CN109037118A - A kind of pick-and-place method and apparatus that permanent magnet is used for more crystal grain - Google Patents
A kind of pick-and-place method and apparatus that permanent magnet is used for more crystal grain Download PDFInfo
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- CN109037118A CN109037118A CN201811045952.XA CN201811045952A CN109037118A CN 109037118 A CN109037118 A CN 109037118A CN 201811045952 A CN201811045952 A CN 201811045952A CN 109037118 A CN109037118 A CN 109037118A
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- 238000000034 method Methods 0.000 title claims abstract description 34
- 239000013078 crystal Substances 0.000 title claims abstract description 20
- 238000005192 partition Methods 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 16
- 230000008569 process Effects 0.000 claims description 12
- 238000006243 chemical reaction Methods 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 8
- 230000005484 gravity Effects 0.000 claims description 7
- 239000011159 matrix material Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 230000008859 change Effects 0.000 claims description 3
- 238000009826 distribution Methods 0.000 claims description 3
- 230000005571 horizontal transmission Effects 0.000 claims description 3
- 230000003628 erosive effect Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 5
- 230000004888 barrier function Effects 0.000 abstract description 3
- 230000006641 stabilisation Effects 0.000 abstract description 3
- 238000011105 stabilization Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000011068 loading method Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000008094 contradictory effect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a kind of pick-and-place method and apparatus that permanent magnet is used for more crystal grain, use ndfeb magnet, it can guarantee to attract the permanent stabilization of magnetic force, guarantee stability, cooperate partition to use, separated chip and permanent magnets by partition, does not have the effect of barrier magnetic force, it avoids chip from directly contacting with permanent magnets to be sucked and cause not separating, facilitates taking and unloading for chip.The problem of pushing permanent magnets mobile using cylinder, permanent magnets can be made slowly to move, magnetic force can be made slowly to weaken, avoided during upward attract with being detached from downwards, cause the violent shaking of magnetic force material.Can be taken multiple chips simultaneously, and push multiple mandrils by a cylinder, and multiple chips is made to be completed at the same time the operation taken and unloaded, and sync rates are high, improve work efficiency.The size of magnetic force suffered by chip can be changed by adjusting the elongation of cylinder, and then adapt to the chip of different weight, it is applied widely.
Description
Technical field
The present invention relates to encapsulation procedure apparatus fields, and in particular to a kind of pick-and-place side that permanent magnet is used for more crystal grain
Method and equipment.
Background technique
IC package just refers to the circuit pin on silicon wafer, connect and guided at external lug with conducting wire, so as to other devices
Connection.Packing forms refer to the shell of installation semiconductor integrated circuit chip.It not only plays installation, fixation, sealing, protection
The effect of chip and enhancing electric heating property etc., but also drawing for package casing is wired to by the contact on chip
On foot, these pins are connected further through the conducting wire on printed circuit board with other devices, to realize inside chip and outside
The connection of circuit.
IC package uses lead frame etching forming, and mode used at present is that the soft suction nozzle of vacuum pump connection carries out pick-and-place behaviour
Make, vacuum pump refers to using machinery, physics, chemically or physically the method for chemistry is evacuated and obtains vacuum to being smoked container
Device or equipment.For popular, vacuum pump is to be improved in a certain enclosure space with various methods, generate and maintain the dress of vacuum
It sets, under the prior art, the suction nozzle of soft suction nozzle is easily deformed, and is caused stability when loading or unloading operation poor, is influenced working efficiency.
Mechanical arm refer to high-precision, high speed glue dispensing machine hand, mechanical arm be a multiple-input and multiple-output, nonlinearity,
The complication system of close coupling.Because of its unique operating flexibility, in industry assembling, the fields such as safety anti-explosive are answered extensively
With.
Burr machine is the equipment for handling the thermohardening plastic products flash of compression or ejection formation, self contained projection dress
Set, cabinet, annulus conveying device, dust collect plant etc. are combined into one, and are a kind of tailored appearances, do not take up space, efficiency is again high
Injection rinsing machine can be used for the etching work procedure of IC package.
Summary of the invention
In order to solve the above technical problems, permanent magnet is used for more crystal grain the purpose of the present invention is to provide a kind of
Pick-and-place method and apparatus, by adjust magnetic force size pick and place chip, improve stability, it is time saving and energy saving, improve work effect
Rate.
The purpose of the present invention can be achieved through the following technical solutions:
A kind of pick-and-place method that permanent magnet is used for more crystal grain, including IC pallet, mechanical arm, fetching device and etching
Device, a kind of pick-and-place method that permanent magnet is used for more crystal grain include:
S1. the taking-up and fixation of chip: mechanical arm is fixedly connected with fetching device, and mechanical arm controls fetching device movement,
Make fetching device with place IC pallet on the table and be aligned and close, fetching device contradicts behind the upper surface of IC pallet,
Mechanical arm position is fixed, while fetching device starts, chip is sucked out from IC pallet by increasing magnetic force, adsorbs chip
In the lower end surface of fetching device, complete to take out fixed process；
S2. the etching of chip: absorption is fixed with the fetching device horizontal transmission of chip to Etaching device by control mechanical arm
In, then change chip suffered by magnetic force size, when chip gravity be greater than magnetic force, separate chip with fetching device, etching
Device processes chip；
S3. the transfer of chip: after the completion of device to be etched is to chip manufacture, the operation of S1 is repeated, makes the core for completing to process
Piece is absorbed and fixed at together again with fetching device, is transported by mechanical arm into next process equipment.
Further, the Etaching device is burr machine.
Further, the chip is QFN IC Package.
Further, the IC pallet is QFN Matrix IC Tray, and the surface of the IC pallet offers 48
A fixing groove in matrix distribution, the fixing groove are cube structure.
This method the utility model has the advantages that attracted using magnetic force, when taking and placing, can guarantee stability under loading, Bu Huiyou
In soft suction nozzle suction nozzle deformation and the stability problem that generates, and it is time saving and energy saving, improve work efficiency.
A kind of fetching device that permanent magnet is used for more crystal grain, including cylinder, the cylinder are fixedly connected with connection
Threaded post, the connection screw thread column are threadedly coupled with mechanical arm, and the piston rod of the cylinder is fixedly connected with push plate, the push plate
Lower end surface be vertically fixedly connected with 48 mandrils of matching fixing groove, the lateral wall of the cylinder passes through fixed bracket and connects
It is connected to mounting box, the mounting box is located at the underface of cylinder, and mounting box is arranged in parallel with push plate, the lower end of the mounting box
Face offers 48 sliding grooves of matching fixing groove, and the inner roof wall of the sliding groove offers connection mounting box upper surface
Jack, the jack, sliding groove and mandril are coaxially disposed, and slidably connect permanent magnets in the sliding groove, the permanent magnets
Upper end is connected by the inner roof wall of reset spring and sliding groove, and the reset spring is movably set on mandril, the mandril
Lower end passes through jack and inconsistent with the upper surface of permanent magnets, is fixedly connected at four endpoints of the mounting box lower end surface
One end of connecting column, the other end of four connecting columns are fixedly connected on the same partition, and the partition is nonmagnetic anti-
The material answered.
Further, the permanent magnets are ndfeb magnet, and the permanent magnets are cylindrical structure, and the bottom surface of permanent magnets
Area is less than the area of chip.
Further, the cylinder is single-acting cylinder, and the driving velocity of cylinder is no more than 1mm/s.
Further, the block board thickness is no more than 1mm, and the length of sliding groove is not less than 7cm.
When taking chip, by IC pallet fixing groove and permanent magnets correspond, cylinder is started, push push plate to
Lower movement, make mandril push permanent magnets moved downward along sliding groove, at this time due to permanent magnets at a distance from chip with the speed of 1mm/s
Degree slowly reduces, and guarantees not will cause the violent shaking of magnetic force material, and chip during attracting upwards and being detached from downwards
Containing wire metals frame, belonging to magnetic force material, magnetic force increases and is greater than the gravity of chip, chip can be sucked out from IC pallet,
It is tightly adsorbed on the lower end surface of partition, magnetic force size will not influence by the partition guarantee of the material of nonmagnetic reaction, and make
Permanent magnets are separated with chip, are avoided chip and are directly sucked with permanent magnets and cause the problem of can not separating.
When unloading chip, cylinder need to only be started, push plate is pushed to move upwards, reset spring pulls permanent magnets along sliding
Slot moves upwards, while permanent magnets and mandril keep contradicting, and guarantees that permanent magnets slowly rise, magnetic force slowly reduces, chip gravity
When greater than magnetic force, chip is separated with partition.
This fetching device the utility model has the advantages that
(1) ndfeb magnet is used, can guarantee to attract the permanent stabilization of magnetic force, guarantees stability, cooperation partition uses, leads to
The partition for crossing the nonmagnetic reaction material production of 1mm thickness separates chip and permanent magnets, does not have the effect of barrier magnetic force, keeps away
Exempt from chip and directly contact with permanent magnets to be sucked and cause not separating, facilitates taking and unloading for chip.
(2) it pushes permanent magnets mobile using cylinder, permanent magnets can be made slowly to move, magnetic force can be made slowly to weaken, kept away
The problem of having exempted from during upward attract with being detached from downwards, having caused the violent shaking of magnetic force material.
(3) can take multiple chips simultaneously, and push multiple mandrils by a cylinder, be completed at the same time multiple chips
It takes the operation unloaded, sync rates are high, improve work efficiency.
(4) size of magnetic force suffered by chip can be changed by adjusting the elongation of cylinder, and then adapt to different weight
Chip, it is applied widely.
Detailed description of the invention
The present invention will be further described below with reference to the drawings.
Fig. 1 is the structural schematic diagram of fetching device of the invention；
Fig. 2 is the schematic diagram of internal structure of fetching device of the invention；
Fig. 3 is the structural schematic diagram of IC pallet of the invention.
In figure: cylinder 1, push plate 3, mandril 4, fixation bracket 5, mounting box 6, connecting column 7, partition 8, is answered at connection screw thread column 2
Position spring 9, permanent magnets 10, IC pallet 11, fixing groove 12.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts all other
Embodiment shall fall within the protection scope of the present invention.
Please refer to shown in Fig. 1-3, present embodiments provide it is a kind of by permanent magnet be used for more crystal grain pick-and-place method and
Equipment, including IC pallet 11, mechanical arm, fetching device and Etaching device, it is described a kind of permanent magnet to be used for more crystal grain
Pick-and-place method includes:
S1. the taking-up and fixation of chip: mechanical arm is fixedly connected with fetching device, and mechanical arm controls fetching device movement,
Make fetching device with place IC pallet 11 on the table and be aligned and close, fetching device is contradicted in the upper surface of IC pallet 11
Afterwards, mechanical arm position is fixed, while fetching device starts, chip is sucked out from IC pallet 11 by increasing magnetic force, makes core
Piece is adsorbed on the lower end surface of fetching device, completes to take out fixed process；
S2. the etching of chip: absorption is fixed with the fetching device horizontal transmission of chip to Etaching device by control mechanical arm
In, then change chip suffered by magnetic force size, when chip gravity be greater than magnetic force, separate chip with fetching device, etching
Device processes chip；
S3. the transfer of chip: after the completion of device to be etched is to chip manufacture, the operation of S1 is repeated, makes the core for completing to process
Piece is absorbed and fixed at together again with fetching device, is transported by mechanical arm into next process equipment.
The Etaching device is burr machine.
The chip is QFN IC Package, and internal includes wire metals frame, belongs to magnetic force material.
The IC pallet 11 is QFN Matrix IC Tray, and the surface of the IC pallet 11 offers 48 in square
The fixing groove 12 of battle array distribution, the fixing groove 12 are cube structure.
This method the utility model has the advantages that attracted using magnetic force, when taking and placing, can guarantee stability under loading, Bu Huiyou
In soft suction nozzle suction nozzle deformation and the stability problem that generates, and it is time saving and energy saving, improve work efficiency.
A kind of fetching device that permanent magnet is used for more crystal grain, including cylinder 1, the cylinder 1 are single-acting cylinder,
And the driving velocity of cylinder 1 is no more than 1mm/s, magnetic force meeting is because remote apart from becoming, and cracking decrease, but is not equal proportion
Variation；Therefore mobile permanent magnet must very slowly the light and handy separation of ability, the cylinder 1 be fixedly connected with connection screw thread column 2, institute
It states connection screw thread column 2 to be threadedly coupled with mechanical arm, the piston rod of the cylinder 1 is fixedly connected with push plate 3, under the push plate 3
End face is vertically fixedly connected with 48 mandrils 4 of matching fixing groove 12, guarantees the sync rates for picking and placing multiple chips, the gas
The lateral wall of cylinder 1 passes through fixed bracket 5 and is connected with mounting box 6, and the mounting box 6 is located at the underface of cylinder 1, and mounting box 6
It is arranged in parallel with push plate 3, the lower end surface of the mounting box 6 offers 48 sliding grooves of matching fixing groove 12, and slides
The length of slot is not less than 7cm, can be applicable in the chip of different weight, and the inner roof wall of the sliding groove offers connection mounting box 6
The jack of upper surface, the jack, sliding groove and mandril 4 are coaxially disposed, and slidably connect permanent magnets 10, institute in the sliding groove
Stating permanent magnets 10 is ndfeb magnet, and the permanent magnets 10 are cylindrical structure, and the base area of permanent magnets 10 is less than chip
Area, the upper ends of the permanent magnets 10 connect by reset spring 9 with the inner roof wall of sliding groove, and the reset spring 9 is movable
It is set on mandril 4, the lower end of the mandril 4 passes through jack and inconsistent with the upper surface of permanent magnets 10, under the mounting box 6
One end of connecting column 7 is fixedly connected at four endpoints of end face, the other end of four connecting columns 7 is fixedly connected on together
On one partition 8, the iron plate for the reaction that is magnetic can most obstruct magnetic force；And the material of nonmagnetic reaction, magnetic will not be stopped instead
Power, therefore the partition 8 is the material of nonmagnetic reaction, being detached from key is using partition 8, and future is not inhaled directly by permanent magnets 10
It firmly causes not separating, 8 thickness of partition is no more than 1mm.
This fetching device uses ndfeb magnet, can guarantee to attract the permanent stabilization of magnetic force, guarantee stability, cooperate partition
8 use, and separate chip and permanent magnets 10 by the partition 8 that the nonmagnetic reaction material of 1mm thickness makes, do not have barrier magnetic
The effect of power avoids chip from directly contacting with permanent magnets 10 and is sucked and causes not separating, facilitates taking and unloading for chip.Make
Push permanent magnets 10 mobile with cylinder 1, permanent magnets 10 can be made slowly to move, magnetic force can be made slowly to weaken, avoid to
Upper attraction and during being detached from downwards, the problem of causing the violent shaking of magnetic force material.Can be taken multiple chips simultaneously, and
Multiple mandrils 4 are pushed by a cylinder 1, multiple chips is made to be completed at the same time the operation taken and unloaded, sync rates are high, improve work
Make efficiency.The size of magnetic force suffered by chip can be changed by adjusting the elongation of cylinder 1, and then adapt to the core of different weight
Piece, it is applied widely.
The specific work process of this fetching device is as follows:
1) when taking chip, the fixing groove 12 on IC pallet 11 is corresponded with permanent magnets 10, cylinder 1 is started,
It pushes push plate 3 to move downward, makes mandril 4 that permanent magnets 10 be pushed to move downward along sliding groove, at this time due to permanent magnets 10 and chip
Distance slowly reduced with the speed of 1mm/s, guarantee it is upward attract and be detached from downwards during, not will cause magnetic force material
Violent shaking, and chip contains wire metals frame, belongs to magnetic force material, and magnetic force increases and be greater than the gravity of chip, can will
Chip is sucked out from IC pallet 11, is tightly adsorbed on the lower end surface of partition 8, is guaranteed by the partition 8 of the material of nonmagnetic reaction
It will not influence magnetic force size, and separate permanent magnets 10 with chip, avoid chip and permanent magnets 10 are directly sucked and cause nothing
The problem of method separates；
2) when unloading chip, cylinder 1 need to only be started, push plate 3 is pushed to move upwards, reset spring 9 pulls permanent magnets
10 move upwards along sliding groove, while permanent magnets 10 and mandril 4 keep contradicting, and guarantee that permanent magnets 10 slowly rise, magnetic force is slow
Reduce, when chip gravity is greater than magnetic force, chip is separated with partition 8.
Above content is only to structure of the invention example and explanation, affiliated those skilled in the art couple
Described specific embodiment does various modifications or additions or is substituted in a similar manner, without departing from invention
Structure or beyond the scope defined by this claim, is within the scope of protection of the invention.
Claims (8)
1. a kind of pick-and-place method that permanent magnet is used for more crystal grain, including IC pallet (11), mechanical arm, fetching device and erosion
Engraving device, which is characterized in that a kind of pick-and-place method that permanent magnet is used for more crystal grain includes:
S1. the taking-up and fixation of chip: mechanical arm is fixedly connected with fetching device, and mechanical arm controls fetching device movement, makes to take
Put equipment with place IC pallet (11) on the table and be aligned and close, upper surface of the fetching device conflict in IC pallet (11)
Afterwards, mechanical arm position is fixed, while fetching device starts, chip is sucked out from IC pallet (11) by increasing magnetic force, is made
Chip is adsorbed on the lower end surface of fetching device, completes to take out fixed process；
S2. the etching of chip: control mechanical arm will adsorb the fetching device horizontal transmission for being fixed with chip into Etaching device, with
Afterwards change chip suffered by magnetic force size, when chip gravity be greater than magnetic force, separate chip with fetching device, Etaching device pair
Chip is processed；
S3. the transfer of chip: after the completion of device to be etched is to chip manufacture, repeat S1 operation, make complete process chip with
Fetching device is absorbed and fixed at together again, is transported by mechanical arm into next process equipment.
2. a kind of pick-and-place method that permanent magnet is used for more crystal grain according to claim 1, which is characterized in that described
Etaching device is burr machine.
3. a kind of pick-and-place method that permanent magnet is used for more crystal grain according to claim 1, which is characterized in that described
Chip is QFN IC Package.
4. a kind of pick-and-place method that permanent magnet is used for more crystal grain according to claim 1, which is characterized in that described
IC pallet (11) is QFN Matrix IC Tray, and the surface of the IC pallet (11) offers 48 in matrix distribution
Fixing groove (12), the fixing groove (12) are cube structure.
5. a kind of fetching device that permanent magnet is used for more crystal grain according to claim 1, which is characterized in that described
Fetching device includes cylinder (1), and the cylinder (1) is fixedly connected with connection screw thread column (2), the connection screw thread column (2) and machine
Tool arm is threadedly coupled, and the piston rod of the cylinder (1) is fixedly connected with push plate (3), and the lower end surface of the push plate (3) is vertically fixed
48 mandrils (4) of matching fixing groove (12) are connected with, the lateral wall of the cylinder (1) passes through fixed bracket (5) connection
Have mounting box (6), the mounting box (6) is located at the underface of cylinder (1), and mounting box (6) is arranged in parallel with push plate (3), institute
The lower end surface for stating mounting box (6) offers 48 sliding grooves of matching fixing groove (12), and the inner roof wall of the sliding groove is opened
Jack equipped with connection mounting box (6) upper surface, the jack, sliding groove and mandril (4) are coaxially disposed, sliding in the sliding groove
Dynamic to be connected with permanent magnets (10), the upper end of the permanent magnets (10) is connect by reset spring (9) with the inner roof wall of sliding groove, institute
It states reset spring (9) to be movably set on mandril (4), the lower end of the mandril (4) passes through jack and upper with permanent magnets (10)
End face is inconsistent, and one end of connecting column (7), four institutes are fixedly connected at four endpoints of mounting box (6) lower end surface
The other end for stating connecting column (7) is fixedly connected on the same partition (8), and the partition (8) is the material of nonmagnetic reaction.
6. a kind of fetching device that permanent magnet is used for more crystal grain according to claim 5, which is characterized in that described
Permanent magnets (10) are ndfeb magnet, and the permanent magnets (10) are cylindrical structure, and the base area of permanent magnets (10) is less than
The area of chip.
7. a kind of fetching device that permanent magnet is used for more crystal grain according to claim 5, which is characterized in that described
Cylinder (1) is single-acting cylinder, and the driving velocity of cylinder (1) is no more than 1mm/s.
8. a kind of fetching device that permanent magnet is used for more crystal grain according to claim 5, which is characterized in that described
Partition (8) thickness is no more than 1mm, and the length of sliding groove is not less than 7cm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811045952.XA CN109037118B (en) | 2018-09-07 | 2018-09-07 | Method and equipment for taking and placing permanent magnet for multiple grains |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811045952.XA CN109037118B (en) | 2018-09-07 | 2018-09-07 | Method and equipment for taking and placing permanent magnet for multiple grains |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109037118A true CN109037118A (en) | 2018-12-18 |
| CN109037118B CN109037118B (en) | 2023-11-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811045952.XA Active CN109037118B (en) | 2018-09-07 | 2018-09-07 | Method and equipment for taking and placing permanent magnet for multiple grains |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109037118B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111780628A (en) * | 2020-05-25 | 2020-10-16 | 中煤科工集团淮北爆破技术研究院有限公司 | Binocular stereo medicine height measuring device |
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| CN109037118B (en) | 2023-11-17 |
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