CN112080221A - Conductive silver adhesive with long service time at room temperature and low-temperature curing function and preparation method thereof - Google Patents
Conductive silver adhesive with long service time at room temperature and low-temperature curing function and preparation method thereof Download PDFInfo
- Publication number
- CN112080221A CN112080221A CN202010978394.3A CN202010978394A CN112080221A CN 112080221 A CN112080221 A CN 112080221A CN 202010978394 A CN202010978394 A CN 202010978394A CN 112080221 A CN112080221 A CN 112080221A
- Authority
- CN
- China
- Prior art keywords
- powder
- silver
- particle
- parts
- conductive silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
Abstract
The invention relates to the technical field of adhesives for 3C electronic industry, in particular to a conductive silver adhesive which has long service time at room temperature and can be cured at low temperature and a preparation method thereof, 70-75 parts of silver powder, 17.5-21.3 parts of epoxy resin, 1.5-2.2 parts of diisocyanate modified imidazole, 4-5.5 parts of active diluent, 0.18-0.26 part of coupling agent, 0.036-0.052 part of defoaming agent and 0.09-0.13 part of dispersing agent; the conductive silver adhesive prepared by the formula and the preparation method thereof can prolong the storage period of the conductive silver adhesive without increasing the viscosity of the conductive silver adhesive.
Description
Technical Field
The invention relates to the technical field of adhesives for 3C electronic industry, in particular to a conductive silver adhesive which has long service time at room temperature and can be cured at low temperature and a preparation method thereof.
Background
The current 3C industry's demand for conductive adhesives is more prone to low temperature curing, which is more beneficial for protecting the performance of other components. The existing low-temperature curing conductive silver adhesive is placed at normal temperature, the viscosity of the conductive adhesive is easy to increase, the use performance of the conductive adhesive is affected, and the use period of the conductive adhesive is greatly shortened. In addition, the content of the latent curing agent in the existing conductive adhesive is large, and the viscosity of the conductive adhesive is directly and indirectly increased.
Disclosure of Invention
The invention aims to provide the conductive silver adhesive which has long service time at room temperature and can be cured at low temperature and the preparation method thereof, aiming at the defects and the defects of the prior art.
In order to achieve the purpose, the invention adopts the technical scheme that:
the conductive silver adhesive which can be used for a long time at room temperature and can be cured at low temperature comprises, by weight, 70-75 parts of silver powder, 17.5-21.3 parts of epoxy resin, 1.5-2.2 parts of self-made diisocyanate modified imidazole, 4-5.5 parts of reactive diluent, 0.18-0.26 part of coupling agent, 0.036-0.052 part of defoaming agent and 0.09-0.13 part of dispersing agent.
Further, the diisocyanate modified imidazole is prepared by adding 0.5mol of di-ethyl-tetra-methylimidazole, 0.5mol of diphenylmethane diisocyanate and 180.2g of analytically pure ethyl acetate into a 500ml three-neck flask, reacting for 2 hours at 70-80 ℃, and cooling to evaporate ethyl acetate.
Further, the coupling agent is any one of a silane coupling agent, a titanate coupling agent and an aluminate coupling agent.
Further, the reactive diluent is any one of glycidyl ether, ethylene glycol diglycidyl ether and propylene glycol diglycidyl ether.
In order to solve the technical problems, the invention adopts the technical scheme that: the method comprises the following steps:
a. stirring epoxy resin, diisocyanate modified imidazole, reactive diluent, coupling agent, defoaming agent and dispersing agent in a preset amount for 20 minutes at normal temperature and under the environment condition that the humidity is 50-60% to form uniform liquid, and preparing base adhesive for later use;
b. b, putting a preset amount of silver powder into the base glue obtained in the step a, and uniformly stirring and dispersing;
c. and c, vacuumizing and exhausting bubbles of the silver colloid uniformly stirred in the step b, subpackaging, and performing secondary bubble exhausting by using a centrifugal machine after subpackaging.
Further, the silver powder is composed of flake silver powder and spherical silver powder; the silver powder comprises large-particle powder, medium-particle powder and fine-particle powder; the particle size of the large-particle powder is 8-10 mu m; the particle size of the medium-particle powder is 5-8 mu m; the particle size of the fine powder is less than 3 mu m; the mass ratio of the large-grain powder material to the medium-grain powder material to the fine-grain powder material is 1:1: 0.5; and adding the large-particle powder, the medium-particle powder and the fine-particle powder into the base adhesive in the order of the particle size from large to small, uniformly stirring after adding the silver powder of one specification, and then adding the silver powder of the other particle size and uniformly stirring until the silver powder of various particle sizes is added.
Compared with the prior art, the invention has the beneficial effects that:
1. the base adhesive prepared by mixing the self-made diisocyanate modified imidazole can prolong the time of viscosity change and prolong the storage period of the conductive silver adhesive.
2. The use content of the latent curing agent can be reduced by adopting diisocyanate modified imidazole, the content of the epoxy resin is increased relatively, and the viscosity of the conductive silver adhesive can be effectively reduced.
3. Adding silver powder with different granularities is helpful to improve the silver powder distribution of the conductive silver paste: the silver powder can be arranged more compactly, and the conductivity of the adhesive is better.
Detailed Description
The present invention will now be described in detail with reference to specific examples, which are provided for illustration only and are not intended to be limiting.
Example 1:
the conductive silver adhesive which has long service time at room temperature and can be cured at low temperature is prepared from the following components in parts by weight:
the weight of each part of the following components is 1 kg;
70 parts of silver powder, 17.5 parts of epoxy resin, 1.8 parts of diisocyanate modified imidazole, 5.5 parts of reactive diluent, 0.26 part of coupling agent, 0.052 part of defoaming agent and 0.09 part of dispersing agent.
The conductive silver adhesive which has long service time at room temperature and can be cured at low temperature is prepared by the following preparation method, and comprises the following steps:
a. stirring 17.5 parts of epoxy resin, 1.8 parts of diisocyanate modified imidazole, 5.5 parts of reactive diluent, 0.26 part of coupling agent, 0.052 part of defoaming agent and 0.09 part of dispersing agent according to the preset amount for 20 minutes under the ambient conditions of normal temperature and 50% of humidity to form uniform liquid, and preparing base adhesive for later use; b. b, putting a preset amount of silver powder into the base glue obtained in the step a, and uniformly stirring and dispersing; c. b, vacuumizing and discharging bubbles from the silver colloid uniformly stirred in the step b, subpackaging, and performing secondary bubble discharge by using a centrifugal machine after subpackaging;
wherein the silver powder is composed of flake silver powder and spherical silver powder; the silver powder comprises large-particle powder, medium-particle powder and fine-particle powder; the particle size of the large-particle powder is 8-10 mu m; the particle size of the medium-particle powder is 5-8 mu m; the particle size of the fine powder is less than 3 mu m; the mass ratio of the large-grain powder material to the medium-grain powder material to the fine-grain powder material is 1:1: 0.5; adding 28 parts of large-particle powder, 28 parts of medium-particle powder and 14 parts of fine-particle powder into the base adhesive in the order from large to small according to the particle size, uniformly stirring after adding each silver powder of one specification, then adding silver powder of another particle size and uniformly stirring until the silver powder of various particle sizes is added; the diisocyanate modified imidazole is prepared by adding 0.5mol of di-ethyl-tetra-methylimidazole, 0.5mol of diphenylmethane diisocyanate and 180.2g of analytically pure ethyl acetate into a 500ml three-neck flask, reacting at 70-80 ℃ for 2 hours, and cooling to evaporate ethyl acetate. The coupling agent is any one of silane coupling agent, titanate coupling agent and aluminate coupling agent. The reactive diluent is any one of glycidyl ether, ethylene glycol diglycidyl ether and propylene glycol diglycidyl ether.
Example 2:
the conductive silver adhesive which has long service time at room temperature and can be cured at low temperature is prepared from the following components in parts by weight:
72 parts of silver powder, 21.3 parts of epoxy resin, 2.2 parts of diisocyanate modified imidazole, 4 parts of reactive diluent, 0.22 part of coupling agent, 0.044 part of defoaming agent and 0.13 part of dispersing agent.
The conductive silver adhesive which has long service time at room temperature and can be cured at low temperature is prepared by the following preparation method, and comprises the following steps:
a. stirring 21.3 parts of epoxy resin, 2.2 parts of diisocyanate modified imidazole, 4 parts of reactive diluent, 0.22 part of coupling agent, 0.044 part of defoaming agent and 0.13 part of dispersing agent according to a preset amount for 20 minutes under the environmental conditions of normal temperature and 60% humidity to form uniform liquid, and preparing base adhesive for later use; b. b, putting a preset amount of silver powder into the base glue obtained in the step a, and uniformly stirring and dispersing; c. and c, vacuumizing and exhausting bubbles of the silver colloid uniformly stirred in the step b, subpackaging, and performing secondary bubble exhausting by using a centrifugal machine after subpackaging. Wherein the silver powder is composed of flake silver powder and spherical silver powder; the silver powder comprises large-particle powder, medium-particle powder and fine-particle powder; the particle size of the large-particle powder is 8-10 mu m; the particle size of the medium-particle powder is 5-8 mu m; the particle size of the fine powder is less than 3 mu m; the mass ratio of the large-grain powder material to the medium-grain powder material to the fine-grain powder material is 1:1: 0.5; 28.8 parts of large-particle powder, 28.8 parts of medium-particle powder and 14.4 parts of fine-particle powder are added into the base adhesive in the order of particle size from large to small, and the silver powder with the other particle size is added and stirred uniformly after each silver powder with one specification is added; the diisocyanate modified imidazole is prepared by adding 0.5mol of di-ethyl-tetra-methylimidazole, 0.5mol of diphenylmethane diisocyanate and 180.2g of analytically pure ethyl acetate into a 500ml three-neck flask, reacting at 70-80 ℃ for 2 hours, and cooling to evaporate ethyl acetate. The coupling agent is any one of silane coupling agent, titanate coupling agent and aluminate coupling agent. The reactive diluent is any one of glycidyl ether, ethylene glycol diglycidyl ether and propylene glycol diglycidyl ether.
Example 3:
the conductive silver adhesive which has long service time at room temperature and can be cured at low temperature is prepared from the following components in parts by weight:
the weight of each part of the following components is 1 kg;
75 parts of silver powder, 20 parts of epoxy resin, 1.5 parts of diisocyanate modified imidazole, 4.8 parts of reactive diluent, 0.18 part of coupling agent, 0.036 part of defoaming agent and 0.11 part of dispersing agent.
The conductive silver adhesive which has long service time at room temperature and can be cured at low temperature is prepared by the following preparation method, and comprises the following steps:
a. stirring 75 parts of silver powder, 20 parts of epoxy resin, 1.5 parts of diisocyanate modified imidazole, 4.8 parts of reactive diluent, 0.18 part of coupling agent, 0.036 part of defoaming agent and 0.11 part of dispersing agent for 20 minutes at normal temperature and under the environment with the humidity of 55% to obtain uniform liquid, and preparing base adhesive for later use; b. b, putting a preset amount of silver powder into the base glue obtained in the step a, and uniformly stirring and dispersing; c. and c, vacuumizing and exhausting bubbles of the silver colloid uniformly stirred in the step b, subpackaging, and performing secondary bubble exhausting by using a centrifugal machine after subpackaging. Wherein the silver powder is composed of flake silver powder and spherical silver powder; the silver powder comprises large-particle powder, medium-particle powder and fine-particle powder; the particle size of the large-particle powder is 8-10 mu m; the particle size of the medium-particle powder is 5-8 mu m; the particle size of the fine powder is less than 3 mu m; the mass ratio of the large-grain powder material to the medium-grain powder material to the fine-grain powder material is 1:1: 0.5; adding 30 parts of large-particle powder, 30 parts of medium-particle powder and 15 parts of fine-particle powder into the base adhesive in the order from large to small according to the particle size, uniformly stirring after adding each silver powder of one specification, then adding silver powder of another particle size and uniformly stirring until the silver powder of various particle sizes is added; the diisocyanate modified imidazole is prepared by adding 0.5mol of di-ethyl-tetra-methylimidazole, 0.5mol of diphenylmethane diisocyanate and 180.2g of analytically pure ethyl acetate into a 500ml three-neck flask, reacting at 70-80 ℃ for 2 hours, and cooling to evaporate ethyl acetate. The coupling agent is any one of silane coupling agent, titanate coupling agent and aluminate coupling agent. The reactive diluent is any one of glycidyl ether, ethylene glycol diglycidyl ether and propylene glycol diglycidyl ether.
Compared with the prior art, the invention has the beneficial effects that:
1. the base adhesive formed by mixing diisocyanate modified imidazole can prolong the time of viscosity change and prolong the storage period of the conductive silver adhesive.
2. The use content of the latent curing agent can be reduced by adopting diisocyanate modified imidazole, the content of the epoxy resin is increased, and the viscosity of the conductive silver adhesive can be increased.
3. Adding silver powder with different granularities is helpful to improve the silver powder distribution of the conductive silver paste: the silver powder can be arranged more compactly, and the conductivity of the adhesive is better.
The foregoing is for the purpose of illustrating the invention only and various simple changes and modifications within the spirit of the invention made by those skilled in the art should fall within the scope of the invention.
Claims (6)
1. The utility model provides a room temperature live time is long and can low temperature solidification conductive silver glue which characterized in that: the conductive silver adhesive consists of the following components in percentage by weight,
70-75 parts of silver powder, 17.5-21.3 parts of epoxy resin, 1.5-2.2 parts of self-made diisocyanate modified imidazole, 4-5.5 parts of reactive diluent, 0.18-0.26 part of coupling agent, 0.036-0.052 part of defoaming agent and 0.09-0.13 part of dispersing agent.
2. The conductive silver paste capable of being used at room temperature for a long time and being cured at low temperature according to claim 1, wherein: the diisocyanate modified imidazole is prepared by adding 0.5mol of di-ethyl-tetra-methylimidazole, 0.5mol of diphenylmethane diisocyanate and 180.2g of analytically pure ethyl acetate into a 500ml three-neck flask, reacting for 2 hours at 70-80 ℃, cooling and distilling off the ethyl acetate.
3. The conductive silver paste capable of being used at room temperature for a long time and being cured at low temperature according to claim 1, wherein: the coupling agent is any one of silane coupling agent, titanate coupling agent and aluminate coupling agent.
4. The conductive silver paste capable of being used at room temperature for a long time and being cured at low temperature according to claim 1, wherein: the reactive diluent is any one of glycidyl ether, ethylene glycol diglycidyl ether and propylene glycol diglycidyl ether.
5. The method for preparing the conductive silver adhesive which has long service life at room temperature and can be cured at low temperature according to claim 1, is characterized in that: the method comprises the following steps:
a. stirring epoxy resin, diisocyanate modified imidazole, reactive diluent, coupling agent, defoaming agent and dispersing agent in a preset amount for 20 minutes at normal temperature and under the environment condition that the humidity is 50-60% to form uniform liquid, and preparing base adhesive for later use;
b. b, putting a preset amount of silver powder into the base glue obtained in the step a, and uniformly stirring and dispersing;
c. and c, vacuumizing and exhausting bubbles of the silver colloid uniformly stirred in the step b, subpackaging, and performing secondary bubble exhausting by using a centrifugal machine after subpackaging.
6. The conductive silver paste capable of being used at room temperature for a long time and being cured at low temperature according to claim 5, wherein: the silver powder consists of flake silver powder and spherical silver powder; the silver powder comprises large-particle powder, medium-particle powder and fine-particle powder; the particle size of the large-particle powder is 8-10 mu m; the particle size of the medium-particle powder is 5-8 mu m; the particle size of the fine powder is less than 3 mu m; the mass ratio of the large-grain powder material to the medium-grain powder material to the fine-grain powder material is 1:1: 0.5; and adding the large-particle powder, the medium-particle powder and the fine-particle powder into the base adhesive in the order of the particle size from large to small, uniformly stirring after adding the silver powder of one specification, and then adding the silver powder of the other particle size and uniformly stirring until the silver powder of various particle sizes is added.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010978394.3A CN112080221A (en) | 2020-09-17 | 2020-09-17 | Conductive silver adhesive with long service time at room temperature and low-temperature curing function and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010978394.3A CN112080221A (en) | 2020-09-17 | 2020-09-17 | Conductive silver adhesive with long service time at room temperature and low-temperature curing function and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112080221A true CN112080221A (en) | 2020-12-15 |
Family
ID=73737299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010978394.3A Pending CN112080221A (en) | 2020-09-17 | 2020-09-17 | Conductive silver adhesive with long service time at room temperature and low-temperature curing function and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112080221A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115073693A (en) * | 2022-07-06 | 2022-09-20 | 北京中科纳通电子技术有限公司 | Toughening resin-based conductive silver paste and preparation method thereof |
| CN115181520A (en) * | 2022-05-25 | 2022-10-14 | 惠州市杜科新材料有限公司 | High-temperature-resistant single-component epoxy-structure inductor magnetic core bonding adhesive and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101805575A (en) * | 2010-04-09 | 2010-08-18 | 连云港昭华科技有限公司 | High-performance conductive silver paste and preparation method thereof |
| US20160237322A1 (en) * | 2013-08-08 | 2016-08-18 | Boe Technology Group Co., Ltd. | Silver conductive adhesive and preparation method |
| CN111261320A (en) * | 2020-01-20 | 2020-06-09 | 常州烯奇新材料有限公司 | Epoxy resin-based low-temperature conductive silver paste and preparation method thereof |
-
2020
- 2020-09-17 CN CN202010978394.3A patent/CN112080221A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101805575A (en) * | 2010-04-09 | 2010-08-18 | 连云港昭华科技有限公司 | High-performance conductive silver paste and preparation method thereof |
| US20160237322A1 (en) * | 2013-08-08 | 2016-08-18 | Boe Technology Group Co., Ltd. | Silver conductive adhesive and preparation method |
| CN111261320A (en) * | 2020-01-20 | 2020-06-09 | 常州烯奇新材料有限公司 | Epoxy resin-based low-temperature conductive silver paste and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 吴思保: ""异氰酸酯改性咪唑类固化剂的合成及其解封与固化行为评价研究"", 《工程科技Ⅰ辑》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115181520A (en) * | 2022-05-25 | 2022-10-14 | 惠州市杜科新材料有限公司 | High-temperature-resistant single-component epoxy-structure inductor magnetic core bonding adhesive and preparation method thereof |
| CN115073693A (en) * | 2022-07-06 | 2022-09-20 | 北京中科纳通电子技术有限公司 | Toughening resin-based conductive silver paste and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112080221A (en) | Conductive silver adhesive with long service time at room temperature and low-temperature curing function and preparation method thereof | |
| CN102766426A (en) | Conductive adhesive for encapsulating semiconductor chip and preparation method thereof | |
| CN102174306B (en) | Conductive adhesive for LED (light emitting diode) packaging and preparation method of conductive adhesive | |
| CN101148571B (en) | Fire resistant epoxy conducting adhesive and preparation method thereof | |
| CN104017529A (en) | Single-component epoxy resin conductive silver adhesive composition and preparation method thereof | |
| WO2017181447A1 (en) | Fluid chip-level underfill resin and manufacturing method thereof | |
| CN101985547A (en) | Single-component epoxy electronic potting adhesive capable of being stored at room temperature and preparation method thereof | |
| CN108102589A (en) | A kind of epoxy encapsulation conducting resinl of the low modulus of low-temperature setting and preparation method thereof | |
| CN114854347B (en) | Insulating and heat-conducting adhesive, preparation method thereof and heat-conducting adhesive material | |
| CN103540285A (en) | Epoxy resin adhesive used for encapsulating smart cards | |
| CN109135611A (en) | One kind is i.e. with low temperature curing type liquid metal conducting resinl in using and preparation method thereof | |
| CN113773613B (en) | High-filling ultrahigh-thermal-conductivity epoxy resin material and preparation method thereof | |
| CN106883806B (en) | New energy thin film capacitor polyurethane pouring sealant and preparation method thereof | |
| CN107033823B (en) | Moisture-heat-resistant epoxy adhesive for nano rubber modified LED backlight source and preparation method thereof | |
| CN113583388A (en) | Heat-conducting epoxy resin composite material and preparation method thereof | |
| CN103666316B (en) | A kind of high temperature can be repaired conducting resinl and preparation method thereof | |
| CN110845989B (en) | Two-component organic silicon pouring sealant and application method thereof | |
| CN102373029A (en) | Preparation method of rapid curing of flexible conductive adhesive under room temperature | |
| CN101503608B (en) | Phenolic epoxy resin system conductive adhesive and preparation thereof | |
| CN110964462B (en) | Single-component conductive adhesive stored and cured at normal temperature and preparation method and application thereof | |
| CN113698767A (en) | Novel high-performance silicon rubber for insulator and preparation method | |
| CN110233300A (en) | Low temperature resistant colloidal electrolyte of large capacity and preparation method thereof | |
| CN111471426A (en) | High-reliability integrally-formed adhesive for inductor and preparation method thereof | |
| CN112341940B (en) | Epoxy conductive silver adhesive capable of being quickly dried at low temperature and stored at normal temperature and preparation method thereof | |
| CN114410118B (en) | Preparation method of ultralow-thermal-resistance insulating compound heat-conducting powder filled silicone resin |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201215 |
|
| RJ01 | Rejection of invention patent application after publication |