CN109186817B - Capacitive flexible pressure sensor and manufacturing method thereof - Google Patents
Capacitive flexible pressure sensor and manufacturing method thereof Download PDFInfo
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- CN109186817B CN109186817B CN201811066406.4A CN201811066406A CN109186817B CN 109186817 B CN109186817 B CN 109186817B CN 201811066406 A CN201811066406 A CN 201811066406A CN 109186817 B CN109186817 B CN 109186817B
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- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
- G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
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Abstract
The invention relates to a capacitance type flexible pressure sensor and a processing method thereof.A microstructure formed by arrayed radial protrusions is distributed on the corresponding surfaces of an upper substrate and a lower substrate at equal intervals, the corresponding surfaces of the upper substrate and the lower substrate are respectively provided with a conductive layer which is tightly attached to the conductive layers and has the same microstructure, and a dielectric layer with a pore structure is arranged between the upper conductive layer and the lower conductive layer. Under the action of pressure, the effective contact area between the upper and lower conducting layers and the dielectric is sharply increased, and the distance is correspondingly reduced, so that the sensitivity is high. The invention utilizes the selective laser melting technology to prepare a steel mold with a microstructured surface, pours a flexible substrate material to prepare a substrate with a microstructured surface, and then uses a graphene film as a conductive layer by a chemical vapor deposition method and an intermediate transfer technology to make the conductive layer microstructured. The invention has the outstanding advantages of controllable microstructure parameters, effective improvement of the performance of the capacitive flexible pressure sensor and convenience for large-scale production.
Description
Technical Field
The invention belongs to a flexible sensor, and particularly relates to a capacitive flexible pressure sensor and a processing method thereof.
Background
In recent years, wearable flexible pressure sensors have become an important research direction of electronic skins, and have great application prospects in artificial skins, intelligent robots and human physiological signal monitoring.
Most of the reported capacitive flexible pressure sensors are based on photolithography and evaporation processes, which are complicated, expensive in equipment and involve high temperature processes.
It has also been reported that the TPU dielectric layer of a capacitive flexible pressure sensor can be constructed by an electrospinning process to make it gas permeable.
In summary, the prior art has not been able to effectively prepare a capacitive flexible pressure sensor with a controllable microstructure on the surface of a polar plate and a controllable pore structure of a dielectric layer, and the microstructure on the surface of the polar plate and the pore structure of the dielectric layer have great significance on the performance of the sensor.
Disclosure of Invention
Aiming at the technical problems in the prior art, the invention discloses a capacitive flexible pressure sensor and a processing method thereof.
The invention relates to a capacitive flexible pressure sensor which comprises flexible upper and lower substrates and a packaging structure, wherein microstructures formed by arrayed radial protrusions are distributed on the corresponding surfaces of the upper and lower substrates at equal intervals, the sections of the radial protrusions are tooth-shaped, conductive layers which are tightly attached to the surfaces of the upper and lower substrates and have the same microstructures are arranged on the corresponding surfaces of the upper and lower substrates, a dielectric layer with a pore structure is arranged between the upper and lower conductive layers, the arrayed radial protrusions of the upper and lower conductive layers are connected with the dielectric layer, and silver electrodes and leads thereof which respectively correspond to the opposite ends of the dielectric layer are arranged at one ends of the conductive layers of the upper and lower substrates.
The height and the interval range of the radial bulges distributed on the surfaces of the upper substrate and the lower substrate are both 0.1-0.2 mm.
The pore structure of the dielectric layer is an orthogonal porous structure, the distance between the line units is 0.05-0.1mm, and the thickness of the dielectric layer is 0.1-0.15mm.
The processing method of the capacitive flexible pressure sensor comprises the following steps:
(1) Preparing a steel die with a microstructured surface by using a selective laser melting technology, wherein the microstructure is formed by arrayed radial projections with equal height and interval, the sections of the radial projections are in a tooth shape, and the height and the interval of the arrayed radial projections are both 0.1-0.2 mm;
(2) Pouring a mixed solution of polydimethylsiloxane and a curing agent on the surface of the steel mold with the microstructure prepared in the step (1), wherein the mass ratio of the polydimethylsiloxane to the curing agent is 10;
(3) Stripping the cured polydimethylsiloxane substrate from the surface of the steel mold, and copying the microstructure of the surface of the steel mold to the surface of the substrate;
(4) Depositing a graphene film on the surface of a substrate with a microstructure as a conducting layer by using a chemical vapor deposition method, wherein the conducting layer is tightly combined with the microstructure on the surface of the substrate and has the same microstructure;
(5) Taking a silver electrode, and fixing the silver electrode at one end of the conductive layer through conductive adhesive;
(6) Respectively taking substrates with silver electrodes fixed on equal number of conductive layers as an upper substrate and a lower substrate, and printing mixed slurry of polydimethylsiloxane and a curing agent on the surface of the conductive layer of the lower substrate in an orthogonal mode by using a 3D printing technology to obtain a dielectric layer with a porous structure, wherein the distance between line units of the dielectric layer is 0.05-0.1mm, the thickness of the dielectric layer is 0.1-0.15mm, and the mass ratio of the polydimethylsiloxane to the curing agent is 10;
(7) The silver electrodes of the upper and lower substrate conducting layers are respectively connected with leads;
(8) Arranging an upper substrate on the upper surface of the dielectric layer of the lower substrate, wherein the conductive layer of the upper substrate is connected with the dielectric layer, and the silver electrodes of the conductive layer of the upper substrate and the conductive layer of the lower substrate respectively correspond to the opposite ends of the dielectric layer;
(9) And packaging to obtain the capacitive flexible pressure sensor.
The steel mould is made of stainless steel.
And drying and curing the upper and lower substrates of the polydimethylsiloxane under a vacuum condition, wherein the heating temperature is 80 ℃, and the curing time is 120 minutes.
The method for forming the graphene film on the surface of the substrate to form the conducting layer by using the chemical vapor deposition method is characterized in that ethanol is used as a carbon source, hydrogen is used as an auxiliary reducing gas, and the working pressure is 10 5 Pa, deposition temperature of 1000 ℃, deposition time of 2h, using a copper or nickel metal plate as a growth substrate, and after the deposition is finished, using polymethyl methacrylate as an intermediary substance and transferring the medium to the surface of the substrate.
The invention has the advantages that: the capacitive flexible pressure sensor is provided with an upper conductive layer and a lower conductive layer of a microstructure and a dielectric layer with a pore structure, under the action of pressure, the effective contact area between the upper conductive layer and the dielectric layer is sharply increased, the distance between the upper conductive layer and the lower conductive layer is correspondingly reduced, and the change amplitude of capacitance is very obvious, so that the capacitive flexible pressure sensor has very high sensitivity, and the sensitivity can reach 0.3-0.5 Kpa-1 in a low-pressure region (< 1Kpa range) through experimental detection. The processing method of the capacitive flexible pressure sensor fully utilizes the selective laser melting technology to prepare the steel mold with the microstructured surface, the flexible substrate with the microstructured surface is prepared by pouring the flexible substrate material, and the graphene film is used as the conducting layer by the chemical vapor deposition method and the intermediate transfer technology, so that the conducting layer is microstructured. The invention has the outstanding advantages of controllable microstructure parameters, effective improvement of the performance of the capacitive flexible pressure sensor and convenience for large-scale production.
Drawings
FIG. 1 is a flow chart of the process.
FIG. 2 is a schematic view of a radially convex section of the steel mold.
FIG. 3 is a schematic view of a second embodiment of a radially protruding section of a steel mold.
FIG. 4 is a schematic view of a third embodiment of a radially protruding section of a steel die.
Fig. 5 is a schematic diagram of the pore structure of the dielectric layer.
The mark in the figure is: 1 steel mould, 2 substrates, 2a lower substrate, 2b upper substrate, 3 conductive layers, 4 silver electrodes, 5 dielectric layers and 6 leads.
Detailed Description
The invention is further illustrated by the following examples and figures.
As shown in fig. 1 (1), a selective laser melting technique is used to prepare a stainless steel mold 1 with a microstructured surface, wherein the microstructure is composed of arrayed radial protrusions with equal height and interval, the cross section of the radial protrusions is in a tooth shape, and the height and interval of the arrayed radial protrusions are both 0.1 mm-0.2 mm. The cross section of the radial protrusion may be tooth-shaped as shown in fig. 2, 3 and 4, but is not limited thereto.
Pouring the mixed solution of polydimethylsiloxane and curing agent on the surface of a steel mold with a microstructure stainless material shown in the picture 1 (1) to form a substrate 2 after curing, wherein the mass ratio of the polydimethylsiloxane to the curing agent is 10. And drying and curing the upper and lower polydimethylsiloxane substrates under vacuum conditions, wherein the heating temperature is 80 ℃ and the curing time is 120 minutes.
As shown in fig. 1 (2), the cured polydimethylsiloxane substrate 2 is peeled from the surface of the steel mold 1, so that the microstructure of the surface of the steel mold is transferred to the surface of the substrate 2.
As shown in fig. 1 (3), a graphene film is used as a conductive layer 3 on the surface of a substrate 2 having a microstructure by using a chemical vapor deposition method and an intermediate transfer technique, and the conductive layer 3 is tightly combined with the microstructure on the surface of the substrate 2 and has the same microstructure.
The chemical vapor deposition method uses ethanol as a carbon source, hydrogen as an auxiliary reducing gas and has a working pressure of 10 5 Pa, deposition temperature of 1000 ℃, deposition time of 2h, using a copper or nickel metal plate as a growth substrate, and after deposition, using polymethyl methacrylate as an intermediary substance and transferring the polymethyl methacrylate to the surface of the substrate 2 to form the conductive layer 3.
As shown in fig. 1 (4), the silver electrode 4 is fixed to one end of the conductive layer 3 by a conductive adhesive.
As shown in fig. 1, (5) and (6), the substrate 2 with silver electrodes 4 fixed on equal number of conductive layers 3 is respectively used as an upper substrate 2b and a lower substrate 2a, and the polydimethylsiloxane and curing agent mixed slurry is printed on the surface of the conductive layer 3 of the lower substrate 2a in an orthogonal manner by using a 3D printing technology, so as to obtain the dielectric layer 5 with a porous structure, wherein the mass ratio of the polydimethylsiloxane to the curing agent is 10. The thickness of the dielectric layer is 0.1-0.15mm, the pores of the dielectric layer are as shown in fig. 5, the distance d between the line units of the dielectric layer is 0.05-0.1mm,
as shown in fig. 1 (6), the silver electrodes 4 of the upper substrate 2b and the lower substrate 2a are connected to leads 6.
As shown in fig. 1 (7), an upper substrate 2b is arranged on the upper surface of the dielectric layer 5 of the lower substrate 2a, the conductive layer 3 of the upper substrate 2b is connected with the dielectric layer 5, and the silver electrodes of the upper and lower substrate conductive layers and the leads thereof respectively correspond to the opposite ends of the dielectric layer 5;
based on the figures 1 and 7, various soft packaging structures can be adopted to obtain the capacitive flexible pressure sensor. The soft package structure of the embodiment takes the following simple form: the upper substrate 2b and the conductive layer 3 thereof, and the lower substrate 2a and the overlapping portion of the conductive layer 3 and the dielectric layer 5, which are shown in fig. 1 (7), may be integrally connected by using glue, such as glass glue or silane curing glue.
Claims (6)
1. The utility model provides a flexible pressure sensor of capacitanc, includes flexible upper and lower basement and packaging structure, its characterized in that: the surface corresponding to the upper and lower substrates is distributed with microstructures formed by arrayed radial protrusions at equal intervals, the cross section of each radial protrusion is in a tooth shape, the surface corresponding to the upper and lower substrates is provided with a conductive layer which is tightly attached to the surface and has the same microstructure, a dielectric layer with a pore structure is arranged between the upper and lower conductive layers, the arrayed radial protrusions of the upper and lower conductive layers are combined with the dielectric layer, and one end of the conductive layer of the upper and lower substrates is provided with a silver electrode and a lead thereof which respectively correspond to the opposite end of the dielectric layer;
the processing method of the capacitive flexible pressure sensor comprises the following steps:
(1) Preparing a steel die with a microstructured surface by using a selective laser melting technology, wherein the microstructure is formed by arrayed radial projections with equal height and interval, the cross section of each radial projection is in a tooth shape, and the height and the interval of the arrayed radial projections are both 0.1-0.2 mm;
(2) Pouring the mixed solution of polydimethylsiloxane and curing agent on the surface of the steel mold with the microstructure prepared in the step (1), wherein the mass ratio of the polydimethylsiloxane to the curing agent is 10;
(3) Stripping the cured polydimethylsiloxane substrate from the surface of the steel mold, and copying the microstructure of the surface of the steel mold to the surface of the substrate;
(4) Depositing a graphene film on the surface of a substrate with a microstructure as a conducting layer by using a chemical vapor deposition method, wherein the conducting layer is tightly combined with the microstructure on the surface of the substrate and has the same microstructure;
(5) Taking a silver electrode, and fixing the silver electrode at one end of the conductive layer through conductive adhesive;
(6) Respectively taking substrates with silver electrodes fixed on equal number of conductive layers as an upper substrate and a lower substrate, and printing mixed slurry of polydimethylsiloxane and a curing agent on the surface of the conductive layer of the lower substrate in an orthogonal mode by using a 3D printing technology to obtain a dielectric layer with a porous structure, wherein the distance between line units of the dielectric layer is 0.05-0.1mm, the thickness of the dielectric layer is 0.1-0.15mm, and the mass ratio of the polydimethylsiloxane to the curing agent is 10;
(7) The silver electrodes of the upper and lower substrate conducting layers are respectively connected with leads;
(8) Arranging an upper substrate on the upper surface of a dielectric layer of a lower substrate, wherein a conductive layer of the upper substrate is connected with the dielectric layer, and silver electrodes of the conductive layer of the upper substrate and the conductive layer of the lower substrate respectively correspond to one opposite ends of the dielectric layer;
(9) And packaging to obtain the capacitive flexible pressure sensor.
2. The capacitive flexible pressure sensor according to claim 1, wherein: the height and the interval range of the radial bulges distributed on the surfaces of the upper substrate and the lower substrate are both 0.1 mm-0.2 mm.
3. The capacitive flexible pressure sensor according to claim 1, wherein: the pore structure of the dielectric layer is an orthogonal porous structure, the distance between the line units is 0.05-0.1mm, and the thickness of the dielectric layer is 0.1-0.15mm.
4. The capacitive flexible pressure sensor according to claim 1, wherein: the steel mould is made of stainless steel.
5. The capacitive flexible pressure sensor according to claim 1, wherein: the upper and lower substrates of the polydimethylsiloxane are dried and cured under vacuum condition, the heating temperature is 80 ℃, and the curing time is 120 minutes.
6. The capacitive flexible pressure sensor according to claim 1, wherein: the method for forming the graphene film on the surface of the substrate to form the conductive layer by using the chemical vapor deposition method is characterized in that ethanol is used as a carbon source, hydrogen is used as an auxiliary reducing gas, the working pressure is 105Pa, the deposition temperature is 1000 ℃, the deposition time is 2h, a copper or nickel metal plate is used as a growth substrate, and after the deposition is finished, polymethyl methacrylate is used as an intermediate and transferred to the surface of the substrate.
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