stacked substrate layers, through holes are formed in opposite positions of each substrate layer, and the first gold finger is electrically connected with the second gold finger through the through holes.
Preferably, the first gold finger or the second gold finger is a plurality of discrete rectangular sheet-shaped bonding pads, and the bonding pads are arranged in parallel and spaced at a certain interval.
The invention also discloses a display module, which comprises a display panel, a flexible circuit board and any one of the printed circuit boards;
the display panel comprises a front side capable of displaying pictures and a back side opposite to the front side, and a terminal area is arranged at the edge of the front side of the display panel;
the first end of the flexible circuit board is bound with the terminal area, the second end of the flexible circuit board is bound with the first golden finger of the printed circuit board, and the flexible circuit board is flat;
the bonding region of the circuit substrate is farther away from the edge of the display panel than the device region, and the second surface of the circuit substrate faces the same side as the front surface of the display panel.
The invention also discloses a display module, which comprises a display panel, a flexible circuit board and any one of the printed circuit boards;
the display panel comprises a front side capable of displaying pictures and a back side opposite to the front side, and a terminal area is arranged at the edge of the front side of the display panel;
the first end of the flexible circuit board is bound with the terminal area, the second end of the flexible circuit board is bound with the second golden finger of the printed circuit board, and the flexible circuit board is bent into a U shape;
the edge of the display panel and the binding area of the circuit substrate are positioned in the U-shaped groove, the printed circuit board is positioned on one side of the back face of the display panel, and the first surface of the circuit substrate and the front face of the display panel face to the opposite side.
Compared with the prior art, the invention can bring at least one of the following beneficial effects:
1. the printed circuit board is universal for the flat display module and the bending display module, can flexibly perform relative conversion between the flat display module and the bending display module, and reduces development and material preparation cost;
2. because the binding area is the component forbidden area, the gold fingers are arranged on both sides of the binding area, and the design of electronic components in the existing printed circuit board is not required to be changed basically.
Drawings
The present invention will be further described in the following detailed description of preferred embodiments, which is to be read in connection with the accompanying drawings.
FIG. 1 is a front view of a conventional flat display module;
FIG. 2 is a left side view of a conventional flat display module;
FIG. 3 is a front view of a conventional foldable display module;
FIG. 4 is a left side view of a conventional foldable display module;
FIG. 5 is a schematic view of a first side of a printed circuit board of the present invention;
FIG. 6 is a schematic view of a second side of the printed circuit board of the present invention;
FIG. 7 is a front view of a flexible circuit board of the display module of the present invention;
FIG. 8 is a left side view of a flexible circuit board of the display module of the present invention;
FIG. 9 is a schematic structural diagram of a display module according to the present invention;
FIG. 10 is a left side view of the display module shown in FIG. 9;
FIG. 11 is a schematic structural view of a display module according to another embodiment of the present invention before being bent;
FIG. 12 is a schematic view of the display module shown in FIG. 11 after being bent;
FIG. 13 is a left side view of the display module shown in FIG. 11.
Detailed Description
The present invention is further illustrated by the following figures and specific examples, which are to be understood as illustrative only and not as limiting the scope of the invention, which is to be given the full breadth of the appended claims and any and all equivalent modifications thereof which may occur to those skilled in the art upon reading the present specification.
The printed circuit board 03 of the present invention includes: a circuit substrate having a first surface and a second surface opposite to each other, an electronic component 032 disposed on the first surface of the circuit substrate, and a first gold finger 0311 and a second gold finger 0312 disposed on the second surface and the first surface of the circuit substrate, respectively. Wherein, the first gold finger 0311 opposite to the electronic component 032 is used for binding (bonding) in a flat display module (flat type); the second gold finger 0312 located on the same side as the electronic component 032 is used for binding in the bend type display module.
The circuit board in the printed circuit board 03 may be a single rigid substrate layer or may be composed of a plurality of rigid substrate layers stacked, and the substrate layer has insulation properties. The circuit substrate is provided with a first surface and a second surface which are opposite, the first surface and the second surface are two surfaces with the largest area of the circuit substrate, and the shape of the first surface and the second surface is preferably rectangular or rounded rectangle. The circuit substrate comprises a binding area and an element area except the binding area, and the binding area is close to the side edge of the circuit substrate; such as: when the first surface and the second surface are rectangular, the binding region may be located on a long side of the rectangle.
Fig. 5 shows a schematic diagram of a first side of the printed circuit board 03, in which an electronic component 032 is disposed on the first surface of the circuit substrate and located in the component region, and a second gold finger 0312 is disposed on the first surface of the circuit substrate and located in the bonding region. Fig. 6 shows a schematic diagram of the second side of the printed circuit board 03, in which the first gold finger 0311 is located on the second surface of the circuit substrate and within the bonding region.
The first gold finger 0311 and the second gold finger 0312 are rectangular plate pads, electrically connected to the electronic component 032, and are interfaces for connecting the electronic component 032 on the printed circuit board 03 to external devices. In other embodiments, the first gold finger 0311 or the second gold finger 0312 may be a plurality of discrete rectangular chip pads, which are arranged in parallel and spaced apart by a certain distance. The first gold finger 0311 or the second gold finger 0312 may extend to the edge of the printed circuit board 03, or may be located inside the printed circuit board 03 and spaced from the edge thereof.
The first gold finger 0311 includes a plurality of first contact points, and the second gold finger 0312 includes a plurality of second contact points corresponding to the first contact points one by one, and the corresponding first contact points and second contact points have the same electrical structure, that is, when the printed circuit board 03 is bonded to an external device, the first contact points and second contact points can be engaged with the same position of the external device and input and output the same signal. The first gold finger 0311 and the second gold finger 0312 are opposite in position, and the first contact point is opposite in position to the corresponding second contact point, that is, in the direction perpendicular to the substrate surface, the projection of the first gold finger 0311 coincides with the projection of the second gold finger 0312, and the projection of the first contact point coincides with the projection of the corresponding second contact point. When the circuit board is formed by a plurality of rigid substrate layers stacked, through holes are formed in the substrate layers at opposite positions, and the first gold finger 0311 is electrically connected to the second gold finger 0312 through the through holes.
The two sides of the binding area of the printed circuit board 03 are provided with the golden fingers, so that the printed circuit board 03 can be universally used for a flat display module and a bent display module, and the invention also discloses two display modules comprising the printed circuit board 03.
A display module is a flat display module, including: a display panel 01, a flexible circuit board 02, and the printed circuit board 03. The gold finger used for binding with the flexible circuit board 02 is a first gold finger 0311 of the printed circuit board 03.
The display panel 01 comprises a front side capable of displaying pictures and a back side opposite to the front side, and a terminal area is arranged on the edge of the front side of the display panel 01.
A front view of the flexible circuit board 02 is shown in fig. 7, and a left side view is shown in fig. 8. The flexible circuit board 02 includes a flexible substrate 020, a flexible circuit (not shown), a first flexible terminal 021 and a second flexible terminal 022, wherein the first flexible terminal 021 and the second flexible terminal 022 are respectively located at a first end and a second end of the same side of the flexible substrate 020, and the flexible circuit is respectively electrically connected with the first flexible terminal 021 and the second flexible terminal 022.
As shown in fig. 9, a first end of the flexible circuit board 02 is bonded to the terminal area of the display panel 01, a second end of the flexible circuit board 02 is bonded to the first gold finger 0311 of the printed circuit board 03, and the flexible circuit board 02 is flat. The second surface of the circuit substrate faces the same side as the front surface of the display panel 01, the first surface of the circuit substrate faces the same side as the back surface of the display panel 01, and the bonding region of the circuit substrate is farther away from the edge of the display panel 01 than the device region. The electronic component 032 is located on the first surface of the circuit substrate, i.e., on the back side of the display panel 01. The left view of the display module is shown in fig. 10.
Another kind of display module is the bending type display module, includes: a display panel 01, a flexible circuit board 02, and the printed circuit board 03. The gold finger used for binding with the flexible circuit board 02 is a second gold finger 0312 of the printed circuit board 03.
The display panel 01 comprises a front side capable of displaying pictures and a back side opposite to the front side, and a terminal area is arranged on the edge of the front side of the display panel 01.
A front view of the flexible circuit board 02 is shown in fig. 7, and a left side view is shown in fig. 8. The flexible circuit board 02 includes a flexible substrate 020, a flexible circuit (not shown), a first flexible terminal 021 and a second flexible terminal 022, wherein the first flexible terminal 021 and the second flexible terminal 022 are respectively located at a first end and a second end of the same side of the flexible substrate 020, and the flexible circuit is respectively electrically connected with the first flexible terminal 021 and the second flexible terminal 022.
As shown in fig. 11, before the display module is bent, the first end of the flexible circuit board 02 is bonded to the terminal area of the display panel 01, and the second end of the flexible circuit board 02 is bonded to the second gold finger 0312 of the printed circuit board 03. The first surface of the circuit substrate faces the same side as the front surface of the display panel 01, the second surface of the circuit substrate faces the same side as the back surface of the display panel 01, and the bonding region of the circuit substrate is closer to the edge of the display panel 01 than the device region.
As shown in fig. 12, after the display module is bent, the flexible circuit board 02 is bent into a U shape, so that the edge of the display panel 01 and the bonding area of the circuit substrate are located in the U-shaped groove, the printed circuit board 03 is located on the back side of the display panel 01, and the first surface of the circuit substrate and the front side of the display panel 01 face to the opposite side. The electronic component 032 is located on the first surface of the circuit substrate, i.e., on the back side of the display panel 01. FIG. 13 is a left side view of the display module.
The arrangement sequence of the plurality of first contact points in the first gold finger 0311 is referred to as a definition sequence of the first contact points, and the arrangement sequence of the plurality of second contact points in the second gold finger 0312 is referred to as a definition sequence of the second contact points. Because the corresponding first contact point and the second contact point have the same electrical structure and the projection of the first contact point coincides with the projection of the corresponding second contact point, for the same display panel 01 design and the same electronic component 032 design, in the flat display module, the definition sequence of the first contact point of the printed circuit board 03 of the invention corresponds to the definition sequence of a plurality of terminals in the terminal area of the display panel 01; in the foldable display module, the definition sequence of the second contact points of the printed circuit board 03 of the present invention corresponds to the definition sequence of the plurality of terminals in the terminal area of the display panel 01. Therefore, the printed circuit board 03 can be universally used for the flat display module and the bent display module, can flexibly perform relative conversion between the flat display module and the bent display module, and reduces development and material preparation costs. Since the bonding region is a device forbidden region, the gold fingers are disposed on both sides of the bonding region, and the design of the electronic device 032 in the existing printed circuit board 03 is not changed.
It should be noted that, if the prior art printed circuit board 03 suitable for the flat display module is used to manufacture the foldable display module, the printed circuit board 03 only includes the electronic component 032 and the first gold finger 0311 located on the opposite side of the circuit substrate, the definition sequence of the first gold finger 0311 is different from the definition sequence of the plurality of terminals in the terminal area of the display panel 01, and the flexible circuit board 02 cannot be correctly bound. If the flat display module is manufactured by using the printed circuit board 03 suitable for the foldable display module in the prior art, the printed circuit board 03 only includes the electronic component 032 and the second gold finger 0312 located on the same side of the circuit substrate, the definition sequence of the second gold finger 0312 is different from the definition sequence of the terminals in the terminal area of the display panel 01, and the flexible circuit board 02 cannot be correctly bound.
Although the preferred embodiments of the present invention have been described in detail, the present invention is not limited to the details of the foregoing embodiments, and various equivalent changes (such as number, shape, position, etc.) may be made to the technical solution of the present invention within the technical spirit of the present invention, and these equivalent changes are all within the protection scope of the present invention.