CN109040567B - Camera module and assembly process - Google Patents
Camera module and assembly process Download PDFInfo
- Publication number
- CN109040567B CN109040567B CN201811209482.6A CN201811209482A CN109040567B CN 109040567 B CN109040567 B CN 109040567B CN 201811209482 A CN201811209482 A CN 201811209482A CN 109040567 B CN109040567 B CN 109040567B
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- China
- Prior art keywords
- lens
- circuit board
- camera module
- connecting pin
- thin plate
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Lens Barrels (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
The invention relates to a camera module and an assembly process, wherein the camera module comprises a lens (1) and a circuit board (2) connected with the lens (1), an image sensor and an electronic component are arranged on the circuit board, the circuit board (2) comprises a thin plate (21) and a steel sheet reinforcing plate (22) which is positioned at the lower side of the thin plate (21) and is matched and fixed with the thin plate (21), and a welding disc (2a) is arranged on the circuit board (2). The camera module and the assembly process of the invention enable the heat dissipation to be faster and the overall deformation to be small in the working state, and can effectively ensure the imaging quality of the camera module.
Description
Technical Field
The invention belongs to the technical field of connection of an optical lens and a circuit board, and particularly relates to a camera module and an assembly process.
Background
Currently, a fixed focus camera module is generally assembled by a lens, a photosensitive chip, a circuit board (with a serial board), a structural member and other components such as a bracket, a tail wire and the like. Under normal operating condition, general circuit board is heated unevenly because sensitization chip work produces the heat, and local deformation volume grow influences the distance between camera lens and the sensitization chip to can reduce the formation of image quality of the model of making a video recording.
Disclosure of Invention
The invention aims to provide a camera module and an assembly process capable of improving imaging quality.
In order to achieve the above object, the present invention provides a camera module, which comprises a lens and a circuit board connected to the lens, wherein the circuit board is provided with an image sensor and electronic components,
the circuit board comprises a thin plate and a steel sheet reinforcing plate which is positioned at the lower side of the thin plate and is matched and fixed with the thin plate;
and a bonding pad is arranged on the circuit board.
According to an aspect of the invention, the pad is disposed on the thin plate.
According to one aspect of the invention, the thin plate is provided with a through hole, and the welding pad is positioned in the through hole and fixed on the steel sheet reinforcing plate.
According to one aspect of the invention, the lens module further comprises a connecting pin, one end of the connecting pin is detachably connected with the lens, and the other end of the connecting pin is welded with the circuit board through welding materials.
The heat conductivity coefficient of the steel sheet reinforcing plate is larger than that of the connecting pin.
According to one aspect of the invention, the connecting pin is made of carbon steel.
The invention also provides an assembly process for the camera module, which comprises the following steps:
a. connecting the lens with the connecting pin;
b. focusing processing is carried out on the lens and the image sensor on the circuit board;
c. and welding and fixing the connecting pin and the circuit board through solder.
According to an aspect of the present invention, before the step c, it is necessary to perform a plating process on the connection pin and the wiring board.
According to one aspect of the present invention, a wiring board of the present invention includes a thin plate and a steel sheet reinforcing plate. Through setting up the steel sheet reinforcing plate, structural strength that on the one hand can the reinforced circuit board, on the other hand, the steel sheet reinforcing plate has the fast advantage of heat dissipation, can take away the heat that photosensitive chip work produced rapidly, guarantees that the heat of whole circuit board is even for the deformation volume of circuit board obtains effective control, can promote the imaging quality of module under operating condition by a wide margin.
According to one scheme of the invention, the connecting pin is arranged on the lens, the bonding pad is arranged on the circuit board, and the lens is fixedly connected with the circuit board by welding the connecting pin and the bonding pad. So effectively solved among the prior art utilize glue to be connected camera lens and circuit board the defect that exists, be favorable to improving the formation of image quality of the module of making a video recording.
According to an aspect of the present invention, in the present invention, the steel sheet reinforcing plate has a thermal conductivity greater than that of the connection pin. In the present embodiment, the connection pin is made of carbon steel. Due to the arrangement, heat conduction along the pin in the direction towards the lens is slow in the welding process, and heat conduction towards the direction of the steel sheet reinforcing plate is fast, so that heat generated in the working state of the circuit board is dissipated from the steel sheet reinforcing plate, temperature rise of the circuit board cannot influence temperature drift change of the lens, stability of imaging quality is guaranteed, the camera module can work under harsher environmental conditions, and the application range is wider.
According to one scheme of the invention, the lens is an integral lens and is made of metal materials, so that the thermal deformation of the lens is small, and the influence of the lens component on the imaging quality of the module can be reduced.
Drawings
FIG. 1 is a perspective view schematically illustrating a camera module according to an embodiment of the present invention;
FIG. 2 is a block diagram schematically illustrating a wiring board according to an embodiment of the present invention;
fig. 3 is an exploded view schematically showing a camera module according to the present invention.
The reference numerals in the drawings represent the following meanings:
1. a lens; 2. a circuit board; 3. welding flux; 11. connecting pins; 21. a thin plate; 22. a steel sheet reinforcing plate; 23. a photosensitive chip; 24. an electronic component; 25. a flexible connecting belt.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
In describing embodiments of the present invention, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship that is based on the orientation or positional relationship shown in the associated drawings, which is for convenience and simplicity of description only, and does not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, the above-described terms should not be construed as limiting the present invention.
The present invention is described in detail below with reference to the drawings and the specific embodiments, which are not repeated herein, but the embodiments of the present invention are not limited to the following embodiments.
Referring to fig. 1 and 2, the camera module of the present invention includes a lens 1 and a circuit board 2. As shown in the drawing, the wiring board 2 of the present invention includes a thin plate 21 and a steel sheet reinforcing plate 22. In the present embodiment, the thin plate 21 is located at the upper side, and the steel sheet reinforcing plate 22 is located at the lower side of the thin plate 21 and is connected with the thin plate 21 in a matching manner. The camera module of the present invention further includes a connection pin 11, and the connection pin 11 is disposed between the lens 1 and the circuit board 2, and one end thereof is detachably connected to the lens 1, for example, by screwing or the like. The other end is welded and fixed with the circuit board 2 through welding flux.
Referring to fig. 1 and 2, in the present invention, a sheet 21 of a wiring board 2 is provided with a photosensitive chip 23, an electronic component 24, and a flexible connecting tape 25. The circuit board 2 is further provided with a pad 2a for carrying a solder joint, i.e. the pad 2a is soldered to the connection pin 11. According to one embodiment of the invention, the pads 2a may be provided directly on the sheet 21. According to the second embodiment of the present invention, a through hole may be provided in the thin plate 21 of the wiring board 2, and the land 2a may be provided in the through hole to be fixed to the steel sheet reinforcing plate 22, that is, the land 2a may be provided on the steel sheet reinforcing plate 22. The bonding of the connection pin 11 to the pad 2a can be achieved in both of the above-described manners.
In the present invention, the wiring board 2 of the present invention includes a thin plate 21 and a steel sheet reinforcing plate 22. Through setting up steel sheet reinforcing plate 22, can strengthen the structural strength of circuit board 2 on the one hand, on the other hand, steel sheet reinforcing plate 22 has the fast advantage of heat dissipation, can take away the heat that photosensitive chip 23 work produced rapidly, guarantees that the heat of whole circuit board 2 is even for the deformation volume of circuit board 2 obtains effective control, can promote the imaging quality of the module of making a video recording under operating condition by a wide margin.
In addition, the camera module of the invention is characterized in that the connecting pin 11 is arranged on the lens 1, the pad 2a is arranged on the circuit board 2, and the lens 1 is fixedly connected with the circuit board 2 by welding the connecting pin 11 and the pad 2 a. So effectively solved among the prior art utilize glue to be connected camera lens and circuit board the defect that exists, be favorable to improving the formation of image quality of the module of making a video recording.
In the present invention, it should be noted that the lens 1 of the present invention may adopt a split type lens or an integral type lens. Namely, no matter what structure is adopted for assembling the lens 1, the connecting pin 11 and the circuit board 2, the camera module group of the invention can be ensured to have good imaging quality.
In the present embodiment, the lens 1 of the present invention is an integral lens and is made of metal material, so that the thermal deformation is small, and the influence of the lens assembly on the imaging quality of the module can be reduced.
In the present invention, the steel reinforcing plate 22 has a thermal conductivity greater than that of the connecting pin 11. In the present embodiment, the connection pin 11 is made of a carbon steel material. Due to the arrangement, heat conduction along the pin 11 towards the lens 1 direction is slow in the welding process, and heat conduction towards the steel sheet reinforcing plate 22 direction is fast, so that heat generated in the working state of the circuit board 2 is dissipated from the steel sheet reinforcing plate 22, temperature rise of the circuit board 2 cannot influence the temperature drift change of the lens, stability of imaging quality is guaranteed, the camera module can work under a harsher environment condition, and the application range is wider.
Referring to fig. 1, 2 and 3, the invention further provides an assembly process of the camera module. Comprises a, connecting the lens 1 with the connecting pin 11; b. focusing processing is carried out on the image sensors of the lens 1 and the circuit board 2; c. the connection pins 11 are soldered and fixed to the circuit board 2 by solder 3.
Specifically, the lens 1, the connection pin 11, and the wiring board 2 that have been inspected to be acceptable are first selected.
The connecting pin 11 is then screwed or otherwise fixed to the lens 1. Then, the automatic spot welding machine welds the solder 3 (which may be solder paste, solder ball, solder wire, etc.) on the pad 2a of the circuit board 2. Then, the relative positions of the lens 1 and the circuit board 2 are adjusted, the focusing processing is carried out on the image sensors on the lens 1 and the circuit board 2, and the optical center, the optical axis and the resolving power are adjusted. After the welding is finished, the welding machine is automatically started, and the welding flux 3 at the welding disc 2a is heated and melted to be fixed. And then testing the optical performance of the camera, displaying the test completion state by the LED display screen, and completing the assembly of the lens 1 and the circuit board 2. After which the assembly of other components can be performed.
According to the second embodiment of the present invention, the lens 1, the connection pin 11, and the wiring board 2 that are qualified through the inspection are first selected.
The connecting pin 11 is then screwed or otherwise fixed to the lens 1. Then, the relative positions of the lens 1 and the circuit board 2 are adjusted, the focusing processing is carried out on the image sensors on the lens 1 and the circuit board 2, and the optical center, the optical axis and the resolving power are adjusted. After the adjustment is finished, the solder feeding device feeds a tin wire or a tin ball near the gap between the pad 2a and the connecting pin 11, the welding device melts the solder 3 and then drops at the gap between the pad 2a and the connecting pin 11, the optical performance of the camera is tested after the cooling, the LED display screen displays the test completion state, and the assembly of the lens 1 and the circuit board 2 is finished. And then assembling other components.
In the above two modes, the connection pin 11 and the circuit board 22 (the pad 2a) need to be electroplated before soldering, which is beneficial to ensuring the soldering firmness. The connecting pin 11 and the bonding pad 2a are welded according to the two modes, so that the focusing precision of the camera module is ensured, and the imaging quality is improved.
The foregoing is merely exemplary of particular aspects of the present invention and devices and structures not specifically described herein are understood to be those of ordinary skill in the art and are intended to be implemented in such conventional ways.
The above description is only one embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. A camera module comprises a lens (1) and a circuit board (2) connected with the lens (1), wherein an image sensor and an electronic component are arranged on the circuit board (2),
the circuit board (2) comprises a thin plate (21) and a steel sheet reinforcing plate (22) which is positioned at the lower side of the thin plate (21) and is matched and fixed with the thin plate (21);
a bonding pad (2a) is arranged on the circuit board (2);
the lens fixing device is characterized by further comprising a connecting pin (11), wherein one end of the connecting pin (11) is detachably connected with the lens (1), and the other end of the connecting pin (11) is welded with the circuit board (2) through a welding flux (3);
the heat conductivity coefficient of the steel sheet reinforcing plate (22) is larger than that of the connecting pin (12).
2. A camera module according to claim 1, characterized in that the pads (2a) are provided on the sheet (21).
3. Camera module according to claim 1, characterized in that the lamella (21) is provided with through holes in which the pads (2a) are fixed to the steel reinforcement plate (22).
4. The camera module according to claim 1, characterized in that the connecting pin (12) is made of carbon steel.
5. The camera module according to claim 1, characterized in that the lens (1) is a one-piece lens.
6. The camera module according to claim 5, wherein the lens (1) is made of a metal material.
7. An assembly process for the camera module of any one of claims 1-6, comprising:
a. connecting the lens with the connecting pin;
b. focusing processing is carried out on the lens and the image sensor on the circuit board;
c. and welding and fixing the connecting pin and the circuit board through solder.
8. The assembly process of claim 7, wherein prior to step c, the connection pins and the circuit board are plated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811209482.6A CN109040567B (en) | 2018-10-17 | 2018-10-17 | Camera module and assembly process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811209482.6A CN109040567B (en) | 2018-10-17 | 2018-10-17 | Camera module and assembly process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109040567A CN109040567A (en) | 2018-12-18 |
| CN109040567B true CN109040567B (en) | 2020-09-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811209482.6A Active CN109040567B (en) | 2018-10-17 | 2018-10-17 | Camera module and assembly process |
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| Country | Link |
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| CN (1) | CN109040567B (en) |
Citations (3)
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| EP2234151A1 (en) * | 2009-03-24 | 2010-09-29 | Sony Corporation | Semiconductor device |
| CN106537252A (en) * | 2014-05-06 | 2017-03-22 | 宁波舜宇光电信息有限公司 | Light-deflection three-dimensional imaging device and projection device, and application thereof |
| CN207053880U (en) * | 2017-08-24 | 2018-02-27 | 信利光电股份有限公司 | A kind of circuit sheet material, camera module and electronic equipment |
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| US7943287B2 (en) * | 2006-07-28 | 2011-05-17 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing display device |
| CN102419471A (en) * | 2010-09-27 | 2012-04-18 | 南京芒冠光电科技股份有限公司 | Short-focus lens |
| JP5440559B2 (en) * | 2011-06-30 | 2014-03-12 | 株式会社ニコン | Lens barrel and imaging device |
| CN102821239A (en) * | 2012-09-14 | 2012-12-12 | 信利光电(汕尾)有限公司 | Camera module |
| JP6300579B2 (en) * | 2014-03-05 | 2018-03-28 | キヤノン株式会社 | Method for manufacturing mounting member, electronic component and module |
| CN106817515B (en) * | 2015-11-30 | 2020-07-24 | 宁波舜宇光电信息有限公司 | Camera module and structure and assembling method thereof |
| CN110324516B (en) * | 2016-03-12 | 2021-12-31 | 宁波舜宇光电信息有限公司 | Camera module and photosensitive assembly and manufacturing method thereof |
| CN107092067A (en) * | 2017-07-05 | 2017-08-25 | 深圳市泰衡诺科技有限公司上海分公司 | A kind of lens assembly and the intelligent terminal with the lens assembly |
| CN108401099A (en) * | 2018-05-24 | 2018-08-14 | 苏州智华汽车电子有限公司 | A kind of vehicle-mounted camera |
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2018
- 2018-10-17 CN CN201811209482.6A patent/CN109040567B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2234151A1 (en) * | 2009-03-24 | 2010-09-29 | Sony Corporation | Semiconductor device |
| CN106537252A (en) * | 2014-05-06 | 2017-03-22 | 宁波舜宇光电信息有限公司 | Light-deflection three-dimensional imaging device and projection device, and application thereof |
| CN207053880U (en) * | 2017-08-24 | 2018-02-27 | 信利光电股份有限公司 | A kind of circuit sheet material, camera module and electronic equipment |
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| Publication number | Publication date |
|---|---|
| CN109040567A (en) | 2018-12-18 |
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Address after: 315400 No. 67-69 Fengle Road, Yangming Street, Yuyao City, Ningbo City, Zhejiang Province Patentee after: Zhejiang SunYu Zhiling Technology Co.,Ltd. Address before: 315400 No. 67-69 Fengle Road, Yangming Street, Yuyao City, Ningbo City, Zhejiang Province Patentee before: NINGBO WISSEN INTELLIGENT SENSING TECHNOLOGY Co.,Ltd. |