CN109037118B - Method and equipment for taking and placing permanent magnet for multiple grains - Google Patents
Method and equipment for taking and placing permanent magnet for multiple grains Download PDFInfo
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- CN109037118B CN109037118B CN201811045952.XA CN201811045952A CN109037118B CN 109037118 B CN109037118 B CN 109037118B CN 201811045952 A CN201811045952 A CN 201811045952A CN 109037118 B CN109037118 B CN 109037118B
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- 238000000034 method Methods 0.000 title claims abstract description 32
- 239000000463 material Substances 0.000 claims abstract description 10
- 229910001172 neodymium magnet Inorganic materials 0.000 claims abstract description 6
- 238000005530 etching Methods 0.000 claims description 20
- 238000005192 partition Methods 0.000 claims description 16
- 230000005484 gravity Effects 0.000 claims description 7
- 239000011159 matrix material Substances 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims 5
- 239000013078 crystal Substances 0.000 claims 1
- 238000000926 separation method Methods 0.000 abstract description 8
- 230000005389 magnetism Effects 0.000 description 12
- 239000000696 magnetic material Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- QJVKUMXDEUEQLH-UHFFFAOYSA-N [B].[Fe].[Nd] Chemical compound [B].[Fe].[Nd] QJVKUMXDEUEQLH-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000011197 physicochemical method Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a method and equipment for taking and placing a plurality of grains by using a permanent magnet, which can ensure permanent stability of attractive magnetic force and stability by using a neodymium iron boron magnet. The cylinder is used for pushing the permanent magnet to move, so that the permanent magnet can slowly move, the magnetic force can be slowly weakened, and the problem of severe shaking of magnetic force materials in the process of upward attraction and downward separation is avoided. The multiple chips can be simultaneously taken, the multiple ejector rods are pushed by the one cylinder, so that the multiple chips are simultaneously taken and unloaded, the synchronization rate is high, and the working efficiency is improved. The size of the magnetic force born by the chip can be changed by adjusting the elongation of the air cylinder, so that the chip is suitable for chips with different weights, and the application range is wide.
Description
Technical Field
The invention relates to the field of packaging process equipment, in particular to a method and equipment for taking and placing a permanent magnet for a plurality of grains.
Background
IC packages are referred to as circuit pins on a silicon die that are wired to external connectors for connection to other devices. The package form refers to a case for mounting a semiconductor integrated circuit chip. The chip is connected to pins of the packaging shell through wires by contacts on the chip, and the pins are connected with other devices through wires on a printed circuit board, so that the connection between the internal chip and an external circuit is realized.
The IC package is formed by etching a lead frame, and a currently used method is that a vacuum pump is connected with a soft suction nozzle to perform a pick-and-place operation, wherein the vacuum pump refers to a device or equipment for obtaining vacuum by pumping air from a pumped container by a mechanical, physical, chemical or physicochemical method. In popular practice, a vacuum pump is a device for improving, generating and maintaining vacuum in a certain enclosed space by various methods, and in the prior art, a suction head of a soft suction nozzle is easy to deform, so that stability in taking and placing operations is poor, and working efficiency is affected.
The mechanical arm is a high-precision high-speed dispensing robot arm, and is a complex system with multiple inputs, multiple outputs, high nonlinearity and strong coupling. Because of its unique operational flexibility, it has been widely used in the fields of industrial assembly, safety explosion protection, etc.
The burr machine is used for processing burrs of compressed or injection molded thermosetting plastic products, is integrated with a self-contained projection device, a machine box, an endless belt conveying device, a dust collecting device and the like, is a spray washer with simple appearance, no space occupation and high efficiency, and can be used for an etching process of IC packaging.
Disclosure of Invention
In order to solve the technical problems, the invention aims to provide a method and equipment for taking and placing a plurality of grains by using a permanent magnet, and the chip is taken and placed by adjusting the magnetic force, so that the stability is improved, the time and the labor are saved, and the working efficiency is improved.
The aim of the invention can be achieved by the following technical scheme:
a method for taking and placing a permanent magnet for a plurality of grains comprises an IC tray, a mechanical arm, a taking and placing device and an etching device, wherein the method for taking and placing the permanent magnet for the plurality of grains comprises the following steps:
s1, taking out and fixing a chip: the mechanical arm is fixedly connected with the picking and placing equipment, the mechanical arm controls the picking and placing equipment to move, the picking and placing equipment is aligned with and close to an IC tray placed on the workbench, the picking and placing equipment is abutted against the upper end face of the IC tray, the mechanical arm is fixed in position, meanwhile, the picking and placing equipment is started, chips are sucked out of the IC tray through increasing magnetic force, the chips are adsorbed on the lower end face of the picking and placing equipment, and the process of picking and fixing is completed;
s2, etching the chip: the mechanical arm is controlled to horizontally convey the pick-and-place equipment with the chips adsorbed and fixed to the etching device, then the magnetic force applied to the chips is changed, and when the gravity of the chips is larger than the magnetic force, the chips are separated from the pick-and-place equipment, and the etching device processes the chips;
s3, transferring the chip: after the chip is processed by the etching device, repeating the operation of S1, so that the processed chip and the picking and placing equipment are adsorbed and fixed together again and transported to the next processing equipment through the mechanical arm.
Further, the etching device is a burr machine.
Further, the chip is a QFN IC Package.
Further, the IC tray is QFN Matrix IC Tray, and forty-eight fixing grooves distributed in matrix are formed in the surface of the IC tray, and the fixing grooves are in a cube structure.
The method has the beneficial effects that: the magnetic attraction is used, so that the force can be ensured to be stable when the suction nozzle is taken and placed, the stability problem caused by deformation of the suction head of the soft suction nozzle can be avoided, the time and the labor are saved, and the working efficiency is improved.
The utility model provides a get equipment of putting of many grains with permanent magnet, includes the cylinder, cylinder fixedly connected with connection screw thread post, connection screw thread post and arm threaded connection, the piston rod fixedly connected with push pedal of cylinder, the perpendicular fixedly connected with of lower terminal surface of push pedal matches forty eight ejector pins of fixed slot, the lateral wall of cylinder has the mounting box through fixed bolster connection, the mounting box is located under the cylinder, and mounting box and push pedal parallel arrangement, forty eight sliding trays of matching the fixed slot have been seted up to the lower terminal surface of mounting box, the jack of intercommunication mounting box up end has been seted up to the interior roof of sliding tray, jack, sliding tray and ejector pin coaxial arrangement, sliding connection has the permanent magnetism piece in the sliding tray, the upper end of permanent magnetism piece is connected with the interior roof of sliding tray through reset spring, the reset spring movable sleeve is established on the ejector pin, the lower extreme of ejector pin passes the jack and is inconsistent with the up end of permanent magnetism piece, four terminal points department of terminal surface all fixedly connected with the one end of mounting box lower terminal surface, four other ends are the same magnetism baffle that is connected with on the same one and is the baffle.
Further, the permanent magnet is a neodymium iron boron magnet, the permanent magnet is of a cylindrical structure, and the area of the bottom surface of the permanent magnet is smaller than that of the chip.
Further, the cylinder is a single-acting cylinder, and the pushing speed of the cylinder is not more than 1mm/s.
Further, the thickness of the partition plate is not more than 1mm, and the length of the sliding groove is not less than 7cm.
When the chip is taken, the fixing grooves on the IC tray are in one-to-one correspondence with the permanent magnetic blocks, the air cylinders are started, the pushing plates are pushed to move downwards, the push rods push the permanent magnetic blocks to move downwards along the sliding grooves, at the moment, the distance between the permanent magnetic blocks and the chip is slowly reduced at the speed of 1mm/s, the violent shaking of magnetic materials is avoided in the process of upward attraction and downward detachment, the chip contains a wire metal frame, the magnetic materials are contained, the magnetic force is increased and is larger than the gravity of the chip, the chip can be sucked out of the IC tray, the chips are tightly adsorbed on the lower end face of the partition plate, the size of the magnetic force cannot be influenced by the partition plate of the nonmagnetic material, the permanent magnetic blocks are separated from the chip, and the problem that the chip cannot be separated due to direct attraction of the permanent magnetic blocks is avoided.
When the chip is dismounted, the air cylinder is only required to be started, the push plate is pushed to move upwards, the reset spring pulls the permanent magnet block to move upwards along the sliding groove, meanwhile, the permanent magnet block is kept in conflict with the ejector rod, the permanent magnet block is guaranteed to rise slowly, the magnetic force is reduced slowly, and when the gravity of the chip is larger than the magnetic force, the chip is separated from the partition plate.
The picking and placing device has the beneficial effects that:
(1) Use neodymium iron boron magnetism, can guarantee to attract magnetism steady for a long time, guarantee stability, the cooperation baffle uses, separates chip and permanent magnetism piece through the baffle of 1mm thick nonmagnetic reaction material preparation, does not have the effect of separation magnetic force, avoids chip and permanent magnetism piece direct contact to hold and cause unable separation, makes things convenient for taking and the dismantlement of chip.
(2) The cylinder is used for pushing the permanent magnet to move, so that the permanent magnet can slowly move, the magnetic force can be slowly weakened, and the problem of severe shaking of magnetic force materials in the process of upward attraction and downward separation is avoided.
(3) The multiple chips can be simultaneously taken, the multiple ejector rods are pushed by the one cylinder, so that the multiple chips are simultaneously taken and unloaded, the synchronization rate is high, and the working efficiency is improved.
(4) The size of the magnetic force born by the chip can be changed by adjusting the elongation of the air cylinder, so that the chip is suitable for chips with different weights, and the application range is wide.
Drawings
The invention is further described below with reference to the accompanying drawings.
FIG. 1 is a schematic view of a pick-and-place apparatus of the present invention;
FIG. 2 is a schematic view of the internal structure of the pick-and-place apparatus of the present invention;
fig. 3 is a schematic structural view of the IC tray of the present invention.
In the figure: the device comprises an air cylinder 1, a connecting threaded column 2, a push plate 3, an ejector rod 4, a fixed support 5, a mounting box 6, a connecting column 7, a partition plate 8, a reset spring 9, a permanent magnet block 10, an IC tray 11 and a fixed groove 12.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-3, the present embodiment provides a method and an apparatus for picking and placing a permanent magnet for a plurality of dies, including an IC tray 11, a mechanical arm, a picking and placing apparatus, and an etching device, where the method for picking and placing a permanent magnet for a plurality of dies includes:
s1, taking out and fixing a chip: the mechanical arm is fixedly connected with the picking and placing equipment, the mechanical arm controls the picking and placing equipment to move, the picking and placing equipment is aligned with and close to the IC tray 11 placed on the workbench, the picking and placing equipment is abutted against the upper end face of the IC tray 11, the mechanical arm is fixed in position, meanwhile, the picking and placing equipment is started, chips are sucked out of the IC tray 11 through increasing magnetic force, the chips are adsorbed on the lower end face of the picking and placing equipment, and the process of picking and fixing is completed;
s2, etching the chip: the mechanical arm is controlled to horizontally convey the pick-and-place equipment with the chips adsorbed and fixed to the etching device, then the magnetic force applied to the chips is changed, and when the gravity of the chips is larger than the magnetic force, the chips are separated from the pick-and-place equipment, and the etching device processes the chips;
s3, transferring the chip: after the chip is processed by the etching device, repeating the operation of S1, so that the processed chip and the picking and placing equipment are adsorbed and fixed together again and transported to the next processing equipment through the mechanical arm.
The etching device is a burr machine.
The chip is a QFN IC Package, and the inside of the chip comprises a wire metal frame, and belongs to magnetic materials.
The IC tray 11 is QFN Matrix IC Tray, forty-eight fixing grooves 12 distributed in a matrix are formed in the surface of the IC tray 11, and the fixing grooves 12 are of a cube structure.
The method has the beneficial effects that: the magnetic attraction is used, so that the force can be ensured to be stable when the suction nozzle is taken and placed, the stability problem caused by deformation of the suction head of the soft suction nozzle can be avoided, the time and the labor are saved, and the working efficiency is improved.
A permanent magnet is used for picking and placing equipment of a plurality of grains, and comprises a cylinder 1, wherein the cylinder 1 is a single-acting cylinder, the pushing speed of the cylinder 1 is not more than 1mm/s, and the magnetic force can be quickly weakened due to the fact that the distance is far, but the magnetic force is not changed in an equal proportion; so the movable permanent magnet must be very slowly separated, the cylinder 1 is fixedly connected with a connecting threaded column 2, the connecting threaded column 2 is in threaded connection with a mechanical arm, a piston rod of the cylinder 1 is fixedly connected with a push plate 3, forty-eight push rods 4 matched with a fixing groove 12 are vertically and fixedly connected with the lower end surface of the push plate 3, the synchronous rate of taking and placing a plurality of chips is ensured, the outer side wall of the cylinder 1 is connected with a mounting box 6 through a fixing bracket 5, the mounting box 6 is positioned under the cylinder 1, the mounting box 6 is arranged in parallel with the push plate 3, forty-eight sliding grooves matched with the fixing groove 12 are formed in the lower end surface of the mounting box 6, the length of the sliding grooves is not less than 7cm, the chip with different weights can be suitable, the inner top wall of the sliding groove is provided with a jack communicated with the upper end face of the mounting box 6, the jack, the sliding groove and the ejector rod 4 are coaxially arranged, a permanent magnet block 10 is connected in the sliding groove in a sliding way, the permanent magnet block 10 is of a neodymium iron boron magnet, the permanent magnet block 10 is of a cylindrical structure, the bottom surface area of the permanent magnet block 10 is smaller than the area of a chip, the upper end of the permanent magnet block 10 is connected with the inner top wall of the sliding groove through a return spring 9, the return spring 9 is movably sleeved on the ejector rod 4, the lower end of the ejector rod 4 penetrates through the jack and is in contact with the upper end face of the permanent magnet block 10, one end of a connecting column 7 is fixedly connected to four end points of the lower end face of the mounting box 6, and the other ends of the connecting columns 7 are fixedly connected to the same partition plate 8 and are magnetically reacted iron sheets, so that magnetic force can be blocked most; the material without magnetic reaction does not block magnetic force, so that the partition plate 8 is made of the material without magnetic reaction, the partition plate 8 is used as a separation key, the partition plate 8 is not directly sucked by the permanent magnet block 10 in the future, and the thickness of the partition plate 8 is not more than 1mm.
This get put equipment and use neodymium iron boron magnetism, can guarantee to attract magnetism permanent stability, guarantee stability, cooperation baffle 8 use, separate chip and permanent magnetism piece 10 through the baffle 8 of 1mm thick nonmagnetic reaction material preparation, do not have the effect of separation magnetic force, avoid chip and permanent magnetism piece 10 direct contact to hold and cause unable separation, make things convenient for taking and the dismantlement of chip. The cylinder 1 is used for pushing the permanent magnet blocks 10 to move, so that the permanent magnet blocks 10 can slowly move, the magnetic force can be slowly weakened, and the problem of severe shaking of magnetic force materials in the process of upward attraction and downward separation is avoided. The multiple chips can be taken simultaneously, and the multiple ejector rods 4 are pushed by the air cylinder 1, so that the multiple chips can be taken and unloaded simultaneously, the synchronization rate is high, and the working efficiency is improved. The size of the magnetic force born by the chip can be changed by adjusting the elongation of the air cylinder 1, so that the chip is suitable for chips with different weights, and the application range is wide.
The specific working process of the picking and placing equipment is as follows:
1) When a chip is taken, the fixed grooves 12 on the IC tray 11 are in one-to-one correspondence with the permanent magnet blocks 10, the air cylinder 1 is started to push the push plate 3 to move downwards, so that the push rod 4 pushes the permanent magnet blocks 10 to move downwards along the sliding grooves, at the moment, the distance between the permanent magnet blocks 10 and the chip is slowly reduced at a speed of 1mm/s, the phenomenon that the magnetic materials shake violently in the process of upward attraction and downward detachment is avoided, the chip contains a lead metal frame, the magnetic force is increased and is larger than the gravity of the chip, the chip can be sucked out of the IC tray 11 and is tightly adsorbed on the lower end surface of the partition plate 8, the partition plate 8 through the nonmagnetic material guarantees that the magnetic force is not influenced, the permanent magnet blocks 10 are separated from the chip, and the problem that the chip cannot be separated due to direct attraction of the permanent magnet blocks 10 is avoided;
2) When the chip is dismounted, the cylinder 1 is only required to be started, the push plate 3 is pushed to move upwards, the reset spring 9 pulls the permanent magnet block 10 to move upwards along the sliding groove, meanwhile, the permanent magnet block 10 is kept in conflict with the ejector rod 4, the permanent magnet block 10 is guaranteed to slowly rise, the magnetic force is slowly reduced, and when the gravity of the chip is larger than the magnetic force, the chip is separated from the partition plate 8.
The foregoing is merely illustrative of the structures of this invention and various modifications, additions and substitutions for those skilled in the art can be made to the described embodiments without departing from the scope of the invention or from the scope of the invention as defined in the accompanying claims.
Claims (5)
1. A pick-and-place method for using a permanent magnet for a plurality of dies, comprising an IC tray (11), a robot arm, a pick-and-place apparatus, and an etching device, characterized in that the pick-and-place method for using a permanent magnet for a plurality of dies comprises:
s1, taking out and fixing a chip: the mechanical arm is fixedly connected with the picking and placing equipment, the mechanical arm controls the picking and placing equipment to move, the picking and placing equipment is aligned with and close to an IC tray (11) placed on the workbench, the picking and placing equipment is abutted against the upper end face of the IC tray (11), the mechanical arm is fixed in position, meanwhile, the picking and placing equipment is started, chips are sucked out of the IC tray (11) through increasing magnetic force, the chips are adsorbed on the lower end face of the picking and placing equipment, and the process of picking and fixing is completed;
s2, etching the chip: the mechanical arm is controlled to horizontally convey the pick-and-place equipment with the chips adsorbed and fixed to the etching device, then the magnetic force applied to the chips is changed, and when the gravity of the chips is larger than the magnetic force, the chips are separated from the pick-and-place equipment, and the etching device processes the chips;
s3, transferring the chip: after the chip is processed by the etching device, repeating the operation of S1, so that the processed chip and the picking and placing equipment are adsorbed and fixed together again and transported to the next processing equipment through the mechanical arm;
the picking and placing equipment comprises an air cylinder (1), the air cylinder (1) is fixedly connected with a connecting threaded column (2), the connecting threaded column (2) is in threaded connection with a mechanical arm, a piston rod of the air cylinder (1) is fixedly connected with a push plate (3), forty-eight push rods (4) matched with a fixed groove (12) are vertically and fixedly connected to the lower end face of the push plate (3), an installation box (6) is connected to the outer side wall of the air cylinder (1) through a fixed bracket (5), the installation box (6) is located under the air cylinder (1), the installation box (6) is arranged in parallel with the push plate (3), forty-eight sliding grooves matched with the fixed groove (12) are formed in the lower end face of the installation box (6), jacks communicated with the upper end face of the installation box (6) are formed in the inner top wall of the sliding groove, permanent magnet blocks (10) are coaxially arranged in the sliding groove, the upper end of each permanent magnet block (10) is connected with the inner end face of the corresponding one end face of the corresponding to the corresponding top wall (4) through a reset spring (9), the upper end face of each permanent magnet block (4) is in a sliding mode, the upper end face of each permanent magnet block (10) is fixedly connected with the corresponding to the corresponding end face of the corresponding top wall (4), the other ends of the four connecting columns (7) are fixedly connected to the same partition board (8), and the partition board (8) is made of nonmagnetic reaction materials;
the permanent magnet block (10) is a neodymium iron boron magnet, the permanent magnet block (10) is of a cylindrical structure, and the area of the bottom surface of the permanent magnet block (10) is smaller than the area of a chip;
the cylinder (1) is a single-acting cylinder, and the pushing speed of the cylinder (1) is not more than 1mm/s.
2. The method of claim 1, wherein the etching device is a burr machine.
3. The method of claim 1, wherein the die is a QFN IC Package.
4. The method for taking and placing the permanent magnets into the plurality of grains according to claim 1, wherein the IC tray (11) is QFN Matrix IC Tray, forty-eight fixing grooves (12) distributed in a matrix are formed on the surface of the IC tray (11), and the fixing grooves (12) are in a cube structure.
5. A method for taking and placing a permanent magnet for a plurality of crystal grains according to claim 1, wherein the thickness of the partition plate (8) is not more than 1mm, and the length of the sliding groove is not less than 7cm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811045952.XA CN109037118B (en) | 2018-09-07 | 2018-09-07 | Method and equipment for taking and placing permanent magnet for multiple grains |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811045952.XA CN109037118B (en) | 2018-09-07 | 2018-09-07 | Method and equipment for taking and placing permanent magnet for multiple grains |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109037118A CN109037118A (en) | 2018-12-18 |
| CN109037118B true CN109037118B (en) | 2023-11-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811045952.XA Active CN109037118B (en) | 2018-09-07 | 2018-09-07 | Method and equipment for taking and placing permanent magnet for multiple grains |
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| CN (1) | CN109037118B (en) |
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| CN111780628B (en) * | 2020-05-25 | 2022-05-13 | 中煤科工集团淮北爆破技术研究院有限公司 | Binocular stereo medicine height measuring device |
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| CN109037118A (en) | 2018-12-18 |
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