CN109062283A - A kind of temperature monitoring method and device of dmd chip - Google Patents
A kind of temperature monitoring method and device of dmd chip Download PDFInfo
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- CN109062283A CN109062283A CN201810803199.XA CN201810803199A CN109062283A CN 109062283 A CN109062283 A CN 109062283A CN 201810803199 A CN201810803199 A CN 201810803199A CN 109062283 A CN109062283 A CN 109062283A
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- dmd chip
- operating temperature
- preset threshold
- temperature
- alarm
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
- G05D23/22—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element being a thermocouple
Abstract
The present invention discloses the temperature monitoring method and device of a kind of dmd chip, this method comprises: the operating temperature of sensing dmd chip different location；Judge that whether at least having one in each operating temperature is greater than the first preset threshold, if then carrying out closing alarm, if otherwise continuing to judge, whether at least having one in each operating temperature is greater than the second preset threshold, if then carrying out reducing brightness alarm, if otherwise continuing to judge whether the difference between front position and the operating temperature of back position is greater than third predetermined threshold value, if then carrying out closing alarm, if otherwise continuing to judge whether difference is greater than the 4th preset threshold, if then carrying out reducing brightness alarm, if otherwise without alarming and continuing to sense and judge.The present invention can real-time monitoring dmd chip operating temperature, and alarmed accordingly for the different situations of the operating temperature difference of operating temperature and positive back position.
Description
Technical field
The present invention relates to projection device technical fields.More particularly, to the temperature monitoring method and dress of a kind of dmd chip
It sets.
Background technique
Currently, widely applied DLP (Digital Light Processing, digital light processing) projector is to be based on
DMD (Digital Micromirror Device, digital micromirror device) chip shows to complete viewable numbers information.DLP is thrown
In shadow machine, light beam is emitted on dmd chip after passing through a series of lens, after the display image of dmd chip is irradiated by hot spot
It is reflected into camera lens projection, to form projected image.Dmd chip is the key element in DLP projector, and performance is largely
Determine the overall performance of DLP projector.
After hot spot is radiated on dmd chip, dmd chip reflects hot spot.Since dmd chip can not be to no spot
It carries out fully reflective, so that the part luminous energy of hot spot is converted into thermal energy, and is absorbed by dmd chip.Since the energy of hot spot is higher,
Under hot spot irradiation the temperature of dmd chip is increased.And the heatproof degree of dmd chip is usually limited, it is therefore, bright when hot spot
When spending the position that high or hot spot is radiated on dmd chip and shifting, the temperature of dmd chip can be made to be higher than maximum resistance to
Temperature value, and then dmd chip is caused to be damaged.
Accordingly, it is desirable to provide the temperature monitoring method and device of a kind of dmd chip.
Summary of the invention
The purpose of the present invention is to provide a kind of temperature monitoring method of dmd chip and devices.
In order to achieve the above objectives, the present invention adopts the following technical solutions:
First aspect present invention provides a kind of temperature monitoring method of dmd chip, comprising:
Sense the operating temperature of dmd chip different location；
Judge the operating temperature of dmd chip different location and the relationship of the first preset threshold and the second preset threshold:
If at least having one in the operating temperature of dmd chip different location is greater than the first preset threshold, closed
Alarm；
If the operating temperature of dmd chip different location, which is respectively less than, is equal to the first preset threshold and dmd chip different location
At least there is one in operating temperature and be greater than the second preset threshold, then carries out reducing brightness alarm；
If the operating temperature of dmd chip different location, which is respectively less than, is equal to the second preset threshold, dmd chip front position is judged
Set the relationship of the difference and third predetermined threshold value and the 4th preset threshold between the operating temperature of back position: if difference is greater than
Third predetermined threshold value then carries out closing alarm；If difference is less than or equal to third predetermined threshold value and is greater than the 4th preset threshold, into
Row reduces brightness alarm.
Preferably, the operating temperature of the sensing dmd chip different location includes: sensing dmd chip back center position
Operating temperature, and sense the operating temperature of two symmetric positions of dmd chip front edge.
Preferably, this method further include: judge the difference between dmd chip front position and the operating temperature of back position
With the relationship of the 4th preset threshold:
If difference is less than or equal to the 4th preset threshold, DMD is calculated according to the operating temperature of dmd chip back center position
The operating temperature of the modulated micro mirror array of chip, and judge the operating temperature and first of the modulated micro mirror array of dmd chip
The relationship of preset threshold and the second preset threshold:
If the operating temperature of the modulated micro mirror array of dmd chip is greater than the first preset threshold, closing alarm is carried out；
If the operating temperature of the modulated micro mirror array of dmd chip is less than or equal to the first preset threshold and presets greater than second
Threshold value then carries out reducing brightness alarm.
Preferably, the modulated micro mirror battle array that dmd chip is calculated according to the operating temperature of dmd chip back center position
The operating temperature of column further comprises:
For the DLP projector using a dmd chip processing three primary colours light, dmd chip is calculated using following formula
The work temperature array of modulated micro mirror array:
Tarray=A+ (L* α+3) * B；
For handling the DLP projector of three primary colours light respectively using three dmd chips, DMD core is calculated using following formula
The work temperature array of the modulated micro mirror array of piece:
Tarray=A+ (L* α/3+3) * B；
Wherein, A is the operating temperature of dmd chip back center position, and unit is DEG C；L is projection brightness setting value, unit
For lm；α is dmd chip coefficient, unit w/lm；B be dmd chip thermal resistance, unit be DEG C/w.
Preferably, first preset threshold is 65 DEG C, and second preset threshold is 60 DEG C, the third predetermined threshold value
It is 10 DEG C, the 4th preset threshold is 7 DEG C.
Second aspect of the present invention provides a kind of device for monitoring temperature of dmd chip, including is set to dmd chip different location
Multiple thermocouples, microprocessor and alarm；
The multiple thermocouple senses the operating temperature of dmd chip different location；
The microprocessor judges the operating temperature and the first preset threshold and the second default threshold of dmd chip different location
The relationship of value:
If at least having one in the operating temperature of dmd chip different location is greater than the first preset threshold, to alarm
It sends and closes alarm command；
If the operating temperature of dmd chip different location, which is respectively less than, is equal to the first preset threshold and dmd chip different location
At least there is one in operating temperature and be greater than the second preset threshold, then sending to alarm reduces brightness alarm command；
If the operating temperature of dmd chip different location, which is respectively less than, is equal to the second preset threshold, dmd chip front position is judged
Set the relationship of the difference and third predetermined threshold value and the 4th preset threshold between the operating temperature of back position: if difference is greater than
Third predetermined threshold value then sends to alarm and closes alarm command；If difference is less than or equal to third predetermined threshold value and is greater than the 4th
Preset threshold, then sending to alarm reduces brightness alarm command；
The alarm carries out closing alarm or reduction brightness according to closing alarm command or reducing brightness alarm command
Alarm.
Preferably, the multiple thermocouple includes: set on the first thermocouple of dmd chip back center position and right
Claim the second thermocouple and third thermocouple that are set to dmd chip front edge position.
Preferably, the microprocessor judges the difference between dmd chip front position and the operating temperature of back position
With the relationship of the 4th preset threshold:
If difference is less than or equal to the 4th preset threshold, dmd chip is calculated according to the operating temperature of the first thermocouple sensing
Modulated micro mirror array operating temperature, and judge the operating temperature of the modulated micro mirror array of dmd chip and first default
The relationship of threshold value and the second preset threshold:
If the operating temperature of the modulated micro mirror array of dmd chip is greater than the first preset threshold, sends and close to alarm
Close alarm command；
If the operating temperature of the modulated micro mirror array of dmd chip is less than or equal to the first preset threshold and presets greater than second
Threshold value, then sending to alarm reduces brightness alarm command.
Preferably, the microprocessor,
For the DLP projector using a dmd chip processing three primary colours light, dmd chip is calculated using following formula
The work temperature array of modulated micro mirror array:
Tarray=A+ (L* α+3) * B；
For handling the DLP projector of three primary colours light respectively using three dmd chips, DMD core is calculated using following formula
The work temperature array of the modulated micro mirror array of piece:
Tarray=A+ (L* α/3+3) * B；
Wherein, A is the operating temperature of the first thermocouple sensing, and unit is DEG C；L is projection brightness setting value, unit lm；
α is dmd chip coefficient, unit w/lm；B be dmd chip thermal resistance, unit be DEG C/w.
Preferably, first preset threshold is 65 DEG C, and second preset threshold is 60 DEG C, the third predetermined threshold value
It is 10 DEG C, the 4th preset threshold is 7 DEG C.
Beneficial effects of the present invention are as follows:
Technical solution of the present invention can real-time monitoring dmd chip operating temperature, and be directed to dmd chip operating temperature
Different situations and the different situations of operating temperature difference of the positive back position of dmd chip alarmed accordingly.
Detailed description of the invention
Specific embodiments of the present invention will be described in further detail with reference to the accompanying drawing；
Fig. 1 shows the flow chart of the temperature monitoring method of dmd chip provided in an embodiment of the present invention.
Fig. 2 shows the schematic block diagrams of the device for monitoring temperature of dmd chip provided in an embodiment of the present invention.
Fig. 3 shows the schematic diagram of position of thermocouple.
Specific embodiment
In order to illustrate more clearly of the present invention, the present invention is done further below with reference to preferred embodiments and drawings
It is bright.Similar component is indicated in attached drawing with identical appended drawing reference.It will be appreciated by those skilled in the art that institute is specific below
The content of description is illustrative and be not restrictive, and should not be limited the scope of the invention with this.
As shown in Figure 1, An embodiment provides a kind of temperature monitoring methods of dmd chip, comprising:
Sense the operating temperature of dmd chip different location；
Judge the operating temperature of dmd chip different location and the relationship of the first preset threshold and the second preset threshold:
If at least having one in the operating temperature of dmd chip different location is greater than the first preset threshold, closed
Alarm, such as carry out audio alert " dmd chip temperature is more than limit value, asks pass hull closure "；
If the operating temperature of dmd chip different location, which is respectively less than, is equal to the first preset threshold and dmd chip different location
At least there is one in operating temperature and be greater than the second preset threshold, then carries out reducing brightness alarm, such as carry out audio alert
" dmd chip temperature is more than limit value, low projection brightness of begging to surrender "；
If the operating temperature of dmd chip different location, which is respectively less than, is equal to the second preset threshold, dmd chip front position is judged
Set the relationship of the difference and third predetermined threshold value and the 4th preset threshold between the operating temperature of back position: if difference is greater than
Third predetermined threshold value then carries out closing alarm；If difference is less than or equal to third predetermined threshold value and is greater than the 4th preset threshold, into
Row reduces brightness alarm.
It is understood that if in the operating temperature of the dmd chip different location of sensing including the work of multiple front positions
Make the operating temperature of temperature and/or multiple back positions, then judge dmd chip front position and back position operating temperature it
Between difference when, the difference between all front positions and the operating temperature of all back positions is all larger than third predetermined threshold value,
Determine that the difference between dmd chip front position and the operating temperature of back position is greater than third predetermined threshold value, it is pre- with the 4th
If the comparison of threshold value.
The temperature monitoring method of dmd chip provided in this embodiment, can real-time monitoring dmd chip operating temperature, and needle
The different situations of the operating temperature difference of the positive back position of different situations and dmd chip to the operating temperature of dmd chip carry out
Corresponding alarm.
In some optional implementations of the present embodiment, the operating temperature of sensing dmd chip different location includes: sense
The operating temperature of dmd chip back center position is surveyed, and senses the work temperature of two symmetric positions of dmd chip front edge
Degree.
In some optional implementations of the present embodiment, a dmd chip different location is sensed at regular intervals
Operating temperature, and will continuously sense multiple dmd chip different location operating temperature mean value as in a period
The operating temperature of dmd chip different location substitutes into subsequent judgement and calculating, such as primary every 5 seconds sensings, will continuously sense
12 mean values substitute into subsequent judgement and calculating as the operating temperature in 1 minute, by the operating temperature in 1 minute.Using
Such implementation can avoid the value that certain is once sensed and jump, and lead to the alarm of mistake.
In some optional implementations of the present embodiment, this method further include: judge dmd chip front position and back
The relationship of difference and the 4th preset threshold between the operating temperature of face position:
If difference is less than or equal to the 4th preset threshold, DMD is calculated according to the operating temperature of dmd chip back center position
The operating temperature of the modulated micro mirror array of chip, and judge the operating temperature and first of the modulated micro mirror array of dmd chip
The relationship of preset threshold and the second preset threshold:
If the operating temperature of the modulated micro mirror array of dmd chip is greater than the first preset threshold, closing alarm is carried out；
If the operating temperature of the modulated micro mirror array of dmd chip is less than or equal to the first preset threshold and presets greater than second
Threshold value then carries out reducing brightness alarm.
Using such implementation, in the work temperature for the positive back position of operating temperature and dmd chip for judging dmd chip
Degree difference meets the requirements, and after being not required to alarm, further judges the work of the modulated micro mirror array of the critical component-of dmd chip
Whether temperature meets the requirements and is alarmed accordingly, and the accuracy of monitoring is higher.
In some optional implementations of the present embodiment, according to the operating temperature meter of dmd chip back center position
The operating temperature for calculating the modulated micro mirror array of dmd chip further comprises:
For the DLP projector (1-DLP projector) using a dmd chip processing three primary colours light, using following formula
Calculate the work temperature array of the modulated micro mirror array of dmd chip:
Tarray=A+ (L* α+3) * B；
For handling the DLP projector (3-DLP projector) of three primary colours light respectively using three dmd chips, using as follows
Formula calculates the work temperature array of the modulated micro mirror array of dmd chip:
Tarray=A+ (L* α/3+3) * B；
Wherein, A is the operating temperature of dmd chip back center position, and unit is DEG C；L is projection brightness setting value, unit
For lm；α is dmd chip coefficient, indicates the ratio of dmd chip power consumption and projection brightness, unit w/lm；B is dmd chip thermal resistance,
Indicate the thermal resistance of modulated micro mirror array to dmd chip front face surface, unit is DEG C/w.
In some optional implementations of the present embodiment, the first preset threshold is 65 DEG C, and the second preset threshold is 60
DEG C, third predetermined threshold value is 10 DEG C, and the 4th preset threshold is 7 DEG C.
As shown in Fig. 2, another embodiment of the present invention provides a kind of device for monitoring temperature of dmd chip, including set
In multiple thermocouples, microprocessor and the alarm of dmd chip different location；
Multiple thermocouples sense the operating temperature of dmd chip different location；
Microprocessor judges the operating temperature and the first preset threshold and the second preset threshold of dmd chip different location
Relationship:
If at least having one in the operating temperature of dmd chip different location is greater than the first preset threshold, to alarm
It sends and closes alarm command；
If the operating temperature of dmd chip different location, which is respectively less than, is equal to the first preset threshold and dmd chip different location
At least there is one in operating temperature and be greater than the second preset threshold, then sending to alarm reduces brightness alarm command；
If the operating temperature of dmd chip different location, which is respectively less than, is equal to the second preset threshold, dmd chip front position is judged
Set the relationship of the difference and third predetermined threshold value and the 4th preset threshold between the operating temperature of back position: if difference is greater than
Third predetermined threshold value then sends to alarm and closes alarm command；If difference is less than or equal to third predetermined threshold value and is greater than the 4th
Preset threshold, then sending to alarm reduces brightness alarm command；
Alarm carries out closing alarm or reduces brightness alarm according to closing alarm command or reducing brightness alarm command,
Such as alarm is phonetic alarm, audio alert content is " dmd chip temperature is more than limit value, asks pass hull closure " or " DMD core
Piece temperature is more than limit value, low projection brightness of begging to surrender ".
The device for monitoring temperature of dmd chip provided in this embodiment, can real-time monitoring dmd chip operating temperature, and needle
The different situations of the operating temperature difference at the positive back side of different situations and dmd chip to the operating temperature of dmd chip carry out corresponding
Alarm.
As shown in figure 3, multiple thermocouples include: set on dmd chip in some optional implementations of the present embodiment
First thermocouple TP1 of back center position, and it is symmetrically set in dmd chip front edge the second thermocouple TP2 and third heat
Galvanic couple TP3, TP1, TP2 and TP3 sense the operating temperature of corresponding position in real time, and feedback temperature value respectively: temperature 1,2 and of temperature
Temperature 3.At this point, " difference between dmd chip front position and the operating temperature of back position is greater than third predetermined threshold value " is i.e.
For Δ T1=| temperature 2- temperature 1 | and Δ T2=| temperature 3- temperature 1 | it is all larger than third predetermined threshold value.
In some optional implementations of the present embodiment, TP1, TP2 and TP3 sense a temperature at regular intervals
1, the mean value of temperature 2 and temperature 3, temperature 1, temperature 2 and the temperature 3 that microprocessor senses TP1, TP2 and TP3 continuous several times is made
For the operating temperature of corresponding position.For example, TP1, TP2 and TP3 and every 5 seconds sensings temperature 1, temperature 2 and temperature 3, micro-
Processor is by temperature 1, the mean value of temperature 2 and temperature 3 of continuous 12 sensings of TP1, TP2 and TP3, as TP1, TP2 and TP3 phase
The operating temperature in 1 minute of position is answered, and subsequent judgement and calculating are carried out to it.
In some optional implementations of the present embodiment, microprocessor judges dmd chip front position and back side position
The relationship for the difference and the 4th preset threshold between operating temperature set:
If difference is less than or equal to the 4th preset threshold, dmd chip is calculated according to the operating temperature of the first thermocouple sensing
Modulated micro mirror array operating temperature, and judge the operating temperature of the modulated micro mirror array of dmd chip and first default
The relationship of threshold value and the second preset threshold:
If the operating temperature of the modulated micro mirror array of dmd chip is greater than the first preset threshold, sends and close to alarm
Close alarm command；
If the operating temperature of the modulated micro mirror array of dmd chip is less than or equal to the first preset threshold and presets greater than second
Threshold value, then sending to alarm reduces brightness alarm command.
Using such implementation, in the work temperature for the positive back position of operating temperature and dmd chip for judging dmd chip
Degree difference meets the requirements, and after being not required to alarm, further judges the work of the modulated micro mirror array of the critical component-of dmd chip
Whether temperature meets the requirements and is alarmed accordingly, and the accuracy of monitoring is higher.
In some optional implementations of the present embodiment, microprocessor,
For the DLP projector using a dmd chip processing three primary colours light, dmd chip is calculated using following formula
The work temperature array of modulated micro mirror array:
Tarray=A+ (L* α+3) * B；
For handling the DLP projector of three primary colours light respectively using three dmd chips, DMD core is calculated using following formula
The work temperature array of the modulated micro mirror array of piece:
Tarray=A+ (L* α/3+3) * B；
Wherein, A is the operating temperature of the first thermocouple sensing, and unit is DEG C；L is projection brightness setting value, unit lm；
α is dmd chip coefficient, indicates the ratio of dmd chip power consumption and projection brightness, unit w/lm；B is dmd chip thermal resistance, and expression can
Modulate micro mirror array to dmd chip front face surface thermal resistance, unit be DEG C/w.
DMD thermal resistance: unit DEG C/W, (degree Celsius every watt) refer to the thermal resistance of Tarry to the surface DMD.
In some optional implementations of the present embodiment, the first preset threshold is 65 DEG C, and the second preset threshold is 60
DEG C, third predetermined threshold value is 10 DEG C, and the 4th preset threshold is 7 DEG C.
In the description of the present invention, it should be noted that the orientation or positional relationship of the instructions such as term " on ", "lower" is base
In orientation or positional relationship shown in the drawings, it is merely for convenience of description of the present invention and simplification of the description, rather than indication or suggestion
Signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as to this
The limitation of invention.Unless otherwise clearly defined and limited, term " installation ", " connected ", " connection " shall be understood in a broad sense, example
Such as, it may be fixed connection or may be dismantle connection, or integral connection；It can be mechanical connection, be also possible to be electrically connected
It connects；It can be directly connected, the connection inside two elements can also be can be indirectly connected through an intermediary.For this
For the those of ordinary skill in field, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
It should also be noted that, in the description of the present invention, relational terms such as first and second and the like are only used
Distinguish one entity or operation from another entity or operation, without necessarily requiring or implying these entities or
There are any actual relationship or orders between operation.Moreover, the terms "include", "comprise" or its any other change
Body is intended to non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wrapped
Those elements are included, but also including other elements that are not explicitly listed, or further includes for this process, method, article
Or the element that equipment is intrinsic.In the absence of more restrictions, the element limited by sentence "including a ...", and
It is not excluded in process, method, article or equipment in the process, method, article or apparatus that includes the element that there is also other identical elements.
Obviously, the above embodiment of the present invention be only to clearly illustrate example of the present invention, and not be pair
The restriction of embodiments of the present invention for those of ordinary skill in the art on the basis of the above description can be with
It makes other variations or changes in different ways, all embodiments can not be exhaustive here, it is all to belong to the present invention
The obvious changes or variations extended out of technical solution still in the scope of protection of the present invention.
Claims (10)
1. a kind of temperature monitoring method of dmd chip characterized by comprising
Sense the operating temperature of dmd chip different location；
Judge the operating temperature of dmd chip different location and the relationship of the first preset threshold and the second preset threshold:
If at least having one in the operating temperature of dmd chip different location is greater than the first preset threshold, closing alarm is carried out；
If the operating temperature of dmd chip different location is respectively less than the work for being equal to the first preset threshold and dmd chip different location
At least there is one in temperature and be greater than the second preset threshold, then carries out reducing brightness alarm；
If the operating temperature of dmd chip different location be respectively less than be equal to the second preset threshold, judge dmd chip front position with
The relationship of difference and third predetermined threshold value and the 4th preset threshold between the operating temperature of back position: if difference is greater than third
Preset threshold then carries out closing alarm；If difference is less than or equal to third predetermined threshold value and is greater than the 4th preset threshold, dropped
Low-light level alarm.
2. the temperature monitoring method of dmd chip according to claim 1, which is characterized in that the sensing dmd chip is different
The operating temperature of position includes: to sense the operating temperature of dmd chip back center position, and sense dmd chip front edge
The operating temperature of two symmetric positions.
3. the temperature monitoring method of dmd chip according to claim 2, which is characterized in that this method further include: judgement
The relationship of difference and the 4th preset threshold between dmd chip front position and the operating temperature of back position:
If difference is less than or equal to the 4th preset threshold, dmd chip is calculated according to the operating temperature of dmd chip back center position
Modulated micro mirror array operating temperature, and judge the operating temperature of the modulated micro mirror array of dmd chip and first default
The relationship of threshold value and the second preset threshold:
If the operating temperature of the modulated micro mirror array of dmd chip is greater than the first preset threshold, closing alarm is carried out；
If the operating temperature of the modulated micro mirror array of dmd chip is less than or equal to the first preset threshold and is greater than the second default threshold
Value then carries out reducing brightness alarm.
4. the temperature monitoring method of dmd chip according to claim 3, which is characterized in that described according to the dmd chip back side
The operating temperature that the operating temperature of center calculates the modulated micro mirror array of dmd chip further comprises:
For the DLP projector using a dmd chip processing three primary colours light, the adjustable of dmd chip is calculated using following formula
The work temperature array of micro mirror array processed:
Tarray=A+ (L* α+3) * B；
For handling the DLP projector of three primary colours light respectively using three dmd chips, dmd chip is calculated using following formula
The work temperature array of modulated micro mirror array:
Tarray=A+ (L* α/3+3) * B；
Wherein, A is the operating temperature of dmd chip back center position, and unit is DEG C；L is projection brightness setting value, and unit is
lm；α is dmd chip coefficient, unit w/lm；B be dmd chip thermal resistance, unit be DEG C/w.
5. the temperature monitoring method of dmd chip described in any one of -4 according to claim 1, which is characterized in that described first
Preset threshold is 65 DEG C, and second preset threshold is 60 DEG C, and the third predetermined threshold value is 10 DEG C, the 4th preset threshold
It is 7 DEG C.
6. a kind of device for monitoring temperature of dmd chip, which is characterized in that multiple thermoelectricity including being set to dmd chip different location
Even, microprocessor and alarm；
The multiple thermocouple senses the operating temperature of dmd chip different location；
The microprocessor judges the operating temperature and the first preset threshold and the second preset threshold of dmd chip different location
Relationship:
If at least having one in the operating temperature of dmd chip different location is greater than the first preset threshold, sent to alarm
Close alarm command；
If the operating temperature of dmd chip different location is respectively less than the work for being equal to the first preset threshold and dmd chip different location
At least there is one in temperature and be greater than the second preset threshold, then sending to alarm reduces brightness alarm command；
If the operating temperature of dmd chip different location be respectively less than be equal to the second preset threshold, judge dmd chip front position with
The relationship of difference and third predetermined threshold value and the 4th preset threshold between the operating temperature of back position: if difference is greater than third
Preset threshold then sends to alarm and closes alarm command；If difference is less than or equal to third predetermined threshold value and presets greater than the 4th
Threshold value, then sending to alarm reduces brightness alarm command；
The alarm carries out closing alarm or reduces brightness alarm according to closing alarm command or reducing brightness alarm command.
7. the device for monitoring temperature of dmd chip according to claim 6, which is characterized in that the multiple thermocouple includes:
The first thermocouple set on dmd chip back center position, and it is symmetrically set in the second thermoelectricity of dmd chip front edge position
Even summation third thermocouple.
8. the device for monitoring temperature of dmd chip according to claim 7, which is characterized in that the microprocessor, judgement
The relationship of difference and the 4th preset threshold between dmd chip front position and the operating temperature of back position:
If difference be less than or equal to the 4th preset threshold, according to the first thermocouple sensing operating temperature calculate dmd chip can
The operating temperature of micro mirror array is modulated, and judges the operating temperature and the first preset threshold of the modulated micro mirror array of dmd chip
With the relationship of the second preset threshold:
If the operating temperature of the modulated micro mirror array of dmd chip is greater than the first preset threshold, is sent to alarm and close report
Alert instruction；
If the operating temperature of the modulated micro mirror array of dmd chip is less than or equal to the first preset threshold and is greater than the second default threshold
Value, then sending to alarm reduces brightness alarm command.
9. the device for monitoring temperature of dmd chip according to claim 8, which is characterized in that the microprocessor,
For the DLP projector using a dmd chip processing three primary colours light, the adjustable of dmd chip is calculated using following formula
The work temperature array of micro mirror array processed:
Tarray=A+ (L* α+3) * B；
For handling the DLP projector of three primary colours light respectively using three dmd chips, dmd chip is calculated using following formula
The work temperature array of modulated micro mirror array:
Tarray=A+ (L* α/3+3) * B；
Wherein, A is the operating temperature of the first thermocouple sensing, and unit is DEG C；L is projection brightness setting value, unit lm；α is
Dmd chip coefficient, unit w/lm；B be dmd chip thermal resistance, unit be DEG C/w.
10. the device for monitoring temperature of the dmd chip according to any one of claim 6-9, which is characterized in that described first
Preset threshold is 65 DEG C, and second preset threshold is 60 DEG C, and the third predetermined threshold value is 10 DEG C, the 4th preset threshold
It is 7 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810803199.XA CN109062283B (en) | 2018-07-20 | 2018-07-20 | Temperature monitoring method and device for DMD chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810803199.XA CN109062283B (en) | 2018-07-20 | 2018-07-20 | Temperature monitoring method and device for DMD chip |
Publications (2)
| Publication Number | Publication Date |
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| CN109062283A true CN109062283A (en) | 2018-12-21 |
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| CN110926401A (en) * | 2019-11-26 | 2020-03-27 | 歌尔股份有限公司 | Method and device for calibrating oscillating angle of galvanometer, projection system and storage medium |
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