CN203481281U - Packaging structure of OLED device - Google Patents
Packaging structure of OLED device Download PDFInfo
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- CN203481281U CN203481281U CN201320591822.2U CN201320591822U CN203481281U CN 203481281 U CN203481281 U CN 203481281U CN 201320591822 U CN201320591822 U CN 201320591822U CN 203481281 U CN203481281 U CN 203481281U
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- oled device
- glass
- depressed part
- glass cover
- plate
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Abstract
The utility model relates to the field of packaging technology, and discloses a packaging structure of an OLED device. The packaging structure of an OLED device comprises a glass substrate, a glass cover plate, an OLED device, and a sealing layer, wherein the glass substrate has a sunk part; the glass cover plate is located at the opening of the sunk part, and the periphery of the glass cover plate is bonded with the glass substrate via glass retaining walls formed in a melting mode via glass powder material, such that the glass cover plate and the glass substrate have an integrated structure; the glass cover plate and the sunk part form a sealed containing cavity; and the OLED device and the sealing layer are located in the sealed containing cavity. With the above packaging structure, full glass packaging of the OLED device can be realized, the glass material has good water vapor-blocking and oxygen-blocking performances, the water vapor and the oxygen can be prevented from entering the OLED device, and the service life of the OLED device is prolonged.
Description
Technical field
The utility model relates to encapsulation technology field, particularly a kind of encapsulating structure of OLED device.
Background technology
OLED device refer to organic semiconducting materials and luminescent material under electric field driven by the electroluminescent device of carrier injection and composite guide photoluminescence.OLED device has advantages of more, in demonstration field, has bright prospect.OLED device is very responsive to steam and oxygen, and the steam and the oxygen that penetrate into OLED device inside are to affect the OLED principal element of device lifetime.Steam and oxygen can with organic material generation chemical reaction, cause the inefficacy of OLED device.For example: OLED device belongs to the device of direct current driven type, when OLED device is in running order, if device inside has steam, at device inside, will form a miniature electrolytic cell, there is electrochemical reaction, the reaction gas producing is known from experience metallic cathode is separated with organic function layer, causes component failure.
Therefore, how to provide a kind of and can prevent that the encapsulating structure of steam and oxygen infiltration OLED device from being that those skilled in the art need one of technical problem of solution badly.
Utility model content
The utility model provides a kind of encapsulating structure of OLED device, and the encapsulating structure of this OLED device can prevent that steam and oxygen from entering OLED device, and then improves the useful life of OLED device.
For achieving the above object, the utility model provides following technical scheme:
An encapsulating structure for OLED device, comprises glass substrate, glass cover-plate, OLED device, sealant, wherein:
Described glass substrate has depressed part, described glass cover-plate is positioned at the opening part of described depressed part, and the glass barricade bonding forming by glass powder melting between the periphery of described glass cover-plate and described glass substrate, make described glass cover-plate and described glass substrate there is integral structure, described glass cover-plate and described depressed part form a closed containing cavity, and described OLED device and sealant are all positioned at described closed containing cavity.
In the encapsulating structure of above-mentioned OLED device, the periphery of glass cover-plate is by the glass barricade and the glass substrate bonding that are formed by glass powder melting, make glass cover-plate and glass cover-plate form integral structure, and making glass cover-plate coordinate a closed containing cavity of formation with depressed part, OLED device and the sealant of preparation are positioned at closed containing cavity.
Glass substrate, glass cover-plate and glass barricade have been realized the full glass packaging to OLED device, glass material has good barrier property to steam and oxygen, and then can prevent that steam and oxygen outside encapsulating structure from entering in closed containing cavity, and then prevent that steam and oxygen from entering in OLED device, extend the useful life of OLED device.
Therefore, the encapsulating structure of the OLED device that the utility model provides can prevent that steam and oxygen from entering in OLED device, extends the useful life of OLED device.
Preferably, in a kind of technical scheme, described OLED device is arranged on the bottom surface of described depressed part, and described sealant is filled other spaces in full described closed containing cavity.
Preferably, in order better the periphery of OLED device to be sealed, point to the direction of glass cover-plate along the bottom surface of depressed part, the spacing in described closed containing cavity between relative two sidewalls becomes large gradually.
Preferably, described OLED device is arranged on described glass cover-plate in the one side of described depressed part bottom surface, and described sealant is filled other spaces in full described closed containing cavity.
Preferably, in order better the periphery of OLED device to be sealed, point to the direction of glass cover-plate along the bottom surface of depressed part, the spacing in described closed containing cavity between relative two sidewalls becomes large gradually.
Preferably, the transparent sealant of described sealant for being prepared by silicone oil, resin or liquid crystal.
Preferably, described glass cover-plate deviates from the upper along concordant of the one side of described depressed part bottom surface and the depressed part of described glass substrate.
Accompanying drawing explanation
Structural representation when OLED device is arranged on the depressed part bottom surface of glass substrate in the encapsulating structure of the OLED device that Fig. 1 provides for the utility model embodiment;
The structural representation of glass substrate in the encapsulating structure of the OLED device that Fig. 2 a provides for the utility model embodiment;
Fig. 2 b for arranging the structural representation of OLED device on the bottom surface of the depressed part of the glass substrate of structure shown in Fig. 2 a;
Fig. 2 c is the structural representation while forming sealant on the glass substrate of structure shown in Fig. 2 b and OLED device;
In the encapsulating structure of the OLED device that Fig. 3 provides for the utility model embodiment, OLED device is arranged on the structural representation of glass cover-plate in the one side of the depressed part bottom surface of glass substrate;
A kind of structural representation of the depressed part that in the encapsulating structure of the OLED device that Fig. 4 provides for the utility model embodiment, glass substrate arranges;
The another kind of structural representation of the depressed part that in the encapsulating structure of the OLED device that Fig. 5 provides for the utility model embodiment, glass substrate arranges;
The schematic flow sheet of the method for packing of the encapsulating structure of the OLED device that Fig. 6 provides for the utility model embodiment.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is only the utility model part embodiment, rather than whole embodiment.Embodiment based in the utility model, those of ordinary skills are not making the every other embodiment obtaining under creative work prerequisite, all belong to the scope of the utility model protection.
Please refer to Fig. 1, Fig. 2 a and Fig. 3, wherein, structural representation when OLED device is arranged on the depressed part bottom surface of glass substrate in the encapsulating structure of the OLED device that Fig. 1 provides for the utility model embodiment; The structural representation of glass substrate in the encapsulating structure of the OLED device that Fig. 2 a provides for the utility model embodiment; In the encapsulating structure of the OLED device that Fig. 3 provides for the utility model embodiment, OLED device is arranged on the structural representation of glass cover-plate in the one side of the depressed part bottom surface of glass substrate.
As shown in figures 1 and 3, the encapsulating structure of the OLED device that the present embodiment provides comprises glass substrate 1, glass cover-plate 2, OLED device 3, sealant 4, wherein:
As shown in Figure 2 a, glass substrate 1 has depressed part 11, glass cover-plate 2 is positioned at the opening part of depressed part 11, and glass barricade 5 bondings that form by glass powder melting between the periphery of glass cover-plate 2 and glass substrate 1, make glass cover-plate 2 and glass substrate 1 there is integral structure, glass cover-plate 2 forms a closed containing cavity with the depressed part 11 of glass substrate 1, and OLED device 3 and sealant 4 are all positioned at closed containing cavity.
In the encapsulating structure of above-mentioned OLED device, the periphery of glass cover-plate 2 is by the glass barricade 5 and glass substrate 1 bonding that are formed by glass powder melting, make glass cover-plate 2 and glass cover-plate 1 form integral structure, and making glass cover-plate 2 coordinate a closed containing cavity of formation with the depressed part 11 of glass substrate 1, OLED device 3 and the sealant 4 of preparation are positioned at closed containing cavity.
Therefore, the encapsulating structure of the OLED device that the utility model provides can prevent that steam and oxygen from entering in OLED device, extends the useful life of OLED device.
In the encapsulating structure of the OLED device providing in above-mentioned execution mode, the set-up mode of OLED device 3 can have various ways:
Mode one, please continue to refer to Fig. 1, OLED device 3 can be arranged on the bottom surface of depressed part 11 of glass substrate 1, and sealant 4 is filled other spaces in full closed containing cavity.Like this, the one side that sealant 4 can deviate from depressed part 11 bottom surfaces to the side of OLED device 3 and OLED device 3 better seals.
On the basis of mode one, for the ease of preparing sealant 4, sealant 4 can better be sealed the periphery of OLED device 3, point to the direction of glass cover-plate 2 along the bottom surface of depressed part 11, the spacing in closed containing cavity between relative two sidewalls becomes large gradually.
Mode two, please continue to refer to Fig. 3, OLED device 3 can also be arranged on glass cover-plate 2 in the one side of depressed part 11 bottom surfaces, and sealant 4 is filled other spaces in full closed containing cavity.
Sealant 4 is full of other spaces in the closed containing cavity that glass cover-plate 2 and depressed part 11 assemblings form, and the one side that makes sealant 4 deviate from glass cover-plate 2 to the side of OLED device 3 and OLED device 3 better seals.
On the basis of mode two, for the ease of preparing sealant 4, along the bottom surface of depressed part, point to the direction of glass cover-plate, the spacing in closed containing cavity between relative two sidewalls becomes large gradually.
In a kind of preferred implementation, in the OLED device encapsulation structure providing in the respective embodiments described above, the transparent sealant of above-mentioned sealant 4 for being prepared by silicone oil, resin or liquid crystal.Transparent sealant can not affect the light extraction efficiency of OLED device when luminous, can improve the display quality of OLED device.The use amount of silicone oil, resin or liquid crystal can be according to calculating.
In order to improve the aesthetic property of the encapsulating structure of OLED device, glass cover-plate 2 deviates from the upper along concordant of the one side of depressed part 11 bottom surfaces and the depressed part 11 of glass substrate 1.
Please refer to Fig. 6, the encapsulating structure of the OLED device that the utility model embodiment provides can be realized by following method for packing:
Step S601: on glass substrate, form a depressed part, and prepare OLED device, to packing matcrial in depressed part to form sealant, glass cover-plate is covered to the opening part at depressed part, OLED device and sealant are covered in depressed part;
Step S602: to the gap location filling glass powder between the periphery of glass cover-plate and the sidewall of depressed part;
Step S603: adopt laser package method, control laser head with PC and make glass powder melting along glass powder scanning, glass substrate and glass cover-plate are bonded to integral structure, make glass cover-plate and depressed part form a closed containing cavity.
In the method for packing of the encapsulating structure of above-mentioned OLED device, by the laser package method in step S603, the glass powder melting of the gap location between the periphery of glass cover-plate and the sidewall of depressed part will be filled in step S602, realize the bonding between glass cover-plate periphery and glass substrate, glass substrate and glass cover-plate bonding are integral type structure the most at last, glass cover-plate is coordinated with the depressed part of glass substrate to be formed and closed containing cavity, rigging position by step S601 makes OLED device and sealant be arranged in above-mentioned closed containing cavity, and then the full glass packaging of realization to OLED device.
Particularly, in a kind of preferred implementation, in step S601: form a depressed part on glass substrate, and prepare OLED device, to packing matcrial in depressed part to form sealant, glass cover-plate covered to the opening part at depressed part, OLED device and sealant are covered in depressed part, can specifically comprise:
As shown in Figure 2 a, on glass substrate 1, form one and there is the depressed part 11 of notch cuttype structure, and along the width of depressed part 11 bottom surfaces, be less than the width of depressed part opening;
As shown in Figure 2 b, on the bottom surface of depressed part 11, prepare OLED device 3;
As shown in Figure 2 c, to the interior packing matcrial of depressed part 11, form sealant 4;
Then, glass cover-plate 2 is covered on the cascaded surface having at depressed part 11 sidewalls.
Then by step S602 and step S603, finally obtain the encapsulating structure of OLED device as shown in Figure 1, realize the full glass packaging to OLED device 3.
Certainly, in another kind of preferred implementation, in step S601: form a depressed part on glass substrate, and prepare OLED device, to packing matcrial in depressed part to form sealant, glass cover-plate covered to the opening part at depressed part, OLED device and sealant are covered in depressed part, can also specifically comprise:
On glass substrate, prepare a depressed part with notch cuttype structure, and along the width of depressed part bottom surface, be less than the width of depressed part opening, to packing matcrial in depressed part, and prepare OLED device in the one side of glass cover-plate, the bottom surface facing to the depressed part lid that glass cover-plate is provided with to OLED device is located on the cascaded surface that depressed part sidewall has, and makes encapsulant form sealant.Then by step S602 and step S603, obtain the encapsulating structure of OLED device as shown in Figure 3, also can realize the full glass packaging to OLED device 3.
Further, in above-mentioned two kinds of preferred implementations of step S601, the shape of the depressed part forming on glass substrate is not limited to the shape shown in Fig. 2 a, can also be structure shown in Fig. 4 and Fig. 5.
Obviously, those skilled in the art can carry out various changes and modification and not depart from spirit and scope of the present utility model the utility model embodiment.Like this, if within of the present utility model these are revised and modification belongs to the scope of the utility model claim and equivalent technologies thereof, the utility model is also intended to comprise these changes and modification interior.
Claims (7)
1. an encapsulating structure for OLED device, is characterized in that, comprises glass substrate, glass cover-plate, OLED device, sealant, wherein:
Described glass substrate has depressed part, described glass cover-plate is positioned at the opening part of described depressed part, and the glass barricade bonding forming by glass powder melting between the periphery of described glass cover-plate and described glass substrate, make described glass cover-plate and described glass substrate there is integral structure, described glass cover-plate and described depressed part form a closed containing cavity, and described OLED device and sealant are all positioned at described closed containing cavity.
2. encapsulating structure according to claim 1, is characterized in that, described OLED device is arranged on the bottom surface of described depressed part, and described sealant is filled other spaces in full described closed containing cavity.
3. encapsulating structure according to claim 2, is characterized in that, points to the direction of glass cover-plate along the bottom surface of depressed part, and the spacing in described closed containing cavity between relative two sidewalls becomes large gradually.
4. encapsulating structure according to claim 1, is characterized in that, described OLED device is arranged on described glass cover-plate in the one side of described depressed part bottom surface, and described sealant is filled other spaces in full described closed containing cavity.
5. encapsulating structure according to claim 4, is characterized in that, points to the direction of glass cover-plate along the bottom surface of depressed part, and the spacing in described closed containing cavity between relative two sidewalls becomes large gradually.
6. according to the encapsulating structure described in claim 1～5 any one, it is characterized in that the transparent sealant of described sealant for being prepared by silicone oil, resin or liquid crystal.
7. encapsulating structure according to claim 6, is characterized in that, described glass cover-plate deviates from the upper along concordant of the one side of described depressed part bottom surface and the depressed part of described glass substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320591822.2U CN203481281U (en) | 2013-09-24 | 2013-09-24 | Packaging structure of OLED device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320591822.2U CN203481281U (en) | 2013-09-24 | 2013-09-24 | Packaging structure of OLED device |
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| CN203481281U true CN203481281U (en) | 2014-03-12 |
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| CN201320591822.2U Withdrawn - After Issue CN203481281U (en) | 2013-09-24 | 2013-09-24 | Packaging structure of OLED device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103500799A (en) * | 2013-09-24 | 2014-01-08 | 京东方科技集团股份有限公司 | Packaging structure and method of OLED device |
| CN104505469A (en) * | 2015-01-04 | 2015-04-08 | 京东方科技集团股份有限公司 | Organic light emitting diode display substrate and encapsulation method thereof |
| CN110391346A (en) * | 2018-04-20 | 2019-10-29 | 上海和辉光电有限公司 | A kind of display panel and preparation method thereof, display device |
-
2013
- 2013-09-24 CN CN201320591822.2U patent/CN203481281U/en not_active Withdrawn - After Issue
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103500799A (en) * | 2013-09-24 | 2014-01-08 | 京东方科技集团股份有限公司 | Packaging structure and method of OLED device |
| WO2015043053A1 (en) * | 2013-09-24 | 2015-04-02 | 京东方科技集团股份有限公司 | Encapsulation structure and encapsulation method for oled device |
| CN103500799B (en) * | 2013-09-24 | 2015-10-14 | 京东方科技集团股份有限公司 | A kind of encapsulating structure of OLED and method for packing |
| US9349984B2 (en) | 2013-09-24 | 2016-05-24 | Boe Technology Group Co., Ltd | Encapsulation structure and encapsulating method of OLED device |
| CN104505469A (en) * | 2015-01-04 | 2015-04-08 | 京东方科技集团股份有限公司 | Organic light emitting diode display substrate and encapsulation method thereof |
| CN104505469B (en) * | 2015-01-04 | 2017-04-05 | 京东方科技集团股份有限公司 | A kind of organic light-emitting diode display substrate and its method for packing |
| CN110391346A (en) * | 2018-04-20 | 2019-10-29 | 上海和辉光电有限公司 | A kind of display panel and preparation method thereof, display device |
| CN110391346B (en) * | 2018-04-20 | 2021-11-30 | 上海和辉光电股份有限公司 | Display panel, preparation method thereof and display device |
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20140312 Effective date of abandoning: 20151014 |
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| AV01 | Patent right actively abandoned |
Granted publication date: 20140312 Effective date of abandoning: 20151014 |
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| C25 | Abandonment of patent right or utility model to avoid double patenting |