CN109159506A - 一种柔性uhf rfid抗金属标签 - Google Patents
一种柔性uhf rfid抗金属标签 Download PDFInfo
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- G06K19/07771—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object
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- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
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- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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Abstract
本发明提供了一种柔性UHF RFID抗金属标签,包括:由上至下依次贴合的标签芯片、天线层、基板层和金属底板层;基板层包括由上至下依次贴合的第一层介质层和第二层介质层,第一层介质层与所述天线层贴合,第二层介质层与金属底板层贴合。待标记的金属构件和金属底板层共同消除金属对天线等效电路的干扰;基板层采用聚合物材料作为第一层介质层,而成本较低的支撑柔性材料,如泡沫介质层作为第二层介质层,在保证基板层的柔性足够的情况下节约了成本。本柔性UHF RFID抗金属标签的结构简单、选材普遍、成本低廉,且可应用于金属平板、多种曲面零部件表面以及圆管产品,不受金属材料影响,具有较广的生产适用性。
Description
技术领域
本发明涉及射频识别传感领域,尤其涉及一种柔性UHF RFID抗金属标签。
背景技术
近些年来,射频识别技术(radio frequency identification,RFID)由于其无线、无源特性受到了制造业、物流业、监检测领域的广泛青睐,目前已实现了在生产及物流过程中的产品追踪功能。其中,RFID系统中的电子标签主要由天线层、介质基体层以及保护层构成。其中伴随着待识别物体的结构越来越复杂及小型化,对贴附于产品上的标签需求越来越大。现有技术的电子标签在使用过程中最大的问题是将天线层及芯片元件附着在刚性介质层上,导致标签不具备弯曲的功能,无法满足弯曲以及曲率较大的安装需求,例如金属管、人或动物身体等场景,制约了电子标签的发展。
同时,由于标签位于不同的材质上,其性能会发生较大波动。尤其是针对目前应用最广的金属环境,近期已经提出了很多种解决方式,如折叠偶极子、吸波材料、EBG/AMC结构等。这些抗金属方式的使用如特殊材料及天线结构等,将使的标签的成本提高,不利于电子标签的量产。
近些年来,已经出现了一些柔性抗金属标签的概念及成果,虽然这些成果对传统的标签进行了一定程度上的改进,但仍存在着结构较为复杂、材料选取特殊、成本高的缺点,并不利于抗金属标签的批量制作生产。
因此,目前缺乏一种结构简单、选材普遍、成本低廉,且可应用于金属平板、多种曲面零部件表面以及圆管产品,不受金属材料影响的柔性UHF RFID抗金属标签。
发明内容
为了解决上述问题,本发明提供了一种柔性UHF RFID抗金属标签,包括:由上至下依次贴合的标签芯片、天线层、基板层和金属底板层;基板层包括由上至下依次贴合的第一层介质层和第二层介质层,第一层介质层与天线层贴合,第二层介质层与金属底板层贴合,利用金属底板消除金属构件对标签性能的干扰,保证电子标签的优良性能。
优选地,本柔性UHF RFID抗金属标签还包括保护层,保护层包裹标签芯片,保护层涂覆在天线层上,保护层的材料为油墨。
优选地,标签芯片和天线层通过打线工艺绑定或导电胶固定。
优选地,打线工艺采用的导线包括金线或铝线,导电胶为热固性导电胶。
优选地,天线层的材料为铜或铝,利用刻蚀工艺将天线复合在第一层介质层上,天线层的厚度为10-16μm。
优选地,第一层介质层为聚合物薄膜,聚合物薄膜的材料包括聚酰亚胺或聚对苯二甲酸乙二醇酯,第二层介质层为泡沫介质层,第一层介质层和第二层介质层利用背胶粘接。
优选地,第一层介质层的厚度为50-125μm,第二层介质层的厚度为2-3mm。
优选地,金属底板层的材料为铜,金属底板层与天线层的外轮廓尺寸相同。
优选地,柔性UHF RFID抗金属标签与金属构件利用不干胶粘接。
另一方面,本发明还提供了一种柔性UHF RFID抗金属标签的设计及验证方法,包括:
S1、利用电磁仿真软件HFSS或CST优化确定柔性UHF RFID抗金属标签的材料和最优参数,并制作柔性UHF RFID抗金属标签;
S2、将Tagformance读写器与柔性UHF RFID抗金属标签连接并采集柔性UHF RFID抗金属标签的性能参数,直至柔性UHF RFID抗金属标签获取最优阅读距离并读取信息。
本发明提供了一种柔性UHF RFID抗金属标签,该柔性UHF RFID抗金属标签与金属构件利用不干胶粘接,该柔性UHF RFID抗金属标签并未采用特殊材料屏蔽金属影响,而是采用天线层-基板层-金属底板层构成的微带天线结构,而金属构件作为金属底板层的延伸,以消除金属对天线等效电路的干扰,以使得该柔性UHF RFID抗金属标签的信息能正常读写;基板层采用聚合物材料作为第一层介质层,而成本较低的支撑柔性材料,如泡沫介质层作为第二层介质层,在保证基板层的柔性足够的情况下节约了成本,大大节约了资金;本柔性UHF RFID抗金属标签的结构简单、选材普遍、成本低廉,且可应用于金属平板、多种曲面零部件表面以及圆管产品,不受金属材料影响,具有较广的生产适用性。
附图说明
图1为根据本发明一个优选实施例的柔性UHF RFID抗金属标签的结构示意图;
其中:
1.标签芯片 2.保护层 3.天线层
4.基板层 41.第一层介质层 42.第二层介质层
5.金属底板层。
具体实施方式
下面结合附图和实施例,对本发明的具体实施方式作进一步详细描述。以下实施例用于说明本发明,但不用来限制本发明的范围。
目前的抗金属标签市场中,已经出现了一些柔性抗金属标签的概念及成果,虽然这些成果对传统标签进行了一定程度上的改进,但仍存在着结构较为复杂、材料选取特殊、成本高的缺点,并不利于抗金属标签的批量制作生产。
图1为根据本发明一个优选实施例的柔性UHF RFID抗金属标签的结构示意图,如图1所示,本发明提供了一种柔性UHF RFID抗金属标签,,包括:由上至下依次贴合的标签芯片1、天线层3、基板层4和金属底板层5;基板层4包括由上至下依次贴合的第一层介质层41和第二层介质层42,第一层介质层41与天线层3贴合,第二层介质层42与金属底板层5贴合。
具体地,将标签芯片1、天线层3、基板层4和金属底板层5由上至下依次贴合,其中,基板层4由上至下分别由第一层介质层41和第二层介质层42贴合组成,第一层介质层41和第二层介质层42可根据实际需要选择合适的材料,厚度比例也可根据实际需要配合,以使得基板层4具有的柔性能保证标签的可弯曲性,同时金属底板层5能消除金属对天线等效电路的干扰,实现本柔性UHF RFID抗金属标签的正常读写。
基于上述实施例,如图1所示,本柔性UHF RFID抗金属标签还包括保护层2,保护层2包裹标签芯片1,保护层2涂覆在天线层3上,保护层2的材料为油墨。
具体地,标签芯片1和天线层3贴合,而为了防止天线的金属导体老化,在天线层3上涂覆一层保护层2,而保护层2包裹标签芯片1,对天线层3和标签芯片1一起进行保护。
基于上述实施例,标签芯片1和天线层3通过打线工艺绑定或导电胶固定。
进一步地,打线工艺采用的导线包括金线或铝线,导电胶为热固性导电胶。
基于上述实施例,天线层3的材料为铜或铝,利用刻蚀工艺将天线复合在第一层介质层41上,天线层3的厚度为10-16μm。
基于上述实施例,第一层介质层41为聚合物薄膜,聚合物薄膜的材料包括聚酰亚胺或聚对苯二甲酸乙二醇酯,第二层介质层42为泡沫介质层,第一层介质层41和第二层介质层42利用背胶粘接。
进一步地,第一层介质层41的厚度为50-125μm,第二层介质层42的厚度为2-3mm。
基于上述实施例,金属底板层5的材料为铜,金属底板层5与天线层3的外轮廓尺寸相同。
基于上述实施例,柔性UHF RFID抗金属标签与金属构件利用不干胶粘接。
基于上述实施例,另一方面,本发明还提供了一种柔性UHF RFID抗金属标签的设计及验证方法,包括:
S1、利用电磁仿真软件HFSS或CST优化确定柔性UHF RFID抗金属标签的材料和最优参数,并制作柔性UHF RFID抗金属标签;
S2、采用Tagformance测试系统进行性能测试,将柔性UHF RFID抗金属标签放置于天线层3上方的泡沫支架上,采集柔性UHF RFID抗金属标签的性能参数,直至柔性UHF RFID抗金属标签获取最优阅读距离并读取信息。
基于上述实施例,下面给出一个完整实施例,对本柔性UHF RFID抗金属标签的设计及验证方法进行说明,从而体现本柔性UHF RFID抗金属标签的可实现性。
实施例一
本发明实施例使用的柔性UHF RFID抗金属标签的轮廓尺寸为90*70*3.08mm3。标签芯片1使用的是Alien公司的H3芯片。保护层2所使用的材质为保护油墨,涂覆在天线层3上,防止天线导体氧化。天线层3所使用的天线导体为铜,将铜直接复合至第一层介质层41的聚酰亚胺薄膜上,并采用刻蚀工艺进行制作,导体厚度为15μm。标签芯片1与天线层3的天线导体采用铝线绑定在一起,并用黑胶封装。基板层4的第一层介质层41为50um的聚酰亚胺薄膜(PI),该聚酰亚胺薄膜的介电常数为3.5,损耗正切角为0.08;同时,在第一层介质层41的聚酰亚胺薄膜下设计采用了泡沫介质层的第二层介质层42,该泡沫介质层的介电常数为1.12,厚度为3mm,两介质层之间用背胶粘接。在基板层4下层泡沫背面贴合了金属底板,材料为铜,整个柔性UHF RFID抗金属标签结构无过孔或短路线,工作频段为860Mhz-900Mhz,在工作频率为885Mhz下达到最优,最优阅读距离为2m。
本发明实施例使用的柔性UHF RFID抗金属标签采用较常见的材料,成本较目前已有实例降低20%至30%。其次,标签采用了同一结构的简单复合,制作工艺较已有实例简单、快捷,所需设备更少;有利于产品的推广及批量生产。
本发明提供了一种柔性UHF RFID抗金属标签,该柔性UHF RFID抗金属标签与金属构件利用不干胶粘接,该柔性UHF RFID抗金属标签并未采用特殊材料屏蔽金属影响,而是采用天线层-基板层-金属底板层构成的微带天线结构,而金属构件作为金属底板层的延伸,以消除金属对天线等效电路的干扰,以使得该柔性UHF RFID抗金属标签的信息能正常读写;基板层采用聚合物材料作为第一层介质层,而成本较低的支撑柔性材料,如泡沫介质层作为第二层介质层,在保证基板层的柔性足够的情况下节约了成本,大大节约了资金;本柔性UHF RFID抗金属标签的结构简单、选材普遍、成本低廉,且可应用于金属平板、多种曲面零部件表面以及圆管产品,不受金属材料影响,具有较广的生产适用性。
最后,本发明的方法仅为较佳的实施方案,并非用于限定本发明的保护范围。凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。
Claims (10)
1.一种柔性UHF RFID抗金属标签,其特征在于,包括:由上至下依次贴合的标签芯片、天线层、基板层和金属底板层;所述基板层包括由上至下依次贴合的第一层介质层和第二层介质层,所述第一层介质层与所述天线层贴合,所述第二层介质层与所述金属底板层贴合。
2.根据权利要求1所述的一种柔性UHF RFID抗金属标签,其特征在于,还包括保护层,所述保护层包裹所述标签芯片,所述保护层涂覆在所述天线层上,所述保护层的材料为油墨。
3.根据权利要求1所述的一种柔性UHF RFID抗金属标签,其特征在于,所述标签芯片和所述天线层通过打线工艺绑定或导电胶固定。
4.根据权利要求3所述的一种柔性UHF RFID抗金属标签,其特征在于,所述打线工艺采用的导线包括金线或铝线,所述导电胶为热固性导电胶。
5.根据权利要求1所述的一种柔性UHF RFID抗金属标签,其特征在于,所述天线层的材料为铜或铝,利用刻蚀工艺将所述天线复合在所述第一层介质层上,所述天线层的厚度为10-16μm。
6.根据权利要求1所述的一种柔性UHF RFID抗金属标签,其特征在于,所述第一层介质层为聚合物薄膜,所述聚合物薄膜的材料包括聚酰亚胺或聚对苯二甲酸乙二醇酯,所述第二层介质层为泡沫介质层,所述第一层介质层和所述第二层介质层利用背胶粘接。
7.根据权利要求6所述的一种柔性UHF RFID抗金属标签,其特征在于,所述第一层介质层的厚度为50-125μm,所述第二层介质层的厚度为2-3mm。
8.根据权利要求1所述的一种柔性UHF RFID抗金属标签,其特征在于,所述金属底板层的材料为铜,所述金属底板层与所述天线层的外轮廓尺寸相同。
9.根据权利要求1-8任一项所述的一种柔性UHF RFID抗金属标签,其特征在于,所述柔性UHF RFID抗金属标签与金属构件利用不干胶粘接。
10.一种柔性UHF RFID抗金属标签的设计及验证方法,其特征在于,包括:
S1、利用电磁仿真软件HFSS或CST优化确定所述柔性UHF RFID抗金属标签的材料和最优参数,并制作所述柔性UHF RFID抗金属标签;
S2、将Tagformance读写器与所述柔性UHF RFID抗金属标签连接并采集所述柔性UHFRFID抗金属标签的性能参数,直至所述柔性UHF RFID抗金属标签达到最优阅读距离并读取信息。
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