CN108998758A - 具有涂层的钻头 - Google Patents

具有涂层的钻头 Download PDF

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Publication number
CN108998758A
CN108998758A CN201810749584.0A CN201810749584A CN108998758A CN 108998758 A CN108998758 A CN 108998758A CN 201810749584 A CN201810749584 A CN 201810749584A CN 108998758 A CN108998758 A CN 108998758A
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China
Prior art keywords
layer
hipims
dlc
drill bit
layers
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Granted
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CN201810749584.0A
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CN108998758B (zh
Inventor
S·克拉斯尼策尔
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Ou Ruikang Surface Solutions Inc
Oerlikon Surface Solutions AG Pfaeffikon
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Ou Ruikang Surface Solutions Inc
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B51/00—Tools for drilling machines
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0635—Carbides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0641—Nitrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3435—Applying energy to the substrate during sputtering
    • C23C14/345—Applying energy to the substrate during sputtering using substrate bias
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3485—Sputtering using pulsed power to the target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3492—Variation of parameters during sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/354—Introduction of auxiliary energy into the plasma
    • C23C14/355—Introduction of auxiliary energy into the plasma using electrons, e.g. triode sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/548—Controlling the composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/26—Deposition of carbon only
    • C23C16/27—Diamond only
    • C23C16/276—Diamond only using plasma jets
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/26—Deposition of carbon only
    • C23C16/27—Diamond only
    • C23C16/277—Diamond only using other elements in the gas phase besides carbon and hydrogen; using other elements besides carbon, hydrogen and oxygen in case of use of combustion torches; using other elements besides carbon, hydrogen and inert gas in case of use of plasma jets
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/26—Deposition of carbon only
    • C23C16/27—Diamond only
    • C23C16/278—Diamond only doping or introduction of a secondary phase in the diamond
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
    • C23C28/044—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material coatings specially adapted for cutting tools or wear applications
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
    • C23C28/046—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material with at least one amorphous inorganic material layer, e.g. DLC, a-C:H, a-C:Me, the layer being doped or not
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
    • C23C28/048—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material with layers graded in composition or physical properties
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • C23C30/005—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process on hard metal substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3464—Operating strategies
    • H01J37/3467—Pulsed operation, e.g. HIPIMS
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B2228/00—Properties of materials of tools or workpieces, materials of tools or workpieces applied in a specific manner
    • B23B2228/10—Coatings
    • B23B2228/105—Coatings with specified thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23G—THREAD CUTTING; WORKING OF SCREWS, BOLT HEADS, OR NUTS, IN CONJUNCTION THEREWITH
    • B23G2200/00—Details of threading tools
    • B23G2200/26—Coatings of tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23G—THREAD CUTTING; WORKING OF SCREWS, BOLT HEADS, OR NUTS, IN CONJUNCTION THEREWITH
    • B23G5/00—Thread-cutting tools; Die-heads
    • B23G5/02—Thread-cutting tools; Die-heads without means for adjustment
    • B23G5/06—Taps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00—Cutting by use of rotating axially moving tool
    • Y10T408/78—Tool of specific diverse material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract

本发明涉及一种涂覆基材，优选涂覆钻头的方法，其中借助HIPIMS方法施涂至少一个第一HIPIMS层。优选地，在所述第一HIPIMS层上借助不包括HIPIMS方法的涂覆方法施涂至少一个第二层。

Description

具有涂层的钻头
本申请是申请号为201280051664.X(PCT/EP2012/004352)、申请日为2012年10月18目的发明专利申请的分案申请。
技术领域
本发明涉及钻头，特别是螺纹钻头或微型钻头，其具有至少在该钻头的钻尖上或任选在该螺纹钻头的切槽上形成的涂层，并且该涂层具有至少一个优选直接在所述钻头的钻体上施涂的HIPIMS层，以及涉及涂覆基材的涂覆方法，该涂覆方法用于涂覆部件和工具，尤其是用于涂覆钻头。
背景技术
螺纹钻头具有至少一个切槽和与之相邻的导向区域。其包括直线型和螺旋型开槽的螺纹钻头，其中后者的区别主要在于旋转角度。
通常，这种螺纹钻头通过PVD布置有氮化钛涂层(TiN)或碳氮化钛涂层(TiCN)。对于尤其是借助传统的磁控管雾化涂覆的螺纹钻头，常常需要在涂覆之后将切削面再次打磨得光亮。其原因之一可能在于，由于涂层而不利地改变了可能影响切削形状的滑动性能和摩擦性能，这对于螺纹钻头会产生干扰。
与之相反，通过热真空蒸发用TiN或TiCN涂覆的螺纹钻头不必进行后续打磨。然而，通过热蒸发仅能使用大量消耗而涂覆对于涂覆的经济性操作所需的件数。
使用电弧蒸发来涂覆螺纹钻头也不能得到所希望的结果，这可能是由于使用这种方法涂覆引起的贮藏在层中的所谓污迹(Spritzer)导致不可接受的表面粗糙度。因此，在涂覆之后需要消耗时间和大量费用的打磨工序。
发明内容
本发明的目的在于，提供一种涂覆的钻头，特别是涂覆的螺纹钻头，其在涂覆之后基本上不用繁琐的后续打磨而可以使用。
这里，后续打磨明显不同于相对简单和便宜的在涂覆之后进行的擦刷步骤，通过擦刷步骤例如可以去除由于涂覆产生的毛边。
本发明的目的通过本发明的方法而实现。根据本发明的方法，通过HIPIMS方法在螺纹钻头上施涂硬质层。这里，HIPIMS表示高功率脉冲磁控管溅射，其是一种雾化方法，其中大的放电电流密度提高了雾化材料的离子化程度。根据本发明，特别优选至少部分通过在DE102011018363中公开的方法施涂的那些层。通过这种方法实现了非常高的雾化材料的离子化程度。由于在基材上接上的负偏压，相应的离子向其加速，从而形成非常大的密度。因为在DE102011018363中描述的方法(其中电压源以主从构造形式工作)是非常稳定的涂覆工艺，由此形成的层相应地紧密、均匀、具有非常好的粘附性和低的表面粗糙度。
如果HIPIMS层是由选自铬、钛、铝和钨的金属中的至少一种，更优选两种的氮化物和/或碳化物和/或氧化物沉积而成的层，则可以达到非常好的效果。这样甚至不需要在钻体和HIPIMS层之间设置粘附层。这可能是高速到达钻体的离子的结果。氮化物、碳化物或氧化物的沉积可以交替地或同时进行。特别发现，用AlCrN HIPIMS层涂覆提高了钻头的使用寿命。
根据本发明的另一实施方案，在所述HIPIMS层上还可以配置无定形的碳层或DLC层，其特别是可以含有金属的。由于其好的滑动性能，无定形碳或DLC层(根据含碳的层而命名的)的优点在于刀刃处而不是相应的面上的摩擦较低，这允许较低的磨损和螺纹钻头更长的使用寿命。由于HIPIMS层的表面粗糙度低，位于其上的、在表面上的、含碳的层也具有低的粗糙度，特别是注意到，含碳的层的层厚度不超过5μm。整个层体系优选具有0.1-10μm的厚度。
本发明公开了涂覆钻头(优选螺纹钻头)的方法，其中在钻体上借助HIPIMS方法施涂HIPIMS层，优选直接施涂在钻体上。
优选地，施涂的涂层的总厚度为0.1-10μm。
优选地，沉积的至少一个层是HIPIMS层，该层由至少一种、更优选两种选自铬、钛、铝和钨的金属的至少一种氮化物和/或碳化物和/或氧化物构成。
优选地，所述方法包括至少如下的一个涂覆步骤：将DLC层，优选含金属的DLC层施涂在HIPIMS层上。
用于涂覆含金属的DLC层的金属元素优选与在所述HIPIMS层中的一种金属元素相一致。在DLC层中的金属含量可以向表面方向呈梯度式地减少。
如在本发明的范围，上述的传统的磁控管雾化通常称为常规的溅射工艺或常规的溅射，所有这些术语具有相同的意思。在本发明中，还使用其英文名字的缩写MS(magnetronsputtering)，其也具有如同传统的磁控管雾化的相同意思，并用于本发明中。
类似地，如在本发明的范围，上述的“贮藏在层中的所谓污迹”(由于使用电弧蒸发工艺而产生的)通常称为微滴或大颗粒，这对于电弧层是非常典型的。
在本发明的范围内，热真空蒸发是指等离子体辅助的真空蒸发工艺，其中通过使用等离子体源在真空压力下输入热量而蒸发层材料。为此，可以例如使用低压弧作为等离子体源。可以将待蒸发的层材料放置在例如可以作为阳极连接的钵中。由于其低的粗糙度和基本上好的层质量，这些涂层对于螺纹钻头涂层而言可以很好地形成。然而，并不总是能够很容易地控制工艺参数。
为了提高螺纹钻头的效率，并不总是很容易选择合适的涂层材料。此外，涂覆工艺的类型也很关键，因为涂覆工艺直接影响到沉积的层的结构及其性能。
具有TiCN涂层的螺纹钻头例如具有非常高的表面硬度，并且相比于具有由其它材料形成的涂层的螺纹钻头通常具有更强的抵抗力。由此特别是可以避免边缘毛边的形成。
相反，使用TiN涂层不能达到相当的表面硬度，但是TiN涂层通常可以很好地保护钻头，因此相比于未涂覆的钻头可以实现更长的使用寿命和使用更高的速度。
为了钻孔非金属的基本材料(其中具有Ti基的涂层的钻头被证明是不合适的)，在一些情况下可以使用借助PVD沉积的CrN涂层。
涂覆的螺纹工具提供了更长的使用寿命，并且明显提高了切削数据。通过硬质涂层，显著提高了螺纹钻头的耐磨性。也防止了冷焊接点(Kaltverschweissungen)和结构切口(Aufbauschneiden)的形成。通过剧烈降低的摩擦和涂覆的工具更好的滑动性能，减小了切割力，降低了切割表面的磨损并基本上改善了切削螺纹的表面品质。
在具体的螺纹工具的情况下(例如螺纹钻头)，在多次试验中证实，相比于借助传统磁控管雾化或借助电弧蒸发而制备的涂层，借助等离子体辅助的真空蒸发而制备的层(以后称为蒸汽层)通常具有更长的使用寿命。在本发明的范围，具有电弧层的螺纹钻头用各种组合物和层结构涂覆，并测试其切削效率。按照测试结果，相比于很好形成的TiN基和TiCN基的蒸汽层，几乎所有测试的电弧层对于这种应用总是处于劣势。甚至为了降低电弧层的表面粗糙度而进行相应的后处理操作之后也是如此。然而，具有氮化铝铬基的电弧层的螺纹钻头(在后处理之后)展现出如同具有TiN-和TiCN-蒸汽涂层的螺纹钻头几乎一样好的效率。
然而，为了达到主要在密度和硬度方面与AlCrN基的电弧层相当的性能，也为了更好的表面质量而避免繁琐的后处理，并由此追求等离子体辅助的真空蒸发技术的优势，根据本发明使用HIPMS技术用于螺纹钻头的涂覆。
根据本发明，如果钻头(例如螺纹钻头)涂覆有至少一个HIPIMS层(其优选直接施涂在钻头体上)，则相比于借助等离子体辅助的真空蒸发而制备的层可以达到相当的甚至更高的切削效率。
具体地，HIPIMS层包含氮化物和/或碳化物，HIPIMS层优选包含至少一种氮化物层和/或碳化物层。
具体地，非常合适的是(AI，Cr)N HIPIMS层中的铝相对于铬的浓度以原子百分比表示为约70比30，从而可以达到相比于目前很好形成的(Ti，C)N蒸汽层相当的甚至更好的结果(至少对于具有一定工件材料的螺纹钻头)。此外，由于HIPIMS层相比于电弧层具有低粗糙度，可以如上所述地不必使用否则昂贵的后处理或者使用便宜得多的和较不繁琐的后处理。
根据本发明，上述的层变体(含有施涂在HIPIMS层上的DLC层或优选含金属的DLC层)可以有利地用上述的主从构造制备。
主从构造可以借助图1和2更好地解释。
附图说明
图1显示了具有电绝缘的靶q1、q2、q3、q4、q5和q6的构造，这些靶分别具有可移动的磁体系，其中功率输出单元由多个发电机g1、g2、g3、g4、g5和g6构成，它们以主从构造的形式相连。
图2显示了具有电绝缘的靶q1、q2、q3、q4、q5和q6的构造，这些靶分别具有可移动的磁体系，其中功率输出单元由多个发电机g1、g2、g3、g4、g5和g6构成，它们没有以主从构造的形式相连。
具体实施方式
为了更好地理解用于制备这类层的主从构造的优点，下面示例性地描述涂覆具有由以下五个层构成的涂层的螺纹钻头的方法：1)(AI，Cr)N、2)CrN、3)CrCN、4)Cr-DLC和5)DLC。其中：
1)借助HIPIMS方法沉积的由(AI，Cr)N构成的功能层，
2)和3)借助HIPIMS方法或借助传统的溅射(以后也称为MS，其源自英文名称Magnetron Sputtering)或部分借助HIPIMS方法和部分借助MS沉积的由CrN构成的中间层和由CrCN构成的中间层，
4)借助MS方法和PACVD方法(PACVD源自英文名称Plasma Assisted ChemicalVapour Deposition treatment)的组合或借助HIPIMS方法和PACVD方法的组合或部分借助HIPIMS/PACVD方法和部分借助MS/PACVD方法沉积的由Cr掺杂的DLC构成的滑动层，以及
5)借助PACVD方法沉积的由DLC构成的最终层(Einlaufschicht)。
在涂覆室(真空室)中相互电绝缘地设置四个Al靶和两个Cr靶，并且在涂覆过程中通过以主从单元形式构造的效率输出单元供给。也可以使用具有特定组成的Al/Cr靶，以便实现所希望的层组成。这些层例如可以以熔体冶金或粉末冶金的形式制备。
主从构造是指两个或多个发电机的输出端的平行联接，其中选择待设定的所述发电机之一(主机)的功率，并且电学连接其它发电机而使它们跟随主机的设定。优选地，在主从构造中联接至少与单个电绝缘靶相同数量的发电机(参见图1和2)。
首先清洁螺纹钻头，和/或根据需要预处理待涂覆的表面。然后，将螺纹钻头布置在用于真空室涂覆的相应的基材支架中。在真空室中抽真空之后，对螺纹钻头实施加热工序和浸蚀工序。为了沉积HIPIMS(AI，Cr)N层，随后使涂覆室充满氩气和氮气的混合气体。选择相应的气流来调节所希望的氩气与氮气的浓度比例以及所希望的总压力。为了达到对于HIPIMS方法典型的提高的离子化程度，将通过联接产生的提高的功率传递给每个靶，但是只能持续对于每个靶的冷却所允许的时间(以便避免靶的熔化或燃烧)。按照顺序关闭和断开所述靶。之后决不能同时地对所有的分靶施加在主从构造中的功率输出单元的全部功率(参加图1)。以这种方式，可以在HIPIMS沉积中使用更便宜的发电机。只要(AI，Cr)N层达到所希望的层厚度，则沉积CrN中间层。为此，分解主从构造，并因此对每个靶提供相应的发电机(图2)。以这种方式实现了，当需要时从高度离子化的溅射(HIPIMS)向传统的溅射简单并快速地切换，反之亦然(借助如在图1和2中示例性所示的开关S1、S2、S3、S4、S5和S6)。对于借助传统的溅射沉积CrN中间层，仅需要打开两个Cr靶。在这种情况下，由每个相应的发电机不间断地提供每个Cr靶的功率，直到达到所希望的CrN中间层的厚度。在沉积CrN层之前和/或之中可以任意地调节工艺中的氮浓度以及总压力，以便达到所希望的层性能。对于沉积CrCN，可以向涂覆室中输入含碳的反应性气体，并调节其它工艺气体和反应性气体的流量。在沉积CrN层之前和/或之中也可以任意地调节工艺气体和反应性气体的浓度以及Cr靶的功率，以便达到所希望的层性能。优选地，降低氮气的浓度和Cr靶的溅射功率，直到达到对于沉积Cr-DLC层合适的工艺条件，并且调节对于实施PACVD方法合适的基材偏压。在Cr-DLC层也达到所希望的厚度之后，沉积DLC。对于沉积DLC最终层，不连贯地或逐渐地关闭Cr靶，直到在该层中不出现Cr；如果必要，调节工艺气体和反应性气体的浓度以及室中的压力和基材上的偏压，以便达到所希望的层性能。
优选在沉积每层时，在基材上施加合适的偏压，该偏压在沉积每层时可以任意调节。
根据本发明的涂层和涂覆方法特别是对于提高微型钻头的切削效率是有利的，因为尤其是对于涂覆微型钻头需要的是具有高硬度的层，该层还同时具有好的滑动性能和尤其是具有非常低的粗糙度，以避免在切削边缘的喷溅。此外，在微型钻头的情况下，由于非常小的尺寸，实施后处理以降低层的粗糙度是特别繁琐、昂贵和困难的；因此更有利的是，可以使用本发明的涂层以带来与ARC层相当的切削效率，而同时又具有MS层的低粗糙度。此外，相比于ARC层，根据本发明的HIPIMS层更适合于涂覆微型钻头，因为HIMPIMS层的沉积速率可以调节地如此低，从而实现任意非常薄的层厚度和高的准确性(例如纳米级的层厚度)，这基于微型钻头非常小的尺寸是非常有利的。
应用主从HIPIMS技术的另一特别的优点在于，可以任意地和容易地调节涂覆过程中的脉冲长度和脉冲功率，这可以沉积具有特别是提高的质量和根据需要任选合适的层性能，或者具有合适的层结构和/或层形态的HIPIMS层。

Claims (14)

1.制备钻头、优选螺纹钻头或微型钻头的方法，所述钻头具有至少在该钻头的钻尖上或任选在该螺纹钻头的切槽上形成的涂层，并且该涂层具有至少一层优选直接在所述钻头的钻体上施涂的HIPIMS层，其中，所述HIPIMS层包含至少一层由至少一种金属元素的至少一种氮化物和/或碳化物和/或氧化物构成的层，且在所述HIPIMS层上配置有至少一层DLC层，优选含金属的DLC层，
其特征在于
-所述至少一层HIPIMS层借助HIPIMS沉积在含工艺气体和反应性气体的气氛中由含金属的靶优选直接施涂在所述钻头的待涂覆表面上，其中在所述HIPIMS沉积中电压源以主从构造形式工作，和-所述至少一层DLC层借助其它类型的涂覆方法，优选借助传统的溅射和/或PACVD方法和/或组合的MS/PACVD方法施涂在所述至吵一层HIPIMS层上。
2.根据权利要求1的方法，其特征在于，所述HIPIMS层以使其也含有氧化物的方式沉积而成，和/或所述DLC层以含金属的DLC形式沉积而成。
3.根据权利要求1至2之一的方法，其特征在于，所述HIPIMS层由具有选自铬、钛、铝和钨的金属中的至少一种，更优选两种的靶沉积而成，优选所述HIPIMS层以(Al，Cr)N层或含(Al，Cr)N的层的形式沉积而成。
4.根据权利要求2至3之一的方法，其特征在于，为沉积含金属的DLC层而使用组合的溅射-PACVD方法，其中在含碳气氛中溅射含金属的靶，并且调节对于实施PACVD方法合适的待涂覆钻头偏压，且用于沉积所述含金属的DLC层的金属与在所述HIPIMS层中的一种金属优选相一致。
5.根据权利要求2至4之一的方法，其特征在于，如此沉积所述含金属的DLC层，以使在所述DLC层中的金属含量向表面方向呈梯度式地减少，并且优选将不含金属的DLC最终层作为覆盖层施涂在所述含金属的DLC层上。
6.根据权利要求1至5之一的方法，其特征在于，调节HIPIMS过程中的脉冲长度和脉冲功率，以产生所需的层结构或层形态。
7.根据权利要求4至6之一的方法，其特征在于，
-使用AlCr靶沉积所述HIPIMS层，以制备由(Al，Cr)N构成或含有(Al，Cr)N的HIPIMS层，其中优选铝和铬的浓度以原子百分比表示为约70Al比30Cr，以及
-使用Cr靶沉积所述含金属的DLC层，以制备含有铬的DLC层，以及
-在所述HIPIMS层和所述含金属的DLC层之间沉积至少一个中间层，更优选至少两个中间层，优选第一和/或第二中间层由CrN和/或CrCN构成，以及
-优选将不含金属的DLC最终层作为覆盖层施涂在所述含金属的DLC层上。
8.根据权利要求1至7之一的方法，其特征在于，所述HIPIMS层包含选自铬、钛、铝和钨的金属中的至少一种，更优选两种。
9.根据权利要求8的方法，其特征在于，所述HIPIMS层是(Al，Cr)N层。
10.根据权利要求1至9之一的方法，其特征在于，在所述含金属的DLC层中的至少一种金属元素与在所述HIPIIMS层中的一种金属元素相一致。
11.根据权利要求10的方法，其特征在于，在所述HIPIMS层和所述含金属的DLC层之间沉积至少一个含氮和碳的层，该层的氮含量向表面方向呈梯度式地减少。
12.根据权利要求9至11之一的方法，其特征在于，在所述DLC层中的金属含量向表面方向呈梯度式地减少。
13.根据权利要求1至12之一的方法，其特征在于，所述层的总厚度为0.1-10μm。
14.根据权利要求1至13之一的方法，其特征在于，所述钻头为微型钻头，并且所述涂层的总厚度优选为0.01-5μm。
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