CN109159377B - Die and processing method thereof - Google Patents
Die and processing method thereof Download PDFInfo
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- CN109159377B CN109159377B CN201811179422.4A CN201811179422A CN109159377B CN 109159377 B CN109159377 B CN 109159377B CN 201811179422 A CN201811179422 A CN 201811179422A CN 109159377 B CN109159377 B CN 109159377B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
Abstract
The invention discloses a die and a processing method thereof. The mold comprises an injection molding part, wherein the injection molding part is provided with a strip-shaped fluctuated surface, at least a micron-sized groove is formed in the groove, and the surface is provided with a composite structure of a micro-nano-scale protrusion and a lamellar structure; and/or a micron-sized pit array is formed on the surface of the injection molding part, and a composite structure of a micro-nano-scale protrusion and a lamellar structure is at least formed in the pit array. The mold has the characteristic of small demolding force.
Description
Technical Field
The invention relates to the technical field of material surface modification, in particular to a mold and a processing method of the mold.
Background
Thermoplastic products are mostly used as electronic consumer products, such as housings of mobile phones, notebook computers, smart watches, and the like. Due to the high precision degree and the miniaturization of the product size of electronic consumer products, the requirement on the production and manufacturing of thermoplastic products is higher. Thermoplastic products are typically injection molded.
Because the molding of the thermoplastic product requires a high-temperature environment and needs to be rapidly forced to crystallize, mold and separate, the molding of some fine features of the thermoplastic product is often incomplete, the molding is not in place or the product is deformed and fails when the separation occurs. Further, in injection molding, there are problems such as difficulty in mold release and large mold release force. These problems directly restrict the production yield of thermoplastic products and increase the production cost. At present, the technical scheme for solving the plastic molding problem mainly has two kinds:
in one scheme, the surface of the injection molding part is subjected to discharge treatment, so that a discharge frosting surface is formed in an area with special requirements on the surface, and the separation of the mold and the plastic is realized. The scheme has the characteristics of long discharge machining time, high production cost and the like.
In another aspect, the mold release force is reduced by applying a coating within the mold cavity. The scheme mainly reduces the molding and demolding force by uniformly covering the surface of the injection molding part with the inorganic coating. The scheme has high processing cost, and the coating has poor friction resistance and high temperature resistance and short service life. And the coating is easy to lose efficacy after a certain processing period, and the coating needs to be repeatedly coated, so that the production efficiency of the thermoplastic is low. And the reject ratio of the thermoplastic product is higher, and the improvement effect of the appearance state of the product is not obvious.
Therefore, a new technical solution is needed to solve the above technical problems.
Disclosure of Invention
An object of the present invention is to provide a new technical solution for a mold.
According to a first aspect of the invention, a mould is provided. The mold comprises an injection molding part, wherein,
the injection molding part is provided with a strip-shaped fluctuated surface, a micron-sized groove is formed on the surface, and a composite structure of a micro-nano-scale protrusion and a lamellar structure is at least formed in the groove; and/or
A micron-sized pit array is formed on the surface of the injection molding part, and a composite structure of a micro-nano-scale protrusion and a lamellar structure is at least formed in the pit array.
Optionally, the injection molding part has a surface with a stripe-shaped undulation, and the grooves include first direction grooves and second direction grooves, and the first direction grooves and the second direction grooves are staggered with each other.
Optionally, the surface is covered with a nanoscale coating, and the contact angle of the injection molding material with the nanoscale coating is greater than or equal to 150 °.
Optionally, the injection molding part has a strip-shaped undulating surface, the width of the grooves is 25-60 μm, and the distance between adjacent grooves is 30-60 μm.
Optionally, the depth of the grooves and/or the pits is 4-12 μm.
Optionally, the pits are circular, and the diameter of the pits is 30-60 μm.
Optionally, the injection-molded part has a strip-shaped undulating surface forming a structure having a wave-shaped cross-sectional shape.
Optionally, ribs are formed between adjacent grooves, and a composite structure of micro-nano-scale protrusions and a lamellar structure is formed on the ribs; and/or
And a bulge is formed between the adjacent pits, and a composite structure of a micro-nano-scale bulge and a lamellar structure is formed on the bulge.
According to another aspect of the present disclosure, a method of processing a mold is provided. The method comprises the steps of etching an injection molding part of the mold by adopting a laser etching method so as to form a surface with stripe-shaped fluctuation on the injection molding part, wherein a micron-sized groove is formed on the surface, and a composite structure of a micro-nano-scale protrusion and a lamellar structure is formed in the groove; and/or
And forming a micron-sized pit array on the surface of the injection molding part, and forming a composite structure of a micro-nano-scale protrusion and a lamellar structure in the pit array.
Optionally, the method further comprises: and carrying out heat treatment on the surface after the laser etching, wherein the temperature of the heat treatment is 100-200 ℃.
Optionally, nanosecond laser equipment, picosecond laser equipment or femtosecond laser equipment is adopted to perform laser etching on the injection molding part.
Optionally, the method further comprises the step of arranging a nanoscale coating on the surface, wherein the contact angle of the injection molding material and the nanoscale coating is greater than or equal to 150 degrees.
According to one embodiment of the present disclosure, the mold has a characteristic of small mold release force.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a partial top view of a mold according to one embodiment of the present disclosure.
Fig. 2 is a partial side view of a mold according to one embodiment of the present disclosure.
Figure 3 is a side view of the mould shown in figure 2 in use.
FIG. 4 is a side view of a portion of another mold according to one embodiment of the present disclosure.
Fig. 5 is a partial top view of a mold having two types of grooves according to one embodiment of the present disclosure.
FIG. 6 is a partial top view of a mold having an array of dimples according to one embodiment of the present disclosure.
Figure 7 is a side view of the mold shown in figure 6 in use.
FIG. 8 is a scanning electron micrograph of a mold according to one embodiment of the present disclosure.
Fig. 9 is a partially enlarged view of fig. 8.
Description of reference numerals:
11: a groove; 12: ribs; 13: a first direction groove; 14: a second direction groove; 17: salient points; 18: a pit; 19: injecting a plastic material; 20: a boss portion; 21: a protrusion; 22: a lamellar structure.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
According to one embodiment of the present disclosure, a mold is provided. The mold includes an injection molding portion. The injection part has a preset profile structure. For example, the injection molding part forms a mold cavity. During injection molding, the injection molding compound 19 is poured into the injection molding section. After curing, the injection molding compound 19 forms an injection molded part with a defined structure.
In this example, as shown in fig. 1, the injection molded part has a surface with a striped undulation. The surface is formed with micron-sized grooves 11. And a composite structure of a micro-nano-scale protrusion 21 and a lamellar structure 22 is formed at least in the groove 11, as shown in fig. 9. Ribs 12 are formed between adjacent grooves 11. The grooves 11 and ribs 12 may be straight, curved, dog-leg, wavy, or irregular in shape.
And/or
As shown in fig. 6 and 8, the surface of the injection-molded part is formed with an array of micro-scale recesses 18. An array of pits 18 refers to a plurality of pits 18 forming an array. As shown in fig. 9, a composite structure of micro-nano-scale protrusions 21 and a lamellar structure 22 is formed at least in the array of pits 18. The dimples 18 may be circular, oval, square, triangular, etc. FIG. 6 is a partial top view of a mold having an array of dimples 18 according to one embodiment of the present disclosure. In this example, the pits 18 are circular and the diameter of the pits 18 is 30-60 μm. The dimples 18 of this size range effectively reduce the surface to injection molding material 19 contact area and do not adversely affect the surface topography of the injection molded part.
The adjacent dimples 18 form a convex portion 20 therebetween. During injection molding, the projections 20 come into contact with the molding compound 19. For example, as shown in fig. 6, the protrusions 20 are connected in a network structure.
The micrometer scale means that the width of the groove 11 or the diameter of the pit 18 is micrometer scale. The micro-nano level means that the sizes of the bulges 21 and the sheet structure are in the micron level, the submicron level or the nano level. The protrusions 21 and the lamellar structure 22 uniformly cover the surface of the injection-molded part, for example, the grooves 11, the depressions 18, the ribs 12 and the protrusions 17. The dimensions of the protrusions 21 and the lamellar structures 22 are smaller than the dimensions of the grooves 11, the pits 18, the ribs 12 and the bumps 17.
For example, the composite structure of the above-described grooves, pit arrays, and projections and lamellar structures is formed by electrolytic etching, chemical etching, plasma etching, or the like.
In the embodiment of the present disclosure, the injection molding part has a strip-shaped undulating surface, and the surface is formed with micron-sized grooves 11; and/or the surface is formed with an array of micro-scale pits 18. The injection molding compound 19, for example, plastic, has thermoplastic properties. As shown in fig. 3 and 7, under a set injection pressure, a part of plastic enters the groove 11 and/or the pit 18, and due to the supporting effect of the composite structure of the micro-nano-scale protrusion 21 and the lamellar structure 22 in the pit 18 or the groove 11, the contact area between the plastic and the surface can be effectively reduced, so that a part of the plastic is suspended, and the demolding force of an injection molding part is reduced.
In addition, as shown in fig. 3 and 7, during the injection molding process, the array of grooves 11 and pits 18 provides a gas buffer space, so that instant gas trapping and buffer exhaust can be effectively performed, and gas is prevented from gathering at a local part of the injection molding material 19, so that the injection molding material 19 is subjected to sound deformation.
In addition, in the embodiment, the principle of bionic lotus leaf surface is utilized. The micro-nano level bulges 21 and the lamellar structure 22 are formed in the grooves 11 or the pits 18. The composite structure can effectively support the injection molding material 19, increase the contact angle between the injection molding material 19 and the surface, and ensure that the injection molding material 19 in a molten state cannot infiltrate the inner surface of the groove 11 or the pit 18, thereby effectively reducing the bonding force between the injection molding material 19 and the surface of the injection molding part. In one example, as shown in fig. 1-2, ribs 12 are formed between adjacent grooves 11. A composite structure of a micro-nano-scale protrusion 21 and a lamellar structure 22 is formed on the rib 12; and/or
As shown in fig. 6 to 7, a convex portion 20 is formed between adjacent recesses 18, and a composite structure of a micro-nano-scale protrusion 21 and a lamellar structure 22 is formed on the convex portion 20.
In this example, the composite structure of the micro-nano-scale protrusions 21 and the lamellar structure 22 is formed on the entire surface of the injection-molded part, and the mold release force can be further reduced.
In one example, as shown in fig. 5, the injection molded part has a surface with a striped undulation. The grooves 11 include a first direction groove 13 and a second direction groove 14. The first-direction grooves 13 and the second-direction grooves 14 are staggered with each other. The grooves 13 and 14 in different directions are mutually staggered, so that the contact area between the injection molding material 19 and the surface of the injection molding part can be effectively reduced, the grooves 13 and 14 form a network structure, the air can be effectively exhausted, and the injection molding material 19 is prevented from deforming.
For example, the depth of the intersecting part of the first direction groove 13 and the second direction groove 14 is larger, so that the effects of instant air trapping and buffering and exhausting can be performed, the deformation of the injection molding material 19 is avoided, and the structure of the injection molding material 19 is fuller.
The bumps 17 are formed in the regions other than the first-direction grooves 13 and the second-direction grooves 14. During injection molding, the projections 17 are in contact with the molding compound 19.
The angle between the first-direction groove 13 and the second-direction groove 14 may be any angle. For example, the included angle is 90 °. The surface of the injection molding part formed by the angle is more regular.
FIG. 4 is a side view of a portion of another mold according to one embodiment of the present disclosure. In this example, the grooves 11 and ribs 12 are smoothly connected, and the surface of the injection-molded part is formed in a structure having a wave-like cross-sectional shape. The peak parts of the wave-shaped structure are ribs 12, and the valley parts are grooves 11. In this example, the injection-molded plastic 19 is in contact with the peaks of the undulating structure. The rest of the injection molding compound 19 is suspended. Compared with the planar ribs 12, the wavy structure enables the contact area of the ribs 12 with the injection molding material 19 to be smaller, so that the demolding force of the molded injection molding material 19 is smaller.
In one example, the surface is covered with a nanoscale coating. The contact angle of the injection molding material 19 and the nano-scale coating is greater than or equal to 150 degrees. The thickness of the nanoscale coating is nanoscale. For example, the coating material may be, but is not limited to, stearic acid, lauric acid, and the like. The nanoscale coating can effectively reduce the surface energy of the mold, improve the hydrophobic property of the mold and prevent the injection molding material 19 from infiltrating the surface of the injection molding part.
Nanoscale coatings with hydrophobic properties are common knowledge in the art and can be selected by the person skilled in the art according to the actual requirements without being limited to the examples described above.
The larger the width of the groove 11, the lower the mold release force of the injection-molded part, but the surface topography of the injection-molded part is affected. In one example, the width of the grooves 11 is 25-60 μm, and the spacing between adjacent grooves 11 is 30-60 μm. This size range allows for lower mold release forces of the injection molded part and maintains good surface topography of the injection molded part.
In one example, the depth of the grooves 11 and/or pits 18 is 4-12 μm. The depth range enables instant air trapping and better air buffering and exhausting effects of the grooves 11 and/or the pits 18, and the injection molding material 19 does not contact with the bottoms of the grooves 11 or the pits 18.
According to another embodiment of the present disclosure, a method of processing a mold is provided. The processing method comprises the steps of etching an injection molding part of a mold by adopting a laser etching method so as to form a surface with stripe-shaped fluctuation on the injection molding part, wherein a micron-sized groove 11 is formed on the surface, and a composite structure of a micro-nano-scale protrusion 21 and a lamellar structure 22 is formed in the groove 11; and/or
A micron-scale pit 18 array is formed on the surface of the injection molding part, and a composite structure of a micro-nano-scale protrusion 21 and a lamellar structure 22 is formed in the pit 18 array.
In this example, the material used to form the mold may be, but is not limited to, a metal material such as copper or aluminum, or an inorganic non-metal material. A laser is used to scan the injection section of the mold to form an array of micron-sized grooves 11 and/or pits 18. For example, the groove 11 can be formed using line scan scanning. An array of pits 18 can be formed using a dotting scan. The pulsed laser can form a composite structure of the micro-nano-scale protrusions 21 and the lamellar structure 22 on the surface at the same time.
The laser etching has the characteristics of high processing speed, high processing precision and high yield.
In one example, the injection molding part is laser etched using a nanosecond laser device, a picosecond laser device, or a femtosecond laser device. The equipment can form a micron-scale groove 11 and/or pit 18 array, and a composite structure of a micro-nano-scale protrusion 21 and a lamellar structure 22 is formed on the surface in the groove 11 and/or pit 18 array.
The picosecond laser equipment and the femtosecond laser equipment have shorter pulse width and higher pulse energy, so that the damage to a mold base body is small in the laser etching process, the formed groove 11 and/or pit 18 array structure is more regular, the formed composite structure is more uniform and fine, the hydrophobic property is more excellent, and the contact angle of the surface is larger.
In one example, the processing method further comprises: and carrying out heat treatment on the surface after the laser etching, wherein the heat treatment temperature is 100-200 ℃. The heat treatment can enable the composite structure of the protrusions 21 and the lamellar structure 22 to have higher orientation, so that the performance of the composite structure for supporting the injection molding material 19 is better, the hydrophobic performance of the surface of the injection molding part is effectively improved, and the contact angle of the injection molding material 19 is increased.
In one example, the method of processing further includes disposing a nanoscale coating on the surface. The contact angle of the injection molding material 19 and the nano-scale coating is greater than or equal to 150 degrees. For example, a nanoscale coating may be formed directly on the laser etched surface or on the heat treated surface. The nanoscale coating is as described previously.
The following are specific examples of the mold processing method of the present disclosure.
Example 1:
in this embodiment, the mold is made of copper. And performing criss-cross linear scanning processing on the surface of the injection molding part by adopting infrared picosecond laser equipment to form a first direction groove 13 and a second direction groove 14. And coating a nanoscale coating on the surface after laser etching.
Wherein the line scan process scans three times. The distance between the adjacent first direction grooves 13 and the second direction grooves 14 is 30-60 μm, the depth of the two grooves 13,14 is 3-6 μm, and the depth of the staggered part of the two grooves 13,14 is 4-8 μm. After the laser etching is finished, the surface of the injection molding part is coated with a nano-scale coating containing a lauric acid component, and the injection molding part is placed into an oven. Drying at 60 deg.C.
In this example, lauric acid is dissolved in an organic solvent such as absolute ethanol to facilitate coating.
And after the mold is processed, injecting the silica gel to the injection molding part. And after molding, testing the demolding force of the injection molding piece.
Example 2:
in this embodiment, the mold is made of copper. And performing criss-cross linear scanning processing on the surface of the injection molding part by adopting infrared picosecond laser equipment to form a first direction groove 13 and a second direction groove 14.
Wherein the line scan process scans three times. The distance between the adjacent first direction grooves 13 and the second direction grooves 14 is 30-60 μm, the depth of the two grooves 13,14 is 3-6 μm, and the depth of the staggered part of the two grooves 13,14 is 4-8 μm. After the laser etching is completed, the mold is placed in an oven. Heat treatment is carried out at the temperature of 100-200 ℃ for 2-48 hours. And cooling after the treatment is finished, and taking out the die.
And after the mold is processed, injecting the silica gel to the injection molding part. And after molding, testing the demolding force of the injection molding piece.
Example 3:
in this embodiment, the mold is made of aluminum. The surface of the injection-molded part is spot scanned using an infrared picosecond laser device to form an array of recesses 18.
Wherein dotting is scanned three times. The distance between the pits 18 of two adjacent rows is 30-60 μm, and the depth of the pits 18 is 8-11 μm. After the laser etching was completed, the mold was put into an oven to be heat-treated at 100 ℃ for 48 hours. Then, the mold is taken out.
And after the mold is processed, injecting the silica gel to the injection molding part. And after molding, testing the demolding force of the injection molding piece.
Example 4
In this embodiment, the mold is made of aluminum. The surface of the injection-molded part is spot scanned using an infrared picosecond laser device to form an array of recesses 18.
Wherein dotting is scanned three times. The distance between the pits 18 of two adjacent rows is 30-60 μm, and the depth of the pits 18 is 8-11 μm. After the laser etching was completed, a nano-scale coating of stearic acid component was applied to the surface of the mold, the thickness of the coating being 1 μm. Then, the mold was placed in an oven to be dried at 60 ℃ for 1 hour. Then, the mold is taken out.
In this example, stearic acid is dissolved in an organic solvent such as absolute ethanol to facilitate coating. For example, the stearic acid is at a mass concentration of 1%.
And after the mold is processed, injecting the silica gel to the injection molding part. And after molding, testing the demolding force of the injection molding piece.
Example 5
In this embodiment, the mold is made of aluminum. The surface of the injection-molded part is spot scanned using an infrared picosecond laser device to form an array of recesses 18.
Wherein dotting is scanned three times. The distance between the pits 18 of two adjacent rows is 30-60 μm, and the depth of the pits 18 is 8-11 μm. After the laser etching was completed, the mold was put into an oven to be heat-treated at 100 ℃ for 48 hours. After cooling, the mold was removed. Next, a nano-scale coating layer of stearic acid component was applied to the surface of the injection molded part to a thickness of 1 μm. Then, the mold was placed in an oven to dry at 60 ℃ for 1 hour. After cooling, the mold was removed.
In this example, stearic acid is dissolved in an organic solvent such as absolute ethanol to facilitate coating. For example, the stearic acid is at a mass concentration of 1%. And after the mold is processed, injecting the silica gel to the injection molding part. And after molding, testing the demolding force of the injection molding piece.
Example 6
In this embodiment, the mold is made of aluminum. The surface of the injection-molded part is spot scanned using an infrared picosecond laser device to form an array of recesses 18.
Wherein dotting is scanned three times. The distance between the pits 18 of two adjacent rows is 30-60 μm, and the depth of the pits 18 is 8-11 μm. After the laser etching was completed, the mold was put into an oven to be heat-treated at 100 ℃ for 48 hours. After cooling, the mold was removed. Next, a nano-scale coating of lauric acid component was applied to the surface of the injection-molded part to a thickness of 1 μm. Then, the mold was placed in an oven to dry at 60 ℃ for 1 hour. After cooling, the mold was removed.
In this example, lauric acid is dissolved in an organic solvent such as absolute ethanol to facilitate coating.
And after the mold is processed, injecting the silica gel to the injection molding part. And after molding, testing the demolding force of the injection molding piece.
Example 7
In this embodiment, the mold is made of aluminum. The surface of the injection-molded part is spot scanned using an infrared picosecond laser device to form an array of recesses 18.
Wherein dotting is scanned three times. The distance between the pits 18 of two adjacent rows is 30-60 μm, and the depth of the pits 18 is 8-11 μm. After the laser etching was completed, the mold was placed in an oven and heat-treated at 200 ℃ for 2 hours. Then, the mold is taken out.
And after the mold is processed, injecting the silica gel to the injection molding part. And after molding, testing the demolding force of the injection molding piece.
For comparison, a copper mold and an aluminum mold of the same size were manufactured, and the injection molding material 19 was injected into the injection parts of both molds without being processed by the above-described processing method. And after molding, testing the demolding force of the injection molding piece.
Tests show that the mold prepared by the processing method of the embodiment 1-7 has the demolding force of 4-5N, the structure of the injection molding part is complete, and the yield reaches more than 96%. The mold manufactured by the processing method is firm and durable.
And by adopting the mould which is not processed and formed by the processing method, the demoulding force of the injection moulding piece is 8-10 newtons, part of the injection moulding piece is deformed, and the yield is only 90%.
Therefore, the mold manufactured by the processing method disclosed by the invention has the advantages that the bonding force between the injection molding part and the mold is obviously reduced, the yield is high, and the durability is good.
Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (11)
1. A mold comprising an injection molding part, wherein,
the injection molding part is provided with a strip-shaped fluctuated surface, a micron-sized groove is formed on the surface, and a composite structure of a micro-nano-scale protrusion and a lamellar structure is at least formed in the groove; and/or
A micron-sized pit array is formed on the surface of the injection molding part, and a composite structure of a micro-nano-scale protrusion and a lamellar structure is at least formed in the pit array;
the injection molding material is supported by the composite structure of the micro-nano-scale protrusions and the lamellar structure, so that one part of the injection molding material is suspended;
the injection molding part is provided with a strip-shaped fluctuated surface, the grooves comprise first direction grooves and second direction grooves, and the first direction grooves and the second direction grooves are mutually staggered;
and ribs are formed between the adjacent grooves, and a composite structure of micro-nano-scale protrusions and a lamellar structure is formed on each rib.
2. The mold of claim 1, wherein the surface is covered with a nano-scale coating, and a contact angle of the injection molding compound with the nano-scale coating is greater than or equal to 150 °.
3. The mold according to claim 1, wherein the injection-molded part has a surface with a striped undulation, the grooves have a width of 25 to 60 μm, and a pitch between adjacent grooves is 30 to 60 μm.
4. The mold of claim 1, wherein the depth of the grooves and/or the pits is 4-12 μ ι η.
5. The mold of claim 1, wherein the dimples are circular and have a diameter of 30-60 μm.
6. The mold according to claim 1, wherein the injection molding portion has a surface undulated in a stripe shape, the surface forming a structure having a wave-like cross-sectional shape.
7. The mold according to claim 1, wherein a convex portion is formed between adjacent recesses, and a composite structure of a micro-nano-scale protrusion and a lamellar structure is formed on the convex portion.
8. A processing method of a mold comprises the steps of etching an injection molding part of the mold by adopting a laser etching method so as to form a surface with stripe-shaped fluctuation on the injection molding part, wherein a micron-sized groove is formed on the surface, and a composite structure of a micro-nano-scale protrusion and a lamellar structure is formed in the groove; and/or
Forming a micron-sized pit array on the surface of the injection molding part, and forming a composite structure of a micro-nano-scale protrusion and a lamellar structure in the pit array;
the injection molding material is supported by the composite structure of the micro-nano-scale protrusions and the lamellar structure, so that one part of the injection molding material is suspended;
the injection molding part is provided with a strip-shaped fluctuated surface, the grooves comprise first direction grooves and second direction grooves, and the first direction grooves and the second direction grooves are mutually staggered;
and ribs are formed between the adjacent grooves, and a composite structure of micro-nano-scale protrusions and a lamellar structure is formed on each rib.
9. The process of claim 8, further comprising: and carrying out heat treatment on the surface after the laser etching, wherein the temperature of the heat treatment is 100-200 ℃.
10. The processing method according to claim 8, wherein the injection molded part is laser-etched using a nanosecond laser device, a picosecond laser device, or a femtosecond laser device.
11. The process of claim 9 or 10, further comprising providing a nanoscale coating on said surface, the contact angle of the injected plastic with said nanoscale coating being greater than or equal to 150 °.
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| CN112140452B (en) * | 2020-08-11 | 2022-02-15 | 华南理工大学 | Manufacturing method and application of anti-icing surface with recessed micro-nano two-stage structure |
| CN112480459B (en) * | 2020-11-25 | 2023-02-28 | 浙江工业大学 | Groove-shaped super-hydrophobic truncated cone array surface for realizing liquid drop resilience |
| CN113651289A (en) * | 2021-07-07 | 2021-11-16 | 北京大学 | Manufacturing method of sucker structure forming die and manufacturing method of sucker structure |
| CN114589883B (en) * | 2022-03-30 | 2022-10-28 | 深圳技术大学 | Injection mold and preparation method thereof |
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| CN105789061A (en) * | 2014-12-11 | 2016-07-20 | 财团法人工业技术研究院 | Mold with surface structure and manufacturing method thereof |
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| CN105789061A (en) * | 2014-12-11 | 2016-07-20 | 财团法人工业技术研究院 | Mold with surface structure and manufacturing method thereof |
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