CN109103322B - Novel packaging device - Google Patents
Novel packaging device Download PDFInfo
- Publication number
- CN109103322B CN109103322B CN201811030809.3A CN201811030809A CN109103322B CN 109103322 B CN109103322 B CN 109103322B CN 201811030809 A CN201811030809 A CN 201811030809A CN 109103322 B CN109103322 B CN 109103322B
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- primary color
- chip
- light guide
- light
- color chip
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 41
- 230000003287 optical effect Effects 0.000 claims abstract description 25
- 239000012790 adhesive layer Substances 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 238000005538 encapsulation Methods 0.000 claims description 9
- 230000007423 decrease Effects 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 6
- 229910002027 silica gel Inorganic materials 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims description 3
- 230000006872 improvement Effects 0.000 description 12
- 238000009877 rendering Methods 0.000 description 5
- 239000003086 colorant Substances 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 230000001795 light effect Effects 0.000 description 3
- 238000002310 reflectometry Methods 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002086 nanomaterial Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000009516 primary packaging Methods 0.000 description 1
- 230000009103 reabsorption Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Abstract
The application discloses a novel packaging device, which comprises a packaging substrate, and a light emitting chip set arranged on the packaging substrate, wherein the light emitting chip set comprises a first primary color chip, an optical light distribution device is arranged on the first primary color chip, the optical light distribution device comprises a reflecting part and a light guide part, the light guide part comprises an annular light guide ring and a straight strip type light guide column, two ends of the light guide column are respectively abutted against the inner surface of the light guide ring, the first primary color chip is positioned in the light guide column, the reflecting part is arranged above the first primary color chip, and the light emitting chip set is covered with a packaging adhesive layer. According to the application, the optical light distribution device is arranged on the first primary color chip, so that the light emitted by the first primary color chip can expand the scattering range through the reflecting component and the light guide component, thereby improving the light emitting area of the first primary color chip and further improving the light emitting uniformity of the multi-primary color packaging device.
Description
Technical Field
The application relates to the field of LEDs, in particular to a novel packaging device technology.
Background
The LED light source is recognized as the illumination light source with the most development prospect in the 21 st century, and has the advantages of environmental protection, long service life, energy conservation, high reliability, good light effect, small volume and the like, so that the LED light source has a wider application prospect than the traditional incandescent lamp, fluorescent lamp, energy-saving lamp and the like.
With the continuous improvement of the performance and the continuous reduction of the cost of the LED illumination products, the application range of the LED illumination products is wider and wider. In the field of lighting application, with the improvement of life quality, people pay more attention to the quality of lighting, and color rendering has been paid more and more attention as an important index for influencing the quality of lighting, especially the requirement of indoor environment on color rendering is higher.
Because the red, green and ultraviolet LED chips have lower optical power than the blue LED chips, the main-stream white light LED package is mainly composed of the blue LED chips and yellow fluorescent powder, and because the white light is lack of red light and green light, the color rendering of the light source is extremely low, and the high-quality requirement of the lighting source cannot be met by people at present. For this reason, there is a conventional method in which red and green phosphors are added to a sealing compound to generate red and green light during excitation, thereby improving a color rendering index. However, since a plurality of kinds of phosphors are used, the mixing is likely to be uneven due to the difference in structure, particles, etc. of different phosphors. And the reabsorption is easy to occur among various powders, so that the light efficiency of the device is reduced. In this regard, there is a multi-primary packaging device in the prior art, in which a plurality of LED chips of different colors are used to mix light into white light, but the LED chips of different colors have different light effects, resulting in poor overall mixing uniformity.
Disclosure of Invention
The application aims to solve the technical problems that: the packaging device is high in display index, good in light effect and uniform in color mixing.
The application solves the technical problems as follows: the utility model provides a novel encapsulation device, includes the encapsulation base plate, sets up the luminous chipset on the encapsulation base plate, luminous chipset includes first primary color chip, be provided with optical grading device on the first primary color chip, optical grading device includes reflecting member and light guide part, light guide part includes annular leaded light ring and straight strip type leaded light post, the leaded light post is located the leaded light ring with between the first primary color chip reflecting member installs the top at the first primary color chip, luminous chipset covers outward and has the encapsulation glue film.
As a further improvement of the technical scheme, the reflecting part is columnar, and an arc-shaped concave cavity which is inwards concave is formed in the upper surface of the reflecting part.
As a further improvement of the technical scheme, the reflecting component is a silica gel column, the bottom area of the silica gel column is 0.8-1.2 times of the surface area of the first primary color chip, and the surface of the concave cavity is coated with a reflecting layer.
As the aboveFurther improvement of the technical proposal, the refractive index of the reflecting component is n 1 The refractive index of the light guide member is n 2 The refractive index of the encapsulation adhesive layer is n 3 The n is 1 ≤n 2 The n is 2 -n 3 ≥0.4。
As a further improvement of the technical scheme, the surface of the light guide component is provided with a micro-nano array structure.
As a further improvement of the technical scheme, the end part of the light guide column, which is close to the light guide ring, is a first end part, the structural density of the micro-nano structures on the light guide ring gradually decreases from 20% to 5% from the corresponding position, which is close to the first end part of the light guide column, to the direction, which is far away from the first end part of the light guide strip, and the structural density of the micro-nano array structures on the light guide column gradually decreases from 20% to 5% from the position, which is close to the first primary color chip, to the direction, which is far away from the first primary color chip.
As a further improvement of the technical scheme, the edge of the packaging substrate is provided with the surrounding dam, the light-emitting chip set is positioned in the surrounding dam, the surrounding dam is filled with the packaging adhesive layer, the packaging adhesive layer comprises fluorescent powder adhesive, and the packaging adhesive layer covers the optical light distribution device.
As a further improvement of the technical scheme, the light-emitting chip set further comprises a second primary color chip and a third primary color chip, the number of the first primary color chips is smaller than that of the second primary color chip and the third primary color chip, and the first primary color chips are uniformly distributed on the packaging substrate.
As a further improvement of the technical scheme, the first primary color chip is a red color chip, the second primary color chip is a blue color chip, the third primary color chip is a cyan color chip, and the ratio of the number of the second primary color chip to the number of the third primary color chip is 1-2.
As a further improvement of the technical scheme, the first primary color chip is a cyan chip, the second primary color chip is a blue chip, the third primary color chip is a red chip, and the ratio of the number of the second primary color chip to the number of the third primary color chip is 1-2.
As a further improvement of the technical scheme, the optical power of the blue chip is 1.2-2 times that of the cyan chip; the optical power of the blue chip is 1.2-1.5 times that of the red chip.
The beneficial effects of the application are as follows: according to the application, the optical light distribution device is arranged on the first primary color chip, so that the light emitted by the first primary color chip can expand the scattering range through the reflecting component and the light guide component, thereby improving the light emitting area of the first primary color chip and further improving the light emitting uniformity of the multi-primary color packaging device.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is evident that the drawings described are only some embodiments of the application, but not all embodiments, and that other designs and drawings can be obtained from these drawings by a person skilled in the art without inventive effort.
FIG. 1 is a front view of a novel package of the present application;
FIG. 2 is a partial cross-sectional view of a novel package of the present application;
fig. 3 is a schematic structural view of a light guide member of a novel packaging device according to the present application.
Detailed Description
The conception, specific structure, and technical effects produced by the present application will be clearly and completely described below with reference to the embodiments and the drawings to fully understand the objects, features, and effects of the present application. It is apparent that the described embodiments are only some embodiments of the present application, but not all embodiments, and that other embodiments obtained by those skilled in the art without inventive effort are within the scope of the present application based on the embodiments of the present application. In addition, all coupling/connection relationships mentioned herein do not refer to direct connection of the components, but rather, refer to the fact that a more optimal coupling structure may be formed by adding or subtracting coupling aids depending on the particular implementation. The technical features in the application can be interactively combined on the premise of no contradiction and conflict.
Referring to fig. 1 to 3, a novel packaging device comprises a packaging substrate 1, a light emitting chip set 2 arranged on the packaging substrate 1, wherein the light emitting chip set 2 comprises a first primary color chip, an optical light distribution device 4 is arranged on the first primary color chip, the optical light distribution device 4 comprises a reflecting part 41 and a light guide part 42, the light guide part 42 comprises an annular light guide ring and a straight strip type light guide column, the light guide column is positioned between the light guide ring and the first primary color chip, the reflecting part 41 is arranged above the first primary color chip, and the packaging adhesive layer 3 is covered outside the light emitting chip set 2.
The first primary color chip mentioned in this embodiment may be a simple LED light emitting chip, or may be an LED device after the chip is packaged, where the LED device may conveniently select a light emitting surface, for example, when applied to this embodiment, the LED device may only select side light emitting, and then the light coming out from the side may directly enter the light guiding component, so that the use is more convenient. Of course, besides the above-mentioned packaging structure, the first primary color chip may be any other light-emitting light source unit body in the prior art, where the light-emitting light source unit body has the characteristics of small volume, convenient installation, and the like.
In the conventional multi-primary color package structure, the light emitting area of each light emitting chip is basically the same, and in order to improve the display, the number of different light emitting chips needs to be adjusted, and when the number of light emitting chips of a certain color is smaller than that of light emitting chips of other colors, the light emitting surface of the multi-primary color package structure has uneven conditions of part of display high and part of display low. By arranging the optical light distribution device on the first primary color chip (the chip with the least number of colors), the light of the first primary color chip can be scattered outwards through the light guide component by utilizing the light guide component in the optical light distribution device, so that the light emitting area of the first primary color chip can be effectively increased, and the light emitting of the packaging structure is more uniform. According to the actual demand of production, not every primary color chip is required to be provided with an optical light distribution device, and the periphery of a part of the first primary color chip is not provided with the optical light distribution device. The reflecting component 41 in the optical light distribution device has the function of making a small part of light emitted by the first primary color chip pass through, and reflecting most of light emitted by the first primary color chip into the light guide component, so as to realize the diffusion of the light of the first primary color chip. Since the reflecting member is disposed above the first primary color chip, and the light of the first primary color should be present above the first primary color chip according to practical needs, the reflectivity of the reflecting member in the present application is not 100% total reflection, that is, the reflectivity of the reflecting member is less than 100%, so that some light emitted from the first primary color chip can be emitted from above the reflecting member. Of course, in the prior art, there is already a more mature technology for controlling the reflectivity of the reflecting component, and the description of the present application is omitted.
Further as a preferred embodiment, the reflecting member 41 has a columnar shape, and the upper surface of the reflecting member 41 is provided with an arc-shaped concave cavity which is concave inward. The light emitted by the first primary color chip is reflected into the light guide component when passing through the reflecting component, and the upper surface of the reflecting component is provided with an arc-shaped concave cavity structure according to the installation position and the corresponding structure, so that the light can be reflected into the light guide component on the side surface to the greatest extent.
Further as a preferred embodiment, the reflecting member 41 is a silica gel column, the bottom area of the silica gel column is 0.8-1.2 times of the surface area of the first primary color chip, and the surface of the concave cavity is coated with a reflecting layer.
Further preferably, the refractive index of the reflecting member 41 is n 1 The refractive index of the light guide strip is n 2 The refractive index of the encapsulation adhesive layer 3 is n 3 The n is 1 ≤n 2 The n is 2 -n 3 And more than or equal to 0.4. By adopting the structure, the side light of the first primary color chip and the light reflected by the top can be ensured to be emitted into the light guide component; and n2-n3 is more than or equal to 0.4, so that light with an incidence angle of more than or equal to 40 degrees can be transmitted in the light guide component after total reflection. Generally, a light guide member is required to have a high refractive index (refractive index isAbout 1.7) of a transparent material, such as UV glue.
Further, as a preferred embodiment, the side surface of the light guide member 42 is provided with a micro-nano array structure. After the micro-nano array structure is arranged, the effects of partial total reflection and partial refraction can be realized, and the light conduction and diffusion can be realized.
Further, as a preferred embodiment, the end of the light guide column near the light guide ring is a first end, the structural density of the micro-nano structures on the light guide ring gradually decreases from 20% to 5% from the corresponding position near the first end of the light guide column to the direction away from the first end of the light guide strip, and the structural density of the micro-nano array structures on the light guide column gradually decreases from the position near the first primary color chip to the direction away from the first primary color chip from 20% to 5%. As shown in fig. 3, the structural density of the micro-nano array structure on the light guide ring decreases from 20% to 5% along the direction of the arrow B, i.e. the micro-nano array structure near the first end of the light guide column is more sparse; the structural density of the micro-nano array structures on the light guide strip is gradually decreased from 20% to 5% along the arrow direction a, (the structural density of the micro-nano array structures=the distance between adjacent micro-nano array structures/the length of the light guide component), namely, the micro-nano array structures close to the light guide component at the first primary color chip are relatively sparse, so that light can be outwards diffused as much as possible.
Further as a preferred embodiment, a dam is provided at the edge of the package substrate 1, the light emitting chip set 2 is located in the dam, the dam is filled with the package adhesive layer 3, the package adhesive layer 3 includes a phosphor adhesive, and the package adhesive layer 3 covers the optical light distribution device 4. And a white surrounding dam is arranged outside the packaging substrate 1, and a white light LED packaging structure is formed by filling yellow fluorescent powder glue in a blank area in the surrounding dam. The yellow phosphor paste may have a height slightly higher than the height of the light guide member.
Further as a preferred embodiment, the light emitting chipset 2 further includes a second primary color chip and a third primary color chip, the number of the first primary color chips is smaller than that of the second primary color chip and the third primary color chip, and the first primary color chips are uniformly distributed on the package substrate 1.
Further as a preferred embodiment, the first primary color chip is a red color chip, the second primary color chip is a blue color chip, the third primary color chip is a cyan color chip, and the ratio of the number of the second primary color chip to the number of the third primary color chip is 1-2.
In other embodiments, the first primary color chip is a cyan color chip, the second primary color chip is a blue color chip, the third primary color chip is a red color chip, and the ratio of the number of the second primary color chip to the number of the third primary color chip is 1-2.
Preferably, in order to improve the color rendering index, the packaging device preferably adopts blue, cyan and red chips connected in series, and combines a plurality of strings of light emitting chips connected in parallel.
Also preferably, the blue chip has an optical power of 1.2-2 times that of the cyan chip, and the blue chip has an optical power of 1.2-1.5 times that of the red chip. When the device is of high color temperature (4000-6500K), the ratio of the number of blue chips to the number of cyan chips is: 1-2, and each string of chips at least contains more than 1 red chips (namely, first primary color chips); and when the device is of low color temperature (2700-4000K), the ratio of the number of blue chips to the number of red chips is: each string of 1-2 chips at least contains more than 1 cyan chips (namely, the first primary color chips).
High color temperature: blue and cyan chips are uniformly distributed on the packaging substrate, and are distributed at intervals when the proportion is the same. The red chips are uniformly dispersed and distributed.
Low color temperature: the blue chips and the red chips are uniformly distributed on the packaging substrate, and are distributed at intervals when the proportion is the same. The cyan chips are uniformly dispersed and distributed.
While the preferred embodiment of the present application has been described in detail, the application is not limited to the embodiments, and various equivalent modifications and substitutions can be made by those skilled in the art without departing from the spirit of the application, and these modifications and substitutions are intended to be included in the scope of the present application as defined in the appended claims.
Claims (8)
1. The utility model provides a novel encapsulation device, includes encapsulation base plate (1), sets up luminous chipset (2) on encapsulation base plate (1), its characterized in that: the light emitting chip set (2) comprises a first primary color chip, an optical light distribution device (4) is arranged on the first primary color chip, the optical light distribution device (4) comprises a reflecting part (41) and a light guide part (42), the light guide part (42) comprises an annular light guide ring and a straight strip type light guide column, the light guide column is positioned between the light guide ring and the first primary color chip, the reflecting part (41) is arranged above the first primary color chip, and a packaging adhesive layer (3) is covered outside the light emitting chip set (2); the refractive index of the reflecting member (41) is n 1 The refractive index of the light guide member (42) is n 2 The refractive index of the packaging adhesive layer (3) is n 3 The n is 1 ≤n 2 The n is 2 -n 3 More than or equal to 0.4; the surface of the light guide component (42) is provided with a micro-nano array structure; the end part of the light guide column, which is close to the light guide ring, is a first end part, the structural density of the micro-nano array structure on the light guide ring gradually decreases from the corresponding position, which is close to the first end part of the light guide column, to the direction, which is far away from the first end part of the light guide strip, and the structural density of the micro-nano array structure on the light guide column gradually decreases from the position, which is close to the first primary color chip, to the direction, which is far away from the first primary color chip.
2. The novel packaging device of claim 1, wherein: the reflecting part (41) is columnar, and an arc-shaped concave cavity which is inwards concave is formed in the upper surface of the reflecting part (41).
3. The novel packaging device of claim 2, wherein: the reflecting component (41) is a silica gel column, the bottom area of the silica gel column is 0.8-1.2 times of the surface area of the first primary color chip, and the surface of the concave cavity is coated with a reflecting layer.
4. The novel packaging device of claim 1, wherein: the edge of the packaging substrate (1) is provided with a surrounding dam, the light-emitting chip set (2) is located in the surrounding dam, the surrounding dam is filled with the packaging adhesive layer (3), the packaging adhesive layer (3) comprises fluorescent powder adhesive, and the packaging adhesive layer (3) covers the optical light distribution device (4).
5. The novel packaging device of claim 1, wherein: the light-emitting chip set (2) further comprises second primary color chips and third primary color chips, the number of the first primary color chips is smaller than that of the second primary color chips and the third primary color chips, and the first primary color chips are uniformly distributed on the packaging substrate (1).
6. The novel packaging apparatus of claim 5, wherein: the first primary color chip is a red chip, the second primary color chip is a blue chip, the third primary color chip is a cyan chip, and the ratio of the number of the second primary color chip to the number of the third primary color chip is 1-2.
7. The novel packaging apparatus of claim 5, wherein: the first primary color chip is a cyan chip, the second primary color chip is a blue chip, the third primary color chip is a red chip, and the ratio of the number of the second primary color chip to the number of the third primary color chip is 1-2.
8. The novel packaging apparatus of claim 6 or 7, wherein: the optical power of the blue chip is 1.2-2 times of that of the cyan chip; the optical power of the blue chip is 1.2-1.5 times that of the red chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811030809.3A CN109103322B (en) | 2018-09-05 | 2018-09-05 | Novel packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811030809.3A CN109103322B (en) | 2018-09-05 | 2018-09-05 | Novel packaging device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109103322A CN109103322A (en) | 2018-12-28 |
| CN109103322B true CN109103322B (en) | 2023-11-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811030809.3A Active CN109103322B (en) | 2018-09-05 | 2018-09-05 | Novel packaging device |
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| CN (1) | CN109103322B (en) |
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| CN101345236A (en) * | 2008-05-07 | 2009-01-14 | 蒋峰 | Evenly illuminated white light LED module group packaging optical scheme |
| CN102142510A (en) * | 2010-02-01 | 2011-08-03 | 深圳市光峰光电技术有限公司 | Solid light source based on optical wavelength conversion and application of solid light source |
| CN102593308A (en) * | 2011-01-11 | 2012-07-18 | 展晶科技(深圳)有限公司 | Light emitting diode package structure |
| CN103311418A (en) * | 2012-03-06 | 2013-09-18 | 展晶科技(深圳)有限公司 | Light emitting diode module |
| JP2014179407A (en) * | 2013-03-14 | 2014-09-25 | Stanley Electric Co Ltd | Led light-emitting device, and lighting fixture for vehicle using the same |
| CN105006508A (en) * | 2015-07-02 | 2015-10-28 | 厦门市三安光电科技有限公司 | Light emitting diode packaging structure |
| CN208753368U (en) * | 2018-09-05 | 2019-04-16 | 佛山市国星光电股份有限公司 | A kind of novel encapsulated device |
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2018
- 2018-09-05 CN CN201811030809.3A patent/CN109103322B/en active Active
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| CN101345236A (en) * | 2008-05-07 | 2009-01-14 | 蒋峰 | Evenly illuminated white light LED module group packaging optical scheme |
| CN102142510A (en) * | 2010-02-01 | 2011-08-03 | 深圳市光峰光电技术有限公司 | Solid light source based on optical wavelength conversion and application of solid light source |
| CN102593308A (en) * | 2011-01-11 | 2012-07-18 | 展晶科技(深圳)有限公司 | Light emitting diode package structure |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN109103322A (en) | 2018-12-28 |
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