CN109037416A - 一种led备胶封装加工专用的机械化设备 - Google Patents
一种led备胶封装加工专用的机械化设备 Download PDFInfo
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- CN109037416A CN109037416A CN201810967019.1A CN201810967019A CN109037416A CN 109037416 A CN109037416 A CN 109037416A CN 201810967019 A CN201810967019 A CN 201810967019A CN 109037416 A CN109037416 A CN 109037416A
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- 239000003292 glue Substances 0.000 title claims abstract description 29
- 238000005538 encapsulation Methods 0.000 title claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 80
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- 238000009434 installation Methods 0.000 claims description 16
- 230000001105 regulatory effect Effects 0.000 claims description 16
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- 230000000903 blocking effect Effects 0.000 claims description 5
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- 229910052709 silver Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
Abstract
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CN201810967019.1A CN109037416B (zh) | 2018-08-23 | 2018-08-23 | 一种led备胶封装加工专用的机械化设备 |
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CN201810967019.1A CN109037416B (zh) | 2018-08-23 | 2018-08-23 | 一种led备胶封装加工专用的机械化设备 |
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CN109037416A true CN109037416A (zh) | 2018-12-18 |
CN109037416B CN109037416B (zh) | 2019-10-18 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109399968A (zh) * | 2018-12-21 | 2019-03-01 | 浙江晶鲸科技有限公司 | 建筑调光玻璃封边系统 |
CN110335551A (zh) * | 2019-05-21 | 2019-10-15 | 安徽明洋电子有限公司 | 一种led显示屏加工用屏幕封装设备及其操作方法 |
CN111962823A (zh) * | 2020-08-20 | 2020-11-20 | 北京东豪建设集团有限公司 | 轻钢龙骨冲筋铺贴陶瓷薄板地面用涂胶装置及施工工艺 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0908876A2 (de) * | 1997-10-08 | 1999-04-14 | Leybold Systems GmbH | Verfahren zum Verkleben eines flachen, kreisscheibenförmigen ersten Substrats aus einem Kunststoff mit einem ebensolchen zweiten Substrat zu einer digital video disc und Vorrichtung zur Durchführung des Verfahrens |
CN102612311A (zh) * | 2012-03-01 | 2012-07-25 | 深圳市中科创安科技有限公司 | 一种电子元件的自动上料组装输送装置 |
TW201601846A (zh) * | 2014-07-02 | 2016-01-16 | All Ring Tech Co Ltd | 電子元件液材施作方法及裝置 |
CN107651416A (zh) * | 2017-09-15 | 2018-02-02 | 严传玉 | 一种点胶设备组装上下料机 |
CN108328315A (zh) * | 2018-03-27 | 2018-07-27 | 杭州爵沸网络科技有限公司 | 一种工业夹持输送设备 |
-
2018
- 2018-08-23 CN CN201810967019.1A patent/CN109037416B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0908876A2 (de) * | 1997-10-08 | 1999-04-14 | Leybold Systems GmbH | Verfahren zum Verkleben eines flachen, kreisscheibenförmigen ersten Substrats aus einem Kunststoff mit einem ebensolchen zweiten Substrat zu einer digital video disc und Vorrichtung zur Durchführung des Verfahrens |
CN102612311A (zh) * | 2012-03-01 | 2012-07-25 | 深圳市中科创安科技有限公司 | 一种电子元件的自动上料组装输送装置 |
TW201601846A (zh) * | 2014-07-02 | 2016-01-16 | All Ring Tech Co Ltd | 電子元件液材施作方法及裝置 |
CN107651416A (zh) * | 2017-09-15 | 2018-02-02 | 严传玉 | 一种点胶设备组装上下料机 |
CN108328315A (zh) * | 2018-03-27 | 2018-07-27 | 杭州爵沸网络科技有限公司 | 一种工业夹持输送设备 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109399968A (zh) * | 2018-12-21 | 2019-03-01 | 浙江晶鲸科技有限公司 | 建筑调光玻璃封边系统 |
CN110335551A (zh) * | 2019-05-21 | 2019-10-15 | 安徽明洋电子有限公司 | 一种led显示屏加工用屏幕封装设备及其操作方法 |
CN111962823A (zh) * | 2020-08-20 | 2020-11-20 | 北京东豪建设集团有限公司 | 轻钢龙骨冲筋铺贴陶瓷薄板地面用涂胶装置及施工工艺 |
CN111962823B (zh) * | 2020-08-20 | 2021-09-17 | 北京东豪建设集团有限公司 | 轻钢龙骨冲筋铺贴陶瓷薄板地面用涂胶装置及施工工艺 |
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Effective date of registration: 20190924 Address after: 325007 No. 10 Fengyuan East Road, Lucheng District, Wenzhou City, Zhejiang Province (Wenzhou Feiguang Technology Co., Ltd.) Applicant after: Zhu Feilong Address before: Room 401, No. 210 Lane 3, Tianshan Road, Minhang District, Shanghai 200051 Applicant before: Sun Junbiao |
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Effective date of registration: 20210210 Address after: 102200 423, 4 / F, block a, Xinhua future city building, 175 Litang Road, Changping District, Beijing Patentee after: Li Qiannan Address before: 325007 No.10 Fenglong East Road, Lucheng District, Wenzhou City, Zhejiang Province (Wenzhou FeiGuang Technology Co., Ltd.) Patentee before: Zhu Feilong |
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Effective date of registration: 20211122 Address after: 350800 Building 2, science and technology incubator, No.3, Baijin Road, Baizhong Town, Minqing County, Fuzhou City, Fujian Province Patentee after: Fuzhou hengming Information Technology Co.,Ltd. Address before: 102200 423, 4 / F, block a, Xinhua future city building, 175 Litang Road, Changping District, Beijing Patentee before: Li Qiannan |
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Effective date of registration: 20220117 Address after: 102200 423, 4 / F, block a, Xinhua future city building, 175 Litang Road, Changping District, Beijing Patentee after: Li Gang Address before: 350800 Building 2, science and technology incubator, No.3, Baijin Road, Baizhong Town, Minqing County, Fuzhou City, Fujian Province Patentee before: Fuzhou hengming Information Technology Co.,Ltd. |
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Effective date of registration: 20220803 Address after: 529000 one of the third floor of Building 5, No. 168, Gaoxin West Road, Jianghai District, Jiangmen City, Guangdong Province (self compiled 301) Patentee after: Jiangmen Lanji Fengguang Technology Co.,Ltd. Address before: 102200 423, 4 / F, block a, Xinhua future city building, 175 Litang Road, Changping District, Beijing Patentee before: Li Gang |
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