CN109015278A - Chip abrasive blast equipment - Google Patents
Chip abrasive blast equipment Download PDFInfo
- Publication number
- CN109015278A CN109015278A CN201810962310.XA CN201810962310A CN109015278A CN 109015278 A CN109015278 A CN 109015278A CN 201810962310 A CN201810962310 A CN 201810962310A CN 109015278 A CN109015278 A CN 109015278A
- Authority
- CN
- China
- Prior art keywords
- polishing
- bar
- rotating disc
- wafer
- sliding part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0092—Grinding attachments for lathes or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The present invention relates to chip manufacture fields, more particularly to chip abrasive blast equipment, including polishing pad and rotating disc, rotating disc is located at the top of polishing pad, and polishing pad is equipped with several through-holes being vertically arranged, polishing bar is slidably connected in several through-holes, it is respectively connected with pressure spring between the top and rotating disc of polishing bar, the bottom end for bar of polishing is abrasive end, is slidably connected between adjacent polishing bar, the lower section of polishing pad is equipped with the supporting mechanism for placing wafer, is connected with driving mechanism on rotating disc.The buffed surface that this programme prevents wafer to be formed after polishing is inclined-plane, conducive to the polishing quality for improving wafer.
Description
Technical field
The present invention relates to chip manufacture field more particularly to chip abrasive blast equipments.
Background technique
Wafer refers to silicon wafer used in silicon semiconductor production of integrated circuits, since its shape is circle, therefore referred to as wafer；
It can be processed on silicon and is fabricated to various circuit component structures, and become the IC product for having specific electrical functionality.
Carrying out polishing to the surface of wafer is the important step of chip in process.Currently, the polishing of wafer is main
It is to be completed by grinding wheel.After grinding apparatus has used long, the table of loosening or grinding wheel that the part in equipment can become
Face can be worn, and the surface of grinding wheel is no longer plane, can all be impacted in this way to grinding accuracy, so that the polishing of wafer
The face formed later is not plane, and the face that is formed by after wafer polishing becomes inclined-plane, and then influences the polishing quality of wafer.
Summary of the invention
The purpose of the present invention is to provide chip abrasive blast equipments, are oblique with the buffed surface for preventing wafer from being formed after polishing
Face.
In order to achieve the above objectives, the technical scheme is that chip abrasive blast equipment, including polishing pad and rotating disc, turn
Moving plate is located at the top of polishing pad, and polishing pad is equipped with several through-holes being vertically arranged, slidably connects and beat in several through-holes
Mill bar is respectively connected with pressure spring between the top and rotating disc of bar of polishing, and the bottom end of bar of polishing is abrasive end, adjacent polishing bar it
Between be slidably connected, the lower section of polishing pad is equipped with the supporting mechanism for placing wafer, is connected with driving mechanism on rotating disc.
The working principle of this programme are as follows: supporting mechanism is fixed wafer and supports for placing wafer.Driving mechanism
For driving turn disc.Due to being connected with polishing bar between rotating disc and polishing pad, therefore when turn disc, rotating disc is logical
It crosses polishing bar and drives polishing pad rotation, and polishing bar and polishing pad rotate together.Bar polish during rotation, bar bottom end of polishing
Abrasive end for polishing wafer.Pressure spring is for the pressure certain to polishing bar, the abrasive end and crystalline substance that make to polish on bar
It is closely affixed between round surface, to guarantee the quality of polishing.
Wafer during the grinding process, if after the buffed surface of wafer is at inclined-plane, since buffed surface is not plane but inclined-plane, then
If the bottom end of dry rubbing bar is not in the same plane, therefore each polishing bar is different to the extruding degree of pressure spring, corresponding to polish
The pressure of pressure spring corresponding to bar is different, i.e. the compression of pressure spring corresponding to polishing bar on the higher position of the buffed surface of wafer
Measure larger, the pressure of pressure spring is larger, so that the bar that makes to polish is larger to the polishing dynamics on the higher position of the buffed surface of wafer；And
The decrement of pressure spring corresponding to polishing bar on the lower position of the buffed surface of wafer is smaller, and the pressure of pressure spring is smaller, thus
Keep polishing bar smaller to the polishing dynamics on the lower position of the buffed surface of wafer.This programme pressure spring pressure according to suffered by polishing bar
Difference, the buffed surface of wafer is corrected, so that inclined buffed surface is corrected to plane.
It when by adopting the above technical scheme, realizes in wafer bruting process, wafer buffed surface automatically corrects, i.e., will incline
Oblique buffed surface is corrected to plane, improves the polishing quality and precision of wafer.And existing correcting mode is compared, without stopping
Machine correction, it is simple to operate.
Further, rotating disc is equipped with several threaded holes being vertically arranged, and threaded hole penetrates through rotating disc, threaded hole and beats
The top face of mill bar, threaded hole internal screw thread are connected with bolt, and the bottom of bolt is fixedly connected with fixing seat, and pressure spring is far from polishing
The one end on bar top is fixed in fixing seat；The regulating mechanism for adjusting bolt is configured on rotating disc.Regulating mechanism is used for
Bolt is turned, since bolt thread is connected in threaded hole, therefore when turning bolt, bolt drives fixing seat mobile, and fixing seat is logical
Crossing pressure spring drives polishing bar mobile, it is thus achieved that the adjusting of polishing bar.In this way, when the abrasive end of polishing bar is worn not for the moment,
Can be mobile by making fixing seat, to make bar movement of polishing, air exercise mill bar is adjusted, if guaranteeing the abrasive end position of dry rubbing bar
In on same plane.This programme realizes that air exercise mill bar is adjusted by the way that fixing seat is adjusted, fixing seat and polishing
The distance between bar top is constant, therefore the pressure of pressure spring will not become, to prevent air exercise mill bar when being adjusted to pressure spring
Pressure impacts, if guaranteeing, the decrement of the pressure spring on dry rubbing bar is equal when not working.In addition, by adjusting bolt,
So as to make different number polishing bar abrasive end and wafer contacts, it can be achieved that detail sanding to wafer, or pass through tune
The polishing bar of section different number polishes to wafer, and the roughness that can be polished wafer is adjusted.
Further, supporting mechanism includes rotation seat and the placement rack for placing wafer, and placement rack is located at the top of rotation seat
In portion, placement rack and rotation seat are rotatablely connected, and the bottom of rotation seat is fixedly connected with lead screw, are threaded with and are fixed not on lead screw
Dynamic fixed block, the bottom end of lead screw are connected with unilateral bearing, and gear is coaxially connected on lead screw, is engaged with sector on gear
It takes turns, is connected with motor on sector gear.Placement rack is for placing wafer.When motor rotates, motor drives sector gear rotation, fan
Shape gear interval is engaged with gear, and gear interval drives lead screw rotation, and since lead screw is threadedly coupled with fixed block, therefore lead screw rotates
When, lead screw moves on fixed block, and lead screw drives rotation seat mobile, and rotation seat drives placement rack mobile, and placement rack drives wafer
To mobile close to polishing bar direction, this prevents wafers during the grinding process, wafer thinner and the pressure between polishing bar
It reduces, guarantees polishing bar and wafer continuous extrusion, and the dynamics for squeezing polishing is constant, guarantee that stabilization is polished.Unilateral bearing
For prevent during the grinding process lead screw rotate backward and move down, guarantee wafer polishing when continue with polish bar contacts.
Further, driving mechanism includes sprocket wheel, and sprocket wheel is set on rotating disc.It as a result, can by mechanisms such as sprocket wheel, chains
Drive turn disc.
Further, regulating mechanism includes card cylinder, and link block is fixedly connected on card cylinder, adjusting is slidably connected on link block
Bar.When needing that bolt is adjusted, card cylinder is inserted into threaded hole, the head of card cylinder and bolt is mutually clamped, and is passed through
Adjusting rod is rotated, adjusting rod drives card cylinder to rotate by link block, and card cylinder drives bolt rotation, it is thus achieved that the tune of bolt
Section by this regulating mechanism is convenient for that the bolt being located in threaded hole is adjusted, simple to operate.Since adjusting rod slides
It is connected on link block, therefore operator can according to the actual situation be adjusted the length of adjusting rod, consequently facilitating operation.
Further, polishing bar includes the first sliding part, the second sliding part and third sliding part, and third sliding position is in first
Between sliding part and the second sliding part, the first sliding position in the top of polishing pad, the second sliding position in the lower section of polishing pad,
Third sliding part is slidably connected in through-hole, and the diameter of the diameter of the first sliding part and the second sliding part is all larger than third sliding part
Diameter；The first sliding part on adjacent ground bar is mutually slidably connected, and the second sliding part on adjacent ground bar mutually slides
Connection.Thereby it is ensured that while adjacent polishing bar is mutually slidably connected, polishing bar can pass through through-hole and in through-hole
Wall offsets.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of chip abrasive blast equipment；
Fig. 2 is the structural schematic diagram of polishing bar；
Fig. 3 is the top view of rotating disc；
Fig. 4 is the structural schematic diagram of bolt；
Fig. 5 is the structural schematic diagram of regulating mechanism.
Specific embodiment
It is further described below by specific embodiment:
Appended drawing reference in Figure of description includes: rotating disc 1, sprocket wheel 2, fixing seat 3, pressure spring 4, polishing bar 5, polishing pad
6, placement rack 7, rotation seat 8, fixed block 9, lead screw 10, gear 11, unilateral bearing 12, sector gear 13, motor 14, threaded hole
15, card cylinder 16, adjusting rod 17, link block 18, bolt 19, the first sliding part 20, the second sliding part 21, third sliding part 22.
Embodiment is basic as shown in attached drawing 1- Fig. 5: chip abrasive blast equipment, including rack, and lateral rotation is connected in rack
Polishing pad 6 and the rotating disc 1 above polishing pad 6, as shown in connection with fig. 3, rotating disc 1 are equipped with several screw threads being vertically arranged
Hole 15, and threaded hole 15 penetrates through rotating disc 1.Bolt 19 as shown in Figure 4, bolt are threaded in each threaded hole 15
19 head is located in threaded hole 15, and the bottom of bolt 19 is welded with fixing seat 3, and fixing seat 3 is pierced by out of threaded hole 15 and position
In the lower section of rotating disc 1.The regulating mechanism for adjusting bolt 19, as shown in connection with fig. 5, regulating mechanism are configured on rotating disc 1
Including card cylinder 16, the top of card cylinder 16 is welded with link block 18, and link block 18 is equipped with cross-drilled hole, slidably connects adjusting in cross-drilled hole
Bar 17 when needed penetrates card cylinder 16 at the top of threaded hole 15, and card cylinder 16 and the head of bolt 19 are mutually blocked, from
And rotated by making card cylinder 16, drive bolt 19 to rotate.
Polishing pad 6 is equipped with several through-holes being vertically arranged, and polishing bar 5 is slidably connected in several through-holes.In conjunction with Fig. 2
Shown, polishing bar 5 successively includes the first sliding part 20, third sliding part 22 and the second sliding part 21, third sliding from top to bottom
Portion 22 is slidably connected in through-hole, and the first sliding part 20 and the second sliding part 21 are located above and below polishing pad 6, the
The diameter of the diameter of one sliding part 20 and the second sliding part 21 is all larger than the diameter of third sliding part 22.On adjacent ground bar 5
First sliding part 20 is mutually slidably connected, and the second sliding part 21 on adjacent ground bar 5 is mutually slidably connected, third sliding part 22
The concrete mode and phase being mutually slidably connected with the first sliding part 20 on the slip connection mode of through-hole, adjacent polishing bar 5
The concrete mode of the second sliding part 21 on adjacent polishing bar 5 mutually slided is the phase by way of sliding slot and sliding block cooperation
Mutually sliding.
The top of each polishing bar 5 and each fixing seat 3 are facing each other, and between the top and fixing seat 3 for bar 5 of polishing
It is connected with pressure spring 4, the outer sheath of pressure spring 4 is equipped with retracting cylinder (not shown), and retracting cylinder is connected to fixing seat 3 and polishing bar 5
Top between, retracting cylinder for prevent pressure spring 4 compress when inclination.The bottom end of polishing bar 5 is abrasive end.It is connected on rotating disc 1
There is driving mechanism, driving mechanism includes sprocket wheel 2, and sprocket wheel 2 is set on rotating disc 1, and the present embodiment is matched by sprocket wheel 2 and chain
Conjunction mode drives rotating disc 1 to rotate.Rack is equipped with the supporting mechanism for being located at 6 lower section of polishing pad, and supporting mechanism includes rotation seat 8
With the placement rack 7 for placing wafer, placement rack 7 slides vertically connection on the rack, and placement rack 7 is located at the top of rotation seat 8
On, placement rack 7 and rotation seat 8 are rotatablely connected, and the bottom of rotation seat 8 is welded with lead screw 10, fixed block 9, silk are welded in rack
Thick stick 10 passes through fixed block 9 and is threadedly coupled with fixed block 9, and the bottom end of lead screw 10 is connected with unilateral bearing 12, and unilateral bearing 12 is perpendicular
To being slidably connected on the rack, the gear 11 being coaxially connected on lead screw 10 between unilateral bearing 12 and fixed block 9, gear
It is engaged with sector gear 13 on 11, motor 14 is connected on sector gear 13.
Specific implementation process is as follows: when needing to polish to wafer, wafer being placed on placement rack 7, and make wafer
Upper surface and polish bar 5 bottom end offset.Then rotate rotating disc 1, rotating disc 1 is beaten by pressure spring 4 and retracting cylinder drive
Mill bar 5 follows rotating disc 1 to rotate, and when polishing bar 5 rotates, the bottom end of polishing bar 5 polishes to the upper surface of wafer, meanwhile,
Bar 5 of polishing drives polishing pad 6 to rotate.
In wafer bruting process, start motor 14, motor 14 drive sector gear 13 rotate, 13 interval of sector gear with
Gear 11 engages, to make 11 intermittent rotary of gear, gear 11 drives 10 intermittent rotary of lead screw, and screw rod drives rotation seat 8 putting
Set intermittent rotation on seat 7.Since lead screw 10 is threaded on fixed block 9, therefore when 10 intermittent rotary of lead screw, 10 interval of lead screw
Property move up, lead screw 10 drive and 7 intermittence of placement rack move up, placement rack 7 drive wafer intermittence move up, from
And move up wafer in polishing, so that the bottom end of wafer and polishing bar 5 is in close contact, guarantee wafer and polishing 5 bottom of bar
Pressure between end is constant, to guarantee the quality of polishing.
If wafer is during the grinding process, the upper surface of wafer becomes inclined, i.e. the height of each position in the upper surface of wafer
Degree is different.In this way, polishing 5 bottom end of bar is not also in the same plane, i.e. bar 5 of polishing on the lower position in the upper surface of wafer
Highly lower, the decrement of pressure spring 4 is smaller, and the pressure of pressure spring 4 is smaller, and 5 bottom end of bar of polishing is to the lower position in the upper surface of wafer
The pressure set is smaller, and polishing bar 5 is smaller to polishing dynamics of the wafer at this；Similarly, on the higher position in the upper surface of wafer
Polish bar 5 height it is higher, the degree that polishing bar 5 squeezes pressure spring 4 is larger, and the decrement of pressure spring 4 is larger, the pressure of pressure spring 4 compared with
Greatly, polish bar 5 bottom end it is larger to the pressure on the higher position in the upper surface of wafer, polishing of the polishing bar 5 to wafer at this
Dynamics is larger.The polishing dynamics of the bottom end of the polishing bar 5 on the upper surface lower position of wafer is smaller as a result, the upper table of wafer
The polishing dynamics of polishing bar 5 on the higher position of face is larger, so that the upper surface of wafer gradually becomes plane by skewed,
Realize the correction of wafer upper surface.
With continuing on for polishing bar 5, the abrasion of each polishing 5 bottom end of bar is different, can thus make each polishing
5 bottom end of bar will not be in the same plane when not working, and when the bottom end polishing for bar 5 of polishing, 5 bottom end of bar of polishing is to wafer
Pressure is different, to will affect the grinding accuracy of wafer, influences the uniformity coefficient of wafer polishing.In order to eliminate this unfavorable shadow
It rings, card cylinder 16 and the head of bolt 19 can be made to engage, and rotate adjusting rod 17 by the way that card cylinder 16 to be extend into threaded hole 15,
Adjusting rod 17 drives card cylinder 16 to rotate by link block 18, and card cylinder 16 drives bolt 19 to rotate, and bolt 19 erects in threaded hole 15
To movement, screw thread drives fixing seat 3 mobile, and the used pressure spring 4 of fixing seat 3 and retracting cylinder drive polishing bar 5 vertically movable, thus real
Showed polishing bar 5 vertical adjustment, it is ensured that if the bottom end of dry rubbing bar 5 is in the same plane, guarantee polishing precision and
Uniformity coefficient.Since fixing seat 3 and polishing bar 5 are mobile simultaneously, therefore the relative distance between fixing seat 3 and polishing bar 5 is being polished
When bar 5 is not affected by the extruding of wafer, polishing the distance between bar 5 and fixing seat 3 will not change, therefore the elastic force of pressure spring 4
It will not change, thus prevent air exercise mill bar 5 that the elastic force of pressure spring 4 is caused to interfere and be influenced when adjusting, so as to guarantee
For each polishing bar 5 in the plane polishing to wafer, the pressure polished on bar 5 is identical.
In addition, the bottom end of part polishing bar 5 can also be made to contact with the upper surface of wafer, thus real by adjusting bolt 19
The detail sanding to wafer is showed.Also, by the polishing bar 5 and wafer contacts for making different number, it can also realize that wafer is polished
The adjusting of roughness can carry out smart polishing, when lesser that is, when the bottom end of more polishing bar 5 and wafer contacts to wafer
When the bottom end of polishing bar 5 and wafer contacts, rough grinding can be carried out to wafer.
What has been described above is only a preferred embodiment of the present invention, it is noted that for those skilled in the art,
Without departing from the inventive concept of the premise, several modifications and improvements can also be made, these also should be considered as guarantor of the invention
Range is protected, these all will not influence the effect and patent practicability that the present invention is implemented.The present invention omits the technology of description, shape
Shape, construction portion are well-known technique.
Claims (6)
1. chip abrasive blast equipment, it is characterised in that: including polishing pad and rotating disc, the rotating disc is located at the top of polishing pad,
The polishing pad is equipped with several through-holes being vertically arranged, and polishing bar is slidably connected in several through-holes, the polishing bar
Pressure spring is respectively connected between top and rotating disc, the bottom end for bar of polishing is abrasive end, it is slidably connected between adjacent polishing bar, institute
The lower section for stating polishing pad is equipped with supporting mechanism for placing wafer, is connected with driving mechanism on the rotating disc.
2. chip abrasive blast equipment according to claim 1, it is characterised in that: the rotating disc is equipped with several be vertically arranged
Threaded hole, the threaded hole penetrates through rotating disc, and the top face of threaded hole and polishing bar, threaded hole internal screw thread is connected with spiral shell
Bolt, the bottom of the bolt are fixedly connected with fixing seat, and the pressure spring is fixed in fixing seat far from the one end on polishing bar top；
The regulating mechanism for adjusting bolt is configured on the rotating disc.
3. chip abrasive blast equipment according to claim 1, it is characterised in that: the supporting mechanism includes rotation seat and is used for
The placement rack of wafer is placed, the placement rack is located on the top of rotation seat, and placement rack and rotation seat are rotatablely connected, the rotation
The bottom of seat is fixedly connected with lead screw, fixed fixed block is threaded on the lead screw, the bottom end of lead screw is connected with
Unilateral bearing is coaxially connected with gear on lead screw, sector gear is engaged on the gear, is connected with motor on sector gear.
4. chip abrasive blast equipment according to claim 1, it is characterised in that: the driving mechanism includes sprocket wheel, the chain
Wheel is set on rotating disc.
5. chip abrasive blast equipment according to claim 2, it is characterised in that: the regulating mechanism includes card cylinder, on card cylinder
It is fixedly connected with link block, slidably connects adjusting rod on the link block.
6. chip abrasive blast equipment according to claim 1, it is characterised in that: the polishing bar includes the first sliding part, the
Two sliding parts and third sliding part, the third sliding position is between the first sliding part and the second sliding part, the first sliding part
Positioned at the top of polishing pad, the second sliding position is slidably connected in through-hole in the lower section of polishing pad, third sliding part, and described
The diameter of the diameter of one sliding part and the second sliding part is all larger than the diameter of third sliding part；The first sliding on adjacent ground bar
Portion is mutually slidably connected, and the second sliding part on adjacent ground bar is mutually slidably connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810962310.XA CN109015278B (en) | 2018-08-22 | 2018-08-22 | Chip abrasive device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810962310.XA CN109015278B (en) | 2018-08-22 | 2018-08-22 | Chip abrasive device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109015278A true CN109015278A (en) | 2018-12-18 |
| CN109015278B CN109015278B (en) | 2020-10-27 |
Family
ID=64627932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810962310.XA Active CN109015278B (en) | 2018-08-22 | 2018-08-22 | Chip abrasive device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109015278B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6409584B1 (en) * | 2001-07-24 | 2002-06-25 | Gison Machinery Co., Ltd. | Speed adjusting device for pneumatic grinding tool |
| CN201552478U (en) * | 2009-11-19 | 2010-08-18 | 昆山新力精密五金有限公司 | Material polishing device |
| CN105538132A (en) * | 2015-12-10 | 2016-05-04 | 哈尔滨理工大学 | Constant-force grinding tool for grinding molded surface of vehicle covering part mold |
| CN107263230A (en) * | 2017-06-30 | 2017-10-20 | 铜陵市得盛机电制品有限责任公司 | A kind of continuous producing apparatus |
| CN107900832A (en) * | 2017-11-15 | 2018-04-13 | 王静娴 | A kind of stainless-steel sheet quick deburring equipment in the production for power distribution cabinet |
-
2018
- 2018-08-22 CN CN201810962310.XA patent/CN109015278B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6409584B1 (en) * | 2001-07-24 | 2002-06-25 | Gison Machinery Co., Ltd. | Speed adjusting device for pneumatic grinding tool |
| CN201552478U (en) * | 2009-11-19 | 2010-08-18 | 昆山新力精密五金有限公司 | Material polishing device |
| CN105538132A (en) * | 2015-12-10 | 2016-05-04 | 哈尔滨理工大学 | Constant-force grinding tool for grinding molded surface of vehicle covering part mold |
| CN107263230A (en) * | 2017-06-30 | 2017-10-20 | 铜陵市得盛机电制品有限责任公司 | A kind of continuous producing apparatus |
| CN107900832A (en) * | 2017-11-15 | 2018-04-13 | 王静娴 | A kind of stainless-steel sheet quick deburring equipment in the production for power distribution cabinet |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109015278B (en) | 2020-10-27 |
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Effective date of registration: 20221103 Address after: 646606 Building 12, Yingtian Intelligent Terminal Industrial Park, No. 9, Liangang Road, Shangzhuang Village, Luohan Street, South Sichuan Lingang District, Sichuan Free Trade Zone, Luzhou, Sichuan Patentee after: Luzhou Loongson Micro Technology Co.,Ltd. Address before: 401326 no.66-75, sendi Avenue, Xipeng Town, Jiulongpo District, Chongqing Patentee before: CHONGQING JIALINGXIN TECHNOLOGY CO.,LTD. |
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