JP2003078241A - Method of supplying solder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of simultaneously supplying solder to a wiring board on which electronic components furnished with terminal leads and surface- mounted electronic components are to be mixedly mounted. SOLUTION: Solder cream 4 filled in through holes 8a of a filling plate 8 is transferred to a wired board 1 by a pushing-out plate 9, after the wired board 1 is loaded with electronic components 6 furnished with terminal leads and is upside-down inverted. Then, the wired board is loaded with surface mount electronic components 7, and is collectively heated to solder the mixed members of the electronic components 6 furnished with terminal leads and the surface mount electronic components 7.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder supply method for supplying solder to a wiring board of an electronic device.

[0002]

2. Description of the Related Art In recent years, with the miniaturization and higher frequency of electronic equipment, cream solder supply by printing has been widely adopted as a method for supplying solder to a wiring board. Although this method has increased the number of surface-mountable electronic components that can be supplied with solder, it is difficult to make surface-mountable electronic components due to the heating during soldering, such as high-voltage electrolytic capacitors. There is also an electronic component with a terminal, and there is a demand for a method of collectively soldering a wiring board on which the electronic component with a terminal and the surface-mounted electronic component are mixedly mounted.

Such a conventional solder supplying method by cream solder printing will be described with reference to FIG.

FIG. 3 is a sectional view showing a conventional solder supplying method. In FIG. 3, 1 is a wiring board, 2 is a mask which is arranged on the upper surface of the wiring board 1 and has through holes 2a at predetermined positions. A squeegee 3 is arranged on the top surface of the mask 2, and creamy solder 4 is placed on the moving direction side of the squeegee 3.

In the above structure, when the squeegee 3 is moved to the right of the arrow from the state shown in FIG. 3A, the state shown in FIG.
As shown in, the creamy solder 4 that has passed through the through holes 2 a of the mask 2 is printed on the lands 1 a of the wiring board 1.

After this, as shown in FIG. 3C, the surface mount electronic component 5 is mounted from the upper surface and bonded to the land 1a by heating.

Next, as shown in FIG. 3 (d), the electronic component with terminal 6 has the terminal 6a from the lower surface of the wiring board 1 and the through hole 1b.
The solder 7 is melted with a soldering iron or the like and joined to the land 1c.

[0008]

As described above, in the above-described conventional solder supply method, since the solder is supplied to the surface mount electronic component 5 and the terminal-equipped electronic component 6 separately, the number of steps is large and the cost is high. There was a problem.

The present invention has been made to solve such a conventional problem, and an object of the present invention is to provide a method for collectively supplying solder to electronic components with terminals and surface-mounted electronic components.

[0010]

In order to achieve the above object, the present invention has the following means.

According to the first aspect of the present invention, the creamy solder is extruded from the filling plate filled with the creamy solder and transferred to the wiring board, and then heated to heat the electronic component with terminals and the surface mount electronic component. Since it is possible to perform soldering in a batch, and since solder can be supplied in a batch, there is an effect that a man-hour is small and an inexpensive solder supply method can be realized.

According to a second aspect of the present invention, in the first aspect of the present invention, the filling plate is provided with a recess for adjusting the amount of creamy solder, and the terminal requires a large amount of creamy solder. Since an appropriate cream-like solder can be supplied to both the electronic component with an adhesive and the electronic component with a relatively small amount, good soldering can be performed.

According to a third aspect of the present invention, in addition to the first aspect of the present invention, a release agent is applied to the tip of the push pin, and the release agent contains at least one of alcohol and pine resin as a main component. This is a flux, which facilitates the separation of the extruded pin and the cream-like solder, and can easily transfer the cream-like solder to the wiring board, and the release agent is equivalent to the component contained in the cream-like solder. The use of a flux containing alcohol or pine resin as the main component has the effect of achieving good soldering.

According to a fourth aspect of the present invention, in the invention according to the first aspect, when the creamy solder is transferred, the gap between the wiring board and the filling plate is substantially equal to the terminal protruding height of the electronic component with terminals. The creamy solder spontaneously drops, so that the application of the electronic component with a terminal to the terminals is facilitated, and all the filled creamy solder can be transferred, so that stable soldering can be performed.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to FIGS.

The same components as those described in the section of the prior art are designated by the same reference numerals to simplify the detailed description.

(Embodiment 1) FIG. 1 is a sectional view showing a solder supply method according to an embodiment of the present invention, and FIG. 2 is an explanatory view of the same process. In FIG. The plate 1 is provided with a through hole 1b through which the terminal 6a of the electronic component with terminal 6 is inserted and a plurality of lands 1a for soldering.

A filling plate 8 is arranged above the wiring board 1, and the cream-like solder 4 is filled in the plurality of through holes 8a facing the projecting portions of the terminals 6a and the lands 1a, and also the cream-like solder. A recess 8b for adjusting the amount of solder 4 is provided.

Reference numeral 9 denotes an extruding plate, which is arranged above the filling plate 8 and a plurality of extruding pins 9a are formed in a protruding manner at a position facing the through hole 8a. As No. 10, a flux containing alcohol or pine resin as a main component is applied.

Further, the gap (H) between the wiring board 1 and the filling plate 8 arranged above is approximately equal to the protruding height of the terminal 6a of the electronic component with terminal 6 when the creamy solder 4 is transferred. Has been done.

In the above structure, as shown in FIG. 2 (a), first, the terminal 6a of the electronic component 6 with a terminal such as a high voltage electrolytic capacitor is formed from the upper surface of the wiring board 1 to the through hole 1
The terminal 6a is bent on the lower surface so that the electronic component with terminal 6 does not fall off even if it is attached to the terminal b and inverted, and then the wiring board 1 is inverted.

Next, as shown in FIG. 1B, the filling plate 8 is moved in the downward direction of the arrow, and the gap (H) between the wiring board 1 and the filling plate 8 is set to the terminal of the electronic component with terminal 6. 6a After stopping at a position approximately equal to the protruding height, push plate 9
Is moved downward, the push-out pin 9a is inserted into the through hole 8a of the filling plate 8, and as shown in FIG. 2B, the cream solder 4 is applied to the land 1a of the wiring board 1 and the terminal 6a.
Transfer to the top.

After that, as shown in FIG. 2C, the land 1a on the right side of the wiring board 1 to which the creamy solder 4 is transferred.
A surface mount electronic component 7 such as a chip resistor is mounted on the upper surface.

Finally, as shown in FIG. 2 (d), the creamy solder 4 is produced by collectively heating the wiring board 1 in which the electronic components with terminals 6 and the surface mounting electronic components 7 are mounted together.
Melt and are bonded to the lands 1a.

As described above, according to the present embodiment, after the electronic component 6 with the terminal is mounted and reversed on the wiring board 1, the creamy solder 4 is transferred, and then the surface mount electronic component 7 is mounted, whereby the terminal is mounted. Since the mixed electronic components 6 and the surface-mounted electronic components 7 can be collectively supplied with solder, the number of steps is small and an inexpensive soldering method can be realized.

Further, by providing the filling plate 8 with the recess 8a for adjusting the amount of the creamy solder 4, the electronic component with a terminal 6 requiring a large amount of the creamy solder 4 is formed.
For both the surface mount electronic component 7 and the relatively small number,
The appropriate creamy solder 4 can be supplied.

Then, as a means for improving the separation of the creamy solder 4, the separating agent 10 is applied to the extremity of the extruding pin 9a of the extruding plate 9, and the separating agent 10 is mainly composed of alcohol or pine resin. By using such a flux, the distance between the push-out pin 9a and the cream-like solder 4 is improved, the cream-like solder 4 can be easily transferred to the wiring board 1, and good soldering can be realized.

Furthermore, when the creamy solder 4 is transferred onto the wiring board 1, a gap (H) between the wiring board 1 and the filling plate 8 is obtained.
Is approximately equal to the protruding height of the terminal 6a of the electronic component with terminal 6, so that the creamy solder 4 naturally falls,
Application to the terminals 6a becomes easy, and the filled cream-like solder 4 can be all transferred, so that stable soldering can be performed.

In the above description, the electronic component 6 with terminals is used.
Although the wiring board 1 in which the surface mounting electronic component 7 and the surface mounting electronic component 7 are mixed is described, the present invention can be implemented with only the electronic component with terminal 6 or the wiring board 1 including only the surface mounting electronic component 7.

In addition to the wiring board 1 having the lands 1a on only one surface, the wiring board 1 having the lands 1a on both the upper surface and the lower surface may be used.

Further, as a method of separating the creamy solder 4, apart from applying a separating agent, the pushing pin 9a is used.
Alternatively, the filling plate 8 may be slid up and down.

Further, as a method of mounting the electronic component 6 with terminals on the wiring board 1, in addition to bending the terminals 6a, fixing by adhesion is also possible.

[0033]

As described above, according to the present invention, since solder can be collectively supplied to a wiring board on which an electronic component with terminals and a surface-mounted electronic component are mixed, a man-hour and inexpensive soldering method is realized. The advantageous effect that it can be obtained.

[Brief description of drawings]

FIG. 1 is a sectional view showing a solder supply method according to an embodiment of the present invention.

FIG. 2 is a sectional view for explaining each of the steps.

FIG. 3 is a sectional view showing a conventional solder supply method.

[Explanation of symbols]

4 cream solder Electronic parts with 6 terminals 7 Surface mount electronic components 8 Filling plate 9 Extrusion plate 10 Release agent

Claims (4)

[Claims] 1. A wiring board having a terminal of an electronic component with a terminal mounted on a lower surface protruding to an upper surface, and a land for soldering a surface-mounting electronic component formed on the upper surface, and a wiring board arranged above the wiring board, From a filling plate in which a through hole facing the protruding portion and the land of the terminal is filled with cream-like solder, and an extrusion plate arranged above the filling plate and having an extrusion pin formed at a position facing the through hole. And a solder supply method for transferring the creamy solder to the wiring board with the push pin. 2. The solder supply method according to claim 1, wherein the filling plate is provided with a recess for adjusting the amount of creamy solder. 3. The solder supply method according to claim 1, wherein a releasing agent is applied to the tip of the push pin, and the releasing agent is a flux containing at least one of alcohol and pine resin as a main component. 4. The solder supply method according to claim 1, wherein, when the creamy solder is transferred, the gap between the wiring board and the filling plate arranged above is substantially equal to the protruding height of the terminals of the electronic component with terminals.