CN109054695A - A kind of preparation process of PESD function acrylate adhesive - Google Patents
A kind of preparation process of PESD function acrylate adhesive Download PDFInfo
- Publication number
- CN109054695A CN109054695A CN201810754452.7A CN201810754452A CN109054695A CN 109054695 A CN109054695 A CN 109054695A CN 201810754452 A CN201810754452 A CN 201810754452A CN 109054695 A CN109054695 A CN 109054695A
- Authority
- CN
- China
- Prior art keywords
- acrylate adhesive
- pesd
- preparation process
- electronic component
- function acrylate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
- C08L2205/18—Spheres
- C08L2205/20—Hollow spheres
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention provides a kind of preparation process of PESD function acrylate adhesive, reactivity synthesis PESD binder, in-situ polymerization synthesis of electroactive PEDOT prepares acrylate adhesive, as electronic component ESD function convered structure in the circuit board, wiring board area can effectively be saved, manufacturing cost is reduced, device circuit reliability is promoted.
Description
Technical field
The invention belongs to electronic materials and adhesive to synthesize field, be related to a kind of system of PESD function acrylate adhesive
Standby technique.
Background technique
Static discharge (ESD) problem is the important harm that each electronic product faces, and polymer matrix ESD element (PESD) is anti-
Protection element is more and more widely used due to its low capacitor feature, and PESD protective element is in parallel with by protection component, this
It is in high resistant state of value, component is worked normally without influence, when generating transient high voltages, ESD protection element becomes rapidly
For low-resistance conducting, protective effect is realized.Electronic component just develops towards multi-functional, miniaturization, flexibility direction, dedicated antistatic
Element needs to tie up the valuable area on wiring board, and in addition the factors such as the welding of discrete component, route design also will increase entirety
The manufacturing cost of device.
Summary of the invention
For prior art defect, the purpose of the present invention is to provide a kind of preparations of PESD function acrylate adhesive
Technique, which comprises the steps of:
(1) 3,4-ethylene dioxythiophene monomer (EDOT) is added in isopropanol alcohol, ultrasonic agitation dissolution；
(2) persulfate is dissolved in aqueous acrylic emulsion, is slowly added to first part of butanol solution, adition process
In persistently stir, obtain mixing mother liquor；
(3) mixing mother liquor room temperature~50 DEG C stand reaction 12~24 hours, and curing agent and defoaming agent is added, and stirring is thickened
To the acrylate adhesive of PESD function.
It is 0.05~0.3molL that the 3,4-ethylene dioxythiophene monomer mixes the concentration equivalent in mother liquor before the reaction-1。
The persulfate includes one of potassium peroxydisulfate, ammonium persulfate, sodium peroxydisulfate or combinations thereof, concentration 3,4-
1~3 times of ethylenedioxy thiophene monomer concentration.
The curing agent is one of amine curing agent, including ethylenediamine, m-xylene diamine, and defoaming agent includes mineral oil
One of defoaming agent and Siloxane-Oxyalkylene Copolymers defoaming agent.
Insulation bonding of the PESD function acrylate adhesive for electronic component in the circuit board, it is defeated with electronic component
Entering output pin has a contact, and in parallel with electronic component internal circuit on circuit, ESD function acrylate adhesive is blocked in height
Edge state, when electronic component overvoltage condition, electronic component is protected in the conducting of ESD function acrylate adhesive seepage flow.
The present invention is reactivity synthesis PESD binder, and in-situ polymerization synthesis of electroactive PEDOT prepares acrylate gluing
Agent can effectively save wiring board area as electronic component ESD function convered structure in the circuit board, reduce manufacturing cost,
Promote device circuit reliability.
The contents of the present invention and feature have revealed that as above, however the present invention that describes of front only briefly or pertains only to this
The specific part of invention, feature of the invention may be more than what content disclosed herein was related to.Therefore, protection model of the invention
The revealed content of embodiment should be not limited to by enclosing, and should include the combination of all the elements embodied in different piece, with
And it is various without departing substantially from replacement and modification of the invention, and covered by claims of the present invention.
Specific embodiment
Embodiment 1:
(1) 3,4-ethylene dioxythiophene monomer (EDOT) is added in isopropanol alcohol, ultrasonic agitation dissolution；
(2) potassium peroxydisulfate is dissolved in aqueous acrylic emulsion, is slowly added to first part of butanol solution, adition process
In persistently stir, obtain mixing mother liquor；3,4-ethylene dioxythiophene monomer concentration equivalent is 0.05molL-1, potassium peroxydisulfate concentration
Equivalent is 0.05~0.15molL-1。
(3) mixing mother liquor is stored at room temperature reaction 24 hours, and ethylenediamine and mineral oil antifoam agent is added, and stirring thickening obtains
The acrylate adhesive of PESD function, adhesive tensile strength: 35Mpa, ESD performance reach IEC6100-4-2.
Embodiment 2:
(1) 3,4-ethylene dioxythiophene monomer (EDOT) is added in isopropanol alcohol, ultrasonic agitation dissolution；
(2) potassium peroxydisulfate is dissolved in aqueous acrylic emulsion, is slowly added to first part of butanol solution, adition process
In persistently stir, obtain mixing mother liquor；3,4-ethylene dioxythiophene monomer concentration equivalent is 0.3molL-1, potassium peroxydisulfate concentration works as
Amount is 0.3molL-1。
(3) mixing mother liquor is stored at room temperature reaction 24 hours, and ethylenediamine and Siloxane-Oxyalkylene Copolymers defoaming agent, stirring is added
Thickening obtains the acrylate adhesive of PESD function, and adhesive tensile strength: 33Mpa, ESD performance reach IEC6100-4-2.
Embodiment 3:
(1) 3,4-ethylene dioxythiophene monomer (EDOT) is added in isopropanol alcohol, ultrasonic agitation dissolution；
(2) ammonium persulfate is dissolved in aqueous acrylic emulsion, is slowly added to first part of butanol solution, adition process
In persistently stir, obtain mixing mother liquor；3,4-ethylene dioxythiophene monomer concentration equivalent is 0.1molL-1, ammonium persulfate concentrations work as
Amount is 0.2molL-1。
(3) mixing mother liquor is stored at room temperature reaction 24 hours, and m-xylene diamine and mineral oil antifoam agent is added, and stirring is thickened
To the acrylate adhesive of PESD function, adhesive tensile strength: 35Mpa, ESD performance reach IEC6100-4-2.
Embodiment 4:
(1) 3,4-ethylene dioxythiophene monomer (EDOT) is added in isopropanol alcohol, ultrasonic agitation dissolution；
(2) sodium peroxydisulfate is dissolved in aqueous acrylic emulsion, is slowly added to first part of butanol solution, adition process
In persistently stir, obtain mixing mother liquor；3,4-ethylene dioxythiophene monomer concentration equivalent is 0.1molL-1, sodium peroxydisulfate concentration works as
Amount is 0.3molL-1。
(3) 50 DEG C of standings of mixing mother liquor are reacted 12 hours, and m-xylene diamine and Siloxane-Oxyalkylene Copolymers defoaming agent is added,
Stirring thickening obtains the acrylate adhesive of PESD function, and adhesive tensile strength: 29Mpa, ESD performance reach IEC6100-
4-2。
Claims (5)
1. a kind of preparation process of PESD function acrylate adhesive, which comprises the steps of:
(1) 3,4-ethylene dioxythiophene monomer (EDOT) is added in isopropanol alcohol, ultrasonic agitation dissolution；
(2) persulfate is dissolved in aqueous acrylic emulsion, is slowly added to first part of butanol solution, is held in adition process
Continuous stirring obtains mixing mother liquor；
(3) mixing mother liquor room temperature~50 DEG C stand reaction 12~24 hours, and curing agent and defoaming agent is added, and stirring thickening obtains
The acrylate adhesive of PESD function.
2. a kind of preparation process of PESD function acrylate adhesive according to claim 1, which is characterized in that described 3,
It is 0.05~0.3molL that 4- ethylenedioxy thiophene monomer mixes the concentration equivalent in mother liquor before the reaction-1。
3. a kind of preparation process of PESD function acrylate adhesive according to claim 1, which is characterized in that the mistake
Sulfate includes one of potassium peroxydisulfate, ammonium persulfate, sodium peroxydisulfate or combinations thereof, and concentration is 3,4-ethylene dioxythiophene list
1~3 times of bulk concentration.
4. a kind of preparation process of PESD function acrylate adhesive according to claim 1, which is characterized in that described solid
Agent is one of amine curing agent, including ethylenediamine, m-xylene diamine, and defoaming agent includes that mineral oil antifoam agent and polyethers change
One of property polysiloxane defoaming agent.
5. prepared by a kind of preparation process of the PESD function acrylate adhesive as described in Claims 1 to 4 any one
PESD function acrylate adhesive, for electronic component in the circuit board insulation bonding, it is defeated with the input of electronic component
Pin has a contact out, in parallel with electronic component internal circuit on circuit, and ESD function acrylate adhesive insulate shape in high resistant
State, when electronic component overvoltage condition, electronic component is protected in the conducting of ESD function acrylate adhesive seepage flow.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810754452.7A CN109054695A (en) | 2018-07-05 | 2018-07-05 | A kind of preparation process of PESD function acrylate adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810754452.7A CN109054695A (en) | 2018-07-05 | 2018-07-05 | A kind of preparation process of PESD function acrylate adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109054695A true CN109054695A (en) | 2018-12-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810754452.7A Withdrawn CN109054695A (en) | 2018-07-05 | 2018-07-05 | A kind of preparation process of PESD function acrylate adhesive |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107663428A (en) * | 2017-08-31 | 2018-02-06 | 中国科学院广州能源研究所 | Conductive composite water soluble binding agent and its one-pot preparation thereof and application |
-
2018
- 2018-07-05 CN CN201810754452.7A patent/CN109054695A/en not_active Withdrawn
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107663428A (en) * | 2017-08-31 | 2018-02-06 | 中国科学院广州能源研究所 | Conductive composite water soluble binding agent and its one-pot preparation thereof and application |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20181221 |
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| WW01 | Invention patent application withdrawn after publication |