CN109054709A - A kind of microelectronic product corrosion-resistant packaging plastic and preparation method thereof - Google Patents
A kind of microelectronic product corrosion-resistant packaging plastic and preparation method thereof Download PDFInfo
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- CN109054709A CN109054709A CN201810696061.4A CN201810696061A CN109054709A CN 109054709 A CN109054709 A CN 109054709A CN 201810696061 A CN201810696061 A CN 201810696061A CN 109054709 A CN109054709 A CN 109054709A
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- packaging plastic
- corrosion
- microelectronic product
- trimethylmethoxysilane
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The present invention provides a kind of microelectronic product corrosion-resistant packaging plastic and preparation method thereof, and the corrosion-resistant packaging plastic of the microelectronic product includes following raw material: epoxy resin, isoprene styrene copolymer, polymethyl methacrylate, polyphenylene oxide ketone, trimethylmethoxysilane, fatty acid polyethylene glycol ester, di-tert-butyl peroxide, diethylenetriamines, curing agent；Preparation method includes the following steps: S1, preparing raw material；The premixing of S2, epoxy resin, isoprene styrene copolymer, polymethyl methacrylate and fatty acid polyethylene glycol ester add other raw materials and mix to uniformly up to the corrosion-resistant packaging plastic of microelectronic product.Packaging plastic proposed by the present invention, rationally, excellent in mechanical performance, acidproof, alkaline-resisting and Salt Corrosion is good, and use scope is wide, long service life, and preparation method is simple, and differences between batches are small for formula, is suitable for industrialized mass production.
Description
Technical field
The present invention relates to packaging plastic technical field more particularly to a kind of microelectronic product corrosion-resistant packaging plastic and its preparations
Method.
Background technique
Microelectric technique be with integrated circuit, especially Large Scale integrated circuit and grow up one it is new
Technology.Microelectronics industry is in the booming stage at present, also in the ascendant to the research of microelectronics system encapsulating material.
Packaging plastic is one of most common auxiliary material of microelectronic product, frequently as the adhesive of certain components, is used for component
Sealing, encapsulating or encapsulating, can be played after encapsulation waterproof, it is moisture-proof, shockproof, dust-proof, heat dissipation, secrecy the effects of.But it is traditional
Packaging plastic film forming and corrosion resistance are unsatisfactory, for example use can corrode packaging plastic in acid, alkali or salt fog for a long time, because
This can shorten the service life of packaging plastic in the biggish field use of some corrosivity, and then influence the use longevity of microelectronic product
Life.Based on the deficiencies in the prior art, the present invention proposes a kind of microelectronic product corrosion-resistant packaging plastic and its preparation side
Method.
Summary of the invention
The problem of the purpose of the present invention is to solve existing packaging plastic poor corrosion resistances, and a kind of microelectronics proposed
Product corrosion-resistant packaging plastic and preparation method thereof.
In order to achieve the above object, the present invention is achieved by the following technical programs:
A kind of corrosion-resistant packaging plastic of microelectronic product, the raw material including following parts by weight: 80~120 parts of epoxy resin,
0~30 part of isoprene styrene copolymer 1,6~10 parts of polymethyl methacrylate, 2~4 parts of polyphenylene oxide ketone, trimethyl first
2~8 parts of oxysilane, 0.05~0.15 part of fatty acid polyethylene glycol ester, 0.1~0.3 part of di-tert-butyl peroxide, two sub- second
0.2~0.9 part of base triamine, 0.5~1 part of curing agent.
Preferably, the microelectronic product includes the raw material of following parts by weight with corrosion-resistant packaging plastic: epoxy resin 90~
110 parts, 5~25 parts of isoprene styrene copolymer 1,8~10 parts of polymethyl methacrylate, polyphenylene oxide ketone 2.5~3.5
Part, 4~7 parts of trimethylmethoxysilane, 0.08~0.12 part of fatty acid polyethylene glycol ester, di-tert-butyl peroxide 0.15~
0.25 part, 0.3~0.9 part of diethylenetriamines, 0.6~1 part of curing agent.
Preferably, the mass ratio of the polyphenylene oxide ketone and trimethylmethoxysilane is 1:(1~2).
Preferably, the mass ratio of the di-tert-butyl peroxide and diethylenetriamines is 1:(2~3).
Preferably, the microelectronic product includes the raw material of following parts by weight: epoxy resin 100 with corrosion-resistant packaging plastic
Part, 20 parts of isoprene styrene copolymer, 9 parts of polymethyl methacrylate, 3 parts of polyphenylene oxide ketone, trimethylmethoxysilane
4.5 parts, 0.1 part of fatty acid polyethylene glycol ester, 0.2 part of di-tert-butyl peroxide, 0.6 part of diethylenetriamines, curing agent 0.8
Part.
The invention also provides a kind of microelectronic product preparation methods of corrosion-resistant packaging plastic, comprising the following steps:
S1, according to 80~120 parts of epoxy resin, 0~30 part of isoprene styrene copolymer 1, poly-methyl methacrylate
6~10 parts of ester, 2~4 parts of polyphenylene oxide ketone, 2~8 parts of trimethylmethoxysilane, 0.05~0.15 part of fatty acid polyethylene glycol ester,
0.1~0.3 part of di-tert-butyl peroxide, 0.2~0.9 part of diethylenetriamines, 0.5~1 part of curing agent weigh each raw material, it is standby
With；
S2, by epoxy resin, isoprene styrene copolymer, polymethyl methacrylate and fatty acid polyglycol ethylene glycol
Ester is added in mixing machine, is stirred until homogeneous to obtain mixture A with the speed of 200~300r/min, improve mixing speed to 300~
500r/min again by polyphenylene oxide ketone, trimethylmethoxysilane, di-tert-butyl peroxide, diethylenetriamines and curing agent according to
It is secondary to be added in mixture B, it is stirred until homogeneous up to the corrosion-resistant packaging plastic of microelectronic product.
The corrosion-resistant packaging plastic of microelectronic product provided by the invention, advantage is compared with prior art:
1, packaging plastic proposed by the present invention, formula rationally, using epoxy resin as major ingredient, are copolymerized with isoprene styrene
Object and polymethyl methacrylate are auxiliary material, and pass through addition polyphenylene oxide ketone, trimethylmethoxysilane, fatty acid polyglycol ethylene glycol
Ester, di-tert-butyl peroxide, diethylenetriamines and curing agent improve the performance of packaging plastic, have packaging plastic excellent
Different acidproof, alkaline-resisting and resistant to salt corrosion characteristic can use for a long time in acid, alkali and the higher place of salinity, expand packaging plastic
Use scope, extend packaging plastic and product service life, particularly suitable for microelectronic product field.
2, packaging plastic proposed by the present invention, by adding the polyphenylene oxide ketone and trimethylmethoxysilane of rational proportion, with
Enhance the corrosion resistance of packaging plastic, and the experiment proved that the polyphenylene oxide ketone and trimethyl proposed by the present invention encapsulated in glue formula
Methoxy silane has synergistic effect, resistance to when the mass ratio of polyphenylene oxide ketone and trimethylmethoxysilane is between 1:1~2
Sour, alkaline-resisting and resisting salt fog corrosion effect is preferable, while excellent in mechanical performance, and in polyphenylene oxide ketone and trimethylmethoxysilane
Mass ratio be 1:1.5 when resultant effect it is best.
3, packaging plastic proposed by the present invention, by the di-tert-butyl peroxide and diethylenetriamines that add rational proportion
To adjust the crosslinking rate of packaging plastic, the impact strength and film forming characteristics of packaging plastic are improved, effectively solves traditional packaging plastic not
The problem of easily forming a film.
4, the invention also provides a kind of easy to operate, the miscible packaging plastic of raw material preparation methods, and by being somebody's turn to do
The performance for the packaging plastic that method obtains is consistent, and differences between batches are small, is suitble to industrialized production.
Specific embodiment
Combined with specific embodiments below the present invention is made further to explain.
Embodiment 1
A kind of corrosion-resistant packaging plastic of microelectronic product proposed by the present invention, the raw material including following parts by weight:
80 parts of epoxy resin, 0 part of isoprene styrene copolymer 1,6 parts of polymethyl methacrylate, polyphenylene oxide ketone 2
Part, 2 parts of trimethylmethoxysilane, 0.05 part of fatty acid polyethylene glycol ester, 0.1 part of di-tert-butyl peroxide, diethylidene
0.2 part of triamine, 0.5 part of curing agent；
Preparation method includes the following steps:
S1, according to 80 parts of epoxy resin, 0 part of isoprene styrene copolymer 1,6 parts of polymethyl methacrylate, poly-
2 parts of phenylene ether ketone, 2 parts of trimethylmethoxysilane, 0.05 part of fatty acid polyethylene glycol ester, 0.1 part of di-tert-butyl peroxide, two
0.2 part of ethylenetriamine, 0.5 part of curing agent weigh each raw material, it is spare；
S2, by epoxy resin, isoprene styrene copolymer, polymethyl methacrylate and fatty acid polyglycol ethylene glycol
Ester is added in mixing machine, is stirred until homogeneous to obtain mixture A with the speed of 200r/min, improves mixing speed to 300r/min again
Polyphenylene oxide ketone, trimethylmethoxysilane, di-tert-butyl peroxide, diethylenetriamines and curing agent are added sequentially to mix
It closes in object B, is stirred until homogeneous up to the corrosion-resistant packaging plastic of microelectronic product.
Embodiment 2
A kind of corrosion-resistant packaging plastic of microelectronic product proposed by the present invention, the raw material including following parts by weight:
100 parts of epoxy resin, 20 parts of isoprene styrene copolymer, 9 parts of polymethyl methacrylate, polyphenylene oxide ketone 3
Part, 4.5 parts of trimethylmethoxysilane, 0.1 part of fatty acid polyethylene glycol ester, 0.2 part of di-tert-butyl peroxide, diethylidene
0.6 part of triamine, 0.8 part of curing agent；
Preparation method includes the following steps:
S1, according to 100 parts of epoxy resin, 20 parts of isoprene styrene copolymer, 9 parts of polymethyl methacrylate, poly-
3 parts of phenylene ether ketone, 4.5 parts of trimethylmethoxysilane, 0.1 part of fatty acid polyethylene glycol ester, 0.2 part of di-tert-butyl peroxide,
0.6 part of diethylenetriamines, 0.8 part of curing agent weigh each raw material, it is spare；
S2, by epoxy resin, isoprene styrene copolymer, polymethyl methacrylate and fatty acid polyglycol ethylene glycol
Ester is added in mixing machine, is stirred until homogeneous to obtain mixture A with the speed of 250r/min, improves mixing speed to 400r/min again
Polyphenylene oxide ketone, trimethylmethoxysilane, di-tert-butyl peroxide, diethylenetriamines and curing agent are added sequentially to mix
It closes in object B, is stirred until homogeneous up to the corrosion-resistant packaging plastic of microelectronic product.
Embodiment 3
A kind of corrosion-resistant packaging plastic of microelectronic product proposed by the present invention, the raw material including following parts by weight:
120 parts of epoxy resin, 30 parts of isoprene styrene copolymer, 10 parts of polymethyl methacrylate, polyphenylene oxide ketone
4 parts, 8 parts of trimethylmethoxysilane, 0.15 part of fatty acid polyethylene glycol ester, 0.3 part of di-tert-butyl peroxide, diethylidene
0.9 part of triamine, 1 part of curing agent；
Preparation method includes the following steps:
S1, according to 120 parts of epoxy resin, 30 parts of isoprene styrene copolymer, 10 parts of polymethyl methacrylate,
4 parts of polyphenylene oxide ketone, 8 parts of trimethylmethoxysilane, 0.15 part of fatty acid polyethylene glycol ester, 0.3 part of di-tert-butyl peroxide,
0.9 part of diethylenetriamines, 1 part of curing agent weigh each raw material, it is spare；
S2, by epoxy resin, isoprene styrene copolymer, polymethyl methacrylate and fatty acid polyglycol ethylene glycol
Ester is added in mixing machine, is stirred until homogeneous to obtain mixture A with the speed of 200~300r/min, improve mixing speed to 300~
500r/min again by polyphenylene oxide ketone, trimethylmethoxysilane, di-tert-butyl peroxide, diethylenetriamines and curing agent according to
It is secondary to be added in mixture B, it is stirred until homogeneous up to the corrosion-resistant packaging plastic of microelectronic product.
The packaging plastic and commercially available microelectronics Packaging glue of Examples 1 to 3 preparation are tested for the property respectively, and will be implemented
Packaging plastic and commercially available microelectronics Packaging glue prepared by example 1~3 carries out sour corrosion test (5% sulfuric acid corrosion is for 24 hours), caustic corrosion
Test (5% sodium hydroxide corrosion is for 24 hours) and salt spray test (save one month, salt fog uses in salt fog cabinet in salt fog cabinet
Temperature is 35 DEG C, the sodium chloride solution that pH value is 6.5~7.2, concentration is 5%, and salt fog settles 2ml/80cm2H, salt spray test
Temperature be 35~45 DEG C, humidity 80%), then to after test packaging plastic carry out performance detection, calculate corrosion after summer
Than notched Izod impact hit intensity reduced rate, 1 the results are shown in Table.
Table 1:
| Test item | Embodiment 1 | Embodiment 2 | Embodiment 3 | It is commercially available |
| Charpy notch impact strength KJ/m2 | 62.4 | 69.1 | 63.5 | 51.6 |
| Charpy notch impact strength reduced rate % after acid corrosion-resistant | 13.4 | 7.9 | 11.2 | 22.5 |
| Charpy notch impact strength reduced rate % after alkali corrosion resistance | 16.2 | 11.5 | 15.7 | 32.6 |
| Charpy notch impact strength reduced rate % after salt-fog resistant test | 10.5 | 7.4 | 9.8 | 19.3 |
1 experimental result of table is shown: the packaging plastic Charpy notch impact strength of Examples 1 to 3 preparation is higher than commercially available, and passes through
Charpy notch impact strength reduced rate is lower than commercially available after peracid, alkali and salt air corrosion, shows packaging plastic tool proposed by the present invention
There are excellent volume mechanical property and ability that is acidproof, seeing salt corrosion, can guarantee that packaging plastic makes under conditions of acid, alkali, salt for a long time
With expanding the use scope of packaging plastic.
Embodiment 4~9, under the premise of the gross mass of polyphenylene oxide ketone and trimethylmethoxysilane is identical, by embodiment 1
The mass ratio of middle polyphenylene oxide ketone and trimethylmethoxysilane is replaced according to table 2, and carries out performance detection, then will be implemented
Packaging plastic prepared by example 1~9 carries out sour corrosion test (5% sulfuric acid corrosion is for 24 hours), caustic corrosion test (5% sodium hydroxide corruption
Erosion for 24 hours) and salt spray test (saved one month in salt fog cabinet, salt fog uses temperature for 35 DEG C, pH value 6.5 in salt fog cabinet
~7.2, the sodium chloride solution that concentration is 5%, salt fog settle 2ml/80cm2h, and the temperature of salt spray test is 35~45 DEG C, wet
80%), then to carry out performance detection to the packaging plastic after test, the Charpy notch impact strength after calculating corrosion reduces degree
Rate the results are shown in Table 2.
Table 2:
In table 2, " A:B " indicates the mass ratio of polyphenylene oxide ketone and trimethylmethoxysilane.
2 experimental result of table is shown, polyphenylene oxide ketone or the obtained packaging plastic Charpy of trimethylmethoxysilane is used alone
Notch impact strength is only 45KJ/m2Left and right, the reduced rate of Charpy notch impact strength reaches after peracid, alkali or salt air corrosion
To 20% or more, the performance of packaging plastic is seriously affected, when using polyphenylene oxide ketone and trimethylmethoxysilane, and polyphenylene oxide simultaneously
When the quality of ketone and trimethylmethoxysilane is between 1:1~2, acquired packaging plastic Charpy notch impact strength can be with poly-
The increase presentation of trimethylmethoxysilane specific gravity first increases the trend reduced again, summer in phenylene ether ketone and trimethylmethoxysilane
It can achieve 60KJ/m than notch impact strength2More than, excellent in mechanical performance, and Charpy lacks after peracid, alkali or salt air corrosion
Mouth impact strength reduced rate is 20% hereinafter, far better than the prior art, especially in polyphenylene oxide ketone and trimethyl methoxy
Charpy notch impact strength is maximum when the mass ratio of silane is 1:1.5, the Charpy notch impact strength after acid, alkali or salt air corrosion
Reduced rate is minimum, and acidproof alkali salt corrosive nature is best.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (6)
1. a kind of corrosion-resistant packaging plastic of microelectronic product, which is characterized in that the raw material including following parts by weight: epoxy resin 80
~120 parts, 0~30 part of isoprene styrene copolymer 1,6~10 parts of polymethyl methacrylate, 2~4 parts of polyphenylene oxide ketone,
2~8 parts of trimethylmethoxysilane, 0.05~0.15 part of fatty acid polyethylene glycol ester, di-tert-butyl peroxide 0.1~0.3
Part, 0.2~0.9 part of diethylenetriamines, 0.5~1 part of curing agent.
2. a kind of corrosion-resistant packaging plastic of microelectronic product according to claim 1, which is characterized in that including following weight
The raw material of part: 90~110 parts of epoxy resin, 5~25 parts of isoprene styrene copolymer 1, polymethyl methacrylate 8~
10 parts, 2.5~3.5 parts of polyphenylene oxide ketone, 4~7 parts of trimethylmethoxysilane, 0.08~0.12 part of fatty acid polyethylene glycol ester,
0.15~0.25 part of di-tert-butyl peroxide, 0.3~0.9 part of diethylenetriamines, 0.6~1 part of curing agent.
3. a kind of corrosion-resistant packaging plastic of microelectronic product according to claim 1 or 2, which is characterized in that the polyphenyl
The mass ratio of ether ketone and trimethylmethoxysilane is 1:(1~2).
4. a kind of corrosion-resistant packaging plastic of microelectronic product according to claim 1 or 2, which is characterized in that two uncle
The mass ratio of butylperoxide and diethylenetriamines is 1:(2~3).
5. a kind of corrosion-resistant packaging plastic of microelectronic product according to claim 1, which is characterized in that including following weight
The raw material of part: 100 parts of epoxy resin, 20 parts of isoprene styrene copolymer, 9 parts of polymethyl methacrylate, polyphenylene oxide ketone
3 parts, 4.5 parts of trimethylmethoxysilane, 0.1 part of fatty acid polyethylene glycol ester, 0.2 part of di-tert-butyl peroxide, two sub- second
0.6 part of base triamine, 0.8 part of curing agent.
6. a kind of microelectronic product preparation method of corrosion-resistant packaging plastic, which comprises the following steps:
S1, according to 80~120 parts of epoxy resin, 0~30 part of isoprene styrene copolymer 1, polymethyl methacrylate 6
~10 parts, 2~4 parts of polyphenylene oxide ketone, 2~8 parts of trimethylmethoxysilane, 0.05~0.15 part of fatty acid polyethylene glycol ester, two
0.1~0.3 part of tert-butyl peroxide, 0.2~0.9 part of diethylenetriamines, 0.5~1 part of curing agent weigh each raw material, it is standby
With；
S2, epoxy resin, isoprene styrene copolymer, polymethyl methacrylate and fatty acid polyethylene glycol ester are added
Enter into mixing machine, mixture A be stirred until homogeneous to obtain with the speed of 200~300r/min, improve mixing speed to 300~
500r/min again by polyphenylene oxide ketone, trimethylmethoxysilane, di-tert-butyl peroxide, diethylenetriamines and curing agent according to
It is secondary to be added in mixture B, it is stirred until homogeneous up to the corrosion-resistant packaging plastic of microelectronic product.
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| CN201810696061.4A CN109054709A (en) | 2018-06-29 | 2018-06-29 | A kind of microelectronic product corrosion-resistant packaging plastic and preparation method thereof |
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| CN201810696061.4A CN109054709A (en) | 2018-06-29 | 2018-06-29 | A kind of microelectronic product corrosion-resistant packaging plastic and preparation method thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102666595A (en) * | 2009-09-16 | 2012-09-12 | 杰克瑞特公司 | Composition for a structural adhesive |
| CN104388028A (en) * | 2014-12-01 | 2015-03-04 | 南京大学 | High temperature resistant tough epoxy resin binder |
| CN104592924A (en) * | 2015-01-13 | 2015-05-06 | 潮州三环（集团）股份有限公司 | Adhesive composition, adhesive film, adhesive film roll and preparation methods thereof |
| CN103694644B (en) * | 2013-12-30 | 2015-11-04 | 景旺电子科技(龙川)有限公司 | A kind of composition epoxy resin, metal-based copper-clad plate and preparation method thereof |
| CN105199639A (en) * | 2015-09-16 | 2015-12-30 | 上海回天新材料有限公司 | Flexible adhesive and preparation method and application thereof |
-
2018
- 2018-06-29 CN CN201810696061.4A patent/CN109054709A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102666595A (en) * | 2009-09-16 | 2012-09-12 | 杰克瑞特公司 | Composition for a structural adhesive |
| CN103694644B (en) * | 2013-12-30 | 2015-11-04 | 景旺电子科技(龙川)有限公司 | A kind of composition epoxy resin, metal-based copper-clad plate and preparation method thereof |
| CN104388028A (en) * | 2014-12-01 | 2015-03-04 | 南京大学 | High temperature resistant tough epoxy resin binder |
| CN104592924A (en) * | 2015-01-13 | 2015-05-06 | 潮州三环（集团）股份有限公司 | Adhesive composition, adhesive film, adhesive film roll and preparation methods thereof |
| CN105199639A (en) * | 2015-09-16 | 2015-12-30 | 上海回天新材料有限公司 | Flexible adhesive and preparation method and application thereof |
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