CN109192883A - The encapsulating method and structure of OLED device - Google Patents
The encapsulating method and structure of OLED device Download PDFInfo
- Publication number
- CN109192883A CN109192883A CN201810892745.1A CN201810892745A CN109192883A CN 109192883 A CN109192883 A CN 109192883A CN 201810892745 A CN201810892745 A CN 201810892745A CN 109192883 A CN109192883 A CN 109192883A
- Authority
- CN
- China
- Prior art keywords
- encapsulation
- gas
- oxygen
- oled device
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
Abstract
The invention discloses the encapsulating method and structure of OLED device, the packaging method includes: the OLED device for providing encapsulation cover plate and being set on substrate；It is in the substrate, the OLED device and the encapsulation cover plate in encapsulation atmosphere；The encapsulation cover plate is fixed on the substrate, to form the package cavity for accommodating the OLED device and the encapsulation gas, the encapsulation gas can be reacted with water and oxygen respectively to reduce or remove the indoor steam of the package cavity and oxygen.The property that the present invention utilizes the encapsulation gas that can react respectively with water and oxygen, make to enter the indoor oxygen of the package cavity and steam will with the encapsulation gas reaction and be eliminated, therefore it can prevent the OLED device from electrochemical corrosion occurring easily under the influence of oxygen and steam, guarantee that the performance of OLED device is stablized, extends the service life of the OLED display panel of OLED device and its application.
Description
Technical field
The present invention relates to the packaging method of the technical field of Organic Light Emitting Diode, especially OLED device and encapsulation knots
Structure.
Background technique
OLED display panel has substrate and is set on substrate including anode, organic luminous layer and cathode
OLED device, restricting the major issue that existing OLED display panel develops is the OLED device in OLED display panel
Service life is shorter, reason be mainly OLED device electrode and organic luminous layer luminous organic material for the pollution in atmosphere
Object, steam and oxygen are all very sensitive, and especially in the environment rich in steam and oxygen, OLED device is easy to that electricity occurs
Chemical attack.
The prior art is to protect the encapsulation of electrode and luminous organic material progress inside OLED device, often uses UV glue
Equal organic matters packaging plastic adhesive base plate and encapsulation cover plate, OLED device are packaged in the box type package chamber that the two is formed.Envelope
Dress glue needs to be completed to fix by illumination curing, and the molecular gap after organic matter solidifies is generally large, it is easy to form structure
On gap, so as to cause in atmosphere steam and the substances such as oxygen can still be entered inside package cavity by this kind of gap,
Electrochemical corrosion occurs for the electrode and organic luminous layer for making OLED device, influences the performance of OLED device and shortens it using the longevity
Life.
Summary of the invention
In view of this, the purpose of the present invention is to provide the encapsulating method and structure of OLED device, it is above-mentioned to solve
Problem.
In order to achieve the above purpose, present invention employs the following technical solutions:
The present invention provides a kind of packaging method of OLED device, the packaging method includes: to provide encapsulation cover plate and set
The OLED device being placed on substrate；The substrate, the OLED device and the encapsulation cover plate is set to be in encapsulation atmosphere
In；The encapsulation cover plate is fixed on the substrate, to form the encapsulation for accommodating the OLED device and the encapsulation gas
Chamber, the encapsulation gas can be reacted respectively with water and oxygen with reduce or remove the indoor steam of the package cavity and
Oxygen.
Preferably, the encapsulation gas reacts the solid generated for completely cutting off steam and oxygen with water or oxygen, described solid
Body is formed in the junction of the substrate and the encapsulation cover plate.
Preferably, the substrate, the OLED device and the encapsulation cover plate is made to be in the side in encapsulation atmosphere
Method includes: that the substrate, the OLED device and the encapsulation cover plate are placed in seal chamber；It extracts in the seal chamber
Air, until the atmospheric pressure value in the seal chamber reaches the first preset pressure value；The encapsulation gas is passed through into the seal chamber
Body, until the atmospheric pressure value in the seal chamber reaches the second preset pressure value.
Preferably, it is coated with packaging plastic on the encapsulation cover plate, the encapsulation cover plate is fixed on the side on the substrate
Method includes: be bonded the substrate with the encapsulation cover plate using the packaging plastic, the formation receiving OLED device and described
Encapsulate the package cavity of gas；The packaging plastic is irradiated using light source, makes the encapsulation adhesive curing.
Preferably, the encapsulation gas reacts the inner surface that the solid generated is formed in the packaging plastic with water or oxygen
On.
Preferably, the encapsulation gas is the gas that can be reacted respectively with water and oxygen at normal temperature, the envelope
Dress gas includes the gas of one or more of trimethyl aluminium, three dimethylamino silane and diethyl zirconium.
The present invention also provides a kind of encapsulating structures of OLED device, including substrate, encapsulation cover plate and encapsulation gas.Institute
OLED device is stated to be set on the substrate；The encapsulation cover plate is fixed on the substrate, is formed and is accommodated the OLED device
With it is described encapsulation gas package cavity, wherein the encapsulation gas can be reacted respectively with water and oxygen with reduction or
Remove the indoor steam of the package cavity and oxygen.
Preferably, the encapsulation gas reacts the solid generated for completely cutting off steam and oxygen with water or oxygen, described solid
Body is formed in the junction of the substrate and the encapsulation cover plate.
Preferably, the encapsulation cover plate is fixed on the substrate by packaging plastic, the encapsulation gas and water or oxygen
The solid that reaction generates is formed on the inner surface of the packaging plastic.
Preferably, the encapsulation gas is the gas that can be reacted respectively with water and oxygen at normal temperature, the envelope
Dress gas includes the gas of one or more of trimethyl aluminium, three dimethylamino silane and diethyl zirconium.
The encapsulating method and structure of OLED device provided by the invention encapsulates encapsulation gas with OLED device together
In in package cavity, using the characteristic for the reaction that the encapsulation gas can be reacted and be generated with water and oxygen respectively, so that into institute
Stating the indoor oxygen of package cavity and steam will be eliminated with the encapsulation gas reaction, therefore can prevent the OLED device
Under the influence of oxygen and steam electrochemical corrosion occurs easily for part, guarantees that the performance of OLED device is stablized, extends OLED device
The service life of part and its OLED display panel of application.
Detailed description of the invention
Fig. 1 a~1c is in the packaging method for the OLED device that the embodiment of the present invention 1 provides, and each step respectively corresponds acquisition
Structure schematic diagram；
Fig. 2 is the flow chart of the packaging method of the OLED device；
Fig. 3 is the graphical representation of exemplary of the junction formation solid of substrate described in embodiment 1 and the encapsulation cover plate；
Fig. 4 is the schematic diagram that the OLED device that the embodiment of the present invention 2 provides is packaged in encapsulating structure.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, with reference to the accompanying drawing to specific reality of the invention
The mode of applying is described in detail.The example of these preferred embodiments is illustrated in the accompanying drawings.Shown in attached drawing and according to
The embodiments of the present invention of attached drawing description are only exemplary, and the present invention is not limited to these embodiments.
Here, it should also be noted that, in order to avoid having obscured the present invention because of unnecessary details, in the accompanying drawings only
Show with closely related structure and/or processing step according to the solution of the present invention, and be omitted relationship it is little other are thin
Section.
Embodiment 1
In conjunction with shown in Fig. 1 a~1c and Fig. 2, a kind of packaging method of OLED device 2, the envelope are present embodiments provided
Dress method includes:
S1, as shown in Figure 1a, the OLED device 2 that encapsulation cover plate 3 is provided and is set on substrate 1；
S2, as shown in Figure 1 b, make the substrate 1, the OLED device 2 and the encapsulation cover plate 3 be in encapsulation gas 4
In atmosphere；
S3, as illustrated in figure 1 c, the encapsulation cover plate 3 is fixed on the substrate 1, accommodates the OLED device to be formed
2 and it is described encapsulation gas 4 package cavity 10.
Wherein, the encapsulation gas 4 can be reacted with water and oxygen respectively to reduce or remove the package cavity
Steam and oxygen in 10.
In the packaging method of the OLED device 2, encapsulation gas 4 and OLED device 2 are packaged in package cavity 10 together
It is interior so that into the package cavity 10 oxygen and steam will react and be eliminated with the encapsulation gas 4, therefore it is logical
Crossing above-mentioned setting can prevent the OLED device 2 from electrochemical corrosion occurring easily under the influence of oxygen and steam, make OLED
The property retention of device 2 is stablized, its service life is extended.
Specifically, the reaction temperature that the encapsulation gas 4 is reacted with water or oxygen is room temperature.More specifically, the room temperature
Refer to 25 DEG C ± 5 DEG C.Generally, the use environment of OLED device 2 is room temperature, and therefore, the encapsulation gas 4 should at room temperature may be used
It is reacted with water or oxygen, to play corresponding effect.
Specifically, as shown in Figure 1 b, in the step S2, make the substrate 1, the OLED device 2 and the encapsulation
Cover board 3 is in the method encapsulated in 4 atmosphere of gas
The substrate 1, the OLED device 2 and the encapsulation cover plate 3 are placed in seal chamber 100；
The air in the seal chamber 100 is extracted, until the atmospheric pressure value in the seal chamber 100 reaches the first preset pressure
Value；
The encapsulation gas 4 is passed through into the seal chamber 100, until the atmospheric pressure value in the seal chamber 100 reaches
Two preset pressure values.
In the present embodiment, the first preset pressure value and the second preset pressure value be user according to the actual situation from
The preset air pressure threshold value of row, the first preset pressure value should be set as the lower atmospheric pressure value of numerical value, i.e., extract institute out as much as possible
Original air in seal chamber 100 is stated, steam and amount of oxygen therein are reduced, and is improved in the seal chamber 100 as far as possible
Encapsulate ratio shared by gas 4.
Specifically, packaging plastic 5 is coated on the encapsulation cover plate 3.As illustrated in figure 1 c, in the step S3, by the envelope
The method that capping plate 3 is fixed on the substrate 1 includes:
The substrate 1 is bonded with the encapsulation cover plate 3 using the packaging plastic 5, is formed and accommodates 2 He of OLED device
The package cavity 10 of the encapsulation gas 4；
The packaging plastic 5 is irradiated using light source, solidifies the packaging plastic 5.
Wherein, the packaging plastic 5 should be coated on the encapsulation cover plate 3 before the step S2, more specifically, to institute
After stating the mutually contraposition of encapsulation cover plate 3 and the substrate 1, pressure is applied to the encapsulation cover plate 3, using the packaging plastic 5 by institute
It states substrate 1 to be bonded with the encapsulation cover plate 3, forms the package cavity 10 for accommodating the OLED device 2 and the encapsulation gas 4；
The packaging plastic 5 finally is irradiated using light sources such as ultraviolet lamp or laser, solidifies the packaging plastic 5, the encapsulation cover plate 3 is consolidated
Due on the substrate 1, encapsulation is completed.
As shown in connection with fig. 3, further, the encapsulation gas 4 reacts generation with water or oxygen for completely cutting off steam and oxygen
The solid 41 of gas.Once entering in the package cavity 10, the encapsulation gas 4 can react with it extraneous oxygen or water,
The solid 41 that reaction generates can block the oxygen or water enters the channel of the package cavity 10, to stop extraneous oxygen
Gas or water continue to enter from the channel, further increase the tightness of package cavity 10.Illustratively, in the present embodiment,
The solid 41 is formed in the junction of the substrate 1 and the encapsulation cover plate 3.Due to being easy to produce after the solidification of above-mentioned packaging plastic 5
Raw gap, more specifically, the encapsulation gas 4 reacts the solid 41 generated with water or oxygen and is formed in the interior of the packaging plastic 5
On side surface.
The encapsulation gas 4 is the gas that can be reacted respectively with water and oxygen at normal temperature, illustratively, the encapsulation
Gas 4 includes but is not limited to trimethyl aluminium (TMA, Al (CH3)3), three dimethylamino silane (SiH [N (CH3)2]3, it is SiO2Before
Drive object) and diethyl zirconium (Zr (C2H5)2) one or more of gas.The trimethyl aluminium, three dimethylamino silicon
The gases such as alkane and diethyl zirconium can be reacted with oxygen or water, generate solid 41 to further increase the closed of package cavity 10
Degree, such as: the trimethylaluminum gas can be reacted with oxygen and water respectively generates aluminium oxide Al2O3Solid, reaction equation point
It Wei not 2Al (CH3)3+12O2=Al2O3+6CO2+9H2O, 2Al (CH3)3+3H2O=Al2O3+6CH4；The three dimethylamino silane
Gas is similar to the trimethylaluminum gas and reacts respectively with oxygen and water with reacting for oxygen and water respectively；And diethyl zirconium
Then gas can generate zirconium oxide ZrO with oxygen and reacting for water respectively2Solid, reaction equation are respectively Zr (C2H5)2+14O2
=ZrO2+8CO2+10H2O, Zr (C2H5)2+2H2O=ZrO2+4C2H6.Even if the above-mentioned reaction it can be seen from reaction equation
There are water and oxygen for intermediate product, but with the progress of subsequent reactions, and the water and oxygen in package cavity 10 can be removed.It removes
Outside the above-mentioned gas enumerated, the encapsulation gas 4 can also be the gas that other can be reacted with water and oxygen respectively at normal temperature
Body.Such as: the encapsulation gas 4 can also be other trimethide compounds (M (CH other than above-mentioned trimethyl aluminium3)3) or
Person is the diethyl metal carbonyl compound (M (C other than above-mentioned diethyl zirconium2H5)2) etc..This kind of gas usually can spontaneous combustion at normal temperature,
Promptly consume oxygen, and can occur with cold water it is violent react, can satisfy the present embodiment and the encapsulation gas 4 wanted
It asks.
Embodiment 2
As shown in fig.4, present embodiments providing a kind of encapsulating structure of OLED device, including substrate 1, encapsulation cover plate 3
And encapsulation gas 4, the OLED device 2 are set on the substrate 1；The encapsulation cover plate 3 is fixed on the substrate 1,
Form the package cavity 10 for accommodating the OLED device 2 and the encapsulation gas 4.Wherein, the encapsulation gas 4 can respectively with
Water and oxygen are reacted to reduce or remove steam and oxygen in the package cavity 10.
Below similarly, it is similar to described in embodiment 1, in the encapsulating structure of the OLED device 2, encapsulates the OLED device
Accommodated in the package cavity 10 of part 2 and stated encapsulation gas 4 so that into the package cavity 10 oxygen and steam can be with
The encapsulation gas 4 is reacted and is eliminated, to prevent the OLED device 2 from electrification occurring easily under the influence of oxidation and steam
Corrosion is learned, stablizes the property retention of the OLED device 2, extends its service life.
Specifically, the reaction temperature that the encapsulation gas 4 is reacted with water or oxygen is room temperature.
Further, the encapsulation gas 4 reacts the solid generated for completely cutting off steam and oxygen with water or oxygen, described
Solid is formed in the junction of the substrate 1 and the encapsulation cover plate 3.
Specifically, the encapsulation cover plate 3 is fixed on the substrate 1 by packaging plastic 5, the encapsulation gas 4 and water or
The solid that oxygen reaction generates is formed on the inner surface of the packaging plastic 5.
Similarly, the encapsulation gas 4 is the gas that can be reacted respectively with water and oxygen at normal temperature, for example, the envelope
Fill the gas that gas 4 includes but is not limited to one or more of trimethyl aluminium, three dimethylamino silane and diethyl zirconium
Body.
In conclusion the encapsulating method and structure of OLED device provided in an embodiment of the present invention, will encapsulation gas 4 with
OLED device 2 is packaged in together in package cavity 10, and the characteristic that can be reacted respectively with water and oxygen using the encapsulation gas 4 is made
The oxygen that enters in the package cavity 10 and steam will be reacted with the encapsulation gas 4 and is eliminated, therefore can be to prevent
Only electrochemical corrosion occurs easily under the influence of oxygen and steam for the OLED device 2, guarantees that the performance of OLED device 2 is steady
It is fixed, extend the service life of the OLED display panel of OLED device 2 and its application.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
There is also other identical elements in process, method, article or equipment including the element.
The above is only the specific embodiment of the application, it is noted that for the ordinary skill people of the art
For member, under the premise of not departing from the application principle, several improvements and modifications can also be made, these improvements and modifications are also answered
It is considered as the protection scope of the application.
Claims (10)
1. a kind of packaging method of OLED device, which is characterized in that the packaging method includes:
The OLED device (2) that encapsulation cover plate (3) are provided and are set on substrate (1)；
It is in the substrate (1), the OLED device (2) and the encapsulation cover plate (3) in encapsulation gas (4) atmosphere；
The encapsulation cover plate (3) is fixed on the substrate (1), accommodates the OLED device (2) and the encapsulation to be formed
The package cavity (10) of gas (4), the encapsulation gas (4) can be reacted with water and oxygen respectively to reduce or remove institute
State the steam and oxygen in package cavity (10).
2. packaging method according to claim 1, which is characterized in that the encapsulation gas (4) reacts life with water or oxygen
At the solid (41) for completely cutting off steam and oxygen, the solid (41) is formed in the substrate (1) and the encapsulation cover plate (3)
Junction.
3. packaging method according to claim 1, which is characterized in that make the substrate (1), the OLED device (2) with
And the method that the encapsulation cover plate (3) is in encapsulation gas (4) atmosphere includes:
The substrate (1), the OLED device (2) and the encapsulation cover plate (3) are placed in seal chamber (100)；
The air in the seal chamber (100) is extracted, until the atmospheric pressure value in the seal chamber (100) reaches the first preset pressure
Value；
It is passed through the encapsulation gas (4) into the seal chamber (100), until the atmospheric pressure value in the seal chamber (100) reaches
Second preset pressure value.
4. packaging method according to claim 1, which is characterized in that be coated with packaging plastic on the encapsulation cover plate (3)
(5), include: by the method that the encapsulation cover plate (3) is fixed on the substrate (1)
The substrate (1) is bonded with the encapsulation cover plate (3) using the packaging plastic (5), is formed and accommodates the OLED device
(2) and it is described encapsulation gas (4) package cavity (10)；
The packaging plastic (5) is irradiated using light source, solidifies the packaging plastic (5).
5. packaging method according to claim 4, which is characterized in that the encapsulation gas (4) reacts life with water or oxygen
At solid (41) be formed on the inner surface of the packaging plastic (5).
6. packaging method according to claim 1-5, which is characterized in that the encapsulation gas (4) is can be
The gas reacted respectively with water and oxygen under room temperature, the encapsulation gas include trimethyl aluminium, three dimethylamino silane with
And the gas of one or more of diethyl zirconium.
7. a kind of encapsulating structure of OLED device, which is characterized in that including substrate (1), encapsulation cover plate (3) and encapsulation gas
(4), the OLED device (2) is set on the substrate (1)；The encapsulation cover plate (3) is fixed on the substrate (1), shape
At the package cavity (10) for accommodating the OLED device (2) and encapsulation gas (4), wherein the encapsulation gas (4) can
It is reacted with water and oxygen respectively to reduce or remove steam and oxygen in the package cavity (10).
8. encapsulating structure according to claim 7, which is characterized in that the encapsulation gas (4) reacts life with water or oxygen
At the solid (41) for completely cutting off steam and oxygen, the solid (41) is formed in the substrate (1) and the encapsulation cover plate (3)
Junction.
9. encapsulating structure according to claim 8, which is characterized in that the encapsulation cover plate (3) is fixed by packaging plastic (5)
In on the substrate (1), encapsulation gas (4) reacts the solid (41) generated with water or oxygen and is formed in the packaging plastic
(5) on inner surface.
10. according to the described in any item encapsulating structures of claim 7-9, which is characterized in that the encapsulation gas (4) is can be
The gas reacted respectively with water and oxygen under room temperature, the encapsulation gas include trimethyl aluminium, three dimethylamino silane with
And the gas of one or more of diethyl zirconium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810892745.1A CN109192883A (en) | 2018-08-07 | 2018-08-07 | The encapsulating method and structure of OLED device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810892745.1A CN109192883A (en) | 2018-08-07 | 2018-08-07 | The encapsulating method and structure of OLED device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109192883A true CN109192883A (en) | 2019-01-11 |
Family
ID=64920992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810892745.1A Pending CN109192883A (en) | 2018-08-07 | 2018-08-07 | The encapsulating method and structure of OLED device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109192883A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110707234A (en) * | 2019-09-19 | 2020-01-17 | 武汉华星光电半导体显示技术有限公司 | OLED display panel and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08302340A (en) * | 1995-05-15 | 1996-11-19 | Sumitomo Chem Co Ltd | Organic electroluminescent element and its production |
| WO1999003122A1 (en) * | 1997-07-11 | 1999-01-21 | Fed Corporation | Anhydrous method of packaging organic light emitting displays |
| US5990615A (en) * | 1997-02-03 | 1999-11-23 | Nec Corporation | Organic electroluminescent display with protective layer on cathode and an inert medium |
| CN1409391A (en) * | 2001-09-21 | 2003-04-09 | 伊斯曼柯达公司 | High wet sensitive electronic device part using air ventilation hole and gap and its producing method |
| CN104969660A (en) * | 2013-02-01 | 2015-10-07 | 日东电工株式会社 | Organic electroluminescent device |
-
2018
- 2018-08-07 CN CN201810892745.1A patent/CN109192883A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08302340A (en) * | 1995-05-15 | 1996-11-19 | Sumitomo Chem Co Ltd | Organic electroluminescent element and its production |
| US5990615A (en) * | 1997-02-03 | 1999-11-23 | Nec Corporation | Organic electroluminescent display with protective layer on cathode and an inert medium |
| WO1999003122A1 (en) * | 1997-07-11 | 1999-01-21 | Fed Corporation | Anhydrous method of packaging organic light emitting displays |
| CN1409391A (en) * | 2001-09-21 | 2003-04-09 | 伊斯曼柯达公司 | High wet sensitive electronic device part using air ventilation hole and gap and its producing method |
| CN104969660A (en) * | 2013-02-01 | 2015-10-07 | 日东电工株式会社 | Organic electroluminescent device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110707234A (en) * | 2019-09-19 | 2020-01-17 | 武汉华星光电半导体显示技术有限公司 | OLED display panel and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6852250B2 (en) | Quantum dot LED package structure and method for manufacturing quantum dot LED package | |
| CN100546010C (en) | The manufacture method of OLED display | |
| US10103296B2 (en) | Method for producing optoelectronic semiconductor devices and an optoelectronic semiconductor device | |
| US10875005B2 (en) | Coated luminescent particle, a luminescent converter element, a light source, a luminaire and a method of manufacturing a coated luminescent particle | |
| CN103872264B (en) | Make the controlled the blowing pressure package system of organic electroluminescence device | |
| TWI609504B (en) | Quantum dots encapsulation structure and method for making the same | |
| CN106410062A (en) | Packaging layer and packaging device | |
| MY139178A (en) | Packaging for an interferometric modulator | |
| CN106848087B (en) | Display module encapsulating structure and preparation method thereof | |
| ATE517324T1 (en) | DEVICE FOR DETECTING AND/OR RADIATION ELECTROMAGNETIC RAYS, AND METHOD FOR PRODUCING SUCH A DEVICE | |
| WO2019085115A1 (en) | Oled packaging method and oled packaging structure | |
| US20180233701A1 (en) | Oled packaging method and oled packaging structure | |
| CN103346268A (en) | Encapsulating method for encapsulating components, array substrates, display devices and OLED components | |
| CN103500799A (en) | Packaging structure and method of OLED device | |
| TW200733313A (en) | Sealed structure and method of fabricating sealed structure and semiconductor device and method of fabricating semiconductor device | |
| CN109192883A (en) | The encapsulating method and structure of OLED device | |
| TW200802963A (en) | Light emitting system, light emitting device and fabrication method thereof | |
| JP2013513934A5 (en) | ||
| CN106784382B (en) | A kind of encapsulating structure and packaging method of display device | |
| CN209344074U (en) | A kind of quantum dot LED encapsulation module structure | |
| CN110246981A (en) | Organic illuminating electronic device encapsulation structure and its production technology | |
| CN107833963A (en) | The secondary airtight packaging method of quantum dot On chip white light LEDs | |
| TWI553919B (en) | Color conversion substrate for light-emitting diode and method of fabricating the same | |
| JP3275308B2 (en) | Semiconductor light emitting device and manufacturing method thereof | |
| CN203481281U (en) | Packaging structure of OLED device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190111 |
|
| WD01 | Invention patent application deemed withdrawn after publication |