CN109153658A - Oxime ester derivative compound, Photoepolymerizationinitiater initiater and photosensitive composite comprising it - Google Patents
Oxime ester derivative compound, Photoepolymerizationinitiater initiater and photosensitive composite comprising it Download PDFInfo
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- CN109153658A CN109153658A CN201780030503.5A CN201780030503A CN109153658A CN 109153658 A CN109153658 A CN 109153658A CN 201780030503 A CN201780030503 A CN 201780030503A CN 109153658 A CN109153658 A CN 109153658A
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D279/00—Heterocyclic compounds containing six-membered rings having one nitrogen atom and one sulfur atom as the only ring hetero atoms
- C07D279/10—1,4-Thiazines; Hydrogenated 1,4-thiazines
- C07D279/14—1,4-Thiazines; Hydrogenated 1,4-thiazines condensed with carbocyclic rings or ring systems
- C07D279/18—[b, e]-condensed with two six-membered rings
- C07D279/22—[b, e]-condensed with two six-membered rings with carbon atoms directly attached to the ring nitrogen atom
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
Abstract
The invention discloses a kind of oxime ester derivative compound and a kind of Photoepolymerizationinitiater initiaters and photosensitive composite comprising the oxime ester derivative compound.
Description
Technical field
The present invention relates to oxime ester derivative compound and include its Photoepolymerizationinitiater initiater and photosensitive composite.More
Body, the present invention relates to a kind of oxime esters with excellent susceptibility, heat resistance, light resistance, chemical resistance and curing performance to spread out
Raw compounds, and Photoepolymerizationinitiater initiater and photosensitive composite comprising it.
Background technique
Representative instance as Photoepolymerizationinitiater initiater used in photosensitive composite, it is known that there are many type,
For example, acetophenone derivs, diphenylmethyl ketone derivatives, pyrrolotriazine derivatives, united imidazole derivative, acylphosphine oxide derivative
With oxime ester derivative compound, wherein the advantages of oxime ester derivative compound is that they absorb ultraviolet lights but almost colourless and have height
Free radical luminous efficiency, with the good compatibility and outstanding stability of photosensitive composite material.However, early stage opens
The oxime ester derivative compound of hair has low light-initiated efficiency, especially because low sensitivity during pattern exposure and need
Increase exposure dose, yield is caused to reduce.
Therefore, exploitation have high lightsensitivity Photoepolymerizationinitiater initiater will lead to can be achieved on a small quantity enough susceptibilitys,
The effect for saving cost is generated, and since high sensitive reduces exposure dose, increase yield.
However, when forming pattern using conventional Photoepolymerizationinitiater initiater, due in the exposure process that pattern is formed
Low sensitivity needs to increase the amount of Photoepolymerizationinitiater initiater or increases exposure dose, and its generated disadvantage is exposed
By-product caused by after mask is contaminated in journey, and Photoepolymerizationinitiater initiater decomposes during crosslinking at high temperature reduces production
Rate, and increase since the exposure-processed time increases with exposure dose, there are problems that yield reduction, therefore, is endeavouring
In solving the problems, such as this.
Pertinent literature
Patent document
(patent document 1) WO02/100903 (on December 19th, 2002)
(patent document 2) Japanese patent application publication No.: 2005-025169 (on January 27th, 2005)
(patent document 3) WO07/071497 (on June 28th, 2007)
(patent document 4) Korean Patent Publication No. 2013-0124215 (on November 13rd, 2013)
(patent document 5) Korean Patent Publication No.: 2013-0115272 (on October 21st, 2013).
Summary of the invention
Technical problem
The present invention relates to provide a kind of oxime ester with excellent susceptibility, heat resistance, chemical resistance and curing performance to spread out
Raw compounds, and Photoepolymerizationinitiater initiater and photosensitive composite comprising it.
The present invention further provides a kind of mechanographs of cured product comprising the photosensitive composite.
The display equipment comprising the mechanograph that the present invention further provides a kind of.
Technical solution
In order to achieve the above objectives, according to an aspect of the present invention, the oxime ester derivative compounds of following implementation are provided
Object.
First embodiment is related to oxime ester derivative compound shown in formula 1:
<formula 1>
Wherein, R1And R2Respectively stand alone as hydrogen, (C1-C20) alkyl, (C6-C20) aryl, (C1-C20) alkoxy, (C6-
C20) aryl (C1-C20) alkyl, hydroxyl (C1-C20) alkyl, hydroxyl (C1-C20) alkoxy (C1-C20) alkyl or (C3-
C20) naphthenic base;And
R3For (C1-C20) alkyl, (C6-C20) aryl, (C6-C20) aryl (C1-C20) alkyl or (C3-C20) cycloalkanes
Base.
Second embodiment is related to the oxime ester derivative compound in first embodiment, wherein R1And R2Respectively stand alone as
Hydrogen, methyl, ethyl, n-propyl, isopropyl, normal-butyl, isobutyl group, tert-butyl, n-pentyl, isopentyl, n-hexyl, isohesyl,
N-octyl, positive decyl, isodecyl, dodecyl, cyclopenta, cyclohexyl, phenyl, benzyl, naphthalene, xenyl, terphenyl,
Anthryl, indenyl, phenanthryl, methoxyl group, ethyoxyl, positive propoxy, isopropoxy, n-butoxy, isobutoxy, tert-butoxy, hydroxyl
Ylmethyl, hydroxyethyl, hydroxy-n-propyl, hydroxy-n-butyl, hydroxyisobutyl, hydroxyl n-pentyl, hydroxyl isopentyl, hydroxyl are just
Hexyl, hydroxyl isohesyl, hydroxymethoxy methyl, hydroxymethoxy ethyl, hydroxymethoxy propyl, hydroxymethoxy butyl,
Hydroxyethoxymethyl, hydroxyl ethoxy ethyl, hydroxyethoxypropyl, hydroxyl-oxethyl butyl, hydroxyethoxypentyl or
Hydroxyl-oxethyl hexyl;And R3For methyl, ethyl, n-propyl, isopropyl, normal-butyl, isobutyl group, tert-butyl, n-pentyl, different
Amyl, n-hexyl, isohesyl, cyclopenta, cyclohexyl or phenyl.
Third embodiment is related to the oxime ester derivative compound in first or second embodiment, wherein the oxime ester is derivative
Compound is selected from the compound of the following Expression 2-1 to 2-19:
<formula 2-1 to 2-19>
According to the one side of the disclosure, the Photoepolymerizationinitiater initiater of following implementation is provided.
4th embodiment is related to a kind of Photoepolymerizationinitiater initiater, includes first to one of third embodiment embodiment party
The oxime ester derivative compound of formula.
According to an aspect of the present invention, the photosensitive composite of following implementation is provided.
5th embodiment is related to a kind of photosensitive composite, includes:
(a) alkali soluble resins;
(b) with the polymerizable compound of ethylenic unsaturated bond;And
(c) Photoepolymerizationinitiater initiater includes first to one of third embodiment embodiment oxime ester derivative compounds
Object.
Sixth embodiment is related to the photosensitive composite in the 5th embodiment, wherein is based on the photosensitive composition
The total amount of object is 100wt%, and the amount of the oxime ester derivative compound is 0.01~10wt%.
7th embodiment is related to the photosensitive composite in the 5th or sixth embodiment, wherein the photopolymerization is drawn
Hair agent is further included selected from by thioxanthones based compound, acetophenone based compound, bisglyoxaline based compound, triazine system chemical combination
At least one in group composed by object, O- acyl group oxime ester (O-acyl oxime ester) based compound and mercaptan based compound
Kind.
8th embodiment is related to the photosensitive composite of one of the 5th to the 7th embodiment embodiment,
In, the photosensitive composite further includes colorant.
According to an aspect of the present invention, the mechanograph of following implementation is provided and the display comprising the mechanograph is set
It is standby.
9th embodiment is related to a kind of mechanograph, the sense comprising one of the 5th to the 8th embodiment embodiment
The cured product of photosensitiveness composition.
Tenth embodiment is related to the mechanograph in the 9th embodiment, wherein the mechanograph is array planarization film
(array planarization film), insulating film, chromatic filter, column spacer, black column spacer or black
Matrix.
11st embodiment be related to include membrane product in the 9th or the tenth embodiment display equipment.
Beneficial effect
The advantages of oxime ester derivative compound of embodiment according to the present invention is, when the oxime ester derivative compound by with
With excellent susceptibility when making the Photoepolymerizationinitiater initiater of photosensitive composite, and there is following performance outstanding, for example, residual
Film thickness, pattern stability, heat resistance, chemical resistance and the ductility stayed;And in Thin Film Transistor-LCD (TFT-
LCD) with during rear baking (post-baking) process, the oxime ester derivative compound makes to be caused by photopolymerization the exposure in manufacture
The capacity that agent generates minimizes, to reduce pollution and minimize the defect generated from this.
Specific embodiment
Here, the present invention will be further described.Before describing, it should be understood that in this specification and appended right
Term and text used in claim should not be construed as limited to general and dictionary meaning, but based on it is of the invention
The corresponding meaning and concept of technical aspect, and term is defined suitably to obtain the original of best interpretations based on permission inventor
Then explain these terms and text.
Therefore, embodiment as described herein and example shown in the drawings are only most preferred embodiment, are not represented
All technical aspects of the disclosure, it is, therefore, appreciated that can be come when submitting application with various other equivalent and modification
Replace these embodiments and examples.
Oxime ester derivative compound according to the one side of the disclosure is indicated by the following Expression 1:
<formula 1>
In formula 1, R1And R2Respectively stand alone as hydrogen, (C1-C20) alkyl, (C6-C20) aryl, (C1-C20) alkoxy,
(C6-C20) aryl (C1-C20) alkyl, hydroxyl (C1-C20) alkyl, hydroxyl (C1-C20) alkoxy (C1-C20) alkyl or
(C3-C20) naphthenic base;And
R3For (C1-C20) alkyl, (C6-C20) aryl, (C6-C20) aryl (C1-C20) alkyl or (C3-C20) cycloalkanes
Base.
" alkyl " used herein, " alkoxy " and other substituent groups comprising " alkyl " part include straight chain or branch
Chain type, and " naphthenic base " includes monocyclic hydrocarbon and polycyclic hydrocarbon.
In addition, term " aryl " used herein refers to the freedom induced by aromatic hydrocarbon by removing a hydrogen
Base, and comprising monocycle or fused ring system, or even comprising passing through singly linked multiple aryl.
In addition, term " hydroxy alkyl " used herein refers to the OH- alkane of hydroxyl and alkyl defined above bond
Base, term as used herein " hydroxy alkoxy alkyl " refer to the hydroxy alkyl-O- alkyl of alkoxy and hydroxy alkyl bond,
And alkenyl refers to the structure containing ketone of the alkyl or aryl comprising being bonded with it.
In addition, term as used herein " (C1-C20) alkyl " refers to the alkyl with 1 to 20 carbon atom, and described
Alkyl can be preferably (C1-C12) alkyl.
" (C6-C20) aryl " refers to the aryl with 6 to 20 carbon atoms, and the aryl can preferably (C6-C18)
Aryl." (C1-C20) alkoxy " refers to the alkoxy with 1 to 20 carbon atom, and the alkoxy can preferably (C1-
C10) alkoxy, and more preferably (C1-C4) alkoxy.
" (C6-C20) aryl (C1-C20) alkyl " refers to the tool that a hydrogen is replaced by the aryl with 6 to 20 carbon atoms
There is the alkyl of 1 to 20 carbon atom, and can be preferably (C6-C18) aryl (C1-C10) alkyl, and more preferably (C6-C18)
Aryl (C1-C6) alkyl.
" hydroxyl (C1-C20) alkyl " refers to the alkyl with 1 to 20 carbon atom that a hydrogen is optionally substituted by a hydroxyl group, and can
To be preferably hydroxyl (C1-C10) alkyl, and more preferably hydroxyl (C1-C6) alkyl.
" hydroxyl (C1-C20) alkoxy (C1-C20) alkyl " refers to a hydrogen by the alkoxy with 1 to 20 carbon atom
Replace, and the alkyl with 1 to 20 carbon atom that another hydrogen is optionally substituted by a hydroxyl group, and can be preferably hydroxyl (C1-C10) alkane
Oxygroup (C1-C10) alkyl, and more preferably hydroxyl (C1-C4) alkoxy (C1-C6) alkyl.
" (C3-C20) naphthenic base " refers to the naphthenic base with 3 to 20 carbon atoms, and can be preferably (C3-C10) ring
Alkyl.
According to embodiment of the present disclosure, R1And R2Hydrogen, methyl, ethyl, n-propyl, isopropyl, just can respectively be stood alone as
Butyl, isobutyl group, tert-butyl, n-pentyl, isopentyl, n-hexyl, isohesyl, n-octyl, positive decyl, isodecyl, n-dodecane
Base, cyclopenta, cyclohexyl, phenyl, benzyl, naphthalene, xenyl, terphenyl, anthryl, indenyl, phenanthryl, methoxyl group, ethyoxyl,
Positive propoxy, isopropoxy, n-butoxy, isobutoxy, tert-butoxy, hydroxymethyl, hydroxyethyl, hydroxy-n-propyl, hydroxyl
Base normal-butyl, hydroxyisobutyl, hydroxyl n-pentyl, hydroxyl isopentyl, hydroxyl n-hexyl, hydroxyl isohesyl, hydroxymethoxy first
Base, hydroxymethoxy ethyl, hydroxymethoxy propyl, hydroxymethoxy butyl, hydroxyethoxymethyl, hydroxyl-oxethyl second
Base, hydroxyethoxypropyl, hydroxyl-oxethyl butyl, hydroxyethoxypentyl or hydroxyl-oxethyl hexyl.
In addition, R3It can be methyl, ethyl, n-propyl, isopropyl, normal-butyl, isobutyl group, tert-butyl, n-pentyl, isoamyl
Base, n-hexyl, isohesyl, cyclopenta, cyclohexyl or phenyl.
More specifically, R1And R2Methyl, ethyl, n-propyl, isopropyl, normal-butyl, n-pentyl, just can respectively be stood alone as
Octyl, positive decyl, isodecyl, dodecyl, cyclohexyl, phenyl or benzyl;And R3It can be methyl, ethyl, n-propyl
Or phenyl.
According to embodiment of the present disclosure, chemical combination of the oxime ester derivative compound including but not limited to the following Expression 2-1 to 2-19
Object:
<formula 2-1 to 2-19>
It can be prepared by such as following formulas 1 according to the oxime ester derivative compound of the formula 1 of the disclosure:
<reaction equation 1>
In reaction equation 1, R1To R3It is identical as defined in formula 1, and X is halogen.
In addition, Photoepolymerizationinitiater initiater according to the one side of the disclosure includes oxime ester shown in the formula 1 of at least one type
Derivative compound.
In addition, photosensitive composite according to the one side of the disclosure, includes:
(a) alkali soluble resins;
(b) with the polymerizable compound of ethylenic unsaturated bond;And
(c) Photoepolymerizationinitiater initiater, the oxime ester derivative compound comprising formula 1.
Here, the oxime ester derivative compound can be used as Photoepolymerizationinitiater initiater.
Photosensitive composite according to the one side of the disclosure is excellent in terms of pattern properties modulability, and has such as resistance to
Hot and chemical resistance protrusion film characteristics.Detailed description presented below.
(a) alkali soluble resins
The alkali soluble resins includes acrylic acid series polymeric compounds or has the propylene of acrylic acid series unsaturated bond on side chain
Sour based polymer.
The acrylic acid series polymeric compounds refer to the polymer (comprising homopolymer and copolymer) of acrylic monomer, acrylic acid
Be monomer example include methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl methacrylate,
Pentylmethacrylate, hexyl methacrylate, cyclohexyl methacrylate, metering system heptyl heptylate, 2-Propenoic acid, 2-methyl-, octyl ester,
Nonyl methacrylate, decyl-octyl methacrylate, lauryl ester, lauryl ester, metering system
Sour tetradecane ester, methacrylic acid hexadecane ester, isobornyl methacrylate, methacrylic acid Buddha's warrior attendant alkyl ester, metering system
Sour two ring pentyl esters, methacrylic acid dicyclopentenyl ester, benzyl methacrylate, methacrylic acid 2- methoxy ethyl ester, methyl
Acrylic acid 2- ethoxy ethyl ester, acrylic acid, methacrylic acid, itaconic acid, maleic acid, maleic anhydride, maleic acid mono alkyl ester, clothing
Health acid monoalkyl ester, fumaric acid monoalkyl ester, Glycidyl Acrylate, glycidyl methacrylate, methacrylic acid 3,
4- epoxy butyl ester, methacrylic acid 2,3- epoxy cyclohexyl, methacrylic acid 3,4- epoxycyclohexanecarboxylate, 3- methyl oxa- ring
Butane -3- methylmethacylate, 3- Ethyloxetane -3- methylmethacylate, styrene, Alpha-Methyl benzene second
Alkene, acetoxy-styrene, N- methylmaleimido, n-ethylmaleimide, N- propylmaleimide, N- butyl horse
Come acid imide, N- N-cyclohexylmaleimide, Methacrylamide and N- methyl methacrylamide, they can independent or group
It closes and uses.
In addition, having the acrylic acid series polymeric compounds of acrylic acid series unsaturated bond in side chain is by epoxy resin and comprising carboxylic acid
The addition reaction of acrylic acid series copolymer be formed by copolymer, and including passing through epoxy resin and acrylic acid carboxylic-containing acid
The adhesive resin that the addition reaction of based copolymer obtains at 40~180 DEG C, the epoxy resin are such as acrylic acid epoxy
Propyl ester, glycidyl methacrylate, methacrylic acid 3,4- epoxy butyl ester, methacrylic acid 2,3- epoxy cyclohexyl and methyl
Acrylic acid 3,4- epoxycyclohexanecarboxylate, the packet acrylic acid series copolymer carboxylic-containing acid is by the inclusion of carboxylic acid (for example, propylene
Acid, methacrylic acid, itaconic acid, maleic acid and maleic acid mono alkyl ester) acrylic monomer and at least two alkyl methyls
The copolymerization of acrylate monomer and obtain, at least two alkylmethacrylate system's monomer be such as metering system
Sour methyl esters, hexyl methacrylate, cyclohexyl methacrylate, isobornyl methacrylate, methacrylic acid Buddha's warrior attendant alkyl ester,
Two ring pentyl ester of methacrylic acid, methacrylic acid dicyclopentenyl ester, benzyl methacrylate, methacrylic acid 2- methoxy ethyl
Ester, methacrylic acid 2- ethoxy ethyl ester, styrene, α-methylstyrene, acetoxy-styrene, N- methyl maleimide
Amine, n-ethylmaleimide, N- propylmaleimide, N- butyl maleimide, N- N-cyclohexylmaleimide, methyl
Acrylamide and N- methyl methacrylamide.
Another example in side chain with the acrylic acid series polymeric compounds of acrylic acid series unsaturated bond is by carboxylic acid and packet
The addition reaction of acrylic acid series copolymer containing epoxy group is formed by copolymer, and includes by the inclusion of carboxylic acid (for example, third
Olefin(e) acid, methacrylic acid, itaconic acid, maleic acid and maleic acid mono alkyl ester) acrylic monomer with comprising epoxy group third
The adhesive resin that the addition reaction of olefin(e) acid based copolymer obtains at 40~180 DEG C, the acrylic acid series comprising epoxy group
Copolymer be by the inclusion of the acrylic monomer of epoxy group and the copolymerization of two or more methacrylate monomers and
It obtains, the acrylic monomer comprising epoxy group is such as Glycidyl Acrylate, glycidyl methacrylate, first
Base acrylic acid 3,4- epoxy butyl ester, methacrylic acid 2,3- epoxy cyclohexyl and methacrylic acid 3,4- epoxycyclohexanecarboxylate,
Described two or more alkyl methacrylate systems monomer is such as methyl methacrylate, hexyl methacrylate, methyl
Cyclohexyl acrylate, isobornyl methacrylate, methacrylic acid Buddha's warrior attendant alkyl ester, two ring pentyl ester of methacrylic acid, methyl-prop
Olefin(e) acid dicyclopentenyl ester, benzyl methacrylate, methacrylic acid 2- methoxy ethyl ester, methacrylic acid 2- ethyoxyl second
Ester, styrene, α-methylstyrene, acetoxy-styrene, N- methylmaleimido, n-ethylmaleimide, N- third
Base maleimide, N- butyl maleimide, N- N-cyclohexylmaleimide, Methacrylamide and N- methyl propylene
Amide.
According to embodiment of the present disclosure, in order to adjust the film of pattern properties and imparting such as heat resistance and chemical resistance
Performance, the total amount based on the photosensitive composite are 100wt%, and the amount of the alkali soluble resins can be 3~50wt%, especially
It is 5~45wt%, more specifically 8~40wt%.
Alkali soluble resins can have weight average molecular weight 2, and 000~300,000, in particular 4,000~100,000,
And dispersion degree is 1~10.0.
(b) with the polymerizable compound of ethylenic unsaturated bond
The polymerizable compound with ethylenic unsaturated bond is crosslinked when forming pattern by light reaction, and is had
Help pattern to be formed, and when accompany each other at high temperature heat when, it is described with ethylenic unsaturated bond polymerizable compound crosslinking with
Assign chemical resistance and heat resistance.
Total amount based on the photosensitive composite is 100wt%, the polymerism chemical combination with ethylenic unsaturated bond
The amount of object can be 0.001~40wt%, in particular 0.1~30wt%, more particularly 1~20wt%.
When the polymerizable compound with ethylenic unsaturated bond has excessive, its shortcoming is that the degree mistake of crosslinking
Amount increases, and the ductility reduction of pattern.
The polymerizable compound with ethylenic unsaturated bond specifically includes the Arrcostab of methacrylic acid, for example, first
Base methyl acrylate, ethyl methacrylate, butyl methacrylate, 2-Ethylhexyl Methacrylate, methacrylic acid ten
Dialkyl, glycidyl methacrylate, the polyethylene glycol monomethacrylate with 2~14 ethylene oxide groups, second
Diol dimethacrylate, has 2~14 at the polyethylene glycol dimethacrylate with 2~14 ethylene oxide groups
Dimethacrylate, trimethylolpropane dimethacrylate, the bisphenol-A two of a propylene oxide group shrink sweet
Oily ether acrylic acid adduct, the ditridecyl phthalate of beta-hydroxy ethylmethyl acrylate, beta-hydroxy ethyl methacrylate
The toluene di-isocyanate(TDI) addition product of ester, by polyalcohol and α, compound obtained from the esterification of beta-unsaturated carboxylic acid is (for example, three
Methylolpropane trimethacrylate, pentaerythritol acrylate trimethyl, pentaerythritol tetramethylacrylate, two seasons penta
Tetrol pentamethacrylate, dipentaerythritol hexamethacrylate and dipentaerythritol trimethyl acrylic ester) and it is poly-
Glycidyl compound acrylic acid adduct (for example, the addition product of trihydroxymethylpropanyltri diglycidyl ether acrylic acid, they
It can be used alone or in combination.
(c) Photoepolymerizationinitiater initiater
In the photosensitive composite of the disclosure, as Photoepolymerizationinitiater initiater, the oxime ester derivative compounds of formula 1 can be used
Object.Be 100wt% based on the photosensitive composite total amount, the amount of Photoepolymerizationinitiater initiater be 0.01~10wt% be more effectively,
Preferably 0.1~5wt%, to enhance the transparency while minimize exposure dose.
(d) auxiliary binder
In addition, if needing, the photosensitive composite of the disclosure can further include the silicon with epoxy group or amido
Oxyalkyl compound is as auxiliary binder.
Silicone-based compound with epoxy group or amido can improve viscous between ITO electrode and photosensitive composite
Property, and heat resistance is improved after hardening.Silicone-based compound with epoxy group or amido includes (3- glycidoxy third
Base) trimethoxy silane, (3- glycidoxypropyl group) triethoxysilane, (3- glycidoxypropyl group) methyl dimethoxy oxygroup
Silane, (3- glycidoxypropyl group) methyldiethoxysilane, (3- glycidoxypropyl group) dimethyl methoxy silane,
(3- glycidoxypropyl group) dimethylethoxysilane, 3,4- epoxy group butyl trimethoxy silane, 3,4- epoxy group butyl
Triethoxysilane, 2- (3,4- expoxycyclohexyl) ethyl trimethoxy silane, 2- (3,4- expoxycyclohexyl) ethyl three
Ethoxysilane and aminocarbonyl propyl trimethoxy silane, they can be used alone or in combination.
It is 100wt% based on the photosensitive composite total amount, the silicone-based compound with epoxy group or amido
Amount can be 0.0001~3wt%.When content is less than the range, additional effect is not found, and when content is more than
When the range, the deterioration in characteristics of unexposed area, dross (scum) and residue can be stayed on lower substrate, ITO or glass substrate.
(e) other additives
If it is desirable, photosensitive composite of the invention can further include the additive with compatibility, for example, light
Quick dose, thermal polymerization inhibitor, defoaming agent and levelling agent.
It is 100wt% based on the photosensitive composite total amount, the amount of other additives can be 0.1~10wt%, and work as
When content is less than the range, additional effect is not found, and when content is more than the range, it is possible to create excessive floating
Slag.
(f) solvent
The photosensitive composite of the disclosure is used to be coated by addition solvent, on substrate, irradiates purple using mask
Outside line and pattern is formed using the method that alkaline developing solution develops.
Accordingly, the content of adjustable solvent is so that the contents of the other compositions of the content and photosensitive composite of solvent
Summation is 100wt%, so, the content of solvent can change according to the content of the other compositions of photosensitive composite.For example,
It is preferred that adjust the content of solvent, so that be 100wt% based on the photosensitive composite total amount, the amount of the solvent of addition is 10~
95wt% and make 1~50 centipoise of range of viscosities (cps).
In view of the compatibility with alkali soluble resins, photoinitiator and other compounds, the solvent includes acetic acid second
Ester, butyl acetate, diethylene glycol dimethyl ether, diethylene glycol dimethyl ethyl ether, methyl methoxypropionate, ethyl ethoxy-c
Acid esters (EEP), ethyl lactate, propylene glycol methyl ether acetate (PGMEA), propylene glycol monomethyl ether acetate (PGMEP), propylene glycol first
Ether, propylene glycol propyl ether, methylcellosolve acetate, ethyl cellosolve acetate, diethylene glycol methyl acetic acid ester, diethylene glycol second
Yl acetate, acetone, methyl iso-butyl ketone (MIBK), cyclohexanone, dimethylformamide (DMF), DMAC N,N' dimethyl acetamide (DMAc), N-
Methyl -2- pyrrolones (NMP), gamma-butyrolacton, diethyl ether, glycol dimethyl ether, diethylene glycol dimethyl ether, tetrahydrofuran (THF),
Methanol, ethyl alcohol, propyl alcohol, isopropanol, methyl cellosolve, ethyl cellosolve, diethylene glycol dimethyl ether, diethylene glycol ether, dipropyl two
Alcohol methyl ether, toluene, dimethylbenzene, hexane, heptane and octane, they can be used alone or in combination.
(g) other Photoepolymerizationinitiater initiaters
For Photoepolymerizationinitiater initiater, photosensitive composite of the invention can be used alone oxime ester derivative compound, can also
By oxime ester derivative compound and selected from by thioxanthones based compound, acetophenone based compound, bisglyoxaline based compound, triazine system
Close at least one of group compound combination composed by object, O- acyl group oxime ester based compound and mercaptan (thiol) based compound
It uses.
Total amount based on the photosensitive composite is 100wt%, the Photoepolymerizationinitiater initiater of addition can for 0.01~
5wt%.
Thioxanthones based compound includes, for example, thioxanthones, 2-chlorothioxanthone, 2- methyl thioxanthones, 2- isopropylthioxanthones
Ketone, 4-isopropylthioxanthone, bis- clopenthixal ketone of 2,4-, 2,4- dimethyl thioxanthone, 2,4- diethyl thioxanthone and 2,4- bis- are different
Propyl thioxanthones.
Acetophenone based compound includes, for example, 2- methyl-1-[4- (methyl mercapto) phenyl]-2- morpholinyl propyl- 1- ketone, 2-
Benzyl -2- dimethyl amido -1- (4- morpholino phenyl) butyl- 1- ketone and 2- (4- methylbenzyl) -2- (dimethyl amido) -1-
(4- morpholino phenyl) butyl- 1- ketone.
Bisglyoxaline based compound include bis- (2- chlorphenyl) -4,4', the 5,5'- tetraphenyl -1,2'- bisglyoxalines of such as 2,2'-,
Bis- (2,4 dichloro benzene base) -4,4', the 5,5'- tetraphenyl -1,2'- bisglyoxalines of 2,2'- and bis- (the 2,4,6- trichloro-benzenes of 2,2'-
Base) -4,4', 5,5'- tetraphenyl -1,2'- bisglyoxaline.
Triazine based compound includes, for example, 2,4,6- tri- (trichloromethyl)-s- triazines, bis- (three chloromethanes of 2- methyl -4,6-
Base)-s- triazine, 2- [2- (5- methylfuran -2- base) vinyl] bis- (trichloromethyl)-s- triazines of -4,6-, 2- [2- (furans -
2- yl) vinyl] bis- (the trichloromethyl)-s- triazines of -4,6-, 2- [2- (4- diethyl amido -2- aminomethyl phenyl) vinyl] -4,
Bis- (the trichloromethyl)-s- triazines of 6-, 2- [2- (3,4- Dimethoxyphenyl) vinyl] bis- (trichloromethyl)-s- triazines of -4,6-,
Bis- (the trichloromethyl)-s- triazines of 2- (4- methoxyphenyl) -4,6-, bis- (three chloromethanes of 2- (4- ethoxystyrene base) -4,6-
Base)-s- triazine and bis- (the trichloromethyl)-s- triazines of 2- (4-n- butoxy phenyl) -4,6-.
O- acyl group oxime ester based compound includes, for example, 1,2- octadione- 1- [4- (thiophenyl) phenyl] -2- (o- benzene first
Acyl group oxime), ethyl ketone -1- [9- ethyl -6- (2- methyl benzoyl) -9H- carbazole -3- base] -1- (o-acetyl base oxime), ethyl ketone -
1- [9- ethyl -6- (2- methyl -4- tetrahydrofuran base methoxybenzoyl base) -9H- carbazole -3- base] -1- (o-acetyl base oxime)
And ethyl ketone -1- [9- ethyl -6- { 2- methyl -4- (2,2- dimethyl -1,3- dioxolane base) methoxybenzoyl base } -
9H- carbazole -3- base] -1- (o-acetyl base oxime).
Mercaptan based compound includes pentaerythrite four (3-thiopropionate).
(h) colorant
The photosensitive composite of embodiment according to the present invention may further include colorant, be used to form colored filter
The anti-erosion application of light device or black matrix".
The colorant includes various pigment, for example, red, green, the additive colo(u)r system of blue and brown, that is, blue-green,
The pigment of carmetta, yellow and black, more specifically, obtainable pigment include C.I. pigment Yellow 12,13,14,17,20,24,
55,83,86,93,109,110,117,125,137,139,147,148,153,154,166,168;C.I. pigment orange 36,43,
51,55,59,61;C.I. Pigment Red 9,97,122,123,149,168,177,180,192,215,216,217,220,223,
224,226,227,228,240;C.I. pigment violet 19,23,29,30,37,40,50;C.I pigment blue 15,15:1,15:4,15:
6,22,60,64;C.I. pigment Green 7,36;C.I. pigment brown 23,25,26;C.I. pigment black 7;And titanium is black.
It is 100wt% based on the photosensitive composite total amount, the amount of the colorant can be 5~50wt%.When content is small
When the range, shading performance decline, and when content is more than the range, it may occur however that failure exposure or solidification.
According to an aspect of the present invention, the mechanograph of the cured product comprising the photosensitive composite is provided.
The mechanograph includes but is not limited to array planarization film (array planarization film), insulating film
(insulating film), chromatic filter (color filter), column spacer (column spacer), black column
Spacer (black column spacer) or black matrix" (black matrix).
In addition, according to an aspect of the present invention, the various forms of displays including the mechanograph are provided, for example,
Liquid crystal display and OLED.
The photosensitive composite of embodiment according to the present invention can by rotation coating machine, roll-coater, rod coater,
Slit coater, curtain application device and various known printings and deposition method are applied to soda-lime glass, quartz glass, half
Conductor substrate, metal, paper and plastics supporting substrate.Furthermore, it is possible to form film on supporting substrate, then transfer to
Another supporting substrate, to its applying method, there is no limit.
Hereinafter, in order to fully understand the purpose of the present invention, embodiment and comparative example the present invention is described in detail will be passed through
Representative compound, and embodiment according to the present invention can modify in many different forms, and the scope of the present invention is not answered
It is construed as limited to embodiment mentioned below.Embodiments of the present invention are provided to those skilled in the art with more completely
The description present invention.
Embodiment
<preparation of oxime ester derivative compound>
Embodiment 1
The synthesis of step 1:10- butyl -10H- phenothiazine
10H- phenothiazine (30g) is dissolved in dimethyl sulfoxide (90ml) in reactor, and tetrabutyl bromine is added
Change ammonium (2g) and 50% sodium hydroxide solution (120ml).After stirring 30 minutes, 1- bromobutane (32.6ml) is added dropwise and in room
Temperature lower stirring 24 hours.To after the reaction was completed, extracted 3 times with ethyl acetate and water, with the dry organic layer of anhydrous magnesium sulfate and
The lower concentration of decompression.Use hexane to be purified as developing solvent (developing solvent) by column chromatography, produces
Raw target compound (27.0g, 70.5%).
1H NMR(δppm;CDCl3):0.93(3H,t),1.40-1.50(4H,m),1.74-1.82(2H,q),6.71-
7.05(2H,m),7.11-7.14(2H,m)
MS(m/e):255
The synthesis of step 2:1,1'- (10- butyl -10H- phenothiazine -3,7- diyl) two butyl- 1- ketone
The product of step 1 (27g) is dissolved in methylene chloride (135ml) in reactor, under 0 DEG C or lower temperature
Aluminium chloride (42.0g) and butyl chloride (33.6g) is added, and is stirred at room temperature 8 hours.After completion of the reaction, by reaction solution
It is added in ice water, stirs and stand to remove water layer, be washed with water organic layer 2 times.Simultaneously with the dry organic layer of anhydrous magnesium sulfate
It is concentrated under reduced pressure.With ethyl acetate: hexane (1:10) is purified as developing solvent by column chromatography, generates target
Product (17.0g, 41%).
1H NMR(δppm;CDCl3):0.96(3H,t),1.23(6H,t),1.35-1.70(6H,m),1.82-2.01
(2H,m),2.45-2.76(4H,m),4.10-4.14(2H,m),7.46-7.50(2H,m),8.29-8.33(2H,m),8.75
(2H,s)
MS(m/e):395
The synthesis of step 3:1,1'- (10- butyl -10H- phenothiazine -3,7- diyl) bis- (2- (hydroxyl imide base) butyl- 1- ketone)
The product of step 2 (17.0g) is added to after tetrahydrofuran (85ml) in reactor, is slowly added dropwise strong salt
Sour (10.8mL) and isobutyl nitrite (13.3g).Then it is stirred at room temperature 30 minutes 1 hour, is extracted with ethyl acetate and water
It takes 3 times, dries organic layer with anhydrous magnesium sulfate, and crystallized with ethyl acetate, generate target compound (10.7g, 55.0%).
1H NMR(δppm;CDCl3):1.08(3H,t),1.24-1.28(6H,m),1.51-1.70(2H,m),1.82-
2.01(2H,m),2.70-2.76(4H,q),4.10-4.14(2H,m),7.48-7.51(2H,m),8.30-8.34(2H,m),
8.76(2H,s)
MS(m/e):453
Step 4:1,1'- (10- butyl -10H- phenothiazine -3,7- diyl) is bis- (2- (acetoxyl group imido grpup) butyl- 1- ketone)
Synthesis
Ethyl acetate (107ml) is added in the product of step 3 (10.7g) in reactor, is sequentially added dropwise at room temperature
Enter Trimethylamine (7.3g) and chloroacetic chloride (5.65g).After being stirred at room temperature 1 hour, distilled water is added.It has been washed with distilled water
, be then concentrated under reduced pressure machine layer for 2 times, and dry with anhydrous magnesium sulfate, products therefrom ethyl acetate and hexane (1:1) it is molten
Agent crystallization, generates target compound (8.7g, 67.4%).
1H NMR(δppm;CDCl3):1.09(3H,t),1.18-1.26(6H,m),1.59-1.67(2H,m),1.85-
2.01(2H,m),2.31(6H,s),2.80-2.87(4H,m),4.29-4.34(2H,m),7.54(2H,d),8.48(2H,d),
8.81(2H,s)
MS(m/e):537
Decomposition point: 200.8 DEG C
Embodiment 2 to 19
Under the same conditions as example 1, oxime ester derivative compound is synthesized according to the composition in following table 1 and 2.
[table 1]
[table 2]
<preparation of alkali soluble resins>
Synthesis example 1
The azobis isobutyronitrile (AIBN) of the propylene glycol monomethyl ether (PGMEA) of 200mL and 1.5g are added extremely
In the aggregation container of 500mL, methacrylate, glycidyl third are added with the molar ratio of 20:20:40:20 respectively
Ester, methyl methacrylate and dicyclopentanyl acrylate and 40wt% acrylic monomers solids, then in nitrogen atmosphere and 70
It stirs 5 hours and is polymerize at DEG C, to prepare acrylic acid series polymeric compounds (a-1).The weight average molecular weight of resulting polymers is
25,000, and dispersion degree is 1.9.
Synthesis example 2
The AIBN of the propylene glycol monomethyl ether of 200mL and 1.0g is added into the aggregation container of 500mL, respectively
Methacrylate, styrene, methyl methacrylate and cyclohexyl methacrylate is added with the molar ratio of 40:20:20:20
With 4wt% acrylic monomers solids, then stirs 5 hours and polymerize with synthetic copolymer at nitrogen atmosphere and 70 DEG C.
By the N of 0.3g, N- dimethylaniline and with the methacrylic acid ring relative to 100 moles of total monomer solids for 20 molar ratios
Oxygen propyl ester is put into reactor, and is stirred 10 hours at 100 DEG C, to prepare have acrylic acid series unsaturated bond in side chain third
Olefin(e) acid based polymer (a-2).The weight average molecular weight of resulting polymers is 20,000, and dispersion degree is 2.0.
Synthesis example 3
The AIBN of the propylene glycol monomethyl ether of 200mL and 1.0g is added into the aggregation container of 500mL, respectively
Glycidyl methacrylate, styrene, methyl methacrylate and methacrylic acid is added with the molar ratio of 40:20:20:20
The acrylic monomers solids of cyclohexyl and 40wt% then stirs 5 hours at nitrogen atmosphere and 70 DEG C and is polymerize, to close
At polymer.By the N of 0.3g, N- dimethylaniline and with the propylene relative to 100 moles of total monomer solids for 20 molar ratios
Acid is put into reactor, and is stirred 10 hours at 100 DEG C, to prepare the acrylic acid for having acrylic acid series unsaturated bond in side chain
Based polymer (a-3).The weight average molecular weight of resulting polymers is 18,000, and dispersion degree is 1.8.
Embodiment 20~35: the preparation of photosensitive composite
In embodiment 20~35, by institute alkali soluble resins a-1 to a-3;Polymerism chemical combination with ethylenic unsaturated bond
Object;Photoepolymerizationinitiater initiater of the invention;And FC-430 (3M levelling agent) is sequentially put according to ingredient listed by the following table 3 and content
Enter in the reaction mixing channel with UV masking and blender, is then stirred at room temperature, the solvent PGMEA of surplus is added, makes group
The total weight percent for closing object is 100wt%, to prepare photosensitive composite.
Embodiment 36~37: the preparation of coloring photosensitive combination
Coloring photosensitive combination is prepared by method identical with embodiment 17, in addition to having in embodiment 36
There is the carbon black dispersion that 50wt% is added in the PGMEA of 25wt% solids, and in embodiment 37, solid with 25wt%
Paratonere 177 (P.R.177) dispersion of 50wt% is added in the PGMEA of body object, as described in the following table 3.
Embodiment 38
Photosensitive composite is prepared by method identical with embodiment 17, in addition to by the chemical combination of embodiment 1 and following formula 3
The mixture of object is as Photoepolymerizationinitiater initiater, as described in the following table 3.
<formula 3>
<ingredient>
(a) alkali soluble resins
(b) with the polymerizable compound of ethylenic unsaturated bond
B-1: dipentaerythritol hexaacrylate
B-2: Dipentaerythritol Pentaacrylate
B-3: pentaerythritol triacrylate
B-4: pentaerythritol acrylate trimethyl
B-5: trimethylolpropane trimethacrylate
B-6: glycol diacrylate
B-7: bisphenol-A diepoxide propionic ester addition product
B-8: trimethylolpropane tris glycidyl ethers acrylate addition product
(c) Photoepolymerizationinitiater initiater
(e) levelling agent: FC-430 (3M levelling agent)
(h) colorant
H-1: carbon black (solids of 25wt%)
H-2: pigment red 177 (P.R.177) (solids of 25wt%)
[table 3]
Comparative example 1
Photopolymerizable composition is prepared by method identical with embodiment 17, other than Photoepolymerizationinitiater initiater, under use
The compound of formula 4 replaces the compound of embodiment 1.
<formula 4>
Comparative example 2
Photopolymerization constituent is prepared by method identical with embodiment 17, other than Photoepolymerizationinitiater initiater, uses formula 5
Compound replace embodiment 1.
<formula 5>
<evaluation>
The evaluation of photosensitive composite prepared by embodiment 20~38 and comparative example 1~2 is carried out on the glass substrate,
Measure performance such as susceptibility, residual film thickness, pattern stability, chemical resistance and the ductility of photosensitive composite, evaluation
As the result is shown in the following table 4.
1) susceptibility
On the glass substrate by photoresist spin coating, prebake 1 minute and at 100 DEG C is then carried out using stepping mask
Exposure, and develop in 0.04% potassium hydroxide aqueous solution.Thickness based on stepping mask pattern maintains original depth
80% exposure dose evaluates susceptibility.
2) residual film thickness
After photosensitive composite is coated on substrate using spin coater, prebake conditions (pre-baking) 1 is carried out at 100 DEG C
Minute, it then exposes under 365nm light, then toast (post-baking) 20 minutes after carrying out at 230 DEG C, is toasted after measurement
The thickness ratio (%) of the etchant resist of front and back.
3) pattern stability
By the silicon wafer with photoresist pattern along the direction cutting perpendicular to sectional hole patterns, and shown using electron microscope
Observation result in the cross-sectional direction of pattern is shown.The side wall of pattern is upright with 55 degree or bigger of angle relative to substrate,
And it is defined as " excellent " without film reduction, observes that the reduction of film is defined as " film reduction ".
4) chemical resistance
After photosensitive composite is coated on substrate using spin coater, it will be handled by prebake conditions and rear baking processing is formed
Etchant resist be immersed at 40 DEG C in stripping solution 10 minutes, and observe the transmissivity of etchant resist and thickness whether have it is any
Variation.2% or the variation of transmissivity below and thickness be defined as " excellent ", 2% or more transmissivity and the variation of thickness
It is defined as " bad ".
5) ductility
Photosensitive composite is spin-coated on substrate, then prebake conditions 1 minute at 100 DEG C, under the susceptibility of photoresist
It is exposed, and develops under potassium hydroxide aqueous solution, to form the pattern of 20 μm of 20 μ m.By the pattern of formation by
20 packing of baking is crosslinked after at 230 DEG C, and using nano-indenter test instrument measurement pattern to judge ductility.It is negative in 5g power
Carry the lower measurement for carrying out nano-indenter test instrument, total amount of variability be 500nm or more than be defined as " excellent " and total amount of variability
It is defined as " bad " for 500nm or less.
[table 4]
By table 4 it can be found that the oxime ester derivative compound of the disclosure has significant excellent susceptibility, and have outstanding
Performance, such as degree, pattern stability, chemical resistance and ductility after residual film, or even when used as photosensitive composite
Photoepolymerizationinitiater initiater when be a small amount of.
Claims (12)
1. oxime ester derivative compound shown in a kind of formula 1:
<formula 1>
Wherein, R1And R2Respectively stand alone as hydrogen, (C1-C20) alkyl, (C6-C20) aryl, (C1-C20) alkoxy, (C6-C20)
Aryl (C1-C20) alkyl, hydroxyl (C1-C20) alkyl, hydroxyl (C1-C20) alkoxy (C1-C20) alkyl or (C3-C20) ring
Alkyl;And
R3For (C1-C20) alkyl, (C6-C20) aryl, (C6-C20) aryl (C1-C20) alkyl or (C3-C20) naphthenic base.
2. oxime ester derivative compound as described in claim 1, wherein R1And R2Respectively stand alone as hydrogen, methyl, ethyl, positive third
Base, isopropyl, normal-butyl, isobutyl group, tert-butyl, n-pentyl, isopentyl, n-hexyl, isohesyl, n-octyl, positive decyl, isodecyl
Base, dodecyl, cyclopenta, cyclohexyl, phenyl, benzyl, naphthalene, xenyl, terphenyl, anthryl, indenyl, phenanthryl, first
Oxygroup, ethyoxyl, positive propoxy, isopropoxy, n-butoxy, isobutoxy, tert-butoxy, hydroxymethyl, hydroxyethyl, hydroxyl
Base n-propyl, hydroxy-n-butyl, hydroxyisobutyl, hydroxyl n-pentyl, hydroxyl isopentyl, hydroxyl n-hexyl, hydroxyl isohesyl, hydroxyl
Ylmethoxymethyl, hydroxymethoxy ethyl, hydroxymethoxy propyl, hydroxymethoxy butyl, hydroxyethoxymethyl, hydroxyl
Ethoxyethyl group, hydroxyethoxypropyl, hydroxyl-oxethyl butyl, hydroxyethoxypentyl or hydroxyl-oxethyl hexyl;And
R3For methyl, ethyl, n-propyl, isopropyl, normal-butyl, isobutyl group, tert-butyl, n-pentyl, isopentyl, n-hexyl, dissident
Base, cyclopenta, cyclohexyl or phenyl.
3. oxime ester derivative compound as described in claim 1, wherein the oxime ester derivative compound is selected from by the following Expression 2-1
To 2-19 compound represented:
<formula 2-1 to 2-19>
4. a kind of Photoepolymerizationinitiater initiater includes oxime ester derivative compound of any of claims 1-3.
5. a kind of photosensitive composite, includes:
(a) alkali soluble resins;
(b) with the polymerizable compound of ethylenic unsaturated bond;And
(c) Photoepolymerizationinitiater initiater includes oxime ester derivative compound of any of claims 1-3.
6. photosensitive composite as claimed in claim 5, wherein the total amount based on the photosensitive composite is 100wt%,
The amount of the oxime ester derivative compound is 0.01~10wt%.
7. photosensitive composite as claimed in claim 5, wherein the Photoepolymerizationinitiater initiater is further included selected from by thioxanthene
Ketone based compound, acetophenone based compound, bisglyoxaline based compound, triazine based compound, o- acyl group oxime ester based compound and sulphur
At least one of group composed by alcohol based compound.
8. photosensitive composite as claimed in claim 5, wherein the photosensitive composite further includes colorant.
9. photosensitive composite as claimed in claim 7, wherein the photosensitive composite further includes colorant.
10. a kind of mechanograph, the cured product comprising the photosensitive composite described in claim 5.
11. mechanograph as claimed in claim 10, wherein the mechanograph is array planarization film, insulating film, colorized optical filtering
Device, column spacer, black column spacer or black matrix".
12. a kind of display equipment includes mechanograph described in any one of claim 10.
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KR102547857B1 (en) * | 2020-12-31 | 2023-06-28 | (주)켐이 | Penothiazine compound, photopolymerization initiator containing the same, and composition for electronic materials containing the same |
JP7219378B1 (en) | 2021-12-09 | 2023-02-08 | 東洋インキScホールディングス株式会社 | Photosensitive coloring composition, optical filter, image display device, and solid-state imaging device |
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KR20170131218A (en) | 2017-11-29 |
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JP7002617B2 (en) | 2022-01-20 |
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