TWM549340U - Sensor - Google Patents

Description

Sensor

The present invention relates to a sensor, and more particularly to a sensor for sensing the flow of a gas stream.

Referring to FIGS. 1 and 2 , the conventional thermal mass flow sensor includes a circuit board 11 and a flow sensing wafer 12 disposed on the circuit board 11 . Both the circuit board 11 and the flow sensing die 12 are located on the gas flow path. The flow sensing wafer 12 is disposed and fixed to the surface 111 of the circuit board 11, and the flow sensing wafer 12 is used to heat the gas and sense the temperature before and after the gas is heated, and the gas flow rate is calculated by the sensed temperature difference.

Since the surface 111 of the circuit board 11 is convexly provided with a conductive copper line made of a metal copper foil and curved, and the extending direction of the conductive line 112 is different from the flow direction of the air flow 13, the air flow 13 flows through the conductive line. At 112 hours, it will be affected by it and cause turbulence. In addition, since the flow sensing wafer 12 is protruded from the surface 111 of the circuit board 11, the airflow 13 is blocked by the flow sensing wafer 12 to generate turbulent flow again. Based on the influence of the foregoing two, the flow of the airflow 13 is not smooth and unstable, thereby affecting the accuracy of the sensing of the flow sensing wafer 12.

On the other hand, the existing thermal mass flow sensor is also applied to the transfer mechanism that sucks the article through the vacuum nozzle, and the vacuum nozzle and the negative pressure source of the transfer mechanism are connected through the gas pipe, and the flow sensor is connected. It is disposed on the gas pipe for the user to judge whether the vacuum nozzle has positively sucked the article. However, only by means of the flow sensor to determine whether the vacuum chuck has the means to suck the item will cause misjudgment, as explained below:

When the negative pressure source of the transfer mechanism can operate normally so that the vacuum nozzle reliably sucks the article, the flow sensor senses the flow of no airflow in the gas pipe, and the switch output of the flow sensor displays an ON state. When the user views the display state of the flow sensor, the user can correctly determine that the vacuum nozzle does have the object.

When the negative pressure source of the transfer mechanism fails and cannot function properly, the vacuum nozzle cannot attract the item. At this time, since the flow sensor senses the flow of no airflow in the gas pipe, the switch output of the flow sensor still displays an ON state, causing the user to misjudge the vacuum due to the display state of the flow sensor. The suction nozzle has a situation in which the article is sucked.

Accordingly, it is an object of the present invention to provide a sensor that overcomes at least one of the disadvantages of the prior art.

One of the objects of the present invention is to provide a sensor capable of rectifying an input airflow to smoothly and stably flow through a flow sensing wafer to improve flow sensing. The accuracy of wafer sensing.

Another object of the present invention is to provide a sensor capable of simultaneously sensing the flow rate and pressure of the airflow, thereby improving the flexibility of use and the accuracy of the judgment of the switch output.

Thus, the novel sensor includes a flow guiding housing and a sensing device.

The flow guiding housing defines a gas flow path for guiding the air flow to flow in a first flow direction. The sensing device is disposed on the flow guiding housing and includes a sensing module. The sensing module includes a sensing circuit board, a flow sensing chip, and a plurality of first flow guiding components, wherein the sensing circuit board has a first surface facing the gas flow path, the flow sensing chip is disposed on the first surface for sensing a flow rate of the air flowing through the gas flow path, the flow sensing wafer has a sensing surface, the sensing The mask has a first side, the first flow guiding element is protruded from the first surface and spaced apart from the first side, and each of the first flow guiding elements is elongated and long along the first side The flow direction extends, and each of the first flow guiding elements is configured to rectify the airflow to be rectified and flow through the sensing surface.

In some embodiments, the gas flow prop has a guiding flow path for guiding the airflow in the first flow direction, and the flow sensing wafer corresponds to the guiding flow path position for sensing the flow through the The flow rate of the air flow guiding the flow path, the first side edge extending along a direction extending substantially perpendicular to the first flow direction, and the first flow guiding elements are spaced apart from each other along the extending direction.

In some implementations, the guiding flow path selectively directs airflow in a second flow direction opposite to the first flow direction, the sensing surface further having a first side opposite to the first side The sensing module further includes a plurality of second flow guiding elements protruding from the first surface and spaced apart from the second side, each of the second flow guiding elements being elongated and long Extending along the second flow direction, each of the second flow guiding elements is configured to rectify the air flow to be rectified and flow through the sensing surface.

In some embodiments, the second side edge extends along the extending direction, and the second flow guiding elements are spaced apart from each other along the extending direction.

In some embodiments, the first mask has a surface portion, and a groove portion formed by the surface portion recessed, the flow sensing chip is disposed in the groove portion, and the sensing surface is shared with the surface portion The plane is either located in the groove portion.

In some implementations, the gas flow prop has a flow guiding hole spaced from the guiding flow path, and the sensing circuit board further has a second surface opposite to the first surface, the sensing circuit board defines a sensing hole that extends through the first surface and the second surface and communicates with the flow guiding hole, the sensing module further includes a pressure sensing wafer disposed on the second surface and closing the through hole, the pressure sensing The wafer is used to sense the pressure of the gas flow flowing into the perforation through the flow guiding hole.

In some implementations, the gas flow path has a first conductive flow path and a second conductive flow path respectively connected to the opposite ends of the guiding flow path, and the sensing circuit board has a first surface opposite to the first surface. The second side of the sensing circuit board defines a penetrating section The through hole is connected to the first through flow path or the second conductive flow path, and the sensing module further comprises a pressure sensing disposed on the second surface and closing the through hole a wafer for sensing a pressure of a gas flow flowing into the perforation through the first conductive flow path or the second conductive flow path.

In some embodiments, the gas flow channel has a first conductive flow path and a second conductive flow path respectively connected to opposite ends of the guiding flow path, and the sensing module further includes a first surface disposed on the first surface a pressure sensing chip, the pressure sensing chip is located in the first conducting flow path or in the second conducting flow path, and the pressure sensing chip is configured to sense flowing through the first conducting flow path or the second conducting current The flow pressure of the flow path.

In some embodiments, the sensing device further includes a housing engaged with the flow guiding housing, and a flow guiding member disposed in the housing, the housing defining an air inlet, the flow guiding member defining a flow guiding hole communicating with the air inlet hole and spaced apart from the guiding flow path, the sensing circuit board further has a second surface opposite to the first surface, the sensing circuit board defining a through hole The sensing module further includes a pressure sensing wafer disposed on the first surface and enclosing the through hole, the pressure sensing chip is used for the first surface and the second surface and the through hole communicating with the guiding hole The pressure of the gas flow flowing into the perforation through the diversion orifice is sensed.

In some implementations, the sensing module further includes a pressure sensing wafer disposed on the sensing circuit board for sensing a pressure of the airflow flowing through the gas flow path.

In some implementations, the sensing circuit board further has a second surface opposite to the first surface, and the pressure sensing chip is disposed on the second surface for sensing the inflow of the sensing via the gas flow path. The airflow pressure of the board.

In some embodiments, the pressure sensing wafer is disposed on the first surface for sensing a pressure of a gas stream flowing through the gas flow path.

In some embodiments, the sensing device further includes a housing engaged with the flow guiding housing, and a flow guiding member disposed in the housing, the housing defining an air inlet, the flow guiding member defining a flow guiding hole communicating with the air inlet hole, the sensing circuit board further has a second surface opposite to the first surface, the sensing circuit board defining a first surface and the second surface a through hole communicating with the flow guiding hole, the pressure sensing wafer is disposed on the first surface and enclosing the through hole for sensing a pressure of the airflow flowing into the through hole through the guiding hole.

In some implementations, the sensing device further includes a control module, and the sensing module further includes a flow signal transmission line electrically connected between the sensing circuit board and the control module, and an electrical a pressure signal transmission line connected between the sensing circuit board and the control module, and two power transmission lines electrically connected between the sensing circuit board and the control module.

The utility model has the advantages that the input airflow can be rectified to smoothly and stably flow through the flow sensing wafer to improve the accuracy of the flow sensing wafer sensing. In addition, the sensor can sense the flow rate and pressure of the airflow at the same time, thereby improving the use. The flexibility and accuracy of the switch output judgment.

200‧‧‧ sensor

2‧‧‧ diversion housing

21‧‧‧ front end

22‧‧‧ side

23‧‧‧ side

24‧‧‧ gas flow path

241‧‧‧First flow path

242‧‧‧Second flow path

243‧‧‧Guided flow path

244‧‧‧First conduction path

245‧‧‧Second conduction path

246‧‧ ‧Diversion flow path

247‧‧‧Inlet

248‧‧‧ open side

3‧‧‧Sensing device

31‧‧‧ Shell

311‧‧‧Air intake

32‧‧‧Sensing module

320‧‧‧Sensor board

321‧‧‧Flow sensing chip

322‧‧‧First flow guiding element

323‧‧‧Second flow guiding element

324‧‧‧ Pressure Sensing Wafer

325‧‧‧ first side

326‧‧‧ second side

327‧‧‧Electrical circuit

328‧‧‧Sense surface

329‧‧‧ first side

330‧‧‧Second side

331‧‧‧ Surface

332‧‧‧ Groove

333‧‧‧Perforation

334‧‧‧Flow signal transmission line

335‧‧‧Pressure signal transmission line

336‧‧‧Power transmission line

340‧‧‧Control Module

34‧‧‧Control Board

35‧‧‧Power supply board

351‧‧‧Electrical connector

36‧‧‧Display screen

37‧‧‧ deflector

371‧‧‧Inlet

5‧‧‧Transportation mechanism

51‧‧‧Intake pipe

52‧‧‧Vacuum nozzle

53‧‧‧Exhaust pipe

54‧‧‧Negative source

55‧‧‧ Items

F1‧‧‧ first flow direction

F2‧‧‧Second flow direction

D‧‧‧ Extension direction

Other features and effects of the present invention will be apparent from the following description of the drawings, wherein: FIG. 1 is an incomplete perspective view of a circuit board of a conventional thermal mass flow sensor; FIG. 2 is a side view of FIG. 3 is a perspective view of the first embodiment of the present invention; FIG. 4 is a cross-sectional view taken along line S1-S1 of FIG. 3, illustrating the assembly relationship between the flow guiding housing and the sensing device, And the flow sensing wafer and the pressure sensing wafer are disposed on different sides of the sensing circuit board; FIG. 5 is an exploded perspective view of the first embodiment, illustrating the assembly relationship between the flow guiding housing and the sensing device; Is a perspective view of the sensing module of the first embodiment, illustrating the manner in which the airflow flows on the sensing circuit board; FIG. 7 is a cross-sectional view taken along line S2-S2 of FIG. 6, illustrating that the flow sensing die is disposed on In the groove portion, and the sensing surface is coplanar with the surface portion; FIG. 8 is a block diagram of the first embodiment, illustrating the connection relationship between the sensing circuit board, the control circuit board, the power supply circuit board, and the display screen; Figure 9 is a partial enlarged view of Figure 4 illustrating the flow of airflow ; Figure 10 is a schematic view of the first embodiment applied to the transfer mechanism, illustrating the vacuum suction nozzle sucking the article; Figure 11 is a schematic view of the first embodiment applied to the transfer mechanism, illustrating the negative pressure source failure, and the vacuum nozzle is not Figure 12 is a cross-sectional view of the second embodiment of the present invention, illustrating the perforation in communication with the second conductive flow path; Figure 13 is a cross-sectional view of the third embodiment of the present sensor, illustrating the perforation and the A conductive flow path is connected; FIG. 14 is a cross-sectional view of the fourth embodiment of the present invention, illustrating that the flow sensing die and the pressure sensing die are disposed on the same side of the sensing circuit board, and the pressure sensing die is located in the second The flow path is located on the downstream side of the flow sensing wafer; FIG. 15 is a cross-sectional view of the fifth embodiment of the present sensor, illustrating that the flow sensing die and the pressure sensing die are disposed on the same side of the sensing circuit board, and the pressure The sensing wafer is located in the first conducting flow path and located on the upstream side of the flow sensing wafer; and FIG. 16 is a cross-sectional view of the sixth embodiment of the novel sensor, illustrating that the flow sensing wafer and the pressure sensing wafer are disposed at the sensing The same side of the circuit board.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

Referring to FIG. 3, which is a first embodiment of the novel sensor, the sensor 200 is exemplified by a flow and pressure sensor having a function of sensing airflow and pressure. The sensor 200 includes a flow guiding housing 2 and a sensing device 3.

Referring to FIGS. 3, 4 and 5, the flow guiding housing 2 includes a front end surface 21 and two side surfaces 22, 23 respectively located on the left and right sides of the front end surface 21. The flow guiding housing 2 defines a gas flow path 24 having a first flow path 241, a second flow path 242, a guiding flow path 243, a first conductive flow path 244, and a second conductive flow. The road 245, a split flow path 246, and a flow guiding hole 247. The first flow path 241 is formed on the side surface 22 for inserting an intake pipe (not shown), whereby the intake pipe can transport the air flow into the gas flow path 24 through the first flow path 241. The second flow path 242 is formed on the side surface 23 for inserting an air outlet pipe (not shown), whereby the air flow in the gas flow path 24 can be discharged into the air outlet pipe through the second flow path 242. The guiding flow path 243 is open and has an open side 248 formed on the front end surface 21, and the guiding flow path 243 is spaced apart from the front side of the first flow path 241 and the second flow path 242. The first flow path 241, the second flow path 242, and the guide flow path 243 are respectively used to guide the flow of the airflow in a first flow direction F1 (shown in FIG. 6) extending in a left-right direction.

The first conductive flow path 244 is connected between the first flow path 241 and one end of the guiding flow path 243. The first conductive flow path 244 is used to guide a part of the air flow in the first flow path 241 to the guiding flow path 243. Thereby, thereby, the sensing device 3 can sense the flow rate of the airflow in the guiding flow path 243. The second conductive flow path 245 is connected between the second flow path 242 and the other end of the guiding flow path 243, and the second conductive flow path 245 is used to guide the flow path 243. The inner airflow is directed back into the second flow path 242. The split flow path 246 is connected between the first flow path 241 and the second flow path 242 for guiding another portion of the air flow in the first flow path 241 into the second flow path 242, thereby causing the first flow path 241 to be inside. The other portion of the air flow can flow directly into the second flow path 242 through the split flow path 246 without being sensed by the sensing device 3. The flow guiding hole 247 extends in the front-rear direction and is spaced apart from the guiding flow path 243 and the second conduction flow path 245. The front open end of the flow guiding hole 247 is formed on the front end surface 21 and the rear end communicates with the second flow path 242. The sensing device 3 is capable of sensing the pressure of the airflow within the flow guiding hole 247.

Referring to FIG. 4 , FIG. 5 , FIG. 6 and FIG. 7 , the sensing device 3 includes a housing 31 , a sensing module 32 , a control module 340 , and a display screen 36 . The outer casing 31 is joined to the front side of the flow guiding casing 2. The sensing module 32 includes a sensing circuit board 320 , a flow sensing chip 321 , a plurality of first flow guiding elements 322 , a plurality of second flow guiding elements 323 , and a pressure sensing wafer 324 . The sensing circuit board 320 has a first face 325 that faces rearward and a second face 326 that is opposite the first face 325 and that faces forward. The first surface 325 faces the front end surface 21 of the flow housing 2, the guiding flow path 243, the first conduction flow path 244, and the second conduction flow path 245, and the first surface 325 is attached to the front end surface 21 and is closed. The open side 248 of the flow path 243. A conductive line 327 is formed on the first surface 325 of the sensing circuit board 320 and is formed by a plurality of metal copper foils. The conductive lines 327 are used to transmit electrical signals. Wherein, a part of the conductive line 327 is located in the first conductive flow path 244, and another part of the conductive line 327 is located in the second conductive flow path 245. The sense of traffic in this embodiment The measuring wafer 321 is a thermal mass flow sensing wafer disposed on the first surface 325 and corresponding to the position of the guiding flow path 243. The flow sensing wafer 321 has a flow rate for sensing the flow of air flowing through the guiding flow path 243. The sensing surface 328 has a rectangular shape and has a first side 329 and a second side 330 on opposite sides. The first side 329 and the second side 330 are respectively long of the sensing side 328. The sides of the first side 329 and the second side 330 extend along a direction D extending substantially perpendicular to the first flow direction F1.

The plurality of first flow guiding elements 322 are protruded from the first surface 325 of the sensing circuit board 320 , and the first flow guiding element 322 is located between the partial conductive lines 327 and the flow sensing wafer 321 and the first of the flow sensing wafers 321 . One side 329 is spaced apart. Each of the first flow guiding members 322 has an elongated shape and its longitudinal direction extends in the first flow direction F1. Each of the first flow guiding elements 322 is configured to rectify the airflow to be smoothly and stably flowed through the flow sensing wafer 321 after being rectified, thereby improving the accuracy of sensing the flow rate of the flow sensing wafer 321 . In the present embodiment, the first flow guiding elements 322 are spaced apart from each other along the extending direction D, thereby ensuring that the airflow flowing to the sensing surface 328 via any of the first side edges 329 can be maintained. Smooth and stable state.

When the sensor 200 of the embodiment is in use, the intake pipe and the air outlet pipe may be respectively inserted into the second flow path 242 and the first flow path 241, thereby causing the first flow path 241 and the second flow path 242. And the guiding flow path 243 can respectively guide the air flow to flow in a second flow direction F2 opposite to the first flow direction F1. In order to enable the sensor 200 to improve the accuracy of sensing the flow rate of the flow sensing wafer 321 in the foregoing use state, A plurality of second flow guiding members 323 are protruded from the first surface 325 of the measuring circuit board 320. The second flow guiding element 323 is located between the other portion of the conductive line 327 and the flow sensing wafer 321 and spaced apart from the second side 330 of the flow sensing wafer 321 . Each of the second flow guiding members 323 has an elongated shape and its longitudinal direction extends in the second flow direction F2. Each of the second flow guiding elements 323 is configured to rectify the airflow to be smoothly and stably flowed through the flow sensing wafer 321 after being rectified, thereby improving the accuracy of sensing the flow rate of the flow sensing wafer 321 . In the present embodiment, the second flow guiding members 323 are spaced apart from each other along the extending direction D, thereby ensuring that the airflow flowing to the sensing surface 328 via any of the second side edges 330 can be maintained. Smooth and stable state.

In order to prevent the thickness of the flow sensing wafer 321 itself from impeding the flow of the airflow and affecting the flow smoothness thereof, in the present embodiment, the first surface 325 has a surface portion 331 which is flat and conforms to the front end surface 21, and A groove portion 332 which is recessed toward the second surface 326 by the surface portion 331. The conductive line 327 , the first flow guiding element 322 and the second flow guiding element 323 are all protruded from the surface portion 331 of the first surface 325 . The flow sensing wafer 321 is fixed in the groove portion 332 and electrically connected to the sensing circuit board 320 by, for example, soldering. The sensing surface 328 of the flow sensing wafer 321 is coplanar with the surface portion 331 whereby the flow sensing wafer 321 does not protrude beyond the surface portion 331 to impede the flow of airflow. Through the foregoing design method, the smoothness and stability of the airflow can be further improved, and the accurate performance of the flow sensing wafer 321 sensing the flow is further improved. It should be noted that in other embodiments, the sensing surface 328 may also be located. The groove portion 332 is spaced apart from the surface portion 331 by a small distance, so that the sensing surface 328 is not coplanar with the surface portion 331, thereby preventing the flow sensing wafer 321 from protruding from the surface portion 331 and thereby obstructing the flow of the airflow. .

The sensing circuit board 320 defines a through hole 333 extending through the surface portion 331 of the first surface 325 and the second surface 326. The through hole 333 communicates with the flow guiding hole 247 of the flow guiding housing 2. The pressure sensing wafer 324 is disposed on the second surface 326 of the sensing circuit board 320 and electrically connected to the sensing circuit board 320. The pressure sensing wafer 324 closes the through hole 333 for sensing the airflow flowing into the through hole 333 through the guiding hole 247. pressure.

By simultaneously arranging the flow sensing die 321 and the pressure sensing die 324 on the sensing circuit board 320, the sensor 200 has the function of measuring gas flow and pressure at the same time. By using the sensor 200, the user can simultaneously measure the gas flow rate and pressure of the object to be tested, without separately installing two independent products of the flow sensor and the pressure sensor on the object to be tested for measurement. Homework. Thereby, the volume of the sensor mounted on the object to be tested can be reduced. Moreover, since the distance between the flow sensing wafer 321 and the pressure sensing wafer 324 of the sensor 200 is more than the distance between the two flow sensors and the pressure sensor independently mounted on the object to be tested. Closely, therefore, the user can more easily know the flow and pressure values displayed by the sensor 200.

Referring to FIG. 4 and FIG. 8 , the control module 340 includes a control circuit board 34 and a power supply circuit board 35 . The control circuit board 34 , the power supply circuit board 35 , and the display screen 36 are all disposed in the casing 31 , and the control circuit board 34 . Electrically connected to the power supply The road board 35 is between the display screen 36. An electrical connector 351 of the power supply circuit board 35 is used for plugging an external power line (not shown). A display screen 36 is exposed at the front end of the housing 31 for displaying relevant measurement information. The sensing module 32 further includes a flow signal transmission line 334 electrically connected between the sensing circuit board 320 and the control circuit board 34, and a pressure signal electrically connected between the sensing circuit board 320 and the control circuit board 34. The transmission line 335, and two power transmission lines 336 electrically connected between the sensing circuit board 320 and the power supply circuit board 35. The power transmission line 336 is used to transmit the power input to the power supply circuit board 35 to the sensing circuit board 320, thereby providing the power required for the sensing module 32 to operate.

Since the flow sensing die 321 and the pressure sensing die 324 are simultaneously disposed on the sensing circuit board 320, the design of the two power transmission lines 336 can provide the power required for the sensing module 32 to operate. Thereby, the sensor 200 can reduce the number of power transmission lines used to reduce the manufacturing cost compared with two independent flow sensors and pressure sensors.

It should be noted that the control module 340 of the embodiment is described by taking two separate control circuit boards 34 and the power supply circuit board 35 as an example. However, in other embodiments, the control circuit board 34 and the power supply are provided. The supply board 35 can also be integrated into a single board.

Referring to FIG. 4, FIG. 6, FIG. 7 and FIG. 9, the sensor 200 of the embodiment has two usage modes. The first usage mode is to insert the intake pipe and the air outlet pipe respectively. The first mode 241 and the second flow path 242, the second mode of use is to insert the intake pipe and the outlet pipe into the second flow path 242 and the first flow path 241, respectively. Since the two operating modes have the same principle of operation, only the direction of the airflow is different, so the following is only explained in the first mode of use:

First, the air flow delivered by the intake pipe flows into the gas flow path 24 along the first flow path 241, and the air flow flows in the first flow direction F1. Then, part of the airflow in the first flow path 241 flows forward along the first conductive flow path 244 and flows into the guiding flow path 243, and another part of the air flow flows directly into the second flow path 242 through the dividing flow path 246. . Wherein, part of the airflow flows through the portion of the conductive line 327 during the flow of the first conductive flow path 244. Since the extending direction of the conductive line 327 is different from the first flow direction F1, the air current flows through the conductive line 327 and is affected by the turbulent flow. Further, since the first conduction flow path 244 guides the flow of the air flow from the rear to the front, and the guide flow path 243 guides the flow of the air flow in the first flow direction F1 extending in the left-right direction, the foregoing two The direction in which the guiding airflow flows is different, and the cross-sectional area of the first conducting flow path 244 is gradually reduced toward the guiding flow path 243. Therefore, when the airflow flows into the guiding flow path 243 via the first conducting flow path 244, the flow is unstable. The state of flow. When the airflow flows into the guiding flow path 243, it will flow in the first flow direction F1, and then the airflow will flow through the first flow guiding elements 322, due to the long direction of each first guiding element 322 along the first flow direction. F1 extends, and therefore, each of the first flow guiding members 322 rectifies the airflow, so that the airflow can be rectified to exhibit a smooth and stable flow state. After that, the airflow will remain smooth And the steady state flows through the sensing surface 328 via the first side 329. Since the flow sensing wafer 321 is disposed in the groove portion 332 and the sensing surface 328 is coplanar with the surface portion 331 , the flow sensing wafer 321 does not hinder the flow of the air flow, thereby enabling the sensing surface 328 to be accurately Sensing the flow of airflow. Thereafter, the airflow flows backward along the second conductive flow path 245 into the second flow path 242. During the flow of the gas flow in the first flow direction F1 in the second flow path 242, a portion of the gas flow will flow into the flow guiding holes 247 and the through holes 333, so that the pressure sensing wafer 324 can sense the pressure of the gas flow. Finally, the air flow is discharged into the air outlet pipe via the second flow path 242.

It should be noted that, although the sensing circuit board 320 of the present embodiment is exemplified by a method in which the conductive line 327 is convexly disposed on the first surface 325, in other embodiments, the sensing circuit board 320 may also be used. The conductive line 327 structure is omitted.

After the flow sensing chip 321 senses the flow of the airflow, a corresponding measurement signal is generated, and the measurement signal is transmitted to the control circuit board 34 through the sensing circuit board 320 and the flow signal transmission line 334, and the amount is transmitted through the control circuit board 34. The test signal is processed so that the display screen 36 can display the flow measurement value represented by the measurement signal. The pressure sensing chip 324 senses the pressure of the airflow to generate a corresponding measurement signal. The measurement signal is transmitted to the control circuit board 34 through the sensing circuit board 320 and the pressure signal transmission line 335, and the amount is transmitted through the control circuit board 34. The test signal is processed so that the display screen 36 can display the pressure measurement value represented by the measurement signal.

Referring to FIG. 10, when the sensor 200 is applied to the transfer mechanism 5, the transfer machine One end of the intake pipe 51 of the structure 5 is connected to a vacuum suction nozzle 52, and the other end of the intake pipe 51 is inserted into the first flow path 241. One end of the air outlet pipe 53 of the transfer mechanism 5 is connected to a negative pressure source 54, and the other end of the air outlet pipe 53 is inserted into the second flow path 242.

When the negative pressure source 54 is normally operated such that the vacuum suction nozzle 52 positively sucks the article 55, the flow sensing wafer 321 senses the flow of no airflow, and the display screen 36 displays a flow rate value of 0 mL/min; meanwhile, pressure sensing The wafer 324 senses that the pressure of the gas stream is a negative pressure, and the display screen 36 will display a negative pressure value of, for example, -72 kPa. At this time, the switch output of the sensor 200 is displayed in an ON state, and the user can correctly judge that the vacuum suction nozzle 52 does have the suction article 55 by viewing the display state of the sensor 200.

Referring to FIG. 11, when the negative pressure source 54 fails and fails to operate normally, the flow sensing wafer 321 senses the flow of no airflow, and the display screen 36 displays a flow value of 0 mL/min; meanwhile, the pressure sensing wafer 324 senses the airflow. Without negative pressure, the display screen 36 will display a negative pressure value of 0 kPa. At this time, the sensor 200 determines that the negative pressure source 54 of the transfer mechanism 5 is malfunctioning, and therefore, the switch output of the sensor 200 is in an OFF state. The user can correctly judge that the vacuum suction nozzle 52 does not suck the article 55 by viewing the display state of the sensor 200. By designing the dual sensing mechanism of the flow sensing chip 321 and the pressure sensing chip 324, the sensor 200 can ensure that the switching output of the sensor 200 can be judged correctly to prevent misjudgment.

Referring to FIG. 12, which is a second embodiment of the sensor of the present invention, the overall structure and sensing principle of the sensor 200 are substantially the same as those of the first embodiment, except that the hole is perforated. 333 and the location of the pressure sensing wafer 324.

In the present embodiment, the perforations 333 are in communication with the second conductive flow path 245 of the flow guiding housing 2, and the pressure sensing wafer 324 is aligned with the perforations 333 and closes the perforations 333. Thereby, the pressure sensing wafer 324 can sense the pressure of the gas flow flowing into the perforations 333 via the second conduction flow path 245.

Referring to FIG. 13, which is a third embodiment of the novel sensor, the overall structure and sensing principle of the sensor 200 is substantially the same as that of the first embodiment, except that the through holes 333 and the position of the pressure sensing wafer 324 are disposed.

In the present embodiment, the perforations 333 are in communication with the first conductive flow path 244 of the flow guiding housing 2, and the pressure sensing wafer 324 is aligned with the perforations 333 and closes the perforations 333. Thereby, the pressure sensing wafer 324 can sense the pressure of the gas flow flowing into the perforations 333 via the first conduction flow path 244.

Referring to FIG. 14, which is a fourth embodiment of the present sensor, the overall structure and sensing principle of the sensor 200 is substantially the same as that of the first embodiment, except that the pressure sensing wafer 324 is disposed.

In the present embodiment, the pressure sensing wafer 324 is disposed on the surface portion 331 of the first surface 325 of the sensing circuit board 320, and the pressure sensing wafer 324 is located in the second conductive flow path 245 and located on the downstream side of the flow sensing wafer 321 . Thereby, the airflow sequentially flows through the flow sensing die 321 and the pressure sensing die 324, so that the flow sensing die 321 senses the flow rate of the airflow first and then senses the pressure of the airflow through the pressure sensing die 324.

Referring to FIG. 15, which is a fifth embodiment of the present sensor, the overall structure and sensing principle of the sensor 200 is substantially the same as that of the first embodiment, except that the pressure sensing wafer 324 is disposed.

In the present embodiment, the pressure sensing wafer 324 is disposed on the surface portion 331 of the first surface 325 of the sensing circuit board 320. The pressure sensing wafer 324 is located in the first conductive flow path 244 and is located on the upstream side of the flow sensing wafer 321 . . Thereby, the airflow flows through the pressure sensing wafer 324 and the flow sensing wafer 321 in sequence, so that the pressure sensing wafer 324 first senses the pressure of the airflow and then transmits the flow rate of the airflow through the flow sensing wafer 321.

Referring to FIG. 16, which is a sixth embodiment of the novel sensor, the overall structure and sensing principle of the sensor 200 is substantially the same as that of the first embodiment, except that the pressure sensing wafer 324 is disposed.

In the present embodiment, the pressure sensing wafer 324 is disposed on the surface portion 331 of the first face 325 of the sensing circuit board 320, and the pressure sensing wafer 324 closes the through hole 333. The outer casing 31 defines an air inlet hole 311 which is on the same side as the second flow path 242 of the flow guiding casing 2. The sensing device 3 further includes a flow guiding member 37 disposed in the outer casing 31. The flow guiding member 37 abuts on the second surface 326 of the sensing circuit board 320. The flow guiding member 37 defines a flow guiding hole 371 communicating between the air inlet hole 311 and the through hole 333.

When the sensor 200 of the embodiment is in use, the two intake pipes are respectively inserted into the second flow path 242, and the air inlet hole 311 and the air guiding hole 371, and the air outlet pipe is inserted into the first flow path. 241. Thereby, one of the intake pipes can deliver the airflow to the gas flow path In the 24, the flow sensing wafer 321 senses the flow rate of the airflow; the other intake pipe can convey the airflow into the air inlet hole 311 and the air guiding hole 371, so that the pressure sensing wafer 324 senses the pressure of the airflow.

In summary, the sensor 200 of each embodiment can rectify the input airflow to smoothly and stably flow through the flow sensing chip by the design of the first flow guiding element 322 and the second flow guiding element 323. 321. Moreover, by the way that the flow sensing wafer 321 is disposed in the groove portion 332 and the sensing surface 328 is coplanar with the surface portion 331 or is located in the groove portion 332, the thickness of the flow sensing wafer 321 itself is prevented from being hindered. The airflow flows and affects the smoothness of the flow, thereby further improving the smoothness and stability of the airflow, so that the accurate performance of the flow sensing wafer 321 sensing the flow is further improved. In addition, by simultaneously arranging the flow sensing die 321 and the pressure sensing die 324 on the sensing circuit board 320, the sensor 200 has the function of measuring gas flow and pressure at the same time, thereby improving the sensor. The flexibility of the use of 200 and the accuracy of the judgment of the switch output can indeed achieve the purpose of the present invention.

However, the above is only the embodiment of the present invention, and when it is not possible to limit the scope of the present invention, all the simple equivalent changes and modifications according to the scope of the patent application and the contents of the patent specification are still This new patent covers the scope.

200‧‧‧ sensor

2‧‧‧ diversion housing

21‧‧‧ front end

22‧‧‧ side

23‧‧‧ side

24‧‧‧ gas flow path

241‧‧‧First flow path

242‧‧‧Second flow path

243‧‧‧Guided flow path

244‧‧‧First conduction path

245‧‧‧Second conduction path

246‧‧ ‧Diversion flow path

247‧‧‧Inlet

3‧‧‧Sensing device

31‧‧‧ Shell

32‧‧‧Sensing module

320‧‧‧Sensor board

321‧‧‧Flow sensing chip

324‧‧‧ Pressure Sensing Wafer

325‧‧‧ first side

326‧‧‧ second side

333‧‧‧Perforation

34‧‧‧Control Board

35‧‧‧Power supply board

351‧‧‧Electrical connector

36‧‧‧Display screen

Claims (14)

A sensor includes: a flow guiding housing defining a gas flow path for guiding the air flow in a first flow direction; and a sensing device disposed in the flow guiding housing The method includes a sensing module, a sensing circuit board, a flow sensing chip, and a plurality of first flow guiding elements, the sensing circuit board having a first surface facing the gas flow path, the flow sense The measuring chip is disposed on the first surface for sensing a flow rate of the air flowing through the gas flow path, the flow sensing wafer has a sensing surface, the sensing mask has a first side, and the first guiding An element is disposed on the first surface and spaced apart from the first side, each of the first flow guiding elements has an elongated shape and a long direction extends along the first flow direction, and each of the first flow guiding elements is used to The airflow is rectified so that it rectifies and flows through the sensing surface. The sensor of claim 1, wherein the gas flow prop has a guiding flow path for guiding the airflow in the first flow direction, and the flow sensing wafer corresponds to the guiding flow path position. Sensing a flow rate of the airflow flowing through the guiding flow path, the first side edge extending along a direction substantially perpendicular to the first flow direction, the first flow guiding elements are mutually along the extending direction Arranged at intervals. The sensor of claim 2, wherein the guiding flow path selectively directs airflow in a second flow direction opposite to the first flow direction, the sensing surface being further opposite to the The second side of the first side, the sensing module further includes a plurality of protrusions on the first side and opposite to the second side a second flow guiding element, each of the second flow guiding elements has an elongated shape and a long direction extending along the second flow direction, and each of the second flow guiding elements is configured to rectify the air flow and rectify the flow Sensing surface. The sensor of claim 3, wherein the second side edge extends along the extending direction, and the second flow guiding elements are spaced apart from each other along the extending direction. The sensor of claim 1, 2, 3 or 4, wherein the first mask has a surface portion, and a groove portion formed by the surface portion recessed, the flow sensing wafer is disposed in the concave portion In the groove portion, the sensing surface is coplanar with the surface portion or is located in the groove portion. The sensor of claim 2, wherein the gas flow prop has a flow guiding hole spaced from the guiding flow path, and the sensing circuit board further has a second surface opposite to the first surface, The sensing circuit board defines a through hole extending through the first surface and the second surface and communicating with the flow guiding hole, and the sensing module further includes a pressure sensing disposed on the second surface and closing the through hole A wafer, the pressure sensing wafer is configured to sense a pressure of a gas flow flowing into the perforation through the diversion hole. The sensor of claim 2, wherein the gas flow path has a first conductive flow path and a second conductive flow path respectively connected to opposite ends of the guiding flow path, and the sensing circuit board further has a Opposite to the second surface of the first surface, the sensing circuit board defines a through hole penetrating the first surface and the second surface, and the through hole communicates with the first conductive flow path or the second conductive flow path. The sensing module further includes a pressure sensing wafer disposed on the second surface and enclosing the through hole, the pressure sensing wafer is configured to sense the flow of the through hole through the first conductive flow path or the second conductive flow path Airflow pressure. The sensor of claim 2, wherein the gas flow path has a first conductive flow path and a second conductive flow path respectively connected to opposite ends of the guiding flow path, and the sensing module further comprises a a pressure sensing wafer disposed on the first surface, the pressure sensing wafer being located in the first conductive flow path or in the second conductive flow path, the pressure sensing wafer for sensing flow through the first conductive flow The airflow pressure of the road or the second conducting flow path. The sensor of claim 2, wherein the sensing device further comprises a housing engaged with the flow guiding housing, and a flow guiding member disposed in the housing, the housing defining an air inlet hole The flow guiding member defines a flow guiding hole communicating with the air inlet hole and spaced apart from the guiding flow path, and the sensing circuit board further has a second surface opposite to the first surface, the sensing The circuit board defines a through hole extending through the first surface and the second surface and communicating with the flow guiding hole. The sensing module further includes a pressure sensing chip disposed on the first surface and closing the through hole. The pressure sensing wafer is used to sense the pressure of the gas flow flowing into the perforation through the diversion hole. The sensor of claim 1, wherein the sensing module further comprises a pressure sensing chip disposed on the sensing circuit board, the pressure sensing chip for sensing flow through the gas flow path Air flow pressure. The sensor of claim 10, wherein the sensing circuit board further has a second side opposite to the first surface, the pressure sensing chip is disposed on the second surface for sensing the gas The flow path flows into the sensing circuit board. The sensor of claim 10, wherein the pressure sensing wafer is disposed on the first surface for sensing a flow pressure of the gas flowing through the gas flow path. The sensor of claim 10, wherein the sensing device further comprises a housing engaged with the flow guiding housing, and a flow guiding member disposed in the housing, the housing defining an air inlet The flow guiding member defines a flow guiding hole communicating with the air inlet hole, the sensing circuit board further has a second surface opposite to the first surface, and the sensing circuit board defines a first surface extending through the first surface The pressure sensing wafer is disposed on the first surface and closes the through hole for sensing the pressure of the airflow flowing into the through hole through the guiding hole. The sensor device of claim 10, 11, 12 or 13, wherein the sensing device further comprises a control module, the sensing module further comprising an electrical connection to the sensing circuit board and the control a flow signal transmission line between the modules, a pressure signal transmission line electrically connected between the sensing circuit board and the control module, and two electrically connected between the sensing circuit board and the control module Power transmission line.