CN109029603B - Sensor with a sensor element - Google Patents
Sensor with a sensor element Download PDFInfo
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- CN109029603B CN109029603B CN201710436926.9A CN201710436926A CN109029603B CN 109029603 B CN109029603 B CN 109029603B CN 201710436926 A CN201710436926 A CN 201710436926A CN 109029603 B CN109029603 B CN 109029603B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
- G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
- G01F1/6842—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow with means for influencing the fluid flow
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/05—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects
- G01F1/34—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects by measuring pressure or differential pressure
- G01F1/36—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects by measuring pressure or differential pressure the pressure or differential pressure being created by the use of flow constriction
- G01F1/363—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects by measuring pressure or differential pressure the pressure or differential pressure being created by the use of flow constriction with electrical or electro-mechanical indication
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Abstract
A sensor comprises a flow guide shell and a sensing device. The flow guiding housing defines a gas flow passage for guiding a gas flow along a first flow direction. The sensing device is arranged in the flow guide shell and comprises a sensing module, the sensing module comprises a sensing circuit board, a flow sensing chip and a plurality of first flow guide elements, the sensing circuit board is provided with a first surface facing the gas flow channel, the flow sensing chip is arranged on the first surface and used for sensing the flow of the gas flowing through the gas flow channel, the flow sensing chip is provided with a sensing surface, the sensing surface is provided with a first side edge, the first flow guide elements are convexly arranged on the first surface and are spaced from the first side edge, each first flow guide element is in a long strip shape and extends along the first flow direction, and each first flow guide element is used for rectifying the gas flow to enable the gas flow to flow through the sensing surface after being rectified.
Description
Technical Field
The present invention relates to a sensor, and more particularly, to a sensor for sensing a flow rate of an air flow.
Background
Referring to fig. 1 and 2, the conventional thermal mass flow sensor includes a circuit board 11 and a flow sensing chip 12 disposed on the circuit board 11. The circuit board 11 and the flow sensing chip 12 are located on the gas flow path. The flow sensing chip 12 is disposed and fixed on the surface 111 of the circuit board 11, the flow sensing chip 12 is used for heating the gas and sensing the temperature before and after the gas is heated, and the gas flow is calculated by the sensed temperature difference.
Because the surface 111 of the circuit board 11 is convexly provided with the curved conductive trace 112 made of metal copper foil, and the extending direction of the conductive trace 112 is different from the flowing direction of the airflow 13, the airflow 13 is affected by the conductive trace 112 when flowing through the conductive trace 112 to generate turbulent flow. In addition, since the flow sensing chip 12 is protruded on the surface 111 of the circuit board 11, the airflow 13 is blocked by the flow sensing chip 12 to generate a turbulent flow again. Based on the above two influences, the airflow 13 is not smooth and stable, and the sensing accuracy of the flow sensing chip 12 is affected.
On the other hand, the conventional thermal mass flow sensor is also applied to a transfer mechanism for sucking an article by a vacuum suction nozzle, the vacuum suction nozzle of the transfer mechanism is connected with a negative pressure source by a gas pipe, and the flow sensor is arranged on the gas pipe for a user to determine whether the vacuum suction nozzle really sucks the article. However, the method of determining whether the vacuum chuck has sucked the object by only the flow sensor may cause a misdetermination, which is described as follows:
when the negative pressure source of the transfer mechanism can normally operate to ensure that the vacuum suction nozzle can really suck the article, the flow sensor senses the flow without air flow in the air conveying pipe, the switch output of the flow sensor can display the ON state, and at the moment, a user can correctly judge that the vacuum suction nozzle really sucks the article by watching the display state of the flow sensor.
When the negative pressure source of the transfer mechanism fails and cannot normally operate, the vacuum suction nozzle cannot suck the article. At this time, since the flow sensor senses the flow of no air flow in the air duct, the switch output of the flow sensor still displays the ON state, so that the user may misjudge that the vacuum suction nozzle has sucked the article due to the display state of the flow sensor.
Disclosure of Invention
It is an object of the present invention to provide a sensor that overcomes at least one of the disadvantages of the background art.
An objective of the present invention is to provide a sensor, which can rectify an input airflow to smoothly and stably flow through a flow sensing chip, so as to improve the sensing accuracy of the flow sensing chip.
Another objective of the present invention is to provide a sensor capable of sensing the flow rate and pressure of the airflow at the same time, so as to improve the flexibility of use and the accuracy of the switch output judgment.
The object of the present invention and the background problem thereof are achieved by the following technical solutions, wherein the sensor proposed by the present invention comprises a flow guiding housing and a sensing device, the flow guiding housing defines a gas flow channel for guiding a gas flow to flow along a first flow direction, the sensing device is disposed on the flow guiding housing and comprises a sensing module, the sensing module comprises a sensing circuit board, a flow sensing chip, and a plurality of first flow guiding elements, the sensing circuit board has a first surface facing the gas flow channel, the flow sensing chip is disposed on the first surface for sensing the flow rate of the gas flow flowing through the gas flow channel, the flow sensing chip has a sensing surface, the sensing surface has a first side edge, the first flow guiding elements are protruded on the first surface and spaced from the first side edge, each of the first flow guiding elements is in a strip shape and extends in a length direction along the first flow direction, each first flow guide element is used for rectifying the airflow so that the airflow flows through the sensing surface after being rectified.
In some embodiments, the gas channel has a guiding flow path for guiding the gas flow along the first flow direction, the flow sensing chip is located corresponding to the guiding flow path for sensing the flow rate of the gas flow flowing through the guiding flow path, the first side extends along an extending direction substantially perpendicular to the first flow direction, and the first flow guiding elements are arranged at intervals along the extending direction.
In some embodiments, the guiding flow path selectively guides the airflow to flow along a second flow direction opposite to the first flow direction, the sensing surface further has a second side opposite to the first side, the sensing module further includes a plurality of second flow guiding elements protruding from the first surface and spaced apart from the second side, each of the second flow guiding elements is elongated and extends in the second flow direction, and each of the second flow guiding elements is configured to rectify the airflow so that the airflow flows through the sensing surface after being rectified.
In some embodiments, the second side extends along the extending direction, and the second flow guiding elements are spaced apart from each other along the extending direction.
In some embodiments, the first surface has a surface portion, and a recessed portion formed by the surface portion, the flow sensing chip is disposed in the recessed portion, and the sensing surface is coplanar with the surface portion or located in the recessed portion.
In some embodiments, the gas channel has a flow guiding hole spaced apart from the flow guiding channel, the sensing circuit board further has a second surface opposite to the first surface, the sensing circuit board defines a through hole penetrating through the first surface and the second surface and communicating with the flow guiding hole, the sensing module further includes a pressure sensing chip disposed on the second surface and sealing the through hole, and the pressure sensing chip is configured to sense a pressure of the gas flowing into the through hole through the flow guiding hole.
In some embodiments, the gas channel has a first conduction flow path and a second conduction flow path respectively communicating with opposite ends of the guide flow path, the sensing circuit board further has a second surface opposite to the first surface, the sensing circuit board defines a through hole penetrating through the first surface and the second surface, the through hole is communicated with the first conduction flow path or the second conduction flow path, the sensing module further includes a pressure sensing chip disposed on the second surface and sealing the through hole, and the pressure sensing chip is configured to sense a pressure of a gas flow flowing into the through hole through the first conduction flow path or the second conduction flow path.
In some embodiments, the gas channel has a first conduction flow path and a second conduction flow path respectively connected to opposite ends of the guiding flow path, the sensing module further includes a pressure sensing chip disposed on the first surface, the pressure sensing chip is disposed in the first conduction flow path or the second conduction flow path, and the pressure sensing chip is configured to sense a pressure of the gas flowing through the first conduction flow path or the second conduction flow path.
In some embodiments, the sensing device further includes a housing engaged with the flow guiding housing, and a flow guiding element disposed in the housing, the housing defining an air inlet, the flow guiding element defining a flow guiding hole communicating with the air inlet and spaced apart from the guiding flow path, the sensing circuit board further having a second surface opposite to the first surface, the sensing circuit board defining a through hole penetrating the first surface and the second surface and communicating with the flow guiding hole, the sensing module further including a pressure sensing chip disposed on the first surface and sealing the through hole, the pressure sensing chip being configured to sense a pressure of an air flow flowing into the through hole through the flow guiding hole.
In some embodiments, the sensing module further includes a pressure sensing chip disposed on the sensing circuit board, and the pressure sensing chip is configured to sense a pressure of the gas flowing through the gas channel.
In some embodiments, the sensing circuit board further has a second surface opposite to the first surface, and the pressure sensing chip is disposed on the second surface for sensing a pressure of the gas flowing into the sensing circuit board through the gas channel.
In some embodiments, the pressure sensing chip is disposed on the first surface for sensing a pressure of the gas flowing through the gas channel.
In some embodiments, the sensing device further includes a housing engaged with the flow guiding housing, and a flow guiding element disposed in the housing, the housing defines an air inlet, the flow guiding element defines a flow guiding hole communicating with the air inlet, the sensing circuit board further has a second surface opposite to the first surface, the sensing circuit board defines a through hole penetrating through the first surface and the second surface and communicating with the flow guiding hole, and the pressure sensing chip is disposed on the first surface and seals the through hole for sensing a pressure of an air flow flowing into the through hole through the flow guiding hole.
In some embodiments, the sensing device further includes a control module, and the sensing module further includes a flow signal transmission line electrically connected between the sensing circuit board and the control module, a pressure signal transmission line electrically connected between the sensing circuit board and the control module, and two power transmission lines electrically connected between the sensing circuit board and the control module.
The invention has the beneficial effects that: the flow sensing chip can rectify the input airflow to enable the input airflow to smoothly and stably flow through the flow sensing chip so as to improve the sensing accuracy of the flow sensing chip. In addition, the sensor can simultaneously sense the flow and the pressure of the airflow, so that the elasticity in use and the accuracy of switch output judgment can be improved.
Drawings
FIG. 1 is a fragmentary perspective view of a prior art thermal mass flow sensor circuit board;
FIG. 2 is a side view of FIG. 1;
FIG. 3 is a perspective view of a first embodiment of the sensor of the present invention;
FIG. 4 is a cross-sectional view taken along line S1-S1 in FIG. 3, illustrating the assembly relationship between the fluid-guiding housing and the sensing device, and the flow sensing chip and the pressure sensing chip disposed on different sides of the sensing circuit board;
FIG. 5 is an exploded perspective view of the first embodiment, illustrating the assembly relationship between the fluid-conducting housing and the sensing device;
FIG. 6 is a perspective view of the sensing module of the first embodiment, illustrating the manner in which the airflow flows over the sensing circuit board;
FIG. 7 is a cross-sectional view taken along line S2-S2 of FIG. 6, illustrating the flow sensing chip disposed within the recessed portion with the sensing surface coplanar with the surface portion;
FIG. 8 is a block diagram of the first embodiment, illustrating the connection relationship among the sensing circuit board, the control circuit board, the power supply circuit board, and the display screen;
FIG. 9 is an enlarged view of a portion of FIG. 4 illustrating the direction of flow of the gas stream;
FIG. 10 is a schematic view of the first embodiment applied to a transfer mechanism, illustrating the vacuum nozzles sucking the articles;
FIG. 11 is a schematic view of the first embodiment applied to a transfer mechanism, illustrating a failure of the negative pressure source and no article being sucked by the vacuum nozzle;
FIG. 12 is a cross-sectional view of a second embodiment of the sensor of the present invention illustrating the perforations communicating with the second communication flow path;
FIG. 13 is a cross-sectional view of a third embodiment of the sensor of the present invention illustrating the perforations communicating with the first communication flow path;
FIG. 14 is a cross-sectional view of a fourth embodiment of the sensor of the present invention, illustrating a flow sensing chip and a pressure sensing chip disposed on the same side of the sensing circuit board, the pressure sensing chip being located in the second conductive flow path and on the downstream side of the flow sensing chip;
FIG. 15 is a cross-sectional view of a fifth embodiment of the sensor of the present invention, illustrating a flow sensing chip and a pressure sensing chip disposed on the same side of the sensing circuit board, the pressure sensing chip being located in the first conductive flow path and on the upstream side of the flow sensing chip; and
FIG. 16 is a cross-sectional view of a sixth embodiment of the sensor of the present invention, illustrating the flow sensing chip and the pressure sensing chip disposed on the same side of the sensing circuit board.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and examples.
Before the present invention is described in detail, it should be noted that in the following description, like elements are represented by like reference numerals.
Referring to fig. 3, which is a first embodiment of the sensor of the present invention, the sensor 200 is a flow and pressure sensor, which has the function of sensing the flow and pressure of the airflow. The sensor 200 includes a fluid-guiding housing 2 and a sensing device 3.
Referring to fig. 3, 4 and 5, the diversion housing 2 includes a front surface 21 and two side surfaces 22 and 23 respectively located on the left and right sides of the front surface 21. The flow guiding housing 2 defines a gas flow passage 24, and the gas flow passage 24 has a first flow path 241, a second flow path 242, a guiding flow path 243, a first conducting flow path 244, a second conducting flow path 245, a dividing flow path 246, and a flow guiding hole 247. The first flow path 241 is formed on the side surface 22 for inserting an air inlet pipe (not shown), so that the air inlet pipe can deliver the air flow to the air channel 24 through the first flow path 241. The second flow path 242 is formed on the side surface 23 for inserting an outlet pipe (not shown), so that the gas flow in the gas channel 24 can be discharged into the outlet pipe through the second flow path 242. The guide channel 243 is open and has an open side 248 formed on the front end surface 21, and the guide channel 243 is spaced apart from the first channel 241 and the second channel 242. The first flow path 241, the second flow path 242, and the guiding flow path 243 are respectively used for guiding the airflow to flow along a first flow direction F1 (shown in fig. 6) extending in the left-right direction.
The first conduction flow path 244 is communicated between the first flow path 241 and one end of the guiding flow path 243, and the first conduction flow path 244 is used for guiding a part of the airflow in the first flow path 241 forward to the guiding flow path 243, so that the sensing device 3 can sense the flow rate of the airflow in the guiding flow path 243. The second conduction flow path 245 is connected between the second flow path 242 and the other end of the guide flow path 243, and the second conduction flow path 245 is used for guiding the airflow in the guide flow path 243 backwards into the second flow path 242. The diversion flow path 246 is connected between the first flow path 241 and the second flow path 242 for guiding another part of the airflow in the first flow path 241 to the second flow path 242, so that the another part of the airflow in the first flow path 241 can directly flow into the second flow path 242 through the diversion flow path 246 without being sensed by the sensing device 3. The guiding hole 247 extends in the front-back direction and is spaced apart from the guiding flow path 243 and the second communicating flow path 245, and a front open end of the guiding hole 247 is formed on the front end surface 21 and a rear end thereof is communicated with the second flow path 242, so that the sensing device 3 can sense the pressure of the airflow in the guiding hole 247.
Referring to fig. 4, 5, 6, 7 and 8, the sensing device 3 includes a housing 31, a sensing module 32, a control module 340, and a display screen 36. The housing 31 is coupled to the front side of the guide housing 2. The sensing module 32 includes a sensing circuit board 320, a flow sensing chip 321, a plurality of first flow-guiding elements 322, a plurality of second flow-guiding elements 323, and a pressure sensing chip 324. The sensing circuit board 320 has a first surface 325 facing backward and a second surface 326 opposite to the first surface 325 and facing forward. The first surface 325 faces the front end surface 21, the guide passage 243, the first conduction passage 244, and the second conduction passage 245 of the guide casing 2, and the first surface 325 is attached to the front end surface 21 and closes the open side 248 of the guide passage 243. The first surface 325 of the sensing circuit board 320 is convexly provided with a plurality of curved conductive traces 327 made of metal copper foil, and each conductive trace 327 is used for transmitting an electrical signal. One part of the conductive traces 327 is located in the first conduction flow path 244, and the other part of the conductive traces 327 is located in the second conduction flow path 245. The flow sensing chip 321 of the present embodiment is a thermal mass flow sensing chip disposed on the first surface 325 and corresponding to the position of the guiding flow path 243, the flow sensing chip 321 has a sensing surface 328 for sensing the flow rate of the airflow flowing through the guiding flow path 243, the sensing surface 328 is rectangular and has a first side 329 and a second side 330 on opposite sides, the first side 329 and the second side 330 are respectively long sides of the sensing surface 328, and the length directions of the first side 329 and the second side 330 respectively extend along an extending direction D substantially perpendicular to the first flow direction F1.
The first conductive elements 322 are disposed on the first surface 325 of the sensing circuit board 320 in a protruding manner, and the first conductive elements 322 are disposed between a portion of the conductive traces 327 and the flow sensing chip 321 and spaced apart from the first side 329 of the flow sensing chip 321. Each first flow guiding element 322 is elongated and extends in a first flow direction F1. Each first flow guiding element 322 is used for rectifying the airflow to make the airflow smoothly and stably flow through the flow sensing chip 321 after rectification, so as to improve the accuracy of sensing the flow by the flow sensing chip 321. In the present embodiment, the first flow guiding elements 322 are arranged at intervals along the extending direction D, so that the airflow flowing to the sensing surface 328 through any position on the first side 329 can be ensured to be kept in a smooth and stable state.
When the sensor 200 of the present embodiment is used, the air inlet pipe and the air outlet pipe may be inserted into the second flow path 242 and the first flow path 241, respectively, so that the first flow path 241, the second flow path 242, and the guiding flow path 243 can guide the air flow to flow along a second flow direction F2 opposite to the first flow direction F1, respectively. In order to improve the accuracy of the flow sensing chip 321 in sensing the flow in the sensor 200 in the above-mentioned usage state, a plurality of second flow guiding elements 323 are protruded on the first surface 325 of the sensing circuit board 320. The second flow guiding element 323 is disposed between another portion of the conductive trace 327 and the flow sensing die 321 and spaced apart from the second side 330 of the flow sensing die 321. Each second flow guiding element 323 is elongated and its length extends in the second flow direction F2. Each second flow guiding element 323 is used to rectify the airflow to make the airflow smoothly and stably flow through the flow sensing chip 321, so as to improve the accuracy of the flow sensing chip 321 in sensing the flow. In the embodiment, the second flow guiding elements 323 are arranged at intervals along the extending direction D, so that the airflow flowing to the sensing surface 328 through any position on the second side 330 can be ensured to be in a smooth and stable state.
In order to avoid the thickness of the flow sensing chip 321 obstructing the flow of the air and affecting the smoothness of the flow, in the present embodiment, the first surface 325 has a flat surface 331 attached to the front surface 21, and a groove 332 recessed from the surface 331 toward the second surface 326. The conductive traces 327, the first conductive elements 322, and the second conductive elements 323 are disposed on the surface 331 of the first surface 325 in a protruding manner. Flow sensing chip 321 is fixed in recess portion 332 by, for example, soldering and electrically connected to sensing circuit board 320. The sensing surface 328 of the flow sensing chip 321 is coplanar with the surface portion 331, thereby preventing the flow sensing chip 321 from protruding out of the surface portion 331 and obstructing the flow of the airflow. Through the design, the smoothness and stability of the airflow can be further improved, so that the accuracy of the flow sensing chip 321 in sensing the flow is further improved. It should be noted that in other embodiments, the sensing surface 328 may be located in the groove portion 332 and spaced a small distance from the surface 331, so that the sensing surface 328 is not coplanar with the surface 331, thereby also preventing the flow sensing chip 321 from protruding out of the surface 331 and blocking the flow of the air flow.
Referring to fig. 9, the sensing circuit board 320 defines a through hole 333 penetrating the surface portion 331 of the first surface 325 and the second surface 326, and the through hole 333 is communicated with the diversion hole 247 of the diversion housing 2. The pressure sensing chip 324 is disposed on the second surface 326 of the sensing circuit board 320 and electrically connected to the sensing circuit board 320, and the pressure sensing chip 324 seals the through hole 333 to sense the pressure of the airflow flowing into the through hole 333 through the flow guiding hole 247.
By disposing the flow sensing chip 321 and the pressure sensing chip 324 on the sensing circuit board 320, the sensor 200 can measure the flow and pressure of the gas simultaneously. The user can simultaneously measure the gas flow and pressure of the object to be measured by using the sensor 200 without installing two independent products, namely, a flow sensor and a pressure sensor, on the object to be measured. Therefore, the volume of the sensor mounted on the object to be measured can be reduced. Moreover, since the distance between the flow sensing chip 321 and the pressure sensing chip 324 of the sensor 200 is closer to the distance between two flow sensors and two pressure sensors independently mounted on the object to be measured, the user can more conveniently know the flow and pressure values displayed by the sensor 200.
Referring to fig. 4 and 8, the control module 340 includes a control circuit board 34 and a power supply circuit board 35, the control circuit board 34, the power supply circuit board 35 and the display screen 36 are all disposed in the housing 31, and the control circuit board 34 is electrically connected between the power supply circuit board 35 and the display screen 36. An electrical connector 351 of the power supply circuit board 35 is used for an external power line (not shown) to be plugged in. The display screen 36 is exposed at the front end of the housing 31 for displaying the related measurement information. The sensing module 32 further includes a flow signal transmission line 334 electrically connected between the sensing circuit board 320 and the control circuit board 34, a pressure signal transmission line 335 electrically connected between the sensing circuit board 320 and the control circuit board 34, and two power transmission lines 336 electrically connected between the sensing circuit board 320 and the power supply circuit board 35. The power transmission line 336 is used for transmitting the power input to the power supply circuit board 35 to the sensing circuit board 320, thereby providing the power required by the operation of the sensing module 32.
Since the flow sensing chip 321 and the pressure sensing chip 324 are disposed on the sensing circuit board 320, the two power transmission lines 336 are designed to provide the power required by the operation of the sensing module 32. Thus, the sensor 200 can reduce the number of power transmission lines used to reduce manufacturing costs as compared to two separate flow sensors and pressure sensors.
It should be noted that, although the control module 340 of the present embodiment is exemplified by two separate control circuit boards 34 and power supply circuit boards 35, in other embodiments, the control circuit boards 34 and the power supply circuit boards 35 may be integrated into a single circuit board.
Referring to fig. 4, 6, 7 and 9, the sensor 200 of the present embodiment has two usage modes, a first usage mode is to insert the air inlet pipe and the air outlet pipe into the first flow path 241 and the second flow path 242, respectively, and a second usage mode is to insert the air inlet pipe and the air outlet pipe into the second flow path 242 and the first flow path 241, respectively. Since the two modes of use operate on the same principle and only the direction of the air flow is different, the following description will be made only for the first mode of use:
first, the gas flow delivered by the inlet pipe flows into the gas flow passage 24 along the first flow path 241, and the gas flow flows in the first flow direction F1. Then, a part of the airflow in the first flow path 241 flows forward along the first conducting flow path 244 and flows into the guiding flow path 243, and another part of the airflow flows directly into the second flow path 242 through the diversion flow path 246. In the process of flowing through the first conductive path 244, part of the air flows through part of the conductive traces 327. Since the conductive trace 327 extends in a direction different from the first flow direction F1, the airflow is affected by the conductive trace 327 and generates turbulence. Further, since the first communicating channel 244 guides the flow of the air current from the rear to the front and the guiding channel 243 guides the flow of the air current along the first flow direction F1 extending in the left-right direction, the directions of the guiding air currents are different from each other, and the cross-sectional area of the first communicating channel 244 is gradually reduced toward the guiding channel 243, so that the air current is in an unstable flow state when flowing into the guiding channel 243 through the first communicating channel 244. When the airflow flows into the guiding flow path 243 and then flows along the first flow direction F1, the airflow then flows through the first flow guiding elements 322, and the length direction of each first flow guiding element 322 extends along the first flow direction F1, so that each first flow guiding element 322 rectifies the airflow, and the airflow can be smoothly and stably flowed after being rectified. The airflow then flows smoothly and stably across the sensing surface 328 via the first side 329. Since the flow sensing chip 321 is disposed in the groove portion 332 and the sensing surface 328 is coplanar with the surface portion 331, the flow sensing chip 321 does not obstruct the flow of the airflow, thereby enabling the sensing surface 328 to accurately sense the flow of the airflow. The airflow then flows back along the second conducting flow path 245 into the second flow path 242. During the flow of the air flowing in the second flow path 242 along the first flow direction F1, a portion of the air flows into the diversion hole 247 and the through hole 333, so that the pressure sensing chip 324 can sense the pressure of the air flow. Finally, the gas flow is discharged into the gas outlet pipe through the second flow path 242.
It should be noted that, although the sensing circuit board 320 of the present embodiment is described by taking a manner that the conductive trace 327 is protruded on the first surface 325 as an example, in other embodiments, the conductive trace 327 structure may be omitted from the sensing circuit board 320.
The flow sensing chip 321 senses the flow of the airflow and then generates a corresponding measurement signal, the measurement signal is transmitted to the control circuit board 34 through the sensing circuit board 320 and the flow signal transmission line 334, and the measurement signal is processed by the control circuit board 34, so that the display screen 36 can display the flow measurement value represented by the measurement signal. The pressure sensing chip 324 senses the pressure of the airflow and then generates a corresponding measurement signal, the measurement signal is transmitted to the control circuit board 34 through the sensing circuit board 320 and the pressure signal transmission line 335, and the measurement signal is processed by the control circuit board 34, so that the display screen 36 can display a pressure measurement value represented by the measurement signal.
Referring to fig. 10, when the sensor 200 is applied to the transfer mechanism 5, one end of the air inlet pipe 51 of the transfer mechanism 5 is connected to a vacuum suction nozzle 52, and the other end of the air inlet pipe 51 is inserted into the first flow path 241. One end of the air outlet pipe 53 of the transfer mechanism 5 is connected to a negative pressure source 54, and the other end of the air outlet pipe 53 is inserted into the second flow path 242.
When the negative pressure source 54 can normally operate to make the vacuum nozzle 52 really suck the article 55, the flow sensing chip 321 senses no flow, and the display screen 36 displays a flow value of 0 mL/min; meanwhile, the pressure sensing chip 324 senses the pressure of the air flow as a negative pressure, and the display screen 36 displays the negative pressure value, for example, 72 kPa. At this time, the ON/off output of the sensor 200 indicates an ON state, and the user can correctly determine that the vacuum nozzle 52 has actually sucked the article 55 by looking at the display state of the sensor 200.
Referring to fig. 11, when the negative pressure source 54 fails and cannot operate normally, the flow sensing chip 321 senses no flow, and the display screen 36 displays a flow value of 0 mL/min; meanwhile, the pressure sensing chip 324 senses that the airflow has no negative pressure, and the display screen 36 displays that the negative pressure value is 0 kPa. At this time, the sensor 200 determines that the negative pressure source 54 of the transfer mechanism 5 is broken, and therefore, the switch output of the sensor 200 indicates an OFF state. The user can correctly judge that the vacuum suction nozzle 52 has not sucked the article 55 by looking at the display state of the sensor 200. The sensor 200 can ensure the switch output of the sensor 200 to be correctly determined by the design of the dual sensing mechanism of the flow sensing chip 321 and the pressure sensing chip 324, so as to prevent the occurrence of misdetermination.
Referring to fig. 12, which is a second embodiment of the sensor of the present invention, the overall structure and sensing principle of the sensor 200 are substantially the same as those of the first embodiment, except for the through hole 333 and the position of the pressure sensing chip 324.
In the present embodiment, the through hole 333 communicates with the second conduction flow path 245 of the fluid guiding housing 2, and the pressure sensing chip 324 is aligned with the through hole 333 and closes the through hole 333. Thereby, the pressure sensing chip 324 can sense the pressure of the air flow flowing into the through hole 333 through the second conduction flow path 245.
Referring to fig. 13, which is a third embodiment of the sensor of the present invention, the overall structure and sensing principle of the sensor 200 are substantially the same as those of the first embodiment, except for the through hole 333 and the position of the pressure sensing chip 324.
In the present embodiment, the through hole 333 communicates with the first conduction flow path 244 of the fluid guiding housing 2, and the pressure sensing chip 324 is aligned with the through hole 333 and closes the through hole 333. Thereby, the pressure sensing chip 324 can sense the pressure of the air flow flowing into the through hole 333 through the first conduction flow path 244.
Referring to fig. 14, which is a fourth embodiment of the sensor of the present invention, the overall structure and sensing principle of the sensor 200 are substantially the same as those of the first embodiment, except for the arrangement position of the pressure sensing chip 324.
In the present embodiment, the pressure sensing chip 324 is disposed on the surface portion 331 of the first surface 325 of the sensing circuit board 320, and the pressure sensing chip 324 is located in the second conduction flow path 245 and on the downstream side of the flow sensing chip 321. Therefore, the airflow sequentially flows through the flow sensing chip 321 and the pressure sensing chip 324, so that the flow sensing chip 321 senses the flow of the airflow and then the pressure sensing chip 324 senses the pressure of the airflow.
Referring to fig. 15, which is a fifth embodiment of the sensor of the present invention, the overall structure and sensing principle of the sensor 200 are substantially the same as those of the first embodiment, except for the arrangement position of the pressure sensing chip 324.
In the present embodiment, the pressure sensing chip 324 is disposed on the surface portion 331 of the first surface 325 of the sensing circuit board 320, and the pressure sensing chip 324 is located in the first communication flow path 244 and on the upstream side of the flow sensing chip 321. Therefore, the airflow sequentially flows through the pressure sensing chip 324 and the flow sensing chip 321, so that the pressure sensing chip 324 senses the pressure of the airflow and then senses the flow of the airflow through the flow sensing chip 321.
Referring to fig. 16, which is a sixth embodiment of the sensor of the present invention, the overall structure and sensing principle of the sensor 200 are substantially the same as those of the first embodiment, except for the arrangement position of the pressure sensing chip 324.
In the present embodiment, the pressure sensing chip 324 is disposed on the surface portion 331 of the first side 325 of the sensing circuit board 320, and the pressure sensing chip 324 seals the through hole 333. The housing 31 defines an air inlet 311, and the air inlet 311 is located on the same side of the second flow path 242 of the air guiding housing 2. The sensing device 3 further includes a flow guiding element 37 disposed in the housing 31, wherein the flow guiding element 37 abuts against the second surface 326 of the sensing circuit board 320. The guide member 37 defines a guide hole 371 communicating between the air inlet hole 311 and the through hole 333.
In the sensor 200 of the present embodiment, two air inlet pipes are respectively inserted into the second flow path 242, the air inlet hole 311 and the guiding hole 371, and the air outlet pipe is inserted into the first flow path 241. Therefore, one of the air inlet pipes can convey the airflow into the air flow passage 24, so that the flow sensing chip 321 senses the flow of the airflow; the other air inlet tube can deliver the air flow into the air inlet hole 311 and the flow guiding hole 371, so that the pressure sensing chip 324 senses the pressure of the air flow.
In summary, the sensor 200 of each embodiment can rectify the input airflow to smoothly and stably flow through the flow sensing chip 321 by the design of the first flow guiding element 322 and the second flow guiding element 323. Furthermore, by the design that the flow sensing chip 321 is disposed in the groove portion 332 and the sensing surface 328 and the surface portion 331 are coplanar or are located in the groove portion 332, the thickness of the flow sensing chip 321 itself is prevented from obstructing the flow of the air flow and affecting the smoothness of the flow, so that the smoothness and stability of the flow of the air flow can be further improved, and the accuracy of the flow sensing chip 321 in sensing the flow can be further improved. In addition, the flow sensing chip 321 and the pressure sensing chip 324 are disposed on the sensing circuit board 320, so that the sensor 200 has the function of measuring the gas flow and the pressure, thereby improving the flexibility of the sensor 200 and the accuracy of the switch output judgment, and indeed achieving the purpose of the present invention.
Claims (14)
1. A kind of sensor; the method is characterized in that:
the sensor includes a flow guide housing defining a gas flow passage, and a sensing device, the gas channel is used for guiding the gas flow to flow along a first flow direction, the sensing device is arranged on the flow guide shell and comprises a sensing module, the sensing module comprises a sensing circuit board, a flow sensing chip, and a plurality of first flow-guiding elements, the sensing circuit board has a first surface facing the gas channel, the flow sensing chip is disposed on the first surface for sensing the flow of the gas flowing through the gas channel, the flow sensing chip is provided with a sensing surface, the sensing surface is provided with a first side edge, the first flow guide elements are convexly arranged on the first surface and are spaced from the first side edge, each first flow guide element is in a long strip shape and extends along the first flow direction in the long direction, and each first flow guide element is used for rectifying the airflow so that the airflow flows through the sensing surface after being rectified.
2. The sensor of claim 1, wherein: the gas flow channel is provided with a guide flow path for guiding the gas flow to flow along the first flow direction, the flow sensing chip is corresponding to the position of the guide flow path and used for sensing the flow of the gas flow flowing through the guide flow path, the first side edge extends along an extension direction which is substantially perpendicular to the first flow direction, and the first flow guide elements are arranged at intervals along the extension direction.
3. The sensor of claim 2, wherein: the sensing module further comprises a plurality of second flow guide elements which are convexly arranged on the first surface and spaced from the second side edge, each second flow guide element is long and extends along the second flow direction, and each second flow guide element is used for rectifying the airflow so that the airflow flows through the sensing surface after being rectified.
4. A sensor according to claim 3, wherein: the second side edges extend along the extending direction, and the second flow guide elements are arranged at intervals along the extending direction.
5. The sensor of any one of claims 1 to 4, wherein: the first surface has a surface portion and a recessed portion formed by the surface portion, the flow sensing chip is disposed in the recessed portion, and the sensing surface is coplanar with the surface portion or located in the recessed portion.
6. The sensor of claim 2, wherein: the sensing module further comprises a pressure sensing chip which is arranged on the second surface and seals the through hole, and the pressure sensing chip is used for sensing the pressure of the airflow flowing into the through hole through the flow guide hole.
7. The sensor of claim 2, wherein: the sensing module further comprises a pressure sensing chip which is arranged on the second surface and seals the through hole, and the pressure sensing chip is used for sensing the pressure of airflow flowing into the through hole through the first conducting flow path or the second conducting flow path.
8. The sensor of claim 2, wherein: the sensing module also comprises a pressure sensing chip arranged on the first surface, the pressure sensing chip is positioned in the first conduction flow path or the second conduction flow path, and the pressure sensing chip is used for sensing the pressure of the airflow flowing through the first conduction flow path or the second conduction flow path.
9. The sensor of claim 2, wherein: the sensing device also comprises a shell jointed with the flow guiding shell and a flow guiding piece arranged in the shell, wherein the shell is provided with an air inlet, the flow guiding piece is provided with a flow guiding hole communicated with the air inlet and spaced from the guiding flow path, the sensing circuit board is also provided with a second surface opposite to the first surface, the sensing circuit board is provided with a through hole penetrating through the first surface and the second surface and communicated with the flow guiding hole, the sensing module also comprises a pressure sensing chip arranged on the first surface and closing the through hole, and the pressure sensing chip is used for sensing the pressure of the air flow flowing into the through hole through the flow guiding hole.
10. The sensor of claim 1, wherein: the sensing module also comprises a pressure sensing chip arranged on the sensing circuit board, and the pressure sensing chip is used for sensing the pressure of the airflow flowing through the gas flow passage.
11. The sensor of claim 10, wherein: the sensing circuit board is also provided with a second surface opposite to the first surface, and the pressure sensing chip is arranged on the second surface and used for sensing the pressure of the airflow flowing into the sensing circuit board through the gas channel.
12. The sensor of claim 10, wherein: the pressure sensing chip is arranged on the first surface and used for sensing the pressure of the airflow flowing through the gas channel.
13. The sensor of claim 10, wherein: the sensing device also comprises a shell jointed with the flow guiding shell and a flow guiding piece arranged in the shell, wherein the shell is provided with an air inlet, the flow guiding piece is provided with a flow guiding hole communicated with the air inlet, the sensing circuit board is also provided with a second surface opposite to the first surface, the sensing circuit board is provided with a through hole penetrating through the first surface and the second surface and communicated with the flow guiding hole, and the pressure sensing chip is arranged on the first surface and seals the through hole and is used for sensing the pressure of air flow flowing into the through hole through the flow guiding hole.
14. The sensor of any one of claims 10 to 13, wherein: the sensing device also comprises a control module, and the sensing module also comprises a flow signal transmission line electrically connected between the sensing circuit board and the control module, a pressure signal transmission line electrically connected between the sensing circuit board and the control module, and two power transmission lines electrically connected between the sensing circuit board and the control module.
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