CN109141689A - A kind of low-temperature co-fired ceramics LTCC pressure sensor - Google Patents
A kind of low-temperature co-fired ceramics LTCC pressure sensor Download PDFInfo
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- CN109141689A CN109141689A CN201810789013.XA CN201810789013A CN109141689A CN 109141689 A CN109141689 A CN 109141689A CN 201810789013 A CN201810789013 A CN 201810789013A CN 109141689 A CN109141689 A CN 109141689A
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- capacitor
- pressure sensor
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- pressure
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- 239000000919 ceramic Substances 0.000 title claims abstract description 11
- 239000003990 capacitor Substances 0.000 claims abstract description 63
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 239000011521 glass Substances 0.000 claims abstract description 20
- 238000005516 engineering process Methods 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 3
- 239000002184 metal Substances 0.000 claims abstract description 3
- 230000005611 electricity Effects 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 3
- 230000006835 compression Effects 0.000 claims description 2
- 238000007906 compression Methods 0.000 claims description 2
- 230000005672 electromagnetic field Effects 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 6
- 238000010344 co-firing Methods 0.000 abstract description 3
- 229910052573 porcelain Inorganic materials 0.000 abstract description 2
- 238000013461 design Methods 0.000 description 6
- 238000004364 calculation method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000009530 blood pressure measurement Methods 0.000 description 2
- 238000012512 characterization method Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000028161 membrane depolarization Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
- G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The present invention provides a kind of low-temperature co-fired ceramics LTCC pressure sensor, belongs to sensor technical field.The invention mainly comprises top-down three layers of LTCC substrates, it is characterized in that, the upper surface of first layer LTCC substrate is printed with the spiral inductance of circular flat, the lower surface of first layer LTCC substrate is printed with capacitor top crown, Packed glass is set on second layer LTCC substrate, the upper surface of third layer LTCC substrate is printed with capacitor bottom crown, and the spiral inductance ectonexine is connect by metal throuth hole with capacitor top crown and capacitor bottom crown respectively and constitutes the circuit LC.Low-temperature co-fired ceramics LTCC pressure sensor of the present invention is inherently encapsulated using the multilayer ceramic substrate based on LTCC technique, realizes the miniaturization of sensor bulk.The present invention is that basic common burning porcelain and glass can be improved the yield rate of device, survey pressure range and reliability by the technique of this dissimilar materials matching co-firing with LTCC technology.
Description
Technical field
The invention belongs to pressure sensor technique fields, and in particular to a kind of LTCC capacitive pressure biography of high reliability
Sensor.
Background technique
In the epoch of current rapid development of information technology, important component of the sensor as information acquisition system, referred to as
The source of modern information technologies.Pressure sensor receives external pressure by sensitive membrane as one kind and is converted into telecommunications
Number element, many engineering fields transient pressure measurement in play a significant role.According to working principle difference, pressure is passed
Sensor can be divided into piezoelectric type, pressure resistance type and three kinds of condenser type.Piezoresistive pressure sensor frequency response is high, precision is high, sensitivity
Height, but it is affected by temperature larger, complex process.Piezoelectric pressure indicator easy processing, working band be wide, high sensitivity, but passes
With temperature raising depolarization can occur for sensor material.Capacitance pressure transducer, input energy is small, high sensitivity, electricity parameter
Opposite variation is big, temperature stability is good, is more suitably applied to high temperature, the adverse circumstances such as chemistry.
Currently, pressure passes under the ever-increasing background of requirement of the novel electron system to Circuit assembly density and function
Sensor just towards miniaturization, develop by the direction of high reliability.Low-temperature co-fired ceramics (Low Temperature Co-fired
Ceramic, LTCC) technology because high frequency characteristics it is good, high reliablity, adaptability is good, at low cost, is able to carry out from encapsulating, convenient for small
The features such as type and the preparation for being widely used in sensor.Current LTCC pressure sensor generally includes four layers, first layer
Upper surface is brushed with planar square-spiral inductance and capacitor top crown, and the second layer sets Packed pressure cavities, and the 4th layer brushed with electricity
Pole plate is held, upper and lower two parts interconnect (such as patent 201310029417.6) by through-hole.Above-mentioned 201310029417.6 make
Cavity is avoided to deform in lamination or sintering process with sacrificial layer technology, it is ensured that sensor component surfacing,
But the cell pressure measurement range of this design is small, and reliability is to be improved.
Summary of the invention
To overcome above structure defect, the present invention provides a kind of low-temperature co-fired ceramics LTCC pressure sensor, the sensor
Using the technique of dissimilar materials matching co-firing, the yield rate, measurement range and reliability of sensor are improved.
To achieve the above object, the invention provides the following technical scheme:
A kind of low-temperature co-fired ceramics LTCC pressure sensor, including top-down three layers of LTCC substrate, first layer LTCC
The upper surface of substrate is printed with the spiral inductance of circular flat, and the lower surface of first layer LTCC substrate is printed with capacitor top crown,
Packed glass is set on second layer LTCC substrate, the upper surface of third layer LTCC substrate is printed with capacitor bottom crown, described
Spiral inductance ectonexine is connect by metal throuth hole with capacitor top crown and capacitor bottom crown respectively and constitutes the circuit LC.
Further, electric signal is radiate by heretofore described spiral inductance by way of electromagnetic field.
Further, deformation occurs in extraneous pressure change for heretofore described capacitor top crown, capacitor pole up and down
Plate distance changes, so that capacitance be made to change.
Further, heretofore described inductance internal layer is connect with capacitor top crown, inductance outer layer and capacitor bottom crown
It connects and forms the circuit LC, convert frequency signal for pressure signal.
Further, the glass of heretofore described sealing is the medium of flat capacitor.
It further, is basic common burning porcelain and glass preparation pressure sensor, Ke Yitong with LTCC technology in the present invention
It crosses emulation and obtains the sensor frequency characteristic.
Further, inductance value is a constant in the present invention, and capacitive part measures pressure, when ambient pressure variation, outside
Boundary's pressure and glass pressure formed pressure difference capacitor top crown is pressurized deformation occurs, the distance d hair on capacitor between bottom crown
Changing, capacitor C change, so that the resonance frequency f of the lc circuit of sensor be made to change.
The present invention in such a way that sacrificial layer technology improves sensor yield rate, proposes one kind compared to existing sensor
Novel model, that is, use glass medium as the medium of square parallel plate capacitor, the finished product for having improved device both
Rate realizes high reliability again and surveys pressure range, and completes the design of miniaturization.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of pressure sensor of the present invention；
Fig. 2 is the surface structure schematic diagram of pressure sensor of the present invention；
Fig. 3 is the schematic perspective view of pressure sensor of the present invention；
Fig. 4 tests 200bar pressure displacement characteristic result figure by specific embodiment；
Fig. 5 tests 0~200bar pressure capacitance characterization result figure by specific embodiment；
Fig. 6 tests 0~200bar bias power frequency characterization result figure by specific embodiment.
Wherein, 1 is capacitor bottom crown, and 2 be through-hole, and 3 be spiral inductance, and 4 be LTCC substrate, and 5 capacitor top crowns, 6 be glass
Glass medium.
Specific embodiment
The specific embodiment of the invention is described in detail below in conjunction with Figure of description:
The content with reference to shown in Fig. 1, the embodiment of the invention provides a kind of pressure sensings based on dissimilar materials matching co-firing
Device, comprising: spiral inductance 3, spiral inductance 3 are located at 4 upper surface of first layer LTCC substrate, and internal layer connects capacitor top crown 5,
Outer layer connects capacitor bottom crown 1, and capacitance structure is made of capacitor top crown 5, capacitor bottom crown 1 and glass medium 6, on capacitor
Pole plate 5 is located at 4 lower surface of first layer LTCC substrate, and capacitor bottom crown 1 is located at 4 upper surface of third layer LTCC substrate, glass medium
6 between capacitor top crown 5 and capacitor bottom crown 1, and the shape and size one with capacitor top crown 5 and capacitor bottom crown 1
It causes.Wherein capacitor top crown 5 and capacitor bottom crown 1 are by through-hole 2 and inductance connection, to be equivalent to concatenated LC circuit.
The LTCC ceramic diaphragm lamination that the LTCC substrate 4 of sensor is all made of same material forms, the inductance of top layer and capacitor and logical
Hole 2 is all made of silver paste.
Capacitive part measures pressure, and when ambient pressure variation, ambient pressure and glass pressure form pressure difference and make electricity
Holding the compression of top crown 5, deformation occurs, and the distance d between capacitor top crown 5 and capacitor bottom crown 1 changes, and capacitor C becomes
Change, so that the lc circuit resonance frequency f of sensor changes.The effect of inductance part is coupled with antenna, and antenna is worked as
Input frequency it is consistent with the resonant frequency of sensor circuit when, great variety can occur for the impedance phase angle of antenna, thus
Know the resonant frequency of sensor circuit.
For the present embodiment in design, inductance is equivalent inductance to be estimated with empirical equation, and the design of capacitor is according to parallel
The design of plate capacitor theory, inductance lsWith capacitor CsIt is calculated by following formula:
Wherein: davgIt is the mean radius of spiral winding, calculation formula is as follows: davg=2rs+n (s+w),
It is packing ratio, calculation formula is as follows:
μ0It is the magnetic conductivity of green sheet material, w is coil width, and s is coil-span, and n is coil turn, rsIt is risen for coil
Beginning radius.
In formula: csFor capacitance, A is pole plate positive area, and d is pole plate spacing, and ε is the dielectric constant of medium, condenser type
The ε and A of sensor are constant, and initial spacing is d0, initial capacitance C0, when pressure effect, initial value d0It reduces
Δ d, relationship are as follows:
It brings capacitor calculation formula into, can obtain
The calculation formula of resonant frequency is as follows:
Available corresponding size is calculated according to above formula, is modeled and is emulated using finite element analysis software
Optimization, finally obtains lc circuit structure shown in Fig. 1.
This example is by determining tool to the two primary structure emulation of circular planar spiral inductance 3 and square plate formula capacitor
Body size and position:
Circular planar spiral inductance 3 is located at 4 upper surface of first layer LTCC substrate, and internal layer connects capacitor top crown 5, outer layer
Connect capacitor bottom crown 1.Coil start radius length is 4mm, coil width 0.3mm, coil-span 0.3mm, coil turn
Number for 4 circle, coil with a thickness of 0.01mm.
Bottom crown and intermediate glass are parallel to each other on capacitor, constitute flat capacitor, and capacitor top crown 5 is located at first layer
4 lower surface of LTCC substrate, capacitor bottom crown 1 are located at 4 upper surface of third layer LTCC substrate.Wherein capacitor top crown 5 passes through through-hole
2 connection inductance internal layers, capacitor bottom crown 1 connects inductance outer layer by through-hole 2, to be equivalent to concatenated LC together with inductance
Circuit.Square capacitance top crown 5 and 1 area of capacitor bottom crown are 4mm*4mm, and 6 volume of glass medium is 4mm*4mm*0.3mm.
Wherein the dielectric constant of glass medium 6 is 5.1, Young's modulus 60GPa, Poisson's ratio 0.21.The dielectric of LTCC substrate 4 is normal
Number is 18, Young's modulus 128GPa, Poisson's ratio 0.28.
The 1/4 model placement property figure simulation result of pressure sensor that the specific embodiment of the invention is done as shown in Fig. 3,
The working sensor is under 0~200bar pressure, and in maximum pressure effect, the sensitive membrane of sensor is displaced 3.7e-4mm.
From finding out in capacitance characteristic Fig. 4 after emulation, capacitance is 0.8445pF under zero pressure, and capacitance is with pressure
Increase and increase, the linearity of curve is fine, maximum pressure effect under capacitor increase 3.4fF.
Find out in frequency domain characteristic simulation result diagram, which is 316.19MHz, frequency and pressure
Negative correlation is presented in power, and frequency reduces 640KHZ under the maximum pressure.
The present invention can be measured by the coupling principle between coil, can be believed pressure under contactless state
Number being converted into frequency signal sends test antenna to, can both work, and can also dislike in high temperature, high pressure etc. at normal temperatures and pressures
It works long hours under bad environment, high sensitivity, stability are good and are not easy to be disturbed；And its compact structure, manufacturing process letter
It is single.The present invention proposes a kind of new compared to existing sensor in such a way that sacrificial layer technology improves sensor yield rate simultaneously
The model of type, that is, use glass medium 6 as the medium of square parallel plate capacitor, the finished product for having improved device both
Rate realizes high reliability again and surveys pressure range, and completes the design of miniaturization
The embodiment of the present invention is expounded in conjunction with attached drawing above, but the invention is not limited to above-mentioned tools
Body embodiment, above-mentioned specific embodiment is only schematical, rather than restrictive, the ordinary skill people of this field
Member under the inspiration of the present invention, without breaking away from the scope protected by the purposes and claims of the present invention, can also make very
Multi-form, all of these belong to the protection of the present invention.
Claims (7)
1. a kind of integrated pressure sensor, including top-down three layers of LTCC substrate, which is characterized in that first layer LTCC substrate
Upper surface be printed with the spiral inductance of circular flat, the lower surface of first layer LTCC substrate is printed with capacitor top crown, second
Packed glass is set on layer LTCC substrate, the upper surface of third layer LTCC substrate is printed with capacitor bottom crown, the spiral
Inductance ectonexine is connect by metal throuth hole with capacitor top crown and capacitor bottom crown respectively and constitutes the circuit LC.
2. integrated pressure sensor according to claim 1, which is characterized in that the spiral inductance passes through electric signal
The form of electromagnetic field is radiate.
3. integrated pressure sensor according to claim 1, which is characterized in that the capacitor top crown is in ambient pressure
Deformation occurs when variation, and bottom crown distance changes on capacitor, so that capacitance be made to change.
4. integrated pressure sensor according to claim 1, which is characterized in that the inductance internal layer and capacitor top crown
Connection, inductance outer layer connect with capacitor bottom crown and form the circuit LC, convert frequency signal for pressure signal.
5. integrated pressure sensor according to claim 1, which is characterized in that the glass of the sealing is flat electricity
The medium of appearance.
6. integrated pressure sensor according to any one of claims 1 to 5, which is characterized in that based on LTCC technology altogether
Ceramics and glass preparation pressure sensor are burnt, which can be obtained by emulation.
7. integrated pressure sensor according to claim 6, which is characterized in that inductance value is a constant, and capacitive part is surveyed
Pressure is measured, when ambient pressure variation, ambient pressure and glass pressure form pressure difference and make the compression of capacitor top crown that shape occur
Become, the distance d on capacitor between bottom crown changes, and capacitor C changes, to make the resonance of the LC circuit of sensor
Frequency f changes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810789013.XA CN109141689A (en) | 2018-07-17 | 2018-07-17 | A kind of low-temperature co-fired ceramics LTCC pressure sensor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810789013.XA CN109141689A (en) | 2018-07-17 | 2018-07-17 | A kind of low-temperature co-fired ceramics LTCC pressure sensor |
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| CN109141689A true CN109141689A (en) | 2019-01-04 |
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| CN201810789013.XA Pending CN109141689A (en) | 2018-07-17 | 2018-07-17 | A kind of low-temperature co-fired ceramics LTCC pressure sensor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110487452A (en) * | 2019-08-27 | 2019-11-22 | 清华大学深圳研究生院 | A kind of Bionic flexible pressure sensor, device for pressure measurement and monitoring system |
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|---|---|---|---|---|
| GB1467387A (en) * | 1973-07-20 | 1977-03-16 | Rca Corp | Tunable inductance or lc circuit |
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| CN103115704A (en) * | 2013-01-25 | 2013-05-22 | 中北大学 | High-temperature pressure sensor and production method thereof |
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| CN103346749A (en) * | 2013-06-20 | 2013-10-09 | 电子科技大学 | LTCC integrated encapsulation surface mounting crystal oscillator |
| CN103366955A (en) * | 2013-07-10 | 2013-10-23 | 华中科技大学 | Glass capacitor and encapsulating device |
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-
2018
- 2018-07-17 CN CN201810789013.XA patent/CN109141689A/en active Pending
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|---|---|---|---|---|
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| JPH0730220A (en) * | 1993-06-25 | 1995-01-31 | Matsushita Electric Ind Co Ltd | Electronic circuit part adjusting method |
| DE19716521A1 (en) * | 1997-04-19 | 1998-10-22 | Bosch Gmbh Robert | Force sensor esp pressure sensor in LTCC technology |
| CN101336461A (en) * | 2006-01-30 | 2008-12-31 | 株式会社村田制作所 | Method for regulating capacitance value of built-in capacitor in multilayered ceramic substrate, and multilayered ceramic substrate and process for producing the same |
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| CN103148977A (en) * | 2013-02-27 | 2013-06-12 | 东南大学 | Flexible-substrate-based passive wireless pressure sensor with self-packaging function |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110487452A (en) * | 2019-08-27 | 2019-11-22 | 清华大学深圳研究生院 | A kind of Bionic flexible pressure sensor, device for pressure measurement and monitoring system |
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Application publication date: 20190104 |