TW201402514A - Far-infrared heat dissipation ceramic slurry, fiber cloth made from the slurry, film made from the slurry and preparation method thereof - Google Patents

Abstract

This invention provides a far-infrared heat dissipation ceramic slurry, which is made by mixing the ceramic powder precursor and corresponding solvent, the binder, the dispersant or structure modifier. The ceramic powder precursor contains a composition of Na, Mg, Ca, B, Al, C, Si, Sn, Mn, Fe, Co, Ni, and Cu salt or oxide. The slurry is coated on the surface of a substrate or added to a polymeric material, and after heating, it can form a functional ceramic body, which contains a composition or derivative of the feldspar, olivine, cordierite, chlorite, alipite, carvoeila, tremolite, actinolite, serpentine, spinel, or calcite. It has a far-infrared emissivity up to 0.90 to 0.98 and can rapidly convert the thermal energy into the radiation wave for outward propagation so as to rapidly dissipate the heat.

Description

Far-infrared heat-dissipating ceramic slurry, fiber cloth prepared using the same, film prepared using the same, and preparation method thereof

The invention relates to a ceramic slurry, in particular to a slurry having a far-infrared heat-dissipating effect, and a film and a fiber cloth prepared by using the slurry and a method for preparing the film.

With technological innovation, single-function electronic products have been unable to meet user needs, and versatile electronic products have been developed with great continuation, such as game consoles, smart phones, tablets, flat panel displays and digital cameras.

In this multiplexed product type, the placement ratio and performance requirements of various wafers continue to rise, and how the component effectively dissipates heat becomes a very important issue. If heat cannot be effectively transferred to the outside world, it will not only reduce the performance of the components, but also detract from its service life. Here, all kinds of radiators came into being, supplemented by the purpose of effective heat dissipation. It can be known from the prior art that there are three main methods for increasing the heat dissipation efficiency: 1. selection of the heat sink material; 2. geometry of the heat sink; 3. composition applied to the heat sink. Among them, the first and third types use the heat conduction property of the material itself to accelerate the conduction of the heat source, and the purpose of heat dissipation is mainly copper, magnesium, aluminum, titanium alloy or resin. The second type is to change the shape of the heat sink, increase the air contact area, and achieve the purpose of heat dissipation by convection. It is often used in a porous or columnar manner.

In the three types of related research, the main emphasis is on the development of materials with higher thermal conductivity coefficient in the first category, such as aluminum-zinc alloy (Chinese Invention Patent No. 102330003), carbon nanomaterials (Chinese invention patent announcement) No. 101520685, etc.; the second type is a shape in which a plurality of stacked semicircular heat sinks (Chinese Utility Model Patent No. 1752892) or long radial metal (Chinese Utility Model Patent No. 1773695) To increase the air contact area; Class 3 to develop coating materials with high thermal conductivity, such as heat-dissipating magnesium oxide coatings (Chinese Invention Patent No. 102471082), oxime ester compositions (Chinese Invention Patent No. 1626598) ), an aqueous polyurethane resin composition such as polyethylene glycol or a polyether-oxyalkylene copolymer (Taiwan Invention Patent No. I343935).

In view of the demand for heat dissipation efficiency, the prior art only focuses on heat conduction and convection, ignoring the effect of radiation heat dissipation. Compared with conduction and convection, omnidirectional radiation heat dissipation is a method for significantly improving heat dissipation efficiency. According to the book "Introduction to the Thermodynamics of Materials" by DR Gaskell, "The radiation is generated by the change of the electromagnetic field from the vibration between atoms. Without any medium, it can be directly transmitted by electromagnetic waves. Any object can be Radiation absorbs or releases heat." According to the Stefan-Boltzmann equation, the heat transfer through the radiation in the heat transfer mechanism can be expressed by the following equation:

Qr=A ε ₁ σ (T ₁ ⁴ -T ₂ ⁴ ),

Qr: radiant heat transfer (W);

A: the transmission area of radiation (m ² );

ε ₁ : emissivity of the heat sink (or electronic component), perfect blackbody emissivity is 1.00;

σ: constant (5.675 × 10 ^-8 W/m ² K ⁴ );

T ₁ : radiation surface temperature (K) of the heat sink (or electronic component);

T ₂ : temperature (K) of air in the environment.

It can be known from the above equation that the radiant heat transfer is affected by the radiation emissivity of the material, and the general heat sink is usually made of aluminum or aluminum alloy, and the radiation emissivity of aluminum is about 0.05, so it is radiated into the air. The heat transfer is relatively low, so aluminum or aluminum alloy cannot effectively and quickly radiate heat to the air in the natural convection heat dissipation environment. Although the prior art Taiwan invention patent No. I232878 "Composition and application of heat radiation heat dissipation function" reveals that vermiculite clay, vermiculite, tubular high territory, sericite or mica have a powder material having a thermal radiation emissivity of more than 0.8. , blending 10-30% of the binder (such as thermoplastic polymer resin) into a heat-dissipating coating, coated on the heat-dissipating plate, can achieve the heat-dissipating effect, but it does not explain the radiation heat-dissipating composition and mechanism, and does not consider the radiation conversion efficiency And the correlation between the material structure and the particle size of the powder, it is impossible to produce a better radiation conversion efficiency material.

Another prior art Taiwan new patent No. M384406 "Nano ceramic heat sink structure" also reveals that tantalum nitride, tantalum carbide, aluminum oxide and zirconia itself can also radiate heat to the air by means of radiation conduction in addition to good thermal conductivity. In addition to the ceramic powder, the film also adds metal carbon material to increase the thermal conductivity of the film, and relatively reduce the content ratio of the ceramic powder, so that the contact area of the radiation heat source with the external environment is reduced, and the heat dissipation efficiency is reduced.

There is also a prior art Chinese Patent Publication No. 102263072 "Heat Radiation Heat Dissipating Film Structure and Method of Fabricating the Same", which discloses that the heat radiation heat dissipating film comprises a metal or non-metal composition which is thermally irradiated toward the substrate. The direction of heat propagation to achieve the purpose of heat dissipation, but does not clearly define the composition and composition range of the film, nor does it mention the example of high-efficiency heat dissipation, and the variety of metal and non-metal compositions cannot be made by those skilled in the art. The specific implementation is in violation of the requirements of the patent. The following is a brief description of the missing:

1. The metal composition comprises at least one of silver, copper, tin, aluminum, titanium, iron and bismuth or alloy. The far-infrared emissivity of common metals and alloys is not high, about 0.02-0.3, high efficiency heat dissipation capability. It is difficult to achieve it.

2. The difference between the thermal expansion coefficient of the heat radiation film and the substrate is not more than 0.1%. The thermal expansion coefficients of the alumina and yttria substrates are 6.4×10 ^-6 / ^o C and 2.6×10 ^-6 / ^o C, respectively. If the difference ratio is not more than 0.1%, the thermal radiation coefficient of the heat radiation film matched with the substrate should be (6.4±0.0064)×10 ^-6 / ^o C and (2.6±0.0026)×10 ^-6 / ^{o, respectively.} C, there are indeed difficulties in implementation.

3. The heat radiation heat-dissipating film is heat-transferred in the direction of the substrate, which is contrary to the common sense in the technical field, because an electric insulating substrate is added to the heat radiation heat-dissipating film, so that the heat radiation is shielded by the substrate. It cannot be smoothly transmitted to the outside world, resulting in the accumulation of heat energy and the inability to effectively dissipate heat.

The main object of the present invention is to solve the above-mentioned shortcomings. To achieve the above object, the present invention provides a far-infrared heat-dissipating ceramic slurry prepared with high emissivity, and a composite structure is used to produce a far-infrared heat-dissipating ceramic body with excellent heat dissipation efficiency.

The far-infrared heat-dissipating ceramic slurry of the present invention contains at least one or more salts or oxides of Na, Mg, Ca, B, Al, C, Si, Sn, Mn, Fe, Co, Ni, and Cu. The ceramic powder precursor is composed of corresponding deionized water, methanol, formic acid, ethanol, acetone, acetic acid, hydrochloric acid, sulfuric acid, sodium hydroxide or ammonia water, and methyl cellulose, carboxypropyl methyl cellulose, poly a binder of vinyl alcohol, polyvinyl butyral, phenolic resin, epoxy resin or water glass, with toluene, n-hexane, butylene oxide, dimethylformamide, methyl acetate, n-propanol or a dispersing agent for methanolic ester, or MgCl ₂ ‧6H ₂ O, CaCl ₂ ‧6H ₂ O, SnCl ₂ ‧2H ₂ O, H ₃ BO ₃ , Na ₂ B ₄ O ₅ (OH ₄ )‧8H ₂ O or Na ₂ SiO ₃ ‧9H ₂ O structural modifier is mixed.

The far-infrared heat-dissipating ceramic film of the present invention is formed by using a far-infrared heat-dissipating ceramic slurry to form a material having far-infrared radiation characteristics, and is structurally modified to adjust the ceramic structure, changing its far-infrared radioactivity, thermal expansion coefficient, Thermal conductivity, wear resistance and heat resistance, in order to provide heat-generating bodies such as LED lamps, engines, motors, transformers, power supplies or human bodies, which radiate heat to the outside in the form of heat radiation for rapid heat dissipation. The far-infrared heat-dissipating ceramic film is made by using a far-infrared heat-dissipating ceramic slurry, coated on a transfer surface of a specific temperature substrate, and heated and dried, and the far-infrared emissivity can reach 0.90 to 0.98.

The far-infrared heat-dissipating fiber cloth of the present invention is a salt or an oxide of Na, Mg, Ca, B, Al, C, Si, Sn, Mn, Fe, Co, Ni, Cu, and is combined to form a far-infrared radiation. a substance of a characteristic, mixed with a corresponding solvent, binder, dispersant or structural modifier into a slurry or solution, formed into a ceramic powder by spray granulation, ground to a particle size of less than 10 mm, mixed with polyester powder (polyester powders) In the middle, after melting and polymerizing into far-infrared polyester particles, and then making the far-infrared processing wire with a false twisting machine, the far-infrared fiber cloth is made by the traditional weaving method, and finally cut into various forms with rapid heat dissipation effect. Clothing.

In summary, the present invention has the following advantages and effects:

1. The invention can be applied to any material that needs to dissipate heat, and is not limited to materials, such as metal, ceramic or polymer materials, and can be converted into far-infrared radiation waves to be transmitted to the outside after being matched with the radiation-dissipating ceramic film. Achieve rapid heat dissipation.

2. The composition material of the invention is easy to obtain, and the common mineral base is only added with common transition elements, the overall material cost is low, and the market is highly competitive.

3. The film of the present invention not only has the characteristics of high radiation emissivity, but also has insulation, high temperature stability and good chemical stability, and does not generate toxic substances or gases.

4. The structure of the invention is simple, and the shape is not limited, such as a shape such as a flat plate, a wave or a honeycomb, which is easy to process, thereby effectively enhancing product value and competitiveness.

First, referring to Fig. 1, there is shown a flow chart for producing a far-infrared ceramic slurry of the present invention and preparing a film using the same. The invention utilizes a far-infrared ceramic powder precursor and a corresponding solvent, a binder, a dispersing agent or a structural modifier to form a slurry, wherein the far-infrared ceramic powder precursor is Na, Mg, Ca, B, Al. Salts or oxides of C, Si, Sn, Mn, Fe, Co, Ni, Cu, such as mullite, SiO ₂ , SiCl ₄ , Al ₂ O ₃ , AlCl ₃ , MnCl ₂ , MnO ₂ , FeCl ₃ , Fe ₂ O ₃ , CoCl ₂ ‧6H ₂ O, CoO, NiCl ₂ ‧6H ₂ O, NiO, NiCO ₃ , CuCl ₂ , CuO, MgCl ₂ ‧6H ₂ O, CaCl ₂ ‧6H ₂ O, SnCl ₂ ‧2H ₂ O, H ₃ BO ₃ , Na ₂ B ₄ O ₅ (OH ₄ )‧8H ₂ O or Na ₂ SiO ₃ ‧9H ₂ O at least one of them to form a substance having far-infrared radiation characteristics; and the corresponding solvent Including: deionized water, methanol, formic acid, ethanol, acetone, acetic acid, hydrochloric acid, sulfuric acid, sodium hydroxide or ammonia; the corresponding binders include methyl cellulose, carboxypropyl methyl cellulose One of polyvinyl alcohol, polyvinyl butyral, phenolic resin, epoxy resin or water glass, the weight percentage being less than 5%; the corresponding dispersing agent includes Benzene, n-hexane, butylene oxide, dimethylformamide, methyl acetate, methanol and n-propanol or one of the resin; and is _{MgCl 2 ‧6H 2 O, CaCl 2} ‧6H 2 O, SnCl 2 ‧2H ₂ O, H ₃ BO ₃ , Na ₂ B ₄ O ₅ (OH ₄ )‧8H ₂ O or Na ₂ SiO ₃ ‧9H ₂ O is a structural modifier, which adjusts the ceramic structure and changes the far-infrared radioactivity of the ceramic , thermal expansion coefficient, thermal conductivity, wear resistance and heat resistance.

Then, the mixed slurry is coated on the transfer surface of a substrate, and the material of the substrate may be a metal, a ceramic or a polymer material having a high heat transfer coefficient, and the metal may be an aluminum alloy. , Cu alloy, Al-Zn alloy, Zn-Cu alloy, Ni-P-Co alloy, tin-zinc-cobalt Alloy (Sn-Zn-Co alloy), etc.; the ceramic may be alumina (Al ₂ O ₃ ), aluminum nitride (AlN), tantalum carbide (SiC), tantalum nitride (SiN) or zirconium oxide (ZrO ₂ ) Etc.; the polymer material may be rayon, cotton, polyester or spandex; and the slurry is heated and dried to form a film having At least one or more compositions or derivatives of feldspar, olivine, cordierite, chlorite, chlorite, tourmaline, tremolite, actinolite, serpentine, spinel or calcite structure, The far-infrared emissivity of the film reaches 0.90~0.98, which can quickly convert thermal energy into far-infrared radiation wave to the outside to achieve rapid heat dissipation.

Hereinafter, the constituent parts of the present invention and the film prepared using the same and a method for preparing the same will be described in detail by way of examples.

[Example 1]
Alumina silicate mullite 3Al ₂ O ₃ ‧2SiO ₂ (20-40%) is uniformly mixed with NiCO ₃ (≦10%) and Fe ₂ O ₃ (≦10%), after 200-800 ^o C Add graphite (20-40%), MgCl ₂ ‧6H ₂ O (30-50%), CaCl ₂ ‧6H ₂ O (20-40%) and Na ₂ SiO ₃ ‧9H ₂ O (10-20%) The homogenization heat treatment is carried out for 1 hour, and then sintered to a ceramic powder precursor of bismuth salt at a high temperature of 1200-1400 ^o C. After a constant temperature of about 6 hours, the powder is ground to a micron-scale fineness for use. The ceramic powder precursor, deionized water, methyl cellulose and n-hexane are mixed and stirred into a slurry in a ratio of weight percentage (20-24): 64: (2-3): (9-14).

The slurry is further coated on the transfer surface of a substrate, and then the slurry is dried to form a film having a far infrared radiation function. Referring to Figure 2, the X-ray diffractometer is used to analyze the composition of the film as calcite, Anorthite and Alipite and Cordierite. They are CaCO ₃ , DAlSi ₃ O ₈ , T ₆ [Si ₄ O ₁₀ ](OH) ₈ and Mg ₂ Al ₄ Si ₅ O ₁₈ , where D=Na, Ca; T=Mg, Fe, Ni. Using Fourier transform infrared spectroscopy equivalent blackbody at a temperature of far infrared radiation intensity of 55 ^o C, obtaining the average may be far infrared radiation rate of 0.93 (1.00 perfect blackbody).

[Example 2]
Transition metal salts in different proportions, such as MnCl ₂ (20-40%), FeCl ₃ (20-40%), CoCl ₂ ‧6H ₂ O (≦10%), NiCl ₂ ‧6H ₂ O (≦10%) After uniformly mixing CuCl ₂ (10-20%), it is sintered into a salt-based ceramic powder precursor at a high temperature of 1000-1400 ^o C, and after a constant temperature for about 8 hours, the powder is ground to a micron-scale fineness for use. The ceramic powder precursor, ethanol, polyvinyl butyral, and butylene oxide are mixed and stirred in a ratio of weight percentage (15-19): 73: (3-4): (4-9) to form a slurry.

The slurry is further coated on the transfer surface of a substrate, and then the slurry is dried to form a film having a far infrared radiation function. Referring to Figure 2, the X-ray diffractometer is used to analyze the structure of the film as spinel. The composition of the compound is AB ₂ O ₄ , where A = Cu, Co, Ni, Mn or Fe. ; B = Cu, Co, Ni, Mn or Fe. The Fourier transform infrared spectroscopy was used to analyze the equivalent blackbody at a temperature of 55 ^o C, and the far-infrared radiation intensity averaged the emissivity to 0.93 (perfect blackbody was 1.00).

[Example 3]
Salts of Na, Mg, Ca, Al, Cu, Fe or B in different proportions, such as AlCl ₃ (10-30%), MgCl ₂ ‧6H ₂ O (5-15%), CaCl ₂ ‧6H ₂ O (10-30%), Na ₂ SiO ₃ ‧9H ₂ O (35-65%), CuCl ₂ (≦13%), FeCl ₃ (≦13%) and H ₃ BO ₃ (5-25%) In deionized water and hydrochloric acid, phenolic resin (2%) was added in a weight percentage and uniformly mixed to form a slurry.

Next, a substrate is preheated to about 300-900 ^o C, and the slurry is sprayed on the transfer surface of the substrate, thermally decomposed and sintered into a film having a far-infrared radiation function. Referring to Figure 2, the X-ray diffractometer is used to analyze the composition of the film as a composite structure of Actinolite and Tourmaline. The composition of the film is Ca ₂ E ₅ [Si ₄ O ₁₁ ] ₂ (OH) ₂ and XY ₃ Z ₆ (Si ₆ O ₁₈ )(BO ₃ ) ₃ OH ₄ , where E=Mg, Fe; X=Na, Mg, Ca or vacancy; Y=Cu, Fe, Al or vacancy; Z = Al or Fe. When the equivalent blackbody temperature is 55 ^o C by Fourier transform infrared spectroscopy, the far-infrared emissivity of the far-infrared radiation intensity is 0.96 (the perfect blackbody is 1.00).

[Embodiment 4]
Take MnCl ₂ (20-40%), CoCl ₂ ‧6H ₂ O (≦10%), NiCl ₂ ‧6H ₂ O (≦10%), FeCl ₃ (20-40%) and CuCl ₂ (10-20%) After uniform mixing, the first ceramic powder precursor is formed by high temperature sintering and powder grinding; then AlCl ₃ (10-30%), CuCl ₂ (≦13%), MgCl ₂ ‧6H ₂ O (5-15%) ), CaCl ₂ ‧6H ₂ O (10-30%), Na ₂ SiO ₃ ‧9H ₂ O (35-65%), FeCl ₃ (≦13%) and H ₃ BO ₃ (5-25%), respectively Dissolved in deionized water and hydrochloric acid to form a second ceramic powder precursor; the first ceramic powder precursor and the second ceramic powder precursor are uniformly mixed in a ratio of (3-30%): (70-97%) Thereafter, phenolic resin (2-3%) and butylene oxide (3-5%) were separately mixed and stirred into a slurry according to the weight percentage.

Then, a substrate is preheated by about 300-900 ^o C, and then the slurry is sprayed on the transfer surface of the substrate, thermally decomposed and sintered into a film having a far-infrared radiation function. Referring to Figure 2, the X-ray diffractometer is used to analyze the composite structure of the film composed of Actinolite, Tourmaline and Spinel. The composition of the composition is Ca _{2 .} E ₅ [Si ₄ O ₁₁ ] ₂ (OH) ₂ / XY ₃ Z ₆ (Si ₆ O ₁₈ )(BO ₃ ) ₃ OH ₄ / AB ₂ O ₄ , where E=Mg, Fe; X=Na, Mg, Ca or vacancy; Y = Cu, Fe, Al or vacancy; Z = Al or Fe; A = Cu, Co, Ni, Mn or Fe; B = Cu, Co, Ni, Mn or Fe. Referring to FIG. 3 again, when the equivalent blackbody temperature is 55 ^o C by Fourier transform infrared spectroscopy, the far-infrared radiation intensity averaged emissivity of the film formed in this example is as high as 0.98 (perfect black body is 1.00).

[Embodiment 5]
Take MnCl ₂ (20-40%), CoCl ₂ ‧6H ₂ O (≦10%), NiCl ₂ ‧6H ₂ O (≦10%), FeCl ₃ (20-40%) and CuCl ₂ (10-20%) After uniform mixing, the first ceramic powder precursor is formed by high temperature sintering and powder grinding; then AlCl ₃ (10-30%), CuCl ₂ (≦13%), MgCl ₂ ‧6H ₂ O (5-15%) ), CaCl ₂ ‧6H ₂ O (10-30%), Na ₂ SiO ₃ ‧9H ₂ O (35-65%), FeCl ₃ (≦13%) and H ₃ BO ₃ (5-25%), respectively Dissolved in deionized water and hydrochloric acid to form a second ceramic powder precursor; the first ceramic powder precursor and the second ceramic powder precursor are uniformly mixed in a ratio of (3-30%): (70-97%) After that, the ceramic powder is formed by spray granulation, and the particle size is less than 10 mm, and deionized water (70-75%), butylene oxide (3-5%) and phenolic resin are added according to the weight percentage. 3%) uniformly mix and stir to form a slurry, apply the slurry to a preheated alumina substrate, thermally decompose it into a film, and use a 5W LED lamp as a source of heat change, using JESD51-14- Transient dual interface test method for measuring the thermal resistance of a single path to a semiconductor device with a single path" The temperature change per second of the Junction temperature of the lamp and the substrate is calculated, and the heat dissipation coefficient (k) is calculated, and compared with the uncoated alumina substrate and the tantalum carbide substrate, the result shows that the ceramic of the present invention is coated. The heat dissipation coefficient of the film is 0.544; the heat dissipation coefficient of the uncoated alumina plate is 0.2353; the heat dissipation coefficient of the tantalum carbide substrate is 0.4583, which is 130% higher than that of the alumina substrate; compared with the commercially available carbon germanium substrate, Its heat dissipation efficiency is increased by 15%. The heat dissipation coefficient is defined as k=△T/(T _J -T _R )

△T: temperature change

T _J : junction temperature

T _R : ambient temperature

[Embodiment 6]
Take MnCl ₂ (20-40%), CoCl ₂ ‧6H ₂ O (≦10%), NiCl ₂ ‧6H ₂ O (≦10%), FeCl ₃ (20-40%) and CuCl ₂ (10-20%) After uniform mixing, the first ceramic powder precursor is formed by high temperature sintering and powder grinding; then AlCl ₃ (10-30%), CuCl ₂ (≦13%), MgCl ₂ ‧6H ₂ O (5-15%) ), CaCl ₂ ‧6H ₂ O (10-30%), Na ₂ SiO ₃ ‧9H ₂ O (35-65%), FeCl ₃ (≦13%) and H ₃ BO ₃ (5-25%), respectively Dissolved in deionized water and hydrochloric acid to form a second ceramic powder precursor; the first ceramic powder precursor and the second ceramic powder precursor are uniformly mixed in a ratio of (3-30%): (70-97%) Thereafter, phenolic resin (2-3%) and butylene oxide (3-5%) were separately mixed and stirred into a slurry according to the weight percentage. The slurry is coated on a preheated alumina substrate, thermally decomposed into a film, and then a 5W LED lamp is used as a source of heat change, and is used in accordance with JESD51-14-"for measuring a single path heat flow junction The method of measuring the thermal interface to the thermal resistance of the semiconductor device of the outer casing" measures the standard method. The temperature change per second of the junction temperature of the LED lamp and the substrate is recorded, and the heat dissipation coefficient (k) is calculated. The coated alumina substrate was compared with the tantalum carbide substrate, and the results showed that the heat dissipation coefficient of the ceramic film coated with the present invention was 1.234; the heat dissipation coefficient of the uncoated alumina plate was 0.2353; and the heat dissipation coefficient of the tantalum carbide substrate was 0.4583. Compared with the alumina substrate, the heat dissipation efficiency is increased by 420%; compared with the commercially available tantalum carbide substrate, the heat dissipation efficiency is increased by 150%.

Please refer to FIG. 4 , which is a flow chart for preparing a fiber cloth by using the far-infrared heat-dissipating ceramic slurry of the present invention. First, MnCl ₂ (20-40%), CoCl ₂ ‧6H ₂ O (≦10%), After uniformly mixing NiCl ₂ ‧6H ₂ O (≦10%), FeCl ₃ (20-40%) and CuCl ₂ (10-20%), the first ceramic powder precursor is formed by high-temperature sintering and powder grinding; AlCl ₃ (10-30%), CuCl ₂ (≦13%), MgCl ₂ ‧6H ₂ O (5-15%), CaCl ₂ ‧6H ₂ O (10-30%), Na ₂ SiO ₃ ‧9H ₂ O (35-65%), FeCl ₃ (≦13%) and H ₃ BO ₃ (5-25%), respectively dissolved in deionized water and hydrochloric acid to form a second ceramic powder precursor; the first ceramic The powder precursor and the second ceramic powder precursor are uniformly mixed in a ratio of (3-30%): (70-97%), and then formed into a ceramic powder by spray granulation, and ground to a particle diameter of less than 10 mm, in weight percentage 1-2 wt% of the mixture is mixed into polyester powders, and is melted and polymerized into far-infrared polyester pellets by heating at a temperature, and then made into a far-infrared processing yarn by a false twisting machine, and then made by a conventional weaving method. Far-infrared fiber cloth, which has feldspar, olivine, cordierite, green Stone, green magnesium-nickel, tourmaline, tremolite, actinolite, serpentine, calcite spinel or at least one of the one or more structures or, finally cut into various forms of laundry. In order to compare the heat dissipation capability of the far-infrared fiber cloth, the touch feeling of warmth and coolness (Q-max) is measured in accordance with the method of FTTS-FA-019-"Textile Instant Cooling Verification Specification" to simulate human contact. In the case of fabric, the maximum value of instantaneous heat loss on the surface of the skin, that is, the maximum instantaneous heat flux (W/cm ² ) of the fabric, is compared with the fiber cloth without the far-infrared ceramic powder, and the result shows the far-infrared fiber of the present invention. The instant cooling sensation value of the fabric is 0.153 W/cm ² ; the instantaneous cooling sensation value of the fiber fabric without the far-infrared ceramic powder is 0.095 W/cm ² ; therefore, the instant cooling sensation value of the far-infrared fiber fabric of the present invention can be increased by 61%.

Referring to FIG. 5, a comparison diagram of the junction temperature of the far-infrared heat-dissipating ceramic film of the present invention on an alumina substrate and a commercially available tantalum carbide (SiC) substrate and an alumina substrate can be found from FIG. When the particle diameter of the film coated on the alumina substrate is less than 100 nm (such as the first curve 10 in FIG. 5), and the film diameter of the film coated on the alumina substrate of the present invention is less than 10 mm (such as the second curve 20 in FIG. 5), The temperature values of the commercially available tantalum carbide (SiC) substrate (such as the third curve 30 in FIG. 5) and the alumina substrate (such as the fourth curve 40 in FIG. 5) are significantly different, and the film particles coated on the alumina substrate of the present invention are different. When the diameter is less than 100nm, the temperature can be greatly reduced by 40 ^o C, and the heat dissipation efficiency is much higher than that of the commercially available tantalum carbide (SiC) substrate by 150%, and the heat dissipation capability and heat conduction capability and far infrared radiation rate are known from the junction temperature curve. Related, among them, the far-infrared emissivity is the main influencing factor. FIG. 5 is only an example of the radiation heat dissipating film of the present invention, and the features of the present invention are clearly described by comparison with the conventional products, and are not intended to limit the scope of the present invention. The above results show that the present invention is novel and progressive at the same time. And industrial applicability.

However, the above description is only a preferred embodiment of the present invention, and any simple modification made by the skilled person without departing from the technical scope of the present invention can be made without departing from the scope of the present invention. Or equivalent variations are still within the scope of the invention patent.

10. . . First curve

20. . . Second curve

30. . . Third curve

40. . . Fourth curve

Fig. 1 is a flow chart showing the fabrication of the far-infrared heat-dissipating ceramic film of the present invention.

Fig. 2 is an X-ray diffraction pattern of the far-infrared heat-radiating ceramic film of the present invention.

Fig. 3 is a graph showing the infrared radiation intensity of Example 4 of the present invention.

Fig. 4 is a flow chart showing the fabrication of the far-infrared heat-dissipating ceramic fiber cloth of the present invention.

Fig. 5 is a graph comparing the junction temperature of the present invention with a commercially available tantalum carbide and alumina substrate.

no

Claims (15)

A far-infrared heat-dissipating ceramic slurry comprising: a ceramic powder precursor comprising at least a salt or an oxide of Na, Mg, Ca, B, Al, C, Si, Sn, Mn, Fe, Co, Ni, Cu a group consisting of one or more; and a corresponding solvent, binder, dispersant or structural modifier. The far-infrared heat-dissipating ceramic slurry as described in claim 1, wherein the corresponding solvent comprises: deionized water, methanol, formic acid, ethanol, acetone, acetic acid, hydrochloric acid, sulfuric acid, sodium hydroxide or ammonia. Among them. The far-infrared heat-dissipating ceramic slurry as described in claim 2, wherein the binder comprises: methyl cellulose, carboxypropyl methyl cellulose, polyvinyl alcohol, polyvinyl butyral, phenolic resin One of epoxy resin or water glass. The far-infrared heat-dissipating ceramic slurry according to claim 2 or 3, wherein the dispersing agent comprises: toluene, n-hexane, butylene oxide, dimethylformamide, methyl acetate, and n-propyl One of an alcohol or a methanolic ester. The far-infrared heat-dissipating ceramic slurry according to claim 2 or 3, wherein the structural modifier comprises: MgCl ₂ ‧6H ₂ O, CaCl ₂ ‧6H ₂ O, SnCl ₂ ‧2H ₂ O, H ₃ BO ₃ , Na ₂ B ₄ O ₅ (OH ₄ )‧8H ₂ O or one of Na ₂ SiO ₃ ‧9H ₂ O. The far-infrared heat-dissipating ceramic slurry according to claim 4, wherein the structural modifier comprises: MgCl ₂ ‧6H ₂ O, CaCl ₂ ‧6H ₂ O, SnCl ₂ ‧2H ₂ O, H ₃ BO _{3. One} of Na ₂ B ₄ O ₅ (OH ₄ )‧8H ₂ O or Na ₂ SiO ₃ ‧9H ₂ O. The far-infrared heat-dissipating ceramic slurry according to claim 1, wherein 3Al ₂ O ₃ ‧2SiO ₂ (20-40%), NiCO ₃ (≦10%), and Fe ₂ O ₃ (≦10%) After homogeneous mixing, graphite (20-40%), MgCl ₂ ‧6H ₂ O (30-50%), CaCl ₂ ‧6H ₂ O (20-40%) and Na ₂ SiO ₃ ‧9H ₂ O (10- 20%) homogenization heat treatment, high temperature sintering and powder grinding to form ceramic powder precursor; in proportion by weight, ceramic powder precursor: deionized water: methyl cellulose: n-hexane = (20-24) : 64: (2-3): (9-14) A slurry was prepared by mixing and stirring. The far-infrared heat-dissipating ceramic slurry according to claim 1, wherein MnCl ₂ (20-40%), FeCl ₃ (20-40%), CuCl ₂ (10-20%), NiCl ₂ ‧6H _{After 2} O (≦10%) and CoCl ₂ ‧6H ₂ O (≦10%) are uniformly mixed, the ceramic powder precursor is formed by high-temperature sintering and powder grinding; in the proportion by weight, ceramic powder precursor: ethanol: Polyvinyl butyral: butylene oxide = (15-19): 73: (3-4): (4-9) A slurry was prepared by mixing and stirring. The far-infrared heat-dissipating ceramic slurry according to claim 1, wherein AlCl ₃ (10-30%), CaCl ₂ ‧6H ₂ O (10-30%), MgCl ₂ ‧6H ₂ O (5- 15%), CuCl ₂ (≦13%), FeCl ₃ (≦13%), Na ₂ SiO ₃ ‧9H ₂ O (35-65%) and H ₃ BO ₃ (5-25%), respectively Among the ionic water and hydrochloric acid, 2% by weight of phenolic resin was added and stirred to form a slurry. A far-infrared heat-dissipating fiber cloth prepared by using the slurry of claim 1, which comprises MnCl ₂ (20-40%), CoCl ₂ ‧6H ₂ O (≦10%), NiCl ₂ ‧6H ₂ O (≦10%) After uniformly mixing FeCl ₃ (20-40%) and CuCl ₂ (10-20%), the first ceramic powder precursor is formed by high-temperature sintering and powder grinding; then MgCl ₂ ‧6H ₂ O is taken (5-15) %), CaCl ₂ ‧6H ₂ O (10-30%), AlCl ₃ (10-30%), CuCl ₂ (≦13%), FeCl ₃ (≦13%), H ₃ BO ₃ (5-25% And Na ₂ SiO ₃ ‧9H ₂ O (35-65%), respectively dissolved in deionized water and hydrochloric acid to form a second ceramic powder precursor; the first ceramic powder precursor and the second ceramic powder precursor After uniformly mixing in a ratio of (3-30%): (70-97%), the ceramic powder is granulated by spraying, and ground to a particle size of less than 10 mm, and mixed in a ratio of 1-2 wt% by weight. Polyester powders are melted and polymerized into far-infrared polyester pellets by heating at a temperature, and then made into a far-infrared processing yarn by a false twisting machine, and then produced by a conventional weaving method. The far infrared ray heat dissipation fiber cloth according to claim 10, comprising: Anorthite, Olivine, Cordierite, Chlorite, and Alipite. , at least one or more structural combinations or derivatives of Tourmaline, Tremolite, Actinolite, Serpentine, Spinel, and Calcite . A method for preparing a film using the slurry of claim 1, comprising the steps of: (a) coating the coating on a surface of a substrate by impregnation or spraying; (b) heating and drying to form heat dissipation with heat transmission and far infrared rays. Functional double-layer heat sink film structure. A method for preparing a film using the slurry of claim 1, comprising the steps of: (a) preheating a substrate; and (b) applying a slurry to the surface of the substrate by spraying to form a heat transfer and a far A thin-film heat-dissipating structure film with infrared heat dissipation. A far-infrared heat-dissipating ceramic film containing the slurry component described in claim 1. The far-infrared heat-dissipating ceramic film according to claim 14 includes: Anorthite, Olivine, Cordierite, Chlorite, and Alipite. , at least one or more structural combinations or derivatives of Tourmaline, Tremolite, Actinolite, Serpentine, Spinel, and Calcite .