CN109161166A - A kind of rapid curing low shrinkage epoxy casting filler and preparation method thereof - Google Patents
A kind of rapid curing low shrinkage epoxy casting filler and preparation method thereof Download PDFInfo
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- CN109161166A CN109161166A CN201810934631.9A CN201810934631A CN109161166A CN 109161166 A CN109161166 A CN 109161166A CN 201810934631 A CN201810934631 A CN 201810934631A CN 109161166 A CN109161166 A CN 109161166A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5006—Amines aliphatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- Chemical Kinetics & Catalysis (AREA)
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- Polymers & Plastics (AREA)
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- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention provides a kind of rapid curing low shrinkage epoxy casting fillers, are formed according to the quality of 10~15:1 than hybrid reaction by component A and B component；The component A includes following substance, the mass fraction of each substance and each substance are as follows: 20~40 parts of epoxy resin, 5~15 parts of epoxide diluent, 0.5~1 part of auxiliary agent, 50~70 parts of filler, 3~5 parts of water；The B component includes following substance, the mass fraction of each substance and each substance are as follows: 80~92 parts of amine curing agent, 8~20 parts of calcium oxide.The filler solves the deficiency in background technique, is carried out from thermal desorption system using can not be affected by lower realization rapid curing, and reacting balance, summer are greatly improved using contraction in the reaction system using the collocation of reacting balance curing agent.
Description
Technical field
The present invention provides a kind of rapid curing low shrinkage epoxy casting fillers, more particularly to one kind to be used for gyratory crusher
The casting filler of liner plate belongs to high-molecular compound technical field.
Background technique
Gyratory crusher be it is a kind of suitable for metallurgy, build, build the road, chemistry and silicate industry raw material crusher
Tool.It is of different sizes according to the difference and product particle of smashing principle, and it is divided into many models.Gyratory crusher is widely used in mine
Numerous departments such as mountain, smelting, building materials, highway, railway, water conservancy and chemical industry.Cone crushing is than big, high-efficient, energy
Consume low, product granularity is uniform, be suitble in broken and fine crushing various ores, rock.Epoxy casting filler is as fixed cone of cone crusher
It is easy to be poured because its is easy to operate with mantle liner plate protection material, compression strength, impact resistance are good and are widely used.So
And when carrying out casting production, it can usually encounter following problems: 1, be solidified under the lower environment of temperature in winter, be solidified
Time is longer, causes gyratory crusher downtime long, and influences production.2, consolidated under the higher environment of summer temp
Change, since epoxy casting amount is big, reaction implode heat release it is obvious, therefore will appear internal stress cause castable easily occurs contraction ask
Topic.
Summary of the invention
The present invention provides a kind of rapid curing low shrinkage epoxy casting filler, which is solved in background technique not
Foot is carried out using can be not by external environment using the collocation of reacting balance curing agent from thermal desorption system in the reaction system
Under the influence of realize rapid curing, and reacting balance, summer is greatly improved using contraction.
Realize technical solution used by above-mentioned purpose of the present invention are as follows:
A kind of rapid curing low shrinkage epoxy casting filler is mixed by component A and B component according to the mass ratio of 10~15:1
It reacts；
The component A includes following substance, the mass fraction of each substance and each substance are as follows: 20~40 parts of epoxy resin,
5~15 parts of epoxide diluent, 0.5~1 part of auxiliary agent, 50~70 parts of filler, 3~5 parts of water；
The B component includes following substance, the mass fraction of each substance and each substance are as follows: amine curing agent 80~92
Part, 8~20 parts of calcium oxide.
Epoxy resin in the component A are as follows: E51 type epoxy resin, F51 type epoxy resin, aqueous epoxy resins CYDW-
100 composition, the mass ratio of three are 2:0.5~1.5:0.5~1.5.
Epoxide diluent in the component A are as follows: the combination of ethylene glycol diglycidylether and allyl glycidyl ether
Object, the mass ratio of the two are 1:0.5~1.5.
Auxiliary agent in the component A are as follows: the composition of defoaming agent, wetting dispersing agent and levelling agent, the mass ratio of three
For 3:1.5~2.5:4~6.
Filler in the component A are as follows: after partial size is respectively 100 mesh, 200 mesh, being surface-treated with KH570 of 600 mesh
The composition of active micro silicon powder, the mass ratio of three are 1:1.5~2.5:2.5~3.5.
Amine curing agent in the B component are as follows: N- aminoethyl piperazine, 1,3- hexamethylene dimethylamine, m-xylene diamine and
The composition of polyetheramine D-230, four mass ratio are 3.5~4.5:1:2.5~3.5:1.5~2.5.
Calcium oxide in the B component are as follows: partial size be respectively 200 mesh, 800 mesh calcium oxide composition, the matter of the two
Amount is than being 1:2~3.
In the art, because of reacting balance, heat release is small, shrinks small curing agent, when temperature is low in winter, reaction speed compared with
Slowly, curing time is longer and not applicable；For quick curing agent since curing rate is very fast, use is more universal, but its presence does not carry out
Not heat release when reaction highly exothermic can lead to implode when reacting and carrying out, easily occur the defect shunk so as to cause castable.
Therefore in the application in order to solve problem above, fatty amine and polyetheramine curing agent composition are selected, such curing agent reaction
Steadily, heat release is low, shrink it is smaller, while it is creative in the application a certain amount of water is added in component A, when component A and B
When component mixes, curing agent, calcium oxide in B component mix meeting heat release with the water in component A, and the heat of releasing can promote to solidify
Reaction carries out, to realize rapid curing, solving the problems, such as the curing agent composition, curing rate is slower at low ambient temperatures.?
The calcium oxide of B component addition reacts generation calcium hydroxide with water and solves water so that the water in entire curing system be eliminated
Mix the influence to castable curing performance.
Therefore, rapid curing low shrinkage epoxy casting filler provided by the present invention has winter rapid curing, and summer is anti-
It should be after steady, solidification the advantages that excellent in mechanical performance, lower shrinkage.
Specific embodiment
Detailed specific description done to the present invention combined with specific embodiments below, but protection scope of the present invention not office
It is limited to following embodiment.
Embodiment 1
A kind of rapid curing low shrinkage epoxy casting filler provided in the present embodiment, by component A and B component according to
The quality of 13:1 is formed than hybrid reaction；
The component A includes following substance, the mass fraction of each substance and each substance are as follows: E51 type epoxy resin (13
Part), F51 type epoxy resin (6.5 parts), aqueous epoxy resins CYDW-100 (6.5 parts), ethylene glycol diglycidylether (4.5
Part), allyl glycidyl ether (4.5 parts), defoaming agent BYK-A530 (0.3 part), wetting dispersing agent BYK-110 (0.2 part), stream
Flat agent BYK-306 (0.5 part), 100 mesh active micro silicon powders (10 parts), 200 mesh active micro silicon powders (20 parts), 600 mesh activated silicas are micro-
Powder (31 parts), water (3 parts), and prepared by following technique: 1, weigh aqueous epoxy resins CYDW-100, wetting dispersing agent BYK-
110 and water in container, room temperature 500r/min stirs 10min, 2, to be added in 1 E51 type epoxy resin, F51 type epoxy resin,
Ethylene glycol diglycidylether, allyl glycidyl ether, defoaming agent BYK-A530, levelling agent BYK-306, room temperature 500r/min
Stir 10min, 3, to 100 mesh active micro silicon powders, 200 mesh active micro silicon powders, 600 mesh active micro silicon powders are added in 2, room temperature is taken out true
Sky (- 0.95MPa) 1000r/min stirs 30min, and component A is made；
The B component includes following substance, the mass fraction of each substance and each substance are as follows: N- aminoethyl piperazine (36.8
Part), 1,3- hexamethylene dimethylamine (9.2 parts), m-xylene diamine (27.6 parts), polyetheramine D-230 (18.4 parts), calcium oxide (8 parts),
And prepared by following technique: weighing N- aminoethyl piperazine, 1,3- hexamethylene dimethylamine, m-xylene diamine, polyetheramine D-230 and oxidation
For calcium in container, room temperature 1000r/min stirs 30min, and B component is made；
By the A, B component, A:B=13:1 in mass ratio is uniformly mixed in 35 DEG C of environment, is tested for the property, as a result
As follows: viscosity 6200mPas (25 DEG C), operable time (min, 1Kg glue amount, 35 DEG C): 50min, solidfied material hardness reach
(min, 35 DEG C): 235min the time required to 80D, compression strength (MPa, after solidification 12 hours): 135MPa, solidification after-contraction seam
Gap: seamless；
By the A, B component, A:B=13:1 in mass ratio is uniformly mixed in 5 DEG C of environment, is tested for the property, as a result such as
Under: viscosity 6200mPas (25 DEG C), operable time (min, 1Kg glue amount, 5 DEG C): 53min, solidfied material hardness reach 80D institute
Take time (min, 5 DEG C): 242min, compression strength (MPa, after solidification 12 hours): 134MPa, solidification after-contraction gap: seamless
Gap.
Embodiment 2
A kind of rapid curing low shrinkage epoxy casting filler provided in the present embodiment, by component A and B component according to
The quality of 13:1 is formed than hybrid reaction；
The component A includes following substance, the mass fraction of each substance and each substance are as follows: E51 type epoxy resin (13
Part), F51 type epoxy resin (6.5 parts), aqueous epoxy resins CYDW-100 (6.5 parts), ethylene glycol diglycidylether (4.5
Part), allyl glycidyl ether (4.5 parts), defoaming agent BYK-A530 (0.3 part), wetting dispersing agent BYK-110 (0.2 part), stream
Flat agent BYK-306 (0.5 part), 100 mesh active micro silicon powders (10 parts), 200 mesh active micro silicon powders (20 parts), 600 mesh activated silicas are micro-
Powder (30 parts), water (4 parts), and by the preparation of technique recorded in embodiment 1.
The B component includes following substance, the mass fraction of each substance and each substance are as follows: N- aminoethyl piperazine (34.4
Part), 1,3- hexamethylene dimethylamine (8.6 parts), m-xylene diamine (25.8 parts), polyetheramine D-230 (17.2 parts), calcium oxide (14
Part), and by the preparation of technique recorded in embodiment 1.
By the A, B component, A:B=13:1 in mass ratio is uniformly mixed in 35 DEG C of environment, is tested for the property, as a result
As follows: viscosity 6250mPas (25 DEG C), operable time (min, 1Kg glue amount, 35 DEG C): 46min, solidfied material hardness reach
(min, 35 DEG C): 221min the time required to 80D, compression strength (MPa, after solidification 12 hours): 136MPa, solidification after-contraction seam
Gap: seamless；
By the A, B component, A:B=13:1 in mass ratio is uniformly mixed in 5 DEG C of environment, is tested for the property, as a result such as
Under: viscosity 6250mPas (25 DEG C), operable time (min, 1Kg glue amount, 5 DEG C): 49min, solidfied material hardness reach 80D institute
Take time (min, 5 DEG C): 230min, compression strength (MPa, after solidification 12 hours): 135MPa, solidification after-contraction gap: seamless
Gap.
Embodiment 3
A kind of rapid curing low shrinkage epoxy casting filler provided in the present embodiment, by component A and B component according to
The quality of 13:1 is formed than hybrid reaction；
The component A includes following substance, the mass fraction of each substance and each substance are as follows: E51 type epoxy resin (13
Part), F51 type epoxy resin (6.5 parts), aqueous epoxy resins CYDW-100 (6.5 parts), ethylene glycol diglycidylether (4.5
Part), allyl glycidyl ether (4.5 parts), defoaming agent BYK-A530 (0.3 part), wetting dispersing agent BYK-110 (0.2 part), stream
Flat agent BYK-306 (0.5 part), 100 mesh active micro silicon powders (10 parts), 200 mesh active micro silicon powders (20 parts), 600 mesh activated silicas are micro-
Powder (29 parts), water (5 parts), and by the preparation of technique recorded in embodiment 1.
The B component includes following substance, the mass fraction of each substance and each substance are as follows: N- aminoethyl piperazine (32
Part), 1,3- hexamethylene dimethylamine (8 parts), m-xylene diamine (24 parts), polyetheramine D-230 (16 parts), calcium oxide (20 parts), and press
The preparation of technique recorded in embodiment 1.
By the A, B component, A:B=13:1 in mass ratio is uniformly mixed in 35 DEG C of environment, is tested for the property, as a result
As follows: viscosity 6300mPas (25 DEG C), operable time (min, 1Kg glue amount, 35 DEG C): 44min, solidfied material hardness reach
(min, 35 DEG C): 211min the time required to 80D, compression strength (MPa, after solidification 12 hours): 136MPa, solidification after-contraction seam
Gap: seamless；
By the A, B component, A:B=13:1 in mass ratio is uniformly mixed in 5 DEG C of environment, is tested for the property, as a result such as
Under: viscosity 6300mPas (25 DEG C), operable time (min, 1Kg glue amount, 5 DEG C): 47min, solidfied material hardness reach 80D institute
Take time (min, 5 DEG C): 219min, compression strength (MPa, after solidification 12 hours): 135MPa, solidification after-contraction gap: seamless
Gap.
Embodiment 4
A kind of rapid curing low shrinkage epoxy casting filler provided in the present embodiment, by component A and B component according to
The quality of 10:1 is formed than hybrid reaction；
The component A includes following substance, the mass fraction of each substance and each substance are as follows: E51 type epoxy resin (13
Part), F51 type epoxy resin (6.5 parts), aqueous epoxy resins CYDW-100 (6.5 parts), ethylene glycol diglycidylether (4.5
Part), allyl glycidyl ether (4.5 parts), defoaming agent BYK-A530 (0.3 part), wetting dispersing agent BYK-110 (0.2 part), stream
Flat agent BYK-306 (0.5 part), 100 mesh active micro silicon powders (10 parts), 200 mesh active micro silicon powders (20 parts), 600 mesh activated silicas are micro-
Powder (31 parts), water (3 parts), and by the preparation of technique recorded in embodiment 1.
The B component includes following substance, the mass fraction of each substance and each substance are as follows: N- aminoethyl piperazine (36.8
Part), 1,3- hexamethylene dimethylamine (9.2 parts), m-xylene diamine (27.6 parts), polyetheramine D-230 (18.4 parts), calcium oxide (8 parts),
And by the preparation of technique recorded in embodiment 1.
By the A, B component, A:B=10:1 in mass ratio is uniformly mixed in 35 DEG C of environment, is tested for the property, as a result
As follows: viscosity 6050mPas (25 DEG C), operable time (min, 1Kg glue amount, 35 DEG C): 44min, solidfied material hardness reach
(min, 35 DEG C): 230min the time required to 80D, compression strength (MPa, after solidification 12 hours): 134MPa, solidification after-contraction seam
Gap: seamless；
By the A, B component, A:B=10:1 in mass ratio is uniformly mixed in 5 DEG C of environment, is tested for the property, as a result such as
Under: viscosity 6050mPas (25 DEG C), operable time (min, 1Kg glue amount, 5 DEG C): 47min, solidfied material hardness reach 80D institute
Take time (min, 5 DEG C): 237min, compression strength (MPa, after solidification 12 hours): 133MPa, solidification after-contraction gap: seamless
Gap.
Embodiment 5
A kind of rapid curing low shrinkage epoxy casting filler provided in the present embodiment, by component A and B component according to
The quality of 15:1 is formed than hybrid reaction；
The component A includes following substance, the mass fraction of each substance and each substance are as follows: E51 type epoxy resin (13
Part), F51 type epoxy resin (6.5 parts), aqueous epoxy resins CYDW-100 (6.5 parts), ethylene glycol diglycidylether (4.5
Part), allyl glycidyl ether (4.5 parts), defoaming agent BYK-A530 (0.3 part), wetting dispersing agent BYK-110 (0.2 part), stream
Flat agent BYK-306 (0.5 part), 100 mesh active micro silicon powders (10 parts), 200 mesh active micro silicon powders (20 parts), 600 mesh activated silicas are micro-
Powder (31 parts), water (3 parts), and by the preparation of technique recorded in embodiment 1.
The B component includes following substance, the mass fraction of each substance and each substance are as follows: N- aminoethyl piperazine (36.8
Part), 1,3- hexamethylene dimethylamine (9.2 parts), m-xylene diamine (27.6 parts), polyetheramine D-230 (18.4 parts), calcium oxide (8 parts),
And by the preparation of technique recorded in embodiment 1.
By the A, B component, A:B=15:1 in mass ratio is uniformly mixed in 35 DEG C of environment, is tested for the property, as a result
As follows: viscosity 6350mPas (25 DEG C), operable time (min, 1Kg glue amount, 35 DEG C): 54min, solidfied material hardness reach
(min, 35 DEG C): 239min the time required to 80D, compression strength (MPa, after solidification 12 hours): 133MPa, solidification after-contraction seam
Gap: seamless；
By the A, B component, A:B=15:1 in mass ratio is uniformly mixed in 5 DEG C of environment, is tested for the property, as a result such as
Under: viscosity 6350mPas (25 DEG C), operable time (min, 1Kg glue amount, 5 DEG C): 57min, solidfied material hardness reach 80D institute
Take time (min, 5 DEG C): 247min, compression strength (MPa, after solidification 12 hours): 132MPa, solidification after-contraction gap: seamless
Gap.
Comparative example 1
A kind of rapid curing low shrinkage epoxy casting filler provided in this comparative example, by component A and B component according to
The quality of 13:1 is formed than hybrid reaction；
The component A includes following substance, the mass fraction of each substance and each substance are as follows: E51 type epoxy resin (13
Part), F51 type epoxy resin (6.5 parts), aqueous epoxy resins CYDW-100 (6.5 parts), ethylene glycol diglycidylether (4.5
Part), allyl glycidyl ether (4.5 parts), defoaming agent BYK-A530 (0.3 part), wetting dispersing agent BYK-110 (0.2 part), stream
Flat agent BYK-306 (0.5 part), 100 mesh active micro silicon powders (10 parts), 200 mesh active micro silicon powders (20 parts), 600 mesh activated silicas are micro-
Powder (34 parts), and by the preparation of technique recorded in embodiment 1.
The B component includes following substance, the mass fraction of each substance and each substance are as follows: N- aminoethyl piperazine (40
Part), 1,3- hexamethylene dimethylamine (10 parts), m-xylene diamine (30 parts), polyetheramine D-230 (20 parts), and by recorded in embodiment 1
Technique preparation.
By the A, B component, A:B=13:1 in mass ratio is uniformly mixed in 35 DEG C of environment, is tested for the property, as a result
As follows: viscosity 6200mPas (25 DEG C), operable time (min, 1Kg glue amount, 35 DEG C): 125min, solidfied material hardness reach
(min, 35 DEG C): 510min the time required to 80D, compression strength (MPa, after solidification 12 hours): 86MPa, solidification after-contraction gap:
It has the gap；
By the A, B component, A:B=13:1 in mass ratio is uniformly mixed in 5 DEG C of environment, is tested for the property, as a result such as
Under: viscosity 6200mPas (25 DEG C), operable time (min, 1Kg glue amount, 5 DEG C): 160min, solidfied material hardness reach 80D
Required time (min, 5 DEG C): 625min, compression strength (MPa, after solidification 12 hours): 83MPa, solidification after-contraction gap: seamless
Gap.
It is after analyzing the testing result of above embodiments and comparative example it can be seen that provided by the present invention quickly solid
Change low shrinkage epoxy casting filler compared with comparative example, is carried out either under the higher or lower environment of temperature in use,
Have the advantages that operable time is suitable for, curing rate is fast, cured glue body compression strength is high, ungauged regions gap.
Claims (7)
1. a kind of rapid curing low shrinkage epoxy casting filler, it is characterised in that by component A and B component according to the matter of 10~15:1
Amount is formed than hybrid reaction；
The component A includes following substance, the mass fraction of each substance and each substance are as follows: 20~40 parts of epoxy resin, epoxy
5~15 parts of diluent, 0.5~1 part of auxiliary agent, 50~70 parts of filler, 3~5 parts of water；
The B component includes following substance, the mass fraction of each substance and each substance are as follows: 80~92 parts of amine curing agent, oxygen
Change 8~20 parts of calcium.
2. rapid curing low shrinkage epoxy casting filler according to claim 1, it is characterised in that: in the component A
Epoxy resin are as follows: E51 type epoxy resin, F51 type epoxy resin, aqueous epoxy resins CYDW-100 composition, the matter of three
Amount is than being 2:0.5~1.5:0.5~1.5.
3. rapid curing low shrinkage epoxy casting filler according to claim 1, it is characterised in that: in the component A
Epoxide diluent are as follows: the composition of ethylene glycol diglycidylether and allyl glycidyl ether, the mass ratio of the two are 1:0.5
~1.5.
4. rapid curing low shrinkage epoxy casting filler according to claim 1, it is characterised in that: in the component A
Auxiliary agent are as follows: the composition of defoaming agent, wetting dispersing agent and levelling agent, the mass ratio of three are 3:1.5~2.5:4~6.
5. rapid curing low shrinkage epoxy casting filler according to claim 1, it is characterised in that: in the component A
Filler are as follows: partial size be respectively 100 mesh, 200 mesh, 600 mesh active micro silicon powder composition, the mass ratio of three be 1:1.5~
2.5:2.5~3.5.
6. rapid curing low shrinkage epoxy casting filler according to claim 1, it is characterised in that: in the B component
Amine curing agent are as follows: N- aminoethyl piperazine, 1,3- hexamethylene dimethylamine, m-xylene diamine and polyetheramine D-230 composition, four
The mass ratio of person is 3.5~4.5:1:2.5~3.5:1.5~2.5.
7. rapid curing low shrinkage epoxy casting filler according to claim 1, it is characterised in that: in the B component
Calcium oxide are as follows: partial size be respectively 200 mesh, 800 mesh calcium oxide composition, the mass ratio of the two is 1:2~3.
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| CN201810934631.9A CN109161166B (en) | 2018-08-16 | 2018-08-16 | Fast-curing low-shrinkage epoxy pouring filler and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113416468A (en) * | 2021-07-06 | 2021-09-21 | 安徽江锐新材料有限公司 | Epoxy micaceous iron oxide intermediate paint curing agent capable of being rapidly dispersed and preparation process thereof |
| CN114773953A (en) * | 2022-05-05 | 2022-07-22 | 紫荆花涂料（上海）有限公司 | Waterborne epoxy resin floor paint and use method and application thereof |
Citations (4)
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| US20130022748A1 (en) * | 2010-04-29 | 2013-01-24 | Taesan Engineering Co., Ltd. | Environmentally friendly water-based epoxy resin composition and a use therefor |
| CN104403618A (en) * | 2014-12-18 | 2015-03-11 | 北京天山新材料技术有限公司 | High-strength, halogen-free and self-extinguishing type room temperature cured epoxy casting body and preparation method thereof |
| CN105273361A (en) * | 2015-10-30 | 2016-01-27 | 华南理工大学 | Filler reaction type epoxy composite material as well as preparation method and application thereof |
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| US20130022748A1 (en) * | 2010-04-29 | 2013-01-24 | Taesan Engineering Co., Ltd. | Environmentally friendly water-based epoxy resin composition and a use therefor |
| CN102702686A (en) * | 2012-06-19 | 2012-10-03 | 广州聚合电子材料有限公司 | Epoxy resin system capable of being applied to producing megawatt-level wind turbine blade and preparation method of epoxy resin system |
| CN104403618A (en) * | 2014-12-18 | 2015-03-11 | 北京天山新材料技术有限公司 | High-strength, halogen-free and self-extinguishing type room temperature cured epoxy casting body and preparation method thereof |
| CN105273361A (en) * | 2015-10-30 | 2016-01-27 | 华南理工大学 | Filler reaction type epoxy composite material as well as preparation method and application thereof |
Cited By (2)
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| CN113416468A (en) * | 2021-07-06 | 2021-09-21 | 安徽江锐新材料有限公司 | Epoxy micaceous iron oxide intermediate paint curing agent capable of being rapidly dispersed and preparation process thereof |
| CN114773953A (en) * | 2022-05-05 | 2022-07-22 | 紫荆花涂料（上海）有限公司 | Waterborne epoxy resin floor paint and use method and application thereof |
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