TWI683094B - Sensor - Google Patents

Abstract

A sensor includes a diversion housing and a sensing device. The diversion shell defines a gas flow channel, and the gas flow channel is used to guide the gas flow to flow in a first flow direction. The sensing device is disposed in the diversion housing and includes a sensing module. The sensing module includes a sensing circuit board, a flow sensing chip, and a plurality of first diversion elements. The sensing circuit board has a face On the first surface of the gas flow channel, a flow sensing chip is provided on the first surface for sensing the flow of air flow through the gas flow channel, the flow sensing chip has a sensing surface, and the sensing mask has a first side, The first guide elements are convexly arranged on the first surface and are spaced from the first side, each first guide element is elongated and extends in the first flow direction, and each first guide element is used for air flow Rectification makes it flow through the sensing surface after rectification.

Description

Sensor

The invention relates to a sensor, in particular to a sensor for sensing air flow.

1 and 2, the existing thermal mass flow sensor includes a circuit board 11 and a flow sensing chip 12 disposed on the circuit board 11. The circuit board 11 and the flow sensing chip 12 are located on the gas flow path. The flow sensing chip 12 is disposed and fixed on the surface 111 of the circuit board 11. The flow sensing chip 12 is used to heat the gas and sense the temperature before and after the gas is heated, and the gas flow rate is calculated based on the sensed temperature difference.

Since the surface 111 of the circuit board 11 protrudes with a curved conductive line 112 made of a metal copper foil, and the extending direction of the conductive line 112 is different from the flow direction of the air flow 13, the air flow 13 flows through the conductive line At 112, it will be affected by it and produce turbulence. In addition, since the flow sensing chip 12 is protruded on the surface 111 of the circuit board 11, the airflow 13 is blocked by the flow sensing chip 12 and turbulent flow is generated again. Based on the effects of the foregoing two, the air flow 13 is not smooth and unstable, which further affects the accuracy of the flow sensing chip 12 sensing.

On the other hand, the existing thermal mass flow sensor is also applied to the transfer mechanism that sucks items through the vacuum suction nozzle. The vacuum nozzle of the transfer mechanism and the negative pressure source are connected through an air pipe, and the flow sensor The air pipe is provided for the user to judge whether the vacuum suction nozzle has actually sucked the article. However, the method of judging whether the vacuum chuck sucks the article only by the flow sensor will cause a misjudgment, which is explained as follows: When the negative pressure source of the transfer mechanism can be operated normally so that the vacuum nozzle can surely suck the item, the flow sensor senses the flow of no air flow in the air pipe, and the switch output of the flow sensor will show the ON state. At this time, the user can correctly determine that the vacuum nozzle is indeed sucking the article by looking at the display state of the flow sensor.

When the negative pressure source of the transfer mechanism fails and cannot operate normally, the vacuum suction nozzle cannot suck the items. At this time, since the flow sensor senses that there is no air flow in the air duct, the switch output of the flow sensor will still show the ON state, causing the user to misjudge the vacuum due to the display state of the flow sensor Suction nozzles may attract items.

Therefore, the object of the present invention is to provide a sensor capable of overcoming at least one disadvantage of the prior art.

An object of the present invention is to provide a sensor that can rectify the input airflow so that it smoothly and stably flows through the flow sensing chip to improve the flow sensing Wafer sensing accuracy.

Another object of the present invention is to provide a sensor that can simultaneously sense the flow and pressure of the airflow, thereby improving the flexibility in use and the accuracy of the switch output judgment.

Therefore, the sensor of the present invention includes a diversion housing and a sensing device.

The diversion housing defines a gas flow channel, which is used to guide the gas flow in a first flow direction. The sensing device is disposed in the diversion housing and includes a sensing module. The sensing module includes a sensing circuit board, a flow sensing chip, and a plurality of first diversion elements. The sensing circuit board has A first surface facing the gas flow channel, the flow sensing chip is disposed on the first surface for sensing the flow of gas flow through the gas flow channel, the flow sensing chip has a sensing surface, the sensing The mask has a first side, the first flow guiding elements are convexly arranged on the first surface and are spaced from the first side, each of the first flow guiding elements is elongated and extends along the first side The flow direction extends, and each of the first guide elements is used to rectify the air flow so that it flows through the sensing surface after rectification.

In some embodiments, the gas flow tool has a guide flow path for guiding the air flow in the first flow direction, and the flow sensing chip corresponds to the position of the guide flow path for sensing the flow through the For the air flow rate of the guide flow path, the first side extends along an extension direction substantially perpendicular to the first flow direction, and the first guide elements are arranged at intervals from each other along the extension direction.

In some embodiments, the guiding flow path can selectively guide the air flow in a second flow direction opposite to the first flow direction, and the sensing surface further has a second side opposite to the first side Two sides, the sensing module further includes a plurality of second guide elements protruding on the first surface and spaced from the second side, each of the second guide elements is elongated and long Extending along the second flow direction, each of the second flow guiding elements is used to rectify the air flow so that it flows through the sensing surface after being rectified.

In some embodiments, the second side extends along the extending direction, and the second flow guiding elements are arranged at intervals from each other along the extending direction.

In some embodiments, the first mask has a surface portion, and a recessed portion formed by the recessed surface portion, the flow sensing chip is disposed in the recessed portion, and the sensing surface shares the surface portion The plane may be located in the groove.

In some implementations, the gas flow prop has a diversion hole spaced from the pilot flow path, the sensing circuit board further has a second surface opposite to the first surface, the sensing circuit board defines A through hole penetrating the first surface and the second surface and communicating with the diversion hole, the sensing module further includes a pressure sensing chip disposed on the second surface and closing the through hole, the pressure sensing The wafer is used to sense the pressure of the airflow flowing into the perforation through the diversion hole.

In some embodiments, the gas flow channel has a first conduction flow path and a second conduction flow path respectively connected to opposite ends of the guiding flow path, and the sensing circuit board further has an opposite to the first surface The second side of the sensor circuit board defines a A perforation on one surface and the second surface, the perforation communicating with the first conduction flow path or the second conduction flow path, the sensing module further includes a pressure sensor disposed on the second surface and closing the perforation For the wafer, the pressure sensing wafer is used to sense the pressure of the airflow flowing into the perforation through the first conduction flow path or the second conduction flow path.

In some embodiments, the gas flow channel has a first conduction flow path and a second conduction flow path respectively connected to opposite ends of the guiding flow path, and the sensing module further includes a disposed on the first surface The pressure sensing chip is located in the first conduction flow path or the second conduction flow path. The pressure sensing chip is used to sense the flow through the first conduction flow path or the second conduction Air pressure in the flow path.

In some embodiments, the sensing device further includes a housing that is engaged with the diversion housing, and a deflector disposed in the housing, the housing defines an air intake hole, and the deflector defines There is a guide hole communicating with the air inlet hole and spaced from the guide flow path, the sensing circuit board further has a second surface opposite to the first surface, the sensing circuit board defines a through hole The first surface and the second surface communicate with the diversion hole, the sensing module further includes a pressure sensing chip disposed on the first surface and closing the through hole, the pressure sensing chip is used for The pressure of the airflow flowing into the perforation through the diversion hole is sensed.

In some embodiments, the sensing module further includes a pressure sensing chip disposed on the sensing circuit board. The pressure sensing chip is used to sense the pressure of the airflow flowing through the gas flow channel.

In some embodiments, the sensing circuit board further has a second surface opposite to the first surface, and the pressure sensing chip is disposed on the second surface for sensing the inflow through the gas flow channel Airflow pressure of the circuit board.

In some embodiments, the pressure sensing chip is disposed on the first surface to sense the pressure of the airflow flowing through the gas flow channel.

In some embodiments, the sensing device further includes a housing that is engaged with the diversion housing, and a deflector disposed in the housing, the housing defines an air intake hole, and the deflector defines There is a diversion hole communicating with the air inlet hole, the sensing circuit board further has a second surface opposite to the first surface, the sensing circuit board defines a through surface that penetrates the first surface and the second surface For the through hole communicating with the diversion hole, the pressure sensing chip is disposed on the first surface and closes the through hole, for sensing the pressure of the airflow flowing into the through hole through the diversion hole.

In some embodiments, the sensing device further includes a control module, the sensing module further includes a flow signal transmission line electrically connected between the sensing circuit board and the control module, an electrical property A pressure signal transmission line connected between the sensing circuit board and the control module, and two power transmission lines electrically connected between the sensing circuit board and the control module.

The effect of the present invention is to rectify the input air flow so that it smoothly and stably flows through the flow sensing chip, so as to improve the accuracy of the flow sensing chip sensing. In addition, the sensor can sense the flow and pressure of the airflow at the same time, thereby improving the use of Flexibility and accuracy of switch output judgment.

200‧‧‧sensor

2‧‧‧Diversion housing

21‧‧‧Front face

22‧‧‧Side

23‧‧‧Side

24‧‧‧Gas channel

241‧‧‧ First-rate

242‧‧‧Second flow path

243‧‧‧Guided flow path

244‧‧‧The first conduction channel

245‧‧‧ Second conduction flow path

246‧‧‧Diversion channel

247‧‧‧Diversion hole

248‧‧‧Open side

3‧‧‧sensing device

31‧‧‧Housing

311‧‧‧Air inlet

32‧‧‧sensor module

320‧‧‧sensing circuit board

321‧‧‧Flow sensing chip

322‧‧‧The first guide element

323‧‧‧Second diversion element

324‧‧‧ pressure sensing chip

325‧‧‧The first side

326‧‧‧Second side

327‧‧‧Conducting circuit

328‧‧‧sensing surface

329‧‧‧First side

330‧‧‧Second side

331‧‧‧Surface

332‧‧‧Notch

333‧‧‧Perforation

334‧‧‧Flow signal transmission line

335‧‧‧Pressure signal transmission line

336‧‧‧Power transmission line

340‧‧‧Control module

34‧‧‧Control circuit board

35‧‧‧Power supply circuit board

351‧‧‧Electrical connector

36‧‧‧Display screen

37‧‧‧Guide

371‧‧‧Diversion hole

5‧‧‧ Transfer agency

51‧‧‧Intake pipe

52‧‧‧Vacuum nozzle

53‧‧‧ trachea

54‧‧‧Negative pressure source

55‧‧‧Item

F1‧‧‧First flow direction

F2‧‧‧Second flow direction

D‧‧‧Extending direction

Other features and functions of the present invention will be clearly presented in the embodiments referring to the drawings, in which: FIG. 1 is an incomplete perspective view of the circuit board of the existing thermal mass flow sensor; FIG. 2 is the side of FIG. 1 Figure 3 is a perspective view of the first embodiment of the sensor of the present invention; Figure 4 is a cross-sectional view taken along line S1-S1 in Figure 3, illustrating the assembly relationship between the diversion housing and the sensing device, And the flow sensing chip and the pressure sensing chip are provided on different surfaces of the sensing circuit board; FIG. 5 is an exploded perspective view of the first embodiment, illustrating the assembly relationship between the diversion housing and the sensing device; FIG. 6 Is a perspective view of the sensing module of the first embodiment, illustrating the manner in which the airflow flows on the sensing circuit board; FIG. 7 is a cross-sectional view taken along line S2-S2 in FIG. 6, illustrating that the flow sensing chip is provided in In the groove portion, and the sensing surface and the surface portion are coplanar; FIG. 8 is a block diagram of the first embodiment, illustrating the connection relationship between the sensing circuit board, the control circuit board, the power supply circuit board, and the display screen; 9 is a partial enlarged view of FIG. 4 illustrating the flow direction of the air flow; 10 is a schematic diagram of the first embodiment applied to the transfer mechanism, illustrating the vacuum suction nozzle to suck items; FIG. 11 is a schematic diagram of the first embodiment applied to the transfer mechanism, illustrating a negative pressure source failure, and the vacuum nozzle is not Draw articles; FIG. 12 is a cross-sectional view of the second embodiment of the sensor of the present invention, illustrating the communication between the perforation and the second conduction flow path; FIG. 13 is a cross-sectional view of the third embodiment of the sensor of the present invention, illustrating the perforation and the first A conductive flow path is connected; FIG. 14 is a cross-sectional view of a fourth embodiment of the sensor of the present invention, illustrating that the flow sensing chip and the pressure sensing chip are disposed on the same side of the sensing circuit board, and the pressure sensing chip is located at the second In the conduction flow path and located on the downstream side of the flow sensing chip; FIG. 15 is a cross-sectional view of a fifth embodiment of the sensor of the present invention, illustrating that the flow sensing chip and the pressure sensing chip are disposed on the same side of the sensing circuit board, and the pressure The sensing chip is located in the first conduction flow path and is located on the upstream side of the flow sensing chip; and FIG. 16 is a cross-sectional view of the sixth embodiment of the sensor of the present invention, illustrating that the flow sensing chip and the pressure sensing chip are disposed in the sensing The same side of the circuit board.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same numbers.

Referring to FIG. 3, it is the first embodiment of the sensor of the present invention. The sensor 200 takes a flow and pressure sensor as an example, which has the function of sensing the air flow and pressure. The sensor 200 includes a diversion housing 2 and a sensing device 3.

Referring to FIGS. 3, 4 and 5, the deflector housing 2 includes a front end surface 21 and two side surfaces 22 and 23 respectively located on the left and right sides of the front end surface 21. The diversion housing 2 defines a gas flow channel 24, the gas flow channel 24 has a first flow path 241, a second flow path 242, a guide flow path 243, a first conduction flow path 244, a second conduction flow Road 245, a shunt flow path 246, and a diversion hole 247. The first flow path 241 is formed on the side surface 22 for inserting an air intake pipe (not shown), whereby the air intake pipe can deliver airflow into the gas flow path 24 through the first flow path 241. The second flow path 242 is formed on the side surface 23 for inserting an air outlet pipe (not shown), whereby the airflow in the gas flow channel 24 can be discharged into the air outlet pipe through the second flow path 242. The guide flow path 243 is open and has an open side 248 formed on the front end surface 21. The guide flow path 243 is spaced on the front side of the first flow path 241 and the second flow path 242. The first flow path 241, the second flow path 242, and the guide flow path 243 are respectively used to guide the air flow to flow in a first flow direction F1 (as shown in FIG. 6) extending in a left-right direction.

The first conductive flow path 244 communicates between the first flow path 241 and one end of the guide flow path 243. The first conductive flow path 244 is used to guide part of the airflow in the first flow path 241 forward to the guide flow path 243 In this way, the sensing device 3 can sense the flow rate of the air flow in the guide flow path 243. The second conducting flow path 245 communicates between the second flow path 242 and the other end of the guiding flow path 243. The second conducting flow path 245 is used to guide the guiding flow path 243 The airflow in the channel is directed back into the second flow path 242. The split flow path 246 communicates between the first flow path 241 and the second flow path 242 to guide another part of the air flow in the first flow path 241 into the second flow path 242, thereby making the first flow path 241 The other part of the airflow does not need to be sensed by the sensing device 3 but can directly flow into the second flow path 242 through the split flow path 246. The diversion hole 247 extends in the front-rear direction and is spaced apart from the diversion channel 243 and the second conduction channel 245, the front open end of the diversion hole 247 is formed on the front end surface 21 and the rear end communicates with the second channel 242, thereby , So that the sensing device 3 can sense the pressure of the air flow in the diversion hole 247.

4, 5, 6 and 7, the sensing device 3 includes a housing 31, a sensing module 32, a control module 340, and a display screen 36. The housing 31 is joined to the front side of the flow guide housing 2. The sensing module 32 includes a sensing circuit board 320, a flow sensing chip 321, a plurality of first guiding elements 322, a plurality of second guiding elements 323, and a pressure sensing chip 324. The sensing circuit board 320 has a first surface 325 facing the rear, and a second surface 326 opposite to the first surface 325 and facing the front. The first surface 325 faces the front end surface 21 of the guide case 2, the guide flow path 243, the first conduction flow path 244, and the second conduction flow path 245, and the first surface 325 is attached to the front end surface 21 and closes the guide The open side 248 of the flow path 243. The first surface 325 of the sensing circuit board 320 is protrudingly provided with a plurality of conductive circuits 327 made of metal copper foil and formed in a curved shape, and each of the conductive circuits 327 is used to transmit electrical signals. Among them, a part of the conductive line 327 is located in the first conductive flow path 244, and another part of the conductive line 327 is located in the second conductive flow path 245. The sense of flow in this embodiment The measuring chip 321 is a thermal mass flow sensing chip disposed on the first surface 325 and corresponding to the position of the guide flow path 243. The flow sensing chip 321 has a flow rate for sensing the air flow flowing through the guide flow path 243 The sensing surface 328 is rectangular and has a first side 329 and a second side 330 on opposite sides. The first side 329 and the second side 330 are respectively of the sensing surface 328 The long sides, the longitudinal directions of the first side 329 and the second side 330 respectively extend along an extension direction D substantially perpendicular to the first flow direction F1.

A plurality of first flow guiding elements 322 are protrudingly disposed on the first surface 325 of the sensing circuit board 320. The first flow guiding elements 322 are located between the partially conductive circuit 327 and the flow sensing chip 321 and are One side 329 is spaced apart. Each first flow guiding element 322 has a long shape and its long direction extends along the first flow direction F1. Each first flow guiding element 322 is used to rectify the airflow so that it can smoothly and stably flow through the flow sensing chip 321 after rectification, thereby improving the accuracy of the flow sensing chip 321 to sense the flow. In this embodiment, the first flow guiding elements 322 are spaced apart from each other along the extending direction D, thereby ensuring that the airflow flowing to the sensing surface 328 through any place on the first side 329 can be maintained Smooth and stable state.

When the sensor 200 of this embodiment is used, the air inlet pipe and the air outlet pipe can also be inserted into the second flow path 242 and the first flow path 241, respectively, thereby making the first flow path 241 and the second flow path 242 And the guide flow path 243 can respectively guide the air flow to flow in a second flow direction F2 opposite to the first flow direction F1. In order to enable the sensor 200 to improve the accuracy of the flow sensing of the flow sensing chip 321 in the aforementioned use state, The first surface 325 of the test circuit board 320 is convexly provided with a plurality of second flow guiding elements 323. The second flow guiding element 323 is located between the other part of the conductive circuit 327 and the flow sensing chip 321 and is spaced from the second side 330 of the flow sensing chip 321. Each second flow guiding element 323 has a long shape and its long direction extends along the second flow direction F2. Each second flow guiding element 323 is used to rectify the airflow so that it can smoothly and stably flow through the flow sensing chip 321 after rectification, thereby improving the accuracy of the flow sensing chip 321 to sense the flow. In this embodiment, the second flow guiding elements 323 are arranged at intervals along the extending direction D, thereby ensuring that the airflow flowing to the sensing surface 328 through any place on the second side 330 can be maintained Smooth and stable state.

In order to prevent the thickness of the flow sensing chip 321 itself from obstructing the flow of airflow and affecting its smoothness, in this embodiment, the first surface 325 has a flat surface portion 331 that is attached to the front end surface 21, and A groove portion 332 recessed from the surface portion 331 toward the second surface 326. The conductive circuit 327, the first flow guiding element 322 and the second flow guiding element 323 are all protruding on the surface portion 331 of the first surface 325. The flow sensing chip 321 is fixed in the groove portion 332 by, for example, soldering and is electrically connected to the sensing circuit board 320. The sensing surface 328 of the flow sensing chip 321 is coplanar with the surface portion 331, so that the flow sensing chip 321 does not protrude from the surface portion 331 and hinder the flow of airflow. Through the foregoing design method, the smoothness and stability of the air flow can be further improved, so that the accurate performance of the flow sensing chip 321 in sensing the flow is further improved. It should be noted that, in other embodiments, the sensing surface 328 may also be located The groove portion 332 is separated from the surface portion 331 by a short distance, so that the sensing surface 328 is not coplanar with the surface portion 331, thereby also preventing the flow sensing chip 321 from protruding beyond the surface portion 331 and hindering the flow of airflow .

The sensing circuit board 320 defines a through hole 333 penetrating the surface portion 331 of the first surface 325 and the second surface 326. The through hole 333 communicates with the diversion hole 247 of the diversion housing 2. The pressure sensing chip 324 is disposed on the second surface 326 of the sensing circuit board 320 and is electrically connected to the sensing circuit board 320. The pressure sensing chip 324 closes the through hole 333 to sense the airflow flowing into the through hole 333 through the diversion hole 247 pressure.

By disposing the flow sensing chip 321 and the pressure sensing chip 324 on the sensing circuit board 320 at the same time, the sensor 200 has the function of measuring the gas flow rate and pressure at the same time. By using the sensor 200, the user can measure the gas flow and pressure of the object to be measured at the same time without installing two separate products of the flow sensor and the pressure sensor on the object to be measured. Homework. Thereby, the volume of the sensor installed on the object to be measured can be reduced. Furthermore, since the distance between the flow sensing chip 321 and the pressure sensing chip 324 of the sensor 200 and the distance between the two flow sensors and the pressure sensor independently mounted on the object to be measured are more Close, therefore, the user can more easily know the flow and pressure values displayed by the sensor 200.

Referring to FIGS. 4 and 8, the control module 340 includes a control circuit board 34 and a power supply circuit board 35. The control circuit board 34, the power supply circuit board 35 and the display screen 36 are all disposed in the housing 31, and the control circuit board 34 Electrically connected to the power supply Between the road board 35 and the display screen 36. An electrical connector 351 of the power supply circuit board 35 is used to connect an external power cord (not shown). The display screen 36 is exposed at the front end of the housing 31 to display related measurement information. The sensing module 32 further includes a flow signal transmission line 334 electrically connected between the sensing circuit board 320 and the control circuit board 34, and a pressure signal electrically connecting between the sensing circuit board 320 and the control circuit board 34 The transmission line 335 and two power transmission lines 336 electrically connected between the sensing circuit board 320 and the power supply circuit board 35. The power transmission line 336 is used to transmit the power input to the power supply circuit board 35 to the sensing circuit board 320, thereby providing the power required for the sensing module 32 to operate.

Since the flow sensing chip 321 and the pressure sensing chip 324 are disposed on the sensing circuit board 320 at the same time, the design of the two power transmission lines 336 can provide the power required for the sensing module 32 to operate. In this way, compared with the two independent flow sensors and pressure sensors, the sensor 200 can reduce the number of power transmission lines used to reduce the manufacturing cost.

It should be noted that although the control module 340 of this embodiment takes two separate control circuit boards 34 and the power supply circuit board 35 as an example for description, in other embodiments, the control circuit board 34 and the power supply The supply circuit board 35 can also be integrated into a single circuit board.

Referring to FIGS. 4, 6, 7 and 9, the sensor 200 of this embodiment has two usage modes. The first usage mode is to insert the inlet pipe and the outlet pipe into the The first flow path 241 and the second flow path 242. The second usage mode is to insert the intake pipe and the exhaust pipe into the second flow path 242 and the first flow path 241, respectively. Since the operating principles of the two usage modes are the same, only the flow direction of the airflow is different. Therefore, the following only uses the first usage mode to explain: First, the airflow delivered by the intake pipe will flow into the gas flow channel 24 along the first flow path 241 Inside, the air flow will flow in the first flow direction F1. Then, part of the air flow in the first flow path 241 will flow forward along the first conduction flow path 244 and flow into the guide flow path 243, while another part of the air flow will directly flow into the second flow path 242 through the split flow path 246 . Wherein, part of the airflow will flow through part of the conductive line 327 during the flow in the first conducting flow path 244. Since the extending direction of the conductive line 327 is different from the first flow direction F1, when the airflow flows through the conductive line 327, it will be affected by it and generate turbulent flow. In addition, since the first conduction flow path 244 guides the flow of the air flow from the rear to the front, and the guide flow path 243 guides the flow of the air flow in the first flow direction F1 extending in the left-right direction, therefore, the foregoing two The direction of the flow of the guide air flow is different, and the cross-sectional area of the first conductive flow path 244 gradually decreases toward the guide flow path 243. Therefore, the air flow is unstable when flowing into the guide flow path 243 through the first conductive flow path 244 Flow state. When the airflow flows into the guide flow path 243, it will flow in the first flow direction F1, and then, the airflow will flow through the first flow guide elements 322, because the length of each first flow guide element 322 is along the first flow direction F1 extends. Therefore, each of the first guide elements 322 rectifies the airflow, so that the airflow can flow smoothly and stably after being rectified. After that, the air flow will remain smooth And the stable state flows through the sensing surface 328 via the first side 329. Since the flow sensing chip 321 is disposed in the groove portion 332 and the sensing surface 328 is coplanar with the surface portion 331, the flow sensing chip 321 does not hinder the flow of airflow, thereby enabling the sensing surface 328 to be accurately Sensing the flow of air flow. After that, the air flow will flow backward into the second flow path 242 along the second conduction flow path 245. During the flow of the air flow in the second flow path 242 along the first flow direction F1, part of the air flow flows into the diversion holes 247 and the through holes 333, so that the pressure sensing wafer 324 can sense the pressure of the air flow. Finally, the air flow will be discharged into the air outlet pipe through the second flow path 242.

It should be noted that although the sensing circuit board 320 of this embodiment is described by taking the manner that the conductive circuit 327 is protruded on the first surface 325 as an example, in other embodiments, the sensing circuit board 320 may also be The conductive line 327 structure is omitted.

After the flow sensing chip 321 senses the flow of the airflow, a corresponding measurement signal is generated, and the measurement signal is transmitted to the control circuit board 34 through the sensing circuit board 320 and the flow signal transmission line 334, and the amount is measured by the control circuit board 34. The measurement signal is processed so that the display screen 36 can display the flow measurement value represented by the measurement signal. After the pressure sensing chip 324 senses the pressure of the airflow, a corresponding measurement signal is generated, and the measurement signal is transmitted to the control circuit board 34 through the sensing circuit board 320 and the pressure signal transmission line 335, and the amount is measured by the control circuit board 34. The measurement signal is processed so that the display screen 36 can display the pressure measurement value represented by the measurement signal.

Referring to FIG. 10, when the sensor 200 is applied to the transfer mechanism 5, the transfer machine One end of the intake pipe 51 of the structure 5 is connected to a vacuum suction nozzle 52, and the other end of the intake pipe 51 is inserted into the first flow path 241. One end of the air outlet pipe 53 of the transfer mechanism 5 is connected to a negative pressure source 54, and the other end of the air outlet pipe 53 is inserted into the second flow path 242.

When the negative pressure source 54 can operate normally so that the vacuum suction nozzle 52 surely sucks the article 55, the flow sensing chip 321 senses the flow without air flow, and the display screen 36 will display the flow value as 0 mL/min; meanwhile, the pressure sensing The chip 324 senses that the pressure of the airflow is negative pressure, and the display screen 36 will display a negative pressure value of, for example, -72 kPa. At this time, the switch output of the sensor 200 will display an ON state, and the user can correctly determine that the vacuum suction nozzle 52 indeed sucks the article 55 by viewing the display state of the sensor 200.

Referring to FIG. 11, when the negative pressure source 54 fails and cannot operate normally, the flow sensing chip 321 senses the flow without air flow, and the display screen 36 will display the flow value as 0 mL/min; meanwhile, the pressure sensing chip 324 senses air flow Without negative pressure, the display 36 will show that the negative pressure value is 0kPa. At this time, the sensor 200 determines that the negative pressure source 54 of the transfer mechanism 5 is faulty, so the switch output of the sensor 200 will show an OFF state. By viewing the display state of the sensor 200, the user can correctly determine that the vacuum suction nozzle 52 has not sucked the article 55. The design of the sensor 200 through the dual sensing mechanism of the flow sensing chip 321 and the pressure sensing chip 324 can ensure that the switch output of the sensor 200 can be judged correctly to prevent the situation of misjudgment.

Referring to FIG. 12, it is the second embodiment of the sensor of the present invention. The overall structure and sensing principle of the sensor 200 are roughly the same as those of the first embodiment, the difference is the perforation 333 and the installation position of the pressure sensing wafer 324.

In this embodiment, the through hole 333 communicates with the second conducting flow path 245 of the flow guiding housing 2, the pressure sensing wafer 324 is aligned with the through hole 333 and closes the through hole 333. Thereby, the pressure sensing wafer 324 can sense the pressure of the airflow flowing into the through hole 333 through the second conductive flow path 245.

Referring to FIG. 13, which is the third embodiment of the sensor of the present invention, the overall structure and sensing principle of the sensor 200 are roughly the same as those of the first embodiment, except for the location of the through hole 333 and the pressure sensing chip 324.

In this embodiment, the through hole 333 communicates with the first conducting flow path 244 of the flow guiding housing 2, the pressure sensing wafer 324 is aligned with the through hole 333 and closes the through hole 333. Thereby, the pressure sensing wafer 324 can sense the pressure of the airflow flowing into the through hole 333 through the first conducting flow path 244.

Referring to FIG. 14, this is the fourth embodiment of the sensor of the present invention. The overall structure and sensing principle of the sensor 200 are roughly the same as those of the first embodiment, except for the location of the pressure sensing chip 324.

In this embodiment, the pressure sensing chip 324 is disposed on the surface portion 331 of the first surface 325 of the sensing circuit board 320. The pressure sensing chip 324 is located in the second conductive flow path 245 and is located on the downstream side of the flow sensing chip 321 . Thereby, the airflow will flow through the flow sensing chip 321 and the pressure sensing chip 324 in sequence, so that the flow sensing chip 321 first senses the flow of the airflow and then senses the pressure of the airflow through the pressure sensing chip 324.

Referring to FIG. 15, it is the fifth embodiment of the sensor of the present invention. The overall structure and sensing principle of the sensor 200 are roughly the same as those of the first embodiment, except for the location of the pressure sensing chip 324.

In this embodiment, the pressure sensing chip 324 is disposed on the surface portion 331 of the first surface 325 of the sensing circuit board 320. The pressure sensing chip 324 is located in the first conducting flow path 244 and is located on the upstream side of the flow sensing chip 321 . Thereby, the airflow will flow through the pressure sensing chip 324 and the flow sensing chip 321 in sequence, so that the pressure sensing chip 324 first senses the pressure of the airflow and then senses the flow of the airflow through the flow sensing chip 321.

Referring to FIG. 16, it is the sixth embodiment of the sensor of the present invention. The overall structure and sensing principle of the sensor 200 are roughly the same as those of the first embodiment, except for the location of the pressure sensing chip 324.

In this embodiment, the pressure sensing wafer 324 is disposed on the surface portion 331 of the first surface 325 of the sensing circuit board 320, and the pressure sensing wafer 324 closes the through hole 333. The casing 31 defines an air intake hole 311 which is on the same side as the second flow path 242 of the flow guide housing 2. The sensing device 3 further includes a deflector 37 disposed in the housing 31. The deflector 37 abuts on the second surface 326 of the sensing circuit board 320. The flow guide 37 defines a flow guide hole 371 communicating between the air inlet hole 311 and the through hole 333.

When the sensor 200 of this embodiment is used, two intake pipes are respectively inserted into the second flow path 242, and the intake hole 311 and the diversion hole 371, and the outlet pipe is inserted into the first flow path 241. In this way, one of the intake pipes can deliver the air flow to the gas flow channel In 24, the flow sensing chip 321 senses the flow of the air flow; another air intake pipe can deliver the air flow into the air intake hole 311 and the diversion hole 371, so that the pressure sensing chip 324 senses the pressure of the air flow.

To sum up, the sensor 200 of each embodiment can rectify the input air flow so that it smoothly and stably flows through the flow sensing chip through the design of the first air guide element 322 and the second air guide element 323 321. Furthermore, the design method in which the flow sensing chip 321 is disposed in the groove portion 332 and the sensing surface 328 and the surface portion 331 are coplanar or located in the groove portion 332 prevents the thickness of the flow sensing chip 321 itself from being hindered The airflow flows and affects the smoothness of the flow, thereby, the smoothness and stability of the airflow can be further improved, and the accuracy of the flow sensing chip 321 to sense the flow is further improved. In addition, by disposing the flow sensing chip 321 and the pressure sensing chip 324 on the sensing circuit board 320 at the same time, the sensor 200 has the function of measuring the gas flow and pressure at the same time, thereby improving the sensor The flexibility of the 200 and the accuracy of the judgment of the switch output, so it can indeed achieve the purpose of the invention.

However, the above are only examples of the present invention, and should not be used to limit the scope of the present invention. Any simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the content of the patent specification are still classified as This invention covers the patent.

200‧‧‧sensor

2‧‧‧Diversion housing

22‧‧‧Side

23‧‧‧Side

24‧‧‧Gas channel

241‧‧‧ First-rate

242‧‧‧Second flow path

243‧‧‧Guided flow path

244‧‧‧The first conduction channel

245‧‧‧ Second conduction flow path

246‧‧‧Diversion channel

247‧‧‧Diversion hole

3‧‧‧sensing device

31‧‧‧Housing

32‧‧‧sensor module

320‧‧‧sensing circuit board

321‧‧‧Flow sensing chip

324‧‧‧ pressure sensing chip

325‧‧‧The first side

326‧‧‧Second side

333‧‧‧Perforation

34‧‧‧Control circuit board

35‧‧‧Power supply circuit board

351‧‧‧Electrical connector

36‧‧‧Display screen

Claims (13)

A sensor includes: a deflector housing defining a gas flow channel for guiding air flow in a first flow direction; and a sensing device provided in the diversion housing and Including: a sensing module, including a sensing circuit board, a flow sensing chip, and a plurality of first flow guiding elements, the sensing circuit board has a first face facing the gas flow path, the flow sensing The sensing chip is arranged on the first surface for sensing the airflow flow through the gas flow channel, the flow sensing chip has a sensing surface, the sensing mask has a first side, and the first diversion The element is convexly arranged on the first surface and is spaced from the first side. Each of the first guide elements is elongated and extends in the first flow direction. Each of the first guide elements is used to The air flow is rectified so that it flows through the sensing surface after being rectified. The gas flow tool has a guide flow path for guiding the air flow in the first flow direction, and the flow sensing chip corresponds to the position of the guide flow path To sense the airflow flow through the guide flow path, the first side extends along an extension direction that is substantially perpendicular to the first flow direction, and the first guide elements are mutually along the extension direction Arranged at intervals. The sensor according to claim 1, wherein the guide flow path selectively guides the air flow in a second flow direction opposite to the first flow direction, and the sensing surface further has an opposite On the second side of the first side, the sensing module further includes a plurality of second guide elements protruding on the first surface and spaced apart from the second side, each of the second guide elements Long and long Extending along the second flow direction, each of the second guide elements is used to rectify the air flow so that it flows through the sensing surface after rectification. The sensor according to claim 2, wherein the second side extends along the extending direction, and the second flow guiding elements are arranged at intervals from each other along the extending direction. The sensor according to claim 1, 2, or 3, wherein the first mask has a surface portion, and a groove portion formed by recessing the surface portion, and the flow sensing chip is disposed in the groove portion , The sensing surface is coplanar with the surface portion or is located in the groove portion. The sensor according to claim 1, wherein the gas flow prop has a diversion hole spaced from the pilot flow path, and the sensing circuit board further has a second surface opposite to the first surface, The sensing circuit board defines a through hole penetrating the first surface and the second surface and communicating with the diversion hole, the sensing module further includes a pressure sensor disposed on the second surface and closing the through hole For the wafer, the pressure sensing wafer is used to sense the pressure of the airflow flowing into the perforation through the diversion hole. The sensor according to claim 1, wherein the gas flow path has a first conduction flow path and a second conduction flow path respectively connected to opposite ends of the guiding flow path, and the sensing circuit board further has a Opposite to the second surface of the first surface, the sensing circuit board defines a through hole penetrating the first surface and the second surface, the through hole communicating with the first conduction flow path or the second conduction flow path, The sensing module further includes a pressure sensing chip disposed on the second surface and closing the through hole, the pressure sensing chip is used to sense the inflow through the first conduction flow path or the second conduction flow path into the through hole Air pressure. The sensor according to claim 1, wherein the gas flow channel has separate connections A first conducting flow path and a second conducting flow path passing through the opposite end of the guiding flow path, the sensing module further includes a pressure sensing chip disposed on the first surface, the pressure sensing chip is located in the In the first conduction flow path or the second conduction flow path, the pressure sensing chip is used to sense the pressure of the airflow flowing through the first conduction flow path or the second conduction flow path. The sensor according to claim 1, wherein the sensing device further includes a housing engaged with the diversion housing, and a diversion member disposed in the housing, the housing defining an air inlet , The flow guide defines a flow guide hole communicating with the air intake hole and spaced apart from the guide flow path, the sensing circuit board further has a second face opposite to the first face, the sensing The circuit board defines a through hole penetrating the first surface and the second surface and communicating with the diversion hole, the sensing module further includes a pressure sensing chip disposed on the first surface and closing the through hole, the The pressure sensing chip is used to sense the pressure of the airflow flowing into the through hole through the diversion hole. The sensor according to claim 1, wherein the sensing module further includes a pressure sensing chip disposed on the sensing circuit board, the pressure sensing chip is used to sense the gas flowing through the gas flow path Air pressure. The sensor according to claim 9, wherein the sensing circuit board further has a second surface opposite to the first surface, and the pressure sensing chip is disposed on the second surface for sensing the gas The airflow pressure of the flow channel flowing into the sensing circuit board. The sensor according to claim 9, wherein the pressure sensing chip is disposed on the first surface to sense the pressure of the airflow flowing through the gas flow path. The sensor according to claim 1, wherein the sensing device further includes a A housing joined by the diversion housing, and a deflector disposed in the housing, the housing defines an air intake hole, the diversion component defines a diversion hole communicating with the air intake hole, the sense The sensing circuit board further has a second surface opposite to the first surface, the sensing circuit board defines a through hole penetrating the first surface and the second surface and communicating with the diversion hole, the sensing module It further includes a pressure sensing chip disposed on the first surface and closing the through hole. The pressure sensing chip is used to sense the pressure of the airflow flowing into the through hole through the diversion hole. The sensor according to claim 9, 10, 11 or 12, wherein the sensing device further includes a control module, and the sensing module further includes an electrical connection to the sensing circuit board and the control A flow signal transmission line between the modules, a pressure signal transmission line electrically connected between the sensing circuit board and the control module, and two electrically connected between the sensing circuit board and the control module Power transmission line.

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