CN108990187A - A kind of radiator that graphene is thermally conductive - Google Patents
A kind of radiator that graphene is thermally conductive Download PDFInfo
- Publication number
- CN108990187A CN108990187A CN201810906903.4A CN201810906903A CN108990187A CN 108990187 A CN108990187 A CN 108990187A CN 201810906903 A CN201810906903 A CN 201810906903A CN 108990187 A CN108990187 A CN 108990187A
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- Prior art keywords
- layer
- graphene
- thermally conductive
- fever tablet
- radiator
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 122
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 110
- 206010037660 Pyrexia Diseases 0.000 claims abstract description 50
- 239000002131 composite material Substances 0.000 claims abstract description 43
- 239000004575 stone Substances 0.000 claims abstract description 26
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 13
- 239000010439 graphite Substances 0.000 claims abstract description 13
- 238000010438 heat treatment Methods 0.000 claims description 16
- 239000000956 alloy Substances 0.000 claims description 15
- 229910045601 alloy Inorganic materials 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical group [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000395 magnesium oxide Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910002114 biscuit porcelain Inorganic materials 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 2
- -1 graphite Alkene Chemical class 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000005855 radiation Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 92
- 239000002245 particle Substances 0.000 description 5
- 150000001336 alkenes Chemical class 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 210000004209 hair Anatomy 0.000 description 3
- 238000003486 chemical etching Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Carbon And Carbon Compounds (AREA)
Abstract
The thermally conductive radiator of graphene provided by the invention includes fever tablet and graphene composite layer, wherein fever tablet energization heat, and graphene composite layer has excellent heat dissipation performance, can distribute the heat that fever tablet generates.The fever tablet and the graphene composite layer are arranged alternately and are connected in series.The graphene composite layer includes the first graphene layer, the second graphene layer and porous stone layer of ink, porous stone layer of ink is between first graphene layer and the second graphene layer, the fever tablet of first graphene layer and the second graphene layer respectively with graphene composite layer two sides fits closely, and heat conduction efficiency is high；And porous stone layer of ink is between first graphene layer and the second graphene layer, and porous graphite, which has, to be interconnected and open hole, and make porous stone layer of ink that there is high specific surface area, thus there is good pyroconductivity.Graphene heat conduction radiator structure heat conduction and heat radiation of the invention is fast, easy to manufacture, at low cost, and working service is convenient.
Description
Technical field
The invention belongs to graphene heat sink technology fields, and in particular to a kind of radiator that graphene is thermally conductive.
Background technique
Graphene is a kind of ultralight, ultra-thin, superpower and extra specific surface area quasi- two-dimensional material, surface density about 0.77mg/
m2, the thickness of single-layer graphene about 0.34nm, the toughness of graphene is fabulous, elasticity modulus 1.0TPa, and microstrength is reachable
30GPa is more than 100 times of tradition just now, theoretical specific surface area 2630m2/ g, and there is very high conductive, heating conduction,
Horizontal thermal conductivity is about 5 × 10 at room temperature3W/mK, therefore be applied to radiator field, it is excellent thermally conductive using its
Performance reaches good heat dissipation effect.Existing graphene radiator is mostly by coating graphene coated on radiating fin
Graphene thermal dispersant coatings are formed, to realize heat dissipation.But the preparation process of graphite ene coatings is relative complex, and time-consuming, and coating
Used in binder etc. will affect the heat dissipation performance of graphene.And in the prior art not by the high-termal conductivity of graphene and hair
Thermal element, which combines, makes it be applied to fever field, such as baking oven.
Summary of the invention
Based on the above prior art, the purpose of the present invention is to provide a kind of radiator that graphene is thermally conductive, by by stone
Black alkene composite layer is combined with heat generating member, using the compound high-cooling property of graphene, can be used in fever field.
In order to achieve the goal above, the technical solution adopted by the present invention are as follows: a kind of radiator that graphene is thermally conductive, including hair
Backing and graphene composite layer, the quantity of the fever tablet are multiple, the quantity and the fever tablet of the graphene composite layer
Quantity it is corresponding consistent, and the fever tablet and the graphene composite layer are arranged alternately and connect；The graphene composite layer
Structure include the first graphene layer, the second graphene layer and porous stone layer of ink, the porous stone layer of ink is located at first stone
Between black alkene layer and second graphene layer.
Further, the fever tablet is mutually binded with the graphene composite layer by heat conductive silica gel.
Further, the graphene composite layer with a thickness of 2-10mm.
Further, the fever tablet be sheet metal, and the material of the sheet metal be metallic copper, metallic aluminium, metallic iron,
The alloy material of one or more of metallic silver.
Further, the fever tablet includes metal sleeve, heating alloy, and the wherein heating alloy is fever
Body, heating alloy are located in metal sleeve, and heating alloy both ends are equipped with the lead-out wire to conduct electricity very well.
Further, insulating layer is provided on the fever tablet outer wall.
Further, the insulating layer is the thermally conductive circular layer of double hyer insulation, and the thermally conductive circular layer of double hyer insulation includes internal layer
And outer layer, the internal layer are magnesia bisque, the outer layer is highly dense thermally conductive insulating layer.
Further, the porous stone layer of ink is stacked by graphite particle and is formed.
A kind of baking oven, including the thermally conductive radiator of graphene described in any of the above-described technical solution.
Compared with prior art, the invention has the advantages that:
The thermally conductive radiator of graphene provided by the invention includes fever tablet and graphene composite layer, and wherein fever tablet is powered
Heat, and graphene composite layer has excellent heat dissipation performance, can distribute the heat that fever tablet generates.The fever
The quantity of piece be it is multiple, the quantity of the graphene composite layer it is corresponding with the quantity of the fever tablet unanimously, the fever tablet with
The graphene composite layer is arranged alternately and is connected in series, i.e., the described graphene composite layer be located in two fever tablets it
Between, the heat for enabling the fever tablet to generate all efficiently is distributed by graphene composite layer.The graphene is compound
Layer include the first graphene layer, the second graphene layer and porous stone layer of ink, porous stone layer of ink be located at first graphene layer with
Between second graphene layer, the first graphene layer and the second graphene layer fever tablet with graphene composite layer two sides respectively
It fits closely, heat conduction efficiency is high；And porous stone layer of ink is between first graphene layer and the second graphene layer, it is porous
Graphite has low-density, fire resisting, low thermal coefficient of expansion and an excellent properties such as resistant to chemical etching, and because with interconnecting and open
Property hole, make porous stone layer of ink have high specific surface area, thus have good pyroconductivity.Specifically, of the invention
The porosity of porous stone layer of ink is 60%, also has certain physical strength on the basis of with excellent pyroconductivity.
Graphene heat conduction radiator smart structural design of the invention, heat conduction and heat radiation is fast, easy to manufacture, at low cost, is suitble to
Large-scale production, and working service is convenient.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with specific embodiment, it is clear that described
Embodiment be a part of the embodiment of the present invention, instead of all the embodiments.
Based on the embodiments of the present invention, those of ordinary skill in the art are obtained without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also can be indirectly connected through an intermediary
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in invention.
The embodiment provides a kind of radiator that graphene is thermally conductive, including fever tablet and graphene composite layer,
The quantity of the fever tablet be it is multiple, the quantity of the graphene composite layer is corresponding with the quantity of the fever tablet unanimously, and institute
It states fever tablet and the graphene composite layer is arranged alternately and connects；The structure of the graphene composite layer includes the first graphene
Layer, the second graphene layer and porous stone layer of ink, the porous stone layer of ink are located at first graphene layer and second graphite
Between alkene layer.
The thermally conductive radiator of the graphene that the embodiment of the present invention provides includes fever tablet and graphene composite layer, wherein sending out
Backing energization heat, and graphene composite layer has excellent heat dissipation performance, can distribute the heat that fever tablet generates.
The quantity of the fever tablet be it is multiple, the quantity of the graphene composite layer it is corresponding with the quantity of the fever tablet unanimously, it is described
Fever tablet and the graphene composite layer are arranged alternately and are connected in series, i.e., the described graphene composite layer is located in two hairs
Between backing, the heat for enabling the fever tablet to generate all efficiently is distributed by graphene composite layer.
Specifically, the graphene composite layer includes the first graphene layer, the second graphene layer and porous stone layer of ink, porous
Graphite linings between first graphene layer and the second graphene layer, the first graphene layer and the second graphene layer respectively with
The fever tablet of graphene composite layer two sides fits closely, and heat conduction efficiency is high；And porous stone layer of ink is located at first stone
Between black alkene layer and the second graphene layer, porous graphite has low-density, fire resisting, low thermal coefficient of expansion and resistant to chemical etching etc. excellent
It is anisotropic can, and interconnected and open hole because having, make porous stone layer of ink that there is high specific surface area, thus with good
Good pyroconductivity.Specifically, the porosity of porous stone layer of ink of the invention is 60%, on the basis with excellent pyroconductivity
On also have certain physical strength.
In one embodiment of the invention, it is preferable that the fever tablet and the graphene composite layer pass through thermal conductive silicon
Glue mutually binds.
In this embodiment, the fever tablet is mutually binded with the graphene composite layer by heat conductive silica gel, heat conductive silica gel
Heating conduction is preferable, does not influence the fever tablet and institute while binding the fever tablet mutually with the graphene composite layer
State the heat transfer efficiency between graphene composite layer.
In one embodiment of the invention, it is preferable that the graphene composite layer with a thickness of 2-10mm.
In one embodiment of the invention, it is preferable that the fever tablet is sheet metal, and the material of the sheet metal is
The alloy material of one or more of metallic copper, metallic aluminium, metallic iron, metallic silver.
In one embodiment of the invention, it is preferable that the fever tablet includes metal sleeve, heating alloy, described
Wherein heating alloy is heater, and heating alloy is located in metal sleeve, and heating alloy both ends are equipped with and conduct electricity very well
Lead-out wire.
In one embodiment of the invention, it is preferable that be provided with insulating layer on the fever tablet outer wall.
In one embodiment of the invention, it is preferable that the insulating layer is the thermally conductive circular layer of double hyer insulation, the bilayer
Insulating heat-conductive circular layer includes internal layer and outer layer, and the internal layer is magnesia bisque, and the outer layer is highly dense thermally conductive insulating layer, is passed through
Increase a high-density and high-temperature-resistant in the outside of basic insulation magnesia powder and there is the insulation material layer of Thermal conductivity,
Will not be permeable so that the insulating materials leakproofness is fabulous, it is suitble to electric heater etc. for heating the environment of liquid, safety is high.
In one embodiment of the invention, it is preferable that the porous stone layer of ink is stacked by graphite particle and formed, specifically
Ground, the preparation process of porous stone layer of ink include: step 1: being granulated, combine an adhesive agent to be granulated a graphite powder, to obtain
The graphite particle of multiple greater particle sizes；Step 2: molding:, these graphite particles are shaped to a green compact；Step 3: heat treatment adds
It is cooled down after hot green compact a to set temperature, obtains the porosity graphite.
The embodiments of the present invention also provide a kind of baking oven, dissipate including graphene described in any of the above-described embodiment is thermally conductive
Hot device.
In this embodiment, since the baking oven includes the graphene heat conduction radiator, graphene heat conduction radiator
In the baking oven, the heater energization heat of graphene heat conduction radiator, and radiate out by graphene composite layer, from
And play the role of baking.
Finally, it should be noted that the foregoing is only a preferred embodiment of the present invention, it is not intended to restrict the invention,
Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art, still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features.
All within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in of the invention
Within protection scope.
Claims (9)
1. a kind of radiator that graphene is thermally conductive, including fever tablet and graphene composite layer, which is characterized in that the fever tablet
Quantity be it is multiple, the quantity of the graphene composite layer is corresponding with the quantity of the fever tablet unanimously, and the fever tablet and institute
Graphene composite layer is stated to be arranged alternately and connect；The structure of the graphene composite layer includes the first graphene layer, the second graphite
Alkene layer and porous stone layer of ink, the porous stone layer of ink is between first graphene layer and second graphene layer.
2. the thermally conductive radiator of graphene according to claim 1, which is characterized in that the fever tablet and the graphene
Composite layer is mutually binded by heat conductive silica gel.
3. the thermally conductive radiator of graphene according to claim 1, which is characterized in that the thickness of the graphene composite layer
For 2-10mm.
4. the thermally conductive radiator of graphene according to claim 1, which is characterized in that the fever tablet is sheet metal, and
The material of the sheet metal is the alloy material of one or more of metallic copper, metallic aluminium, metallic iron, metallic silver.
5. the thermally conductive radiator of graphene according to claim 1, which is characterized in that the fever tablet includes metallic sheath
Pipe, heating alloy, the wherein heating alloy are heater, and heating alloy is located in metal sleeve, heating alloy
Both ends are equipped with the lead-out wire to conduct electricity very well.
6. the thermally conductive radiator of graphene according to claim 4 or 5, which is characterized in that set on the fever tablet outer wall
It is equipped with insulating layer.
7. the thermally conductive radiator of graphene according to claim 6, which is characterized in that the insulating layer is double hyer insulation
Thermally conductive circular layer, the thermally conductive circular layer of double hyer insulation include internal layer and outer layer, and the internal layer is magnesia bisque, and the outer layer is height
Close thermally conductive insulating layer.
8. the thermally conductive radiator of graphene according to claim 1, which is characterized in that the porous stone layer of ink is by graphite
Grain stacks molding.
9. a kind of baking oven, which is characterized in that including the thermally conductive radiator of the described in any item graphenes of claim 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810906903.4A CN108990187B (en) | 2018-08-10 | 2018-08-10 | Heat radiator with graphene for heat conduction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810906903.4A CN108990187B (en) | 2018-08-10 | 2018-08-10 | Heat radiator with graphene for heat conduction |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108990187A true CN108990187A (en) | 2018-12-11 |
| CN108990187B CN108990187B (en) | 2021-05-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810906903.4A Expired - Fee Related CN108990187B (en) | 2018-08-10 | 2018-08-10 | Heat radiator with graphene for heat conduction |
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| Country | Link |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111526613A (en) * | 2020-05-18 | 2020-08-11 | 无锡格菲电子薄膜科技有限公司 | Copper electrode graphene electrothermal film and preparation method thereof |
| CN113512665A (en) * | 2021-07-14 | 2021-10-19 | 上海铂世光半导体科技有限公司 | Heat dissipation platform of special water course design of alloy material |
| CN113766685A (en) * | 2020-10-15 | 2021-12-07 | 杨应斌 | High-efficiency energy-saving electric heating element |
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| CN108990187B (en) | 2021-05-25 |
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