CN107393628A - A kind of halogen-free type organic polymer silver conductive paste - Google Patents
A kind of halogen-free type organic polymer silver conductive paste Download PDFInfo
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- CN107393628A CN107393628A CN201710767385.8A CN201710767385A CN107393628A CN 107393628 A CN107393628 A CN 107393628A CN 201710767385 A CN201710767385 A CN 201710767385A CN 107393628 A CN107393628 A CN 107393628A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
Abstract
The present invention relates to environment-friendly materials field, more particularly to a kind of halogen-free type organic polymer silver conductive paste.The slurry by following components and（Parts by weight）Raw material be made, flake silver powder：60 80 parts；Thermoplastic resin intermediate（B）：14.5 26.5 parts；Thermosetting resin intermediate（C）：5.0 10.0 parts；0.5 3.5 parts of curing accelerator intermediate.Slurry film forming on matrix by silk-screen printing technique, drying, the physical and chemical process of solidification, is firmly attached on matrix, forms conductive path.The conductor paste Halogen, possesses good electric conductivity, adhesive force and pliability, available for fields such as RFID tag RFID, wearable device and touch-screens；Suitable for the rigid matrix such as the flexible substrates such as PET and aluminum oxide, glass.Silver conductive paste of the present invention is firmly attached on matrix by printing, curing process（Including flexible organic matrix and rigid inorganic matrix）, conductive path is formed, for fields such as RFID, wearable device, touch-screen, circuit, heaters.
Description
Technical field
The present invention relates to environment-friendly materials field, more particularly to a kind of halogen-free type organic polymer silver conductive paste.
Background technology
1. non-halogen trend：
Halogen is added in the polymeric articles such as plastics（Fluorine, chlorine, bromine, iodine）To improve burning-point, its advantage is：Burning-point is than common
Polymeric material is high, and burning-point is about at 300 DEG C.Halogen compounds is passed through frequently as a kind of fire retardant, as PBB, PBDE,
TBBP-A, PCB, hexabromo dodecane, tribromphenol, short chain chlorinated paraffin etc., applied in electronic components and material.It is such a
Fire retardant can not reclaim use, and burning and can discharge harmful substance in heating process, during burning, can give out halogenation
Gas, oxygen is absorbed rapidly, so that fire extinguishes.It is caused when the chlorine gas concentration discharged when being burnt such as chlorinated organics is high
On The Deterioration of Visibility Over can lead to not escape recognition path, while chlorine has very strong toxicity, influence the respiratory system of people.This
Outside, the halogen gas that halogen containing polymers burning discharges can generate corrosivity pernicious gas when being combined with water vapour（Hydrogen halides）,
Some equipment and building are caused to corrode, threaten health, environment and the descendants of future generation of human body.
Organic compound containing halogen has very big toxicity in itself, and the discarded object containing this type organic exists
Secondary pollution can be caused during burning process, produces the hypertoxic organic matters such as dioxin, therefore limit the use of halogen containing organic compound
It is highly desirable.Developed country " non-halogen " process is deployed already, the use ratio very little of its halogen containing flame-retardant, instead
It is inorganic flame retardant.For the relevant enterprise of China, international " non-halogen " trend is complied with, produces " non-halogen " product,
Both enterprise itself competitiveness can have been effectively improved, has played a part of increasing added value of product, product can again opened and leads to
The road of international market!
In order to strengthen the management of chemicals, reduce and endangered caused by the especially poisonous and harmful chemicals of chemicals, international community reaches
Into a series of Harmonization of Standards, wherein Convention of Stockholm is related to the relevant regulations of persistence organic pollutant.
On May 23rd, 2001, international community endorsed jointly《On persistence organic pollutant（POPs）Convention of Stockholm》,
As protecting human health and environment from persistence organic pollutant（POPs）The Universal Mobile of harm.POPs refers to high poison
Property, chemicals lasting, be easy to biological accumulation and shift over long distances in the environment.Limitation material has：Organo-chlorine pesticide, six
Chlorobenzene（HCB）, Polychlorinated biphenyls（PCBs）, more chlorodiphenyls and to dioxin（PCDDs）, polychlorinated dibenzo（PCDFs）.Conclude a treaty
Member state includes China, and pact is formally effective to China on November 11st, 2004.
There is different limit standards for non-halogen requirement, different products at present.
According to the IEC 61249-2-21 regulation high with the electric slurry degree of association, printed circuit board material and other interconnections
Structure -2-21 parts：Coating and non-packet are enhanced base material, flame retardant type（Testing vertical flammability) the coated halogen-free epoxy braiding of copper
E type glass fibre reinforced laminates（The halogen of all material of allocated circuit plate, resin and reinforced materials）It is it is required that as follows：Chlorine
Limit the quantity 900 ppm;900 ppm of bromine limitation;Halogen is always limited the quantity 1500ppm.
2. durability demand
The sensor and wearable smart machine etc. such as RFID, mobile phone and flat board computer contact screen field, to organic polymer silver
Conductor flexibility requirements more and more higher, it is desirable to which adhesive force is good, dependable performance, durable.
Organic polymer silver conductor pliability depends on permanent bond phase resin material, and organic polymer silver conductor is starched at present
The defects of material, is：
（1）Thermoplastic resin only is selected, its good conductivity, pliability is good, but adhesive force is poor, in fact it could happen that scaling etc. is failed.
（2）Thermosetting epoxy resin system only is selected, adhesive force is excellent, but conductive membrane rigidity, and pliability is poor, and circuit is easy to break
Disconnected failure.
The present invention merges using flexible material and rigid material are appropriate, effectively solves that " poor adhesive force, attached when flexible
It is flexible poor when having puted forth effort " the problem of.
The content of the invention
The purpose of invention：In order to provide a kind of effect more preferable halogen-free type organic polymer silver conductive paste, specific purposes
See multiple substantial technological effects of specific implementation part.
In order to reach as above purpose, the present invention adopts the following technical scheme that：
A kind of halogen-free type organic polymer silver conductive paste, its feature are that the slurry is by following components and parts by weight content
Raw material be made：
Flake silver powder：60-80 parts；Thermoplastic resin intermediate（B）：14.5-26.5 parts；Thermosetting resin intermediate（C）：5.0-
10.0 parts；Curing accelerator intermediate 0.5-3.5 parts.
Further technical scheme of the invention is, outside formula, one kind for adding in alcohols/ethers/esters diluent or
The a variety of non-activated thinners of person are adjusted slurry viscosity.
Further technical scheme is the present invention, the silver powder tap density 2.5-4.0g/ml, 110 DEG C of -1H thermal weight losses≤
0.5%, continue to be heated to 538 DEG C of -1H thermal weight loss≤0.05% after 110 DEG C of -1H heat treatments.
Further technical scheme is the present invention, the thermoplastic resin intermediate（B）Preparation with the following method, will
In these thermoplastic resins of cellulose acetate, polyvinyl butyral resin, polyethylene glycol, polymethyl methacrylate, PET resin
One or more heating be dissolved in terpinol, butyl carbitol, butyl carbitol acetate, one or more kinds of groups of alcohol -12
Into non-activated thinner in, weight percent concentration 5-10% thermoplastic resin solution, described thermoplastic resin tool is made
There is excellent pliability, it is good with matrix material adhesion.
Further technical scheme is the present invention, the thermosetting resin intermediate（C）Preparation with the following method, will
Butanedioic acid hydrazides (SuADH), adipic acid hydrazides (AADH), isophthalic acid hydrazides (IPADH), to monohydroxy benzoic acid hydrazides
(POBH), dicyandiamide（DICY）For the one or more of the superfine powder build latent curing agent of main component, with epoxy resin
Intermediate（A）Solution mixes, and upper three-roll grinder fully mixes, and uniform thermosetting resin mixed system is made（C）；Asphalt mixtures modified by epoxy resin
Fat has epoxy-reactive group, excellent with the adhesion of matrix material.Described epoxy resin intermediate（A）With the following method
Prepare, if using liquid epoxies, can be directly as epoxy resin intermediate（A）For thermosetting resin mixed system
（C）Preparation；If using solid epoxy, it is necessary to by solid epoxy dissolve by heating to terpinol, butyl carbitol,
In the one or more of non-activated thinner such as butyl carbitol acetate, alcohol -12, weight percent concentration 60-70% is made
Epoxy resin solution（A）, for thermosetting resin mixed system（C）Preparation.
Of the invention further technical scheme is, takes thermoplastic resin solution's intermediate（B）100 parts, add imidazoles and dive
Volt property curing agent 5-10 parts, are uniformly mixed（The mixing of three-roll grinder rolling can be gone up if necessary）, obtain in curing accelerator
Mesosome（D）.
Further technical scheme of the invention is that the thermosetting resin that described thermosetting resin intermediate uses is epoxy
The aathermoset resin system that resin forms with latent curing agent and necessary curing accelerator；Described epoxy resin is double
Phenol A type epoxy resin, it is the Halogen corresponding to E-51, E-44, E-12, E-20 type epoxy resin or low halogen product.
Further technical scheme of the invention is that the Imidazole Type Latent Curing Agent is diethyl tetramethyl imidazoles (2E4M
) and imdazole derivatives Z.
Further technical scheme of the invention is that the raw material forms compound system after fully mixing, through silk-screen printing,
It is heating and curing to form excellent conductor film layer.
Further technical scheme of the invention is that described non-activated thinner is that dissolving power is strong and without epoxide group
Non-activated thinner, it is the one or more in terpinol, butyl carbitol, butyl carbitol acetate, alcohol -12, is adding
Volatilize and escape in curing process.
The halogen-free type organic polymer silver conductive paste is preparing RFID, wearable device, touch-screen, circuit, heater
The functions such as middle formation conductive path.
Using the present invention of as above technical scheme, had the advantages that relative to prior art：The slurry passes through silk screen
The physical and chemical process of typography film forming on matrix, drying or solidification, is firmly attached on matrix, is formed conductive logical
Road.The electric slurry component and content（Percentage by weight）For：Flake silver powder 60-80%, thermoplastic resin intermediate 14.5-
26.5%, thermosetting resin intermediate 5.0-10.0%, curing accelerator intermediate 0.5-3.5%, can additional appropriate solvent adjustment it is viscous
Degree.The electric slurry Halogen, possesses good electric conductivity and pliability, available for RFID, wearable device and touch-screen etc.
Field；Suitable for the rigid matrix such as the flexible substrates such as PET and aluminum oxide, glass.This patent product is after printing machine solidifies, firmly
It is attached on matrix（Including flexible organic matrix and rigid inorganic matrix）, conductive path is formed, for RFID, wearable is set
The fields such as standby, touch-screen, circuit, heater.
Embodiment
The present invention is furture elucidated, it should be understood that following embodiments are merely to illustrate the present invention rather than limitation originally
The scope of invention.
A kind of preparation method of Halogen organic polymer silver conductive paste and intermediate：
1. epoxy resin intermediate（A）Preparation, if using liquid epoxies, can be directly as epoxy resin intermediate
（A）For thermosetting resin mixed system（C）Preparation；If using solid epoxy, it is necessary to which solid epoxy is added
Weight percent is made into non-activated thinners such as terpinol, butyl carbitol, butyl carbitol acetate, alcohol -12 in heat of solution
Specific concentration 60-70% epoxy resin solution（A）.
2. thermoplastic resin intermediate（B）Preparation, cellulose acetate, polyvinyl butyral resin, polyethylene glycol, poly- first
The thermoplastic resins such as base methyl acrylate, it is non-that heating is dissolved in terpinol, butyl carbitol, butyl carbitol acetate, alcohol -12 etc.
In reactive diluent, weight percent concentration 5-10% thermoplastic resin solution is made.
3. thermosetting resin intermediate（C）Preparation, by butanedioic acid hydrazides (SuADH), adipic acid hydrazides (AADH), isophthalic
Diacid hydrazides (IPADH), to monohydroxy benzoic acid hydrazides (POBH), dicyandiamide（DICY）For the superfine powder build of main component
The one or more of latent curing agent, with a certain proportion of epoxy resin intermediate（A）Solution mixes, and upper three-roll grinder fills
Divide and mix, uniform thermosetting resin mixed system is made（C）.
4. curing accelerator intermediate（D）Preparation, Imidazole Type Latent Curing Agent, with epoxy resin reactivity compared with
By force, curing reaction will occur for a few days, so the intermediate avoids coexisting with epoxy resin.In view of imidazoles latency is consolidated
Agent and epoxy resin reactivity are higher, are elected to be the curing accelerator of epoxy resin here.In view of the curing accelerator is in silver
Dosage is less, it is necessary to intermediate is made in advance in slurry formula, homogenizes in early days, it is homogenized effect more in later stage silver paste preparation process
It is good, play preferable curing accelerator effect.Specific method is to take thermoplastic resin solution's intermediate（B）100 parts, add miaow
Azole latent curing agent 5-10 parts, are uniformly mixed（The mixing of three-roll grinder rolling can be gone up if necessary）, obtain solidification and promote
Enter agent intermediate（D）.
5. the preparation of Halogen organic polymer silver conductive paste, designed according to formula, weigh flake silver powder, thermoplastic resin
Intermediate（B）, thermosetting resin intermediate（C）, curing accelerator intermediate（D）Into mixing container, stir and evenly mix, upper three roller
Milling train rolling fully homogenizes, and Halogen organic polymer silver conductive paste is made.If viscosity is high, it is allowed to adds appropriate nonactive dilute
Release agent and adjust viscosity to suitable.
6. a series of intermediary materials prepared by the slurry can room temperature preservation preserved under the conditions of more than 6 months, 5-10 DEG C can
Reach the storage life of 12 months.Preserve, guarantee the quality under the conditions of 5-10 DEG C of the patented product " Halogen organic polymer silver conductive paste "
More than 6 months phase.
Embodiment
1st, embodiment raw material inventory
2nd, Example formulations (following number is parts by weight) and technique
Embodiment 1
1. the preparation of epoxy resin intermediate (A)：From the halogen-free type 850S materials of E-51 class I liquid I epoxy resin, epoxy is worked as
184-194g/eq is measured, viscosity (25 DEG C) 11000-15000mPa.s, hydrolyzable chloride content≤300ppm, is diluted without solvent, note
For A1.
2. thermoplastic resin intermediate（B）Preparation：From esterification degree 240-260, acetyl content 39.5-41.5%
Cellulose acetate is as thermoplastic resin, and acetic acid butyl carbitol is as solvent.First acetic acid butyl carbitol solvent is heated to
55-65 DEG C, in the case of effective stirring, by esterification degree 240-260, acetyl content 39.5-41.5% cellulose acetates substep
Add in hot solvent, adding resin amount every time can not be too many, when addition early stage resin dissolving will be to the greatest extent, adds resin, until
Resin dissolving is complete, and the solution of intermediate B 1 of weight percent concentration 10% is made.
3. thermosetting resin intermediate（C）Preparation：100 parts of A1 intermediates are taken, add adipic dihydrazide（ADH）Powder
20 parts, 15 parts of acetic acid butyl carbitol, it is stirred, upper three-roll grinder is fully mixed to fineness≤8 μm, and thermosetting tree is made
Fat intermediate C1.
4. curing accelerator intermediate（D）Preparation：100 parts of 1 solution of intermediate B is taken, adds diethyl tetramethyl imidazoles (2E4
MZ) 7.5 parts, it is uniformly mixed, thermosetting resin intermediate D1 is made.
5. silver paste preparation method：
Formula one（Formulation content is weight percentage）
Weigh flake silver powder（Tap density 4.0g/ml）: 80.0%
Thermoplastic resin intermediate B 1: 14.5%
Thermosetting resin intermediate C1: 5.0%
Curing accelerator intermediate D1: 0.5%
It is total： 100.0%
Silver powder, intermediary material are weighed and be put into mixing container according to formula one, adds appropriate non-activated thinner adjustment
Viscosity, stir and evenly mix, upper three-high mill rolling fully homogenizes, and Halogen organic polymer silver conductive paste is made.Its performance indications
It is as follows：
Chlorinity 1-10ppm；Sheet resistance（Figure 0.5mmX50mm, 200 mesh stainless steel cloths, 25.4 μm is converted into by surveyed resistance
Sheet resistance under standard film thickness）15-25m Ω/ /mil, pliability excellent with the basal body binding force such as PET film, PET-ITO, aluminum oxide
It is good.
Embodiment 2
1. epoxy resin intermediate（A）Preparation：Take acetic acid butyl carbitol to insert in container, heat 50-55 DEG C；Effectively stirring
In the case of mixing, by E-20 solid epoxies（Hydrolyzable chloride content≤900ppm）Substep is gradually added into hot solvent, is added every time
Entering resin amount can not be too many, when early stage add resin dissolving will be to the greatest extent when, add resin, until resin dissolving is complete, be made 60%
Intermediate, be designated as A2.
2. thermoplastic resin intermediate（B）Preparation：From Mitsubishi acrylic resin BR113（The resin is averaged
Molecular weight 30,000,40% 25 DEG C of butanone solution viscosity are 250-340mPa.s）.100 parts of butyl carbitol is taken to be heated in container
60-80 DEG C, in the case of effective stirring, BR113 substeps are gradually added into hot solvent, adding resin amount every time can not be too
It is more, when early stage add resin dissolving will be to the greatest extent when, add resin, until resin dissolving is complete, 7% intermediate B 2 be made.
3. thermosetting resin intermediate（C）Preparation：100 parts of A2 intermediates are taken, add butanedioic acid hydrazides (SuADH) powder
10 parts, it is stirred, upper three-roll grinder is fully mixed to fineness≤8 μm, and thermosetting resin intermediate C2 is made.
4. curing accelerator intermediate（D）Preparation：100 parts of 2 solution of intermediate B is taken, adds diethyl tetramethyl imidazoles (2E4
MZ) 5 parts, it is uniformly mixed, thermosetting resin intermediate D2 is made.
5. silver paste preparation method：
Formula two（Formulation content is weight percentage）
Weigh flake silver powder（Tap density 2.5g/ml）： 60.0%
Thermoplastic resin intermediate B 2： 26.5%
Thermosetting resin intermediate C2： 10.0 %
Curing accelerator intermediate D2： 3.5 %
It is total： 100.0%
Silver powder, intermediary material are weighed and be put into mixing container according to formula two, adds the nonactive of appropriate adjustment viscosity
Diluent, stir and evenly mix, upper three-high mill rolling fully homogenizes, and Halogen organic polymer silver conductive paste is made.Its performance refers to
Mark is as follows：
Chlorinity≤50ppm；Sheet resistance（Figure 0.5mmX50mm, 200 mesh stainless steel cloths, 25.4 μm is converted into by surveyed resistance
Sheet resistance under standard film thickness）10-25m Ω/ /mil, it is good with the basal body binding force such as PET film, PET-ITO, aluminum oxide, it is flexible
Property is excellent.
Embodiment 3
1. epoxy resin intermediate（A）Preparation：Take acetic acid butyl carbitol/terpinol（Weight is than 1:1）Insert in container, add
Hot 50-55 DEG C, in the case of effective stirring, by E-12 solid epoxies（Hydrolyzable chloride content≤900ppm）Substep gradually adds
Enter in hot solvent, adding resin amount every time can not be too many, when addition early stage resin dissolving will be to the greatest extent, resin is added, until setting
Liposoluble solution is complete, and 70% intermediate is made, is designated as A3.
2. thermoplastic resin intermediate（B）Preparation：Take 100 parts of acetic acid butyl carbitol to be placed in container, be heated to
55-65 DEG C, in the case of effective stirring, by polyvinyl butyral resin（SD-5 types）Substep is gradually added into hot solvent,
Adding resin amount every time can not be too many, when early stage add resin dissolving will be to the greatest extent when, add resin, until resin dissolving is complete,
5% intermediate B 3 is made.
3. thermosetting resin intermediate（C）Preparation：100 parts of B3 intermediates are taken, add 20 parts of dicyandiamide (DICY) powder,
It is stirred, upper three-roll grinder is fully mixed to fineness≤8 μm, and thermosetting resin intermediate C3 is made.
4. curing accelerator intermediate（D）Preparation：100 parts of 3 solution of intermediate B is taken, adds diethyl tetramethyl imidazoles (2E4
MZ) 10 parts, it is uniformly mixed, thermosetting resin intermediate D3 is made.
5. silver paste preparation method
Formula three（Formulation content is weight percentage）
Flake silver powder（Tap density 3.2g/ml）: 70.0%
Thermoplastic resin intermediate B 3: 18.5%
Thermosetting resin intermediate C3: 10.0%
Curing accelerator intermediate D3: 1.5%
It is total： 100.0%
Silver powder, intermediary material are weighed and be put into mixing container according to formula three, adds the nonactive of appropriate adjustment viscosity
Diluent, stir and evenly mix, upper three-high mill rolling, fully homogenize, Halogen organic polymer silver conductive paste is made.Its performance refers to
Mark is as follows：
Chlorinity ＜ 53ppm；Sheet resistance（Figure 0.5mmX50mm, 200 mesh stainless steel cloths, 25.4 μm is converted into by surveyed resistance
Sheet resistance under standard film thickness）7-15mΩ/□/mil；It is excellent with the basal body binding force such as PET film, PET-ITO, aluminum oxide；Pliability
It is excellent.
General principle, principal character, preparation method and the advantages of the present invention of the present invention has been shown and described above.Ability
The technical staff in domain should be recognized that the present invention is not limited to the above embodiments, and described in above-described embodiment and specification is
Illustrate the principle of the present invention, without departing from the spirit and scope of the present invention, various changes and modifications of the present invention are possible,
These changes and improvements are both fallen within claimed scope.
Claims (10)
1. a kind of halogen-free type organic polymer silver conductive paste, its feature are, the slurry is by following components and parts by weight
Raw material is made：
Flake silver powder：60-80 parts；Thermoplastic resin intermediate（B）：14.5-26.5 parts；Thermosetting resin intermediate（C）：5.0-
10.0 parts；Curing accelerator intermediate（D）0.5-3.5 parts.
2. a kind of halogen-free type organic polymer silver conductive paste as claimed in claim 1, its feature is, outside formula, adds
The one or more kinds of non-activated thinners entered in alcohols/ethers/esters diluent carry out slurry viscosity adjustment.
3. a kind of halogen-free type organic polymer silver conductive paste as claimed in claim 1, its feature are, the silver powder jolt ramming
Density 2.5-4.0g/ml, continues to be heated to 538 DEG C of -1H thermal weight losses after 110 DEG C of -1H thermal weight losses≤0.5%, 110 DEG C -1H heat treatments
≤ 0.05%, its distinguishing feature is 538 DEG C of thermal weight loss very littles.
4. a kind of halogen-free type organic polymer silver conductive paste as claimed in claim 1, its feature are, the thermoplastic resin
Fat intermediate（B）Preparation with the following method, by cellulose acetate, polyvinyl butyral resin, polyethylene glycol, polymethyl
One or more kinds of heating in the thermoplastic resins such as sour methyl esters, PET resin are dissolved in terpinol, butyl carbitol, butyl card must
In the non-activated thinners that alcohol acetate, the one or more of alcohol -12 form, weight percent concentration 5-10% heat is made
Plastic resin solution.
5. a kind of halogen-free type organic polymer silver conductive paste as claimed in claim 1, its feature are, the thermosetting tree
Fat intermediate（C）Preparation with the following method, by butanedioic acid hydrazides (SuADH), adipic acid hydrazides (AADH), isophthalic acid acyl
Hydrazine (IPADH), to monohydroxy benzoic acid hydrazides (POBH), dicyandiamide（DICY）For the superfine powder build latency of main component
The one or more of curing agent, with epoxy resin intermediate（A）Solution mixes, and upper three-roll grinder fully mixes, and is made uniformly
Thermosetting resin mixed system（C）；Epoxy resin has epoxy-reactive group, excellent with the adhesion of matrix material;It is described
Epoxy resin intermediate（A）Prepare with the following method, if using liquid epoxies, can be directly as epoxy resin
Intermediate（A）For thermosetting resin mixed system（C）Preparation；If using solid epoxy, it is necessary to by solids epoxy
Resin dissolve by heating to the one kind of non-activated thinner such as terpinol, butyl carbitol, butyl carbitol acetate, alcohol -12 or
During person is a variety of, weight percent concentration 60-70% epoxy resin solution is made（A）, for thermosetting resin mixed system（C）
Preparation.
6. a kind of halogen-free type organic polymer silver conductive paste as claimed in claim 1, its feature is, takes thermoplastic resin
Solution intermediate（B）100 parts, Imidazole Type Latent Curing Agent 5-10 parts are added, are uniformly mixed（If necessary can upper three roller grind
Grinding machine rolling mixes）, obtain curing accelerator intermediate（D）.
7. a kind of halogen-free type organic polymer silver conductive paste as claimed in claim 1, its feature are, described thermosetting
The thermosetting resin that resin intermediate uses is that epoxy resin forms with latent curing agent and necessary curing accelerator
Aathermoset resin system；Described epoxy resin is bisphenol A type epoxy resin, is E-51, E-44, E-12, E-20 type ring oxygen tree
Halogen or low halogen product corresponding to fat.
8. a kind of halogen-free type organic polymer silver conductive paste as claimed in claim 1, its feature are that the imidazoles are dived
Volt property curing agent is diethyl tetramethyl imidazoles (2E4MZ) and imidazole derivative.
9. a kind of halogen-free type organic polymer silver conductive paste as claimed in claim 1, its feature are that the raw material is through filling
Divide after mixing and form compound system, through silk-screen printing, being heating and curing to form excellent conductor film layer；Described non-activated thinner
For dissolving power is strong and non-activated thinner without epoxide group, be terpinol, butyl carbitol, butyl carbitol acetate,
One or more in alcohol -12, effusion of being volatilized in heat curing process.
10. halogen-free type organic polymer silver conductive paste as claimed in claim 1 is preparing RFID tag RFID, wearable set
The purposes of conductive path is formed in standby, touch-screen, flexible circuit, heater.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108135089A (en) * | 2017-12-21 | 2018-06-08 | 昆山福烨电子有限公司 | A kind of manufacture craft of ceramic base all print PCB |
| CN113354848A (en) * | 2021-05-28 | 2021-09-07 | 吉林大学 | High-elasticity, repairable, super-durable and harmless ion conductor membrane and preparation method thereof |
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| CN103971784A (en) * | 2013-01-24 | 2014-08-06 | 上海九鹏化工有限公司 | Novel organic/inorganic nano-composite electric conduction slurry and preparing method of novel organic/inorganic nano-composite electric conduction slurry |
| CN103146259A (en) * | 2013-03-20 | 2013-06-12 | 中国人民解放军国防科学技术大学 | Screen printing conductive printing ink composition and preparation method thereof |
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