CN109047965B - Welding tool for multi-pin packaging device and using method thereof - Google Patents
Welding tool for multi-pin packaging device and using method thereof Download PDFInfo
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- CN109047965B CN109047965B CN201811101308.XA CN201811101308A CN109047965B CN 109047965 B CN109047965 B CN 109047965B CN 201811101308 A CN201811101308 A CN 201811101308A CN 109047965 B CN109047965 B CN 109047965B
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- printed circuit
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Combinations Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a welding tool of a multi-pin packaging device and a using method thereof, belongs to the technical field of printed circuit board manufacturing, and solves the problems that pins of the multi-pin packaging device welded by the existing welding method are easy to short circuit, glass bodies of the pins are easy to break, and welding spots are easy to open and weld. The welding tool of the multi-pin packaging device comprises a pin supporting piece and a fixing piece; the pin support and the fixing piece are located between the multi-pin packaging device and the printed circuit board, and the fixing piece is used for fixing the multi-pin packaging device and the printed circuit board. The invention can complete the welding of the multi-pin packaging device with high quality and fast speed, and improves the qualification rate and the production efficiency of welding products.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a welding tool for a multi-pin packaging device and a using method thereof.
Background
In the manufacturing process of the printed circuit board, the conventional requirement that a through hole plug-in component pasting plate is welded or welded at a distance of 0.5-1mm from the printed circuit board can meet the production requirement for through hole plug-in components with few non-metal package pins, but the requirement is not applicable to a multi-pin metal package large-scale component, firstly, the metal package component pasting plate is welded, and short circuit between pins is easily caused in the welding process; in addition, because the number of pins is large, the welding height of components is difficult to ensure, the attractiveness of the printed circuit board is affected, and meanwhile, the shearing force to welding spots is increased in the vibration process, so that the welding spots are easy to damage.
At present, the welding height of the device packaged by the multi-pin metal is mainly determined by an operator, the bottom surface of the device is parallel to the upper surface of a printed circuit board after welding of two ends of the device is difficult to ensure, and the device is often in an inclined state after welding is finished, so that the vibration shearing force of the product is increased, and the attractiveness of the product is influenced; and in the welding process, soldering tin easily permeates into the A surface of the printed circuit board to cause short circuit between pins, so that quality problems are caused.
Disclosure of Invention
In view of the above analysis, the present invention aims to provide a welding tool for a multi-pin metal package device and a method for using the same, which can solve at least one of the following technical problems: (1) solder flows to the back of the printed circuit board to cause short circuit among device pins; (2) the number of pins is large, so that the components are prevented from being failed due to breakage of a glass body caused by deformation of the pins; (3) the multi-pin component is generally large in size and weight, and during tests such as long-time vibration and transportation, the shearing force of a welding spot is relatively large, so that the welding spot is easily broken.
The purpose of the invention is mainly realized by the following technical scheme:
on one hand, the invention discloses a welding tool for a multi-pin packaging device, which comprises a pin supporting piece and a fixing piece; the pin support piece and the fixing piece are located between the multi-pin packaging device and the printed circuit board, and the fixing piece is used for fixing the multi-pin packaging device and the printed circuit board.
On the other hand, the invention also discloses a use method of the multi-pin packaging device welding tool, which specifically comprises the following steps:
(1) manufacturing pin supports according to the row number and the quantity of pins of the multi-pin packaging device;
(2) mounting the manufactured pin support on the pin;
(3) coating silicon rubber on a printed circuit board;
(4) mounting the multi-pin package device on a printed circuit board to enable the pin support piece to be tightly attached to the printed circuit board;
(5) and (4) overturning the printed circuit board, taking the upper surface of the device as a support, and carrying out pin welding after the silicon rubber is solidified.
The invention has the following beneficial effects:
(1) according to the invention, through arranging the pin support piece and controlling the diameter of the through hole on the pin support piece and the thickness of the pin support piece, not only can a supporting function be realized, but also the function of isolating soldering tin can be realized, so that short circuit between pins can be prevented.
(2) Through setting up the mounting, play the effect of fixed pin support piece and printed circuit board to effectively prevented the relative movement between fixed pin support piece and the printed circuit board.
(3) By controlling the using amount of the silicon rubber which plays a role in fixing, the used silicon rubber can play a role in fixing and supporting, and the open circuit of the printed circuit board cannot be caused.
(4) Through the material of selecting suitable mounting for the mounting can play the fixed support effect, has the cushioning effect again, has prolonged the life of device.
(5) According to the using method provided by the invention, welding is completed within reasonable welding temperature and welding time after welding the device according to the welding tool of the multi-pin packaging device, so that the device is qualified after welding is completed, and the processing qualified rate is ensured to be 100%.
(6) The welding tool and the using method provided by the invention greatly shorten the welding time which is less than 5 minutes (when the welding tool is not used, the welding time is about 2 hours), improve the production efficiency, and improve the aesthetic degree of the product because the bottom surface of the welded device is parallel to the upper surface of the printed circuit board.
In the invention, the technical schemes can be combined with each other to realize more preferable combination schemes. Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof.
Drawings
The drawings are only for purposes of illustrating particular embodiments and are not to be construed as limiting the invention, wherein like reference numerals are used to designate like parts throughout.
FIG. 1 is a top view of a multi-pin cartridge device according to an embodiment of the present invention;
FIG. 2 is a top view of a multi-pin support of an embodiment of the invention;
FIG. 3 is a schematic diagram of the mounting relationship of a multi-pin cartridge device, a multi-pin support, a printed circuit board, and a mounting member according to an embodiment of the present invention;
FIG. 4 is a schematic representation of a multi-pin cartridge device having 1 mount on the lower surface according to an embodiment of the invention;
FIG. 5 is a schematic representation of a lower surface of a multi-pin insertion device having 3 fasteners according to an embodiment of the present invention;
FIG. 6 is a schematic view of an embodiment of the invention in which the multi-pin support is oval;
figure 7 is a schematic view of an embodiment of the invention in which the multi-pin support is oval and 2 in number.
Reference numerals:
1-a multi-pin packaged device; 2-a pin support; 3-a printed circuit board; 4-a fixing piece; 5-a pin; 6-pin glass body; 7-through holes.
Detailed Description
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate preferred embodiments of the invention and together with the description, serve to explain the principles of the invention and not to limit the scope of the invention.
Example one
The invention discloses a welding tool of a multi-pin packaging device, which comprises a pin support 2 and a fixing part 4.
The pin support 2, the mount 4, are located between the multi-pin package device 1 and the printed circuit board 3, and the mount is used to secure the multi-pin package device 1 to the printed circuit board 3.
The pin support 2 is provided with a through hole 7 for the pin 5 to pass through, and the diameter of the through hole 7 is equal to the outer diameter of the pin glass body 6. The pin support 2 can support 1 or more pins 5.
For convenience of operation and easy implementation, in this embodiment, instead of providing one pin support on each pin, one pin support is provided for each row of pins, that is, the number of the pin supports is equal to the number of the rows of pins. In order to support each pin, the number and the spacing of the through holes on each pin support 2 correspond to the positions of the rows of pins one by one. Through the design, the pin support piece is easy to manufacture, the pin support piece can be used for supporting a plurality of pins by installing one pin support piece, and compared with the pin support piece which is installed on each pin independently, the time cost is saved, and the labor intensity is reduced.
Example two
In practical use, when the thickness of the support piece is less than 0.8mm, soldering tin permeates from the back to the front of the printed circuit board in the welding process, so that short circuit between pins is easily caused; when the thickness of the supporting piece is larger than 1.2mm, the pins of the device are thin, the welding height is increased, the vibration force is increased in the using process, and the welding spot is damaged after being used for a period of time, so that the welding spot is cracked. The thickness (height) of pin support piece is selected to be 0.8 ~ 1.2mm for this embodiment, and a large amount of vibration test can be accomplished to the product after the welding, and product quality is qualified, can not appear above-mentioned problem.
In the present embodiment, silicone rubber is used to fix the device and the printed circuit board. In the process of mounting the device, the device is pressed down by using external force, when the device is pressed down to 0.8-1.2 mm (the thickness of the device is the same as that of the pin support part), the silicon rubber is tightly attached to the lower surface of the device to form a bonding plane, and after the silicon rubber is solidified, a bonding surface is formed to play a role in fixing the device; the coating height of the silicon rubber is not high and cannot be larger than 2mm, if the coating amount is too much, the silicon rubber easily permeates into a bonding pad in the pressing process of a device to cause short circuit between pins, and when the coating thickness is smaller than 1.5mm, the bonding area between the device and the silicon rubber is reduced due to too low thickness, so that the silicon rubber cannot play a role in fixing. Therefore, the thickness of the fixing piece is selected to be 1.5-2 mm, the situation can not occur, and the safety and reliability of the product quality can be ensured.
Among the numerous silicone rubbers, GD414 was chosen for the present invention because: the GD414 has no corrosiveness to metal, has the advantages of high strength, high elongation at break and the like, has the characteristics of excellent ultraviolet light resistance, weather aging resistance, good electrical insulation performance and the like when being used for a long time in a wide temperature range of-60-200 ℃, and also has the effects of moisture prevention and shock absorption.
EXAMPLE III
The cross section of the fixing piece in the embodiment is irregular and approximately circular. It has been found through a number of experiments that the dimensions of the fixing can be neither too large nor too small. If the size of the fixing piece is too small, the fixing and supporting functions cannot be achieved; if the cross-sectional dimension is too large, it may cause disconnection of the welded product. Therefore, the distance between the two points on the fixing member farthest from each other is required to be 1/3 to 1/2 of the length of the short side of the multi-pin package device. Therefore, the fixing piece can be ensured to play a role in fixing and supporting, and the product can not be broken.
According to the size of printed circuit board and device, the quantity of this embodiment mounting can be a plurality ofly to evenly distributed is between the lower surface of device and printed circuit board, thereby not only can make printed circuit board and device fixed firm, can make device and printed circuit board atress even moreover, prevents that the inhomogeneous vitreous body that arouses the device pin of atress from broken, has improved the product percent of pass.
In order to enhance the fixing and supporting effect of the fixing piece, the silicon gel is coated into different shapes according to the shapes of the devices. The silicone gel is coated to approximate a circle if the device is square or circular, and to approximate an ellipse if the device is rectangular.
Example four
The invention also discloses a use method of the multi-pin packaging device welding tool, which specifically comprises the following steps:
(1) manufacturing a pin support 2 according to the row number and the quantity of pins 5 of the multi-pin packaging device;
(2) mounting the fabricated pin support 2 on the pins 5;
(3) coating silicon rubber on the printed circuit board 3;
(4) mounting the multi-pin package device 1 on a printed circuit board 3 to enable the pin support member 2 to be tightly attached to the printed circuit board 3;
(5) and (3) overturning the printed circuit board 3, taking the upper surface of the device as a support, and carrying out pin welding after the silicon rubber is solidified.
In this embodiment, polytetrafluoroethylene is selected as the material for making the pin support, because: the composite material has very excellent comprehensive performance, and has very wide temperature use range, such as good performance at-190-250 ℃; secondly, the corrosion resistance is good, the corrosion resistance is inert to most chemicals and solvents, and the corrosion resistance is strong acid and strong alkali resistance, water resistance and various organic solvents resistance; thirdly, the medicine has physiological inertia and no toxic action on human body; fourthly, the cable has very good electrical insulation and can resist 1500-volt high-voltage electricity.
In this embodiment, the solidification method is stationary solidification.
Experiments show that when the standing time is less than 15 hours, the silicone rubber is not completely solidified; the standing time is 30 hours, and the silicone rubber is completely solidified, so that the standing time is 15-30 hours in the embodiment in order to completely solidify the silicone rubber.
EXAMPLE five
(1) And manufacturing the polytetrafluoroethylene pin support according to the row number and the number of the pins of the device. The diameter of the supported hole site (namely the through hole on the pin support) is consistent with the outer diameter of the device pin glass body, and the thickness (height) of the support is 0.8 mm;
(2) mounting a support on a device pin, and placing the pin on an anti-static operating platform in an upward mode;
(3) GD414 is coated on the middle part of the position of the printed circuit board where the device is installed, the thickness of the silicon rubber is 1.5mm, the coating shape is approximately circular, and the maximum diameter of the circle is 1/3 of the side length of the short side of the device;
(4) mounting the device on a printed circuit board, pressing the device to the bottom, and enabling the pin support piece to be tightly attached to the printed circuit board;
(5) and (3) overturning the printed circuit board, taking the upper surface of the device as a support, placing the printed circuit board on an anti-static workbench, standing for 15h, and welding pins after the silicon rubber is solidified.
The welding can be finished within 5 minutes, and the welded product is qualified through testing.
EXAMPLE six
(1) And manufacturing the polytetrafluoroethylene pin support according to the row number and the number of the pins of the device. The diameter of the supported hole site (namely the through hole on the pin support) is consistent with the outer diameter of the device pin glass body, and the thickness (height) of the support is 1.2 mm;
(2) mounting a support on a device pin, and placing the pin on an anti-static operating platform in an upward mode;
(3) GD414 is coated on the middle part of the position of the printed circuit board where the device is installed, the thickness of the silicon rubber is 2mm, the coating shape is approximate to a circle, and the maximum diameter of the circle is 1/2 of the side length of the short side of the device;
(4) mounting the device on a printed circuit board, pressing the device to the bottom, and enabling the pin support piece to be tightly attached to the printed circuit board;
(5) and (3) overturning the printed circuit board, taking the upper surface of the device as a support, placing the printed circuit board on an anti-static workbench, standing for 30 hours, and welding pins after the silicon rubber is solidified.
The welding can be finished within 5 minutes, and the welded product is qualified through testing.
EXAMPLE seven
(1) And manufacturing the polytetrafluoroethylene pin support according to the row number and the number of the pins of the device. The diameter of the supported hole site (namely the through hole on the pin support) is consistent with the outer diameter of the device pin glass body, and the thickness (height) of the support is 1 mm;
(2) mounting a support on a device pin, and placing the pin on an anti-static operating platform in an upward mode;
(3) GD414 is coated on the middle part of the position of the printed circuit board where the device is installed, the thickness of the silicon rubber is 1.7mm, the coating shape is approximate to an ellipse, and the length of the long axis of the ellipse is 1/2 of the side length of the short side of the device;
(4) mounting the device on a printed circuit board, pressing the device to the bottom, and enabling the pin support piece to be tightly attached to the printed circuit board;
(5) and (3) overturning the printed circuit board, taking the upper surface of the device as a support, placing the printed circuit board on an anti-static workbench, standing for 24 hours, and welding pins after the silicon rubber is solidified.
The welding can be finished within 5 minutes, and the welded product is qualified through testing.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention.
Claims (8)
1. A welding tool for a multi-pin packaging device is characterized by comprising a pin support piece (2) and a fixing piece (4);
the pin support (2) and the fixing piece (4) are both positioned between the multi-pin packaging device (1) and the printed circuit board (3), and the fixing piece is used for fixing the multi-pin packaging device (1) and the printed circuit board (3);
the fixing piece (4) is made of silicon rubber;
the pin support piece (2) is provided with a through hole (7) for the pin (5) to pass through, and the pin support piece (2) is made of polytetrafluoroethylene;
the distance between the two points which are farthest away on the fixing piece (4) is 1/3-1/2 of the length of the short side of the multi-pin packaging device (1).
2. A multi-pin package device soldering fixture according to claim 1, wherein the diameter of the through hole (7) is equal to the outer diameter of the pin glass body (6).
3. A multi-pin package device soldering tooling according to claim 1, wherein the pin support (2) is capable of supporting 1 or more pins (5).
4. The welding tool for the multi-pin package device according to claim 1, wherein the thickness of the pin support (2) is 0.8-1.2 mm.
5. The welding tooling for the multi-pin package device according to claim 1, wherein the thickness of the fixing member (4) is 1.5-2 mm.
6. A use method of a multi-pin packaging device welding tool is characterized in that the multi-pin packaging device welding tool of any one of claims 1 to 5 is used, and the method specifically comprises the following steps:
(1) manufacturing pin supports (2) according to the row number and the number of pins (5) of the multi-pin packaging device;
(2) mounting the manufactured pin support (2) on the pin (5);
(3) coating silicon rubber on a printed circuit board (3);
(4) mounting the multi-pin packaging device (1) on a printed circuit board (3) to enable the pin support piece (2) to be tightly attached to the printed circuit board (3);
(5) and (3) overturning the printed circuit board (3), taking the upper surface of the device as a support, and carrying out pin welding after the silicon rubber is solidified.
7. The use method of the multi-pin package device welding tool according to claim 6, wherein the pin support member (2) is made of polytetrafluoroethylene.
8. The use method of the multi-pin package device welding tool according to claim 6, wherein in the step (5), the solidification mode is static solidification, and the static time is 15-30 hours.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811101308.XA CN109047965B (en) | 2018-09-20 | 2018-09-20 | Welding tool for multi-pin packaging device and using method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811101308.XA CN109047965B (en) | 2018-09-20 | 2018-09-20 | Welding tool for multi-pin packaging device and using method thereof |
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| CN109047965A CN109047965A (en) | 2018-12-21 |
| CN109047965B true CN109047965B (en) | 2021-02-19 |
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| JPH07202414A (en) * | 1993-12-28 | 1995-08-04 | Matsushita Electric Ind Co Ltd | Reflow system |
| CN1267182A (en) * | 1999-03-13 | 2000-09-20 | 三星电子株式会社 | PC board capable of preventing short circuit during welding |
| JP2003078241A (en) * | 2001-09-03 | 2003-03-14 | Matsushita Electric Ind Co Ltd | Method of supplying solder |
| CN104588820A (en) * | 2014-12-19 | 2015-05-06 | 贵阳高新金达电子科技有限公司 | Tin soldering tool with round heat dissipating holes |
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| JPS5855576Y2 (en) * | 1980-05-07 | 1983-12-20 | クラリオン株式会社 | Connector-fixing device |
| CN1750750A (en) * | 2004-09-15 | 2006-03-22 | 华为技术有限公司 | Method for realizing connection of other device by BGA package device pin repair |
| JP2006128567A (en) * | 2004-11-01 | 2006-05-18 | Three M Innovative Properties Co | Method of connecting semiconductor package to printed wiring board |
| CN203791793U (en) * | 2013-12-02 | 2014-08-27 | 北京铁路信号有限公司 | Welding tool used for printed circuit board |
| CN104602450A (en) * | 2014-12-31 | 2015-05-06 | 京东方科技集团股份有限公司 | Circuit board, circuit board manufacturing method, and display device |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0745775A (en) * | 1993-07-30 | 1995-02-14 | Nec Corp | Semiconductor package and connection structure thereof |
| JPH07202414A (en) * | 1993-12-28 | 1995-08-04 | Matsushita Electric Ind Co Ltd | Reflow system |
| CN1267182A (en) * | 1999-03-13 | 2000-09-20 | 三星电子株式会社 | PC board capable of preventing short circuit during welding |
| JP2003078241A (en) * | 2001-09-03 | 2003-03-14 | Matsushita Electric Ind Co Ltd | Method of supplying solder |
| CN104588820A (en) * | 2014-12-19 | 2015-05-06 | 贵阳高新金达电子科技有限公司 | Tin soldering tool with round heat dissipating holes |
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| CN109047965A (en) | 2018-12-21 |
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