CN109071845A - 保护膜形成用膜以及保护膜形成用复合片 - Google Patents

保护膜形成用膜以及保护膜形成用复合片 Download PDF

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Publication number
CN109071845A
CN109071845A CN201780025032.9A CN201780025032A CN109071845A CN 109071845 A CN109071845 A CN 109071845A CN 201780025032 A CN201780025032 A CN 201780025032A CN 109071845 A CN109071845 A CN 109071845A
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CN
China
Prior art keywords
protective film
film formation
methyl
film
energy ray
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201780025032.9A
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English (en)
Chinese (zh)
Other versions
CN109071845B (zh
Inventor
山本大辅
稻男洋
稻男洋一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
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Lintec Corp
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Publication of CN109071845A publication Critical patent/CN109071845A/zh
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Publication of CN109071845B publication Critical patent/CN109071845B/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00—Characterised by the use of unspecified polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN201780025032.9A 2016-04-28 2017-04-25 保护膜形成用膜以及保护膜形成用复合片 Active CN109071845B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016092013 2016-04-28
JP2016-092013 2016-04-28
PCT/JP2017/016335 WO2017188231A1 (ja) 2016-04-28 2017-04-25 保護膜形成用フィルム及び保護膜形成用複合シート

Publications (2)

Publication Number Publication Date
CN109071845A true CN109071845A (zh) 2018-12-21
CN109071845B CN109071845B (zh) 2024-08-09

Family

ID=60161658

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780025032.9A Active CN109071845B (zh) 2016-04-28 2017-04-25 保护膜形成用膜以及保护膜形成用复合片

Country Status (5)

Country Link
JP (1) JP6971977B2 (ko)
KR (1) KR102407322B1 (ko)
CN (1) CN109071845B (ko)
TW (1) TWI781099B (ko)
WO (1) WO2017188231A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111951694A (zh) * 2019-05-16 2020-11-17 三星显示有限公司 高分子树脂、包含其的窗口模组以及包括其窗口模组的显示装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102519799B1 (ko) * 2018-03-30 2023-04-10 린텍 가부시키가이샤 지지 시트 및 보호막 형성용 복합 시트
JP7288200B2 (ja) * 2020-07-30 2023-06-07 日亜化学工業株式会社 発光装置および梱包体

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007297591A (ja) * 2006-04-06 2007-11-15 Lintec Corp 粘着シート
CN101831253A (zh) * 2009-03-11 2010-09-15 日东电工株式会社 无基材压敏粘合片、其生产方法及使用其的研磨方法
JP2013181109A (ja) * 2012-03-02 2013-09-12 Nitto Denko Corp 粘着シート
CN104937712A (zh) * 2013-03-22 2015-09-23 琳得科株式会社 保护膜形成用膜及保护膜形成用复合片

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5144433B1 (ko) 1970-02-02 1976-11-29
KR100815383B1 (ko) 2006-12-28 2008-03-20 제일모직주식회사 점착필름 형성용 광경화성 조성물 및 이를 포함하는 다이싱다이본딩 필름
JP2010031183A (ja) 2008-07-30 2010-02-12 Furukawa Electric Co Ltd:The エネルギー線硬化型チップ保護用フィルム
JP5144433B2 (ja) * 2008-08-28 2013-02-13 古河電気工業株式会社 チップ保護用フィルム
JP5048815B2 (ja) * 2010-07-20 2012-10-17 日東電工株式会社 フリップチップ型半導体裏面用フィルム、及び、ダイシングテープ一体型半導体裏面用フィルム
TWI637439B (zh) * 2012-12-14 2018-10-01 琳得科股份有限公司 Protective film forming film
WO2016027883A1 (ja) * 2014-08-22 2016-02-25 リンテック株式会社 保護膜形成用シートおよび保護膜付き半導体チップの製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007297591A (ja) * 2006-04-06 2007-11-15 Lintec Corp 粘着シート
CN101831253A (zh) * 2009-03-11 2010-09-15 日东电工株式会社 无基材压敏粘合片、其生产方法及使用其的研磨方法
JP2010212474A (ja) * 2009-03-11 2010-09-24 Nitto Denko Corp 半導体ウエハ保護用基材レス粘着シート、その粘着シートを用いた半導体ウエハ裏面研削方法及びその粘着シートの製造方法
JP2013181109A (ja) * 2012-03-02 2013-09-12 Nitto Denko Corp 粘着シート
CN104937712A (zh) * 2013-03-22 2015-09-23 琳得科株式会社 保护膜形成用膜及保护膜形成用复合片

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111951694A (zh) * 2019-05-16 2020-11-17 三星显示有限公司 高分子树脂、包含其的窗口模组以及包括其窗口模组的显示装置

Also Published As

Publication number Publication date
WO2017188231A1 (ja) 2017-11-02
KR20190002471A (ko) 2019-01-08
JP6971977B2 (ja) 2021-11-24
KR102407322B1 (ko) 2022-06-10
TW201806767A (zh) 2018-03-01
TWI781099B (zh) 2022-10-21
JPWO2017188231A1 (ja) 2019-03-07
CN109071845B (zh) 2024-08-09

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