CN108985432B - Passive RFID tag for tracking and controlling PCB production process - Google Patents
Passive RFID tag for tracking and controlling PCB production process Download PDFInfo
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- CN108985432B CN108985432B CN201810736910.4A CN201810736910A CN108985432B CN 108985432 B CN108985432 B CN 108985432B CN 201810736910 A CN201810736910 A CN 201810736910A CN 108985432 B CN108985432 B CN 108985432B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 238000007639 printing Methods 0.000 claims abstract description 24
- 239000002699 waste material Substances 0.000 claims abstract description 23
- 238000002955 isolation Methods 0.000 claims abstract description 15
- 230000005540 biological transmission Effects 0.000 claims description 18
- 230000005855 radiation Effects 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 14
- 239000010410 layer Substances 0.000 claims description 12
- 238000005457 optimization Methods 0.000 claims description 10
- 239000002356 single layer Substances 0.000 claims description 8
- 238000000926 separation method Methods 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 230000000007 visual effect Effects 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000013461 design Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 8
- 239000012634 fragment Substances 0.000 description 5
- 238000004422 calculation algorithm Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- PEZNEXFPRSOYPL-UHFFFAOYSA-N (bis(trifluoroacetoxy)iodo)benzene Chemical group FC(F)(F)C(=O)OI(OC(=O)C(F)(F)F)C1=CC=CC=C1 PEZNEXFPRSOYPL-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000011438 discrete method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
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- Theoretical Computer Science (AREA)
- Details Of Aerials (AREA)
Abstract
The invention relates to a passive RFID (radio frequency identification) tag for tracking and controlling a PCB (printed Circuit Board) production process, which comprises an RFID chip and a tag antenna, wherein the RFID chip is welded on a PCB, one side of the RFID chip is connected with a grounding structure, the other side of the RFID chip is connected with the tag antenna, the tag antenna is printed on the PCB, and the tag antenna is designed in a discretization manner; the PCB comprises a circuit printing area and a waste material area, wherein a circuit structure is printed in the circuit printing area, the circuit printing area is arranged in the center of the PCB, the waste material area is arranged on the periphery of the circuit printing area, and a grounding structure, an RFID chip and a tag antenna of a tag are arranged in the waste material area; an isolation structure is arranged between the circuit printing area and the label area, and the isolation structure can reduce the influence between the label antenna and the circuit structure. The label can utilize a PCB waste area with a small area to realize the function of the label through a discrete antenna.
Description
Technical Field
The invention relates to the technical field of electronic information engineering, in particular to a passive RFID tag for tracking and controlling a PCB production process.
Background
The Radio Frequency Identification (RFID) technology is a non-contact based object identification technology, and realizes information transmission between transceiver systems by receiving and processing electromagnetic signals returned by a transponder (tag) based on radio frequency signals transmitted by a transmitter (reader). An RFID system generally consists of three parts, a tag, a reader and a background processor. The tag is composed of an RFID chip and a tag antenna, and unique digital identity information for identifying an attached object is stored in the tag chip. The reader transmits and receives radio frequency signals through its own antenna to modify and read information inside the tag. The background processor includes middleware, an information processing system, a database, and the like, and is generally used for managing data, and implementing communication and data transmission. Recently, RFID technology has begun to be applied to PCB production process recording and product tracking, thanks to its advantages of low cost, information interchangeability, etc.
To realize the recording of the PCB production process and the product tracking, the RFID tag attached to the surface of the PCB is required to be readable in the PCB production, storage and transportation processes, namely the RFID tag is required to have the metal-resistant property. In the related researches published at present, the design of embedding the RFID tag into the PCB, which is proposed by Julien Viret et al in england, needs to be grooved in the PCB in advance to place the tag and prevent the chip from being stressed, the production process is complicated, the structure of the PCB is damaged, and the design is not suitable for the produced PCB.
Disclosure of Invention
The invention aims to solve the technical problem of providing a passive RFID tag for tracking and controlling the PCB production process, wherein the tag can realize the function of the tag by utilizing a PCB waste material area with a small area and a discrete antenna.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows:
a passive RFID label for tracking and controlling a PCB production process is characterized in that: the RFID chip is welded on a PCB, one side of the RFID chip is connected with a grounding structure, the other side of the RFID chip is connected with a tag antenna, the tag antenna is printed on the PCB, and the tag antenna is designed in a discretization mode;
the PCB comprises a circuit printing area and a waste material area, wherein a circuit structure is printed in the circuit printing area, the circuit printing area is arranged in the center of the PCB, the waste material area is arranged on the periphery of the circuit printing area, a label area is arranged in the waste material area, and the grounding structure, the RFID chip and the label antenna are all arranged in the label area;
an isolation structure is arranged between the circuit printing area and the label area, and the isolation structure can reduce the influence between the label antenna and the circuit structure.
In order to optimize the above invention, the specific measures taken further include:
the tag antenna is of an inverted F structure, the area where the tag antenna is located is an antenna radiation area, the antenna radiation area is formed by arranging a plurality of small-size line segment matrixes, each small-size line segment is provided with an entity metal segment or a blank segment, and the entity metal segments are connected to form the tag antenna.
The shape of the tag antenna in the antenna radiation area is obtained by designing an objective function and then optimizing the objective function through simulation software HFSS and Visual C, wherein the optimization aim is to improve gain and energy transmission coefficient.
The objective function is:
wherein wiThe weight is represented by a weight that is,
denotes the gain, τ, of the tag in the + z direction at 915MHz frequencyiThe energy transmission coefficient between the tag and the chip is shown when the same type of tag exists/does not exist around the tag, an objective function 1 is to search for the maximum gain, and objective functions 2 and 3 are to search for the maximum transmission coefficient when other tags are close to the tag or not, respectively.
The tag antenna is printed on the surface of the dielectric layer, and the solid metal section of the tag antenna is formed by etching the metal coating on the surface of the PCB.
The PCB is a single-layer PCB or a multi-layer PCB.
The isolation structure is a separation groove which is arranged at the junction of the circuit printing area and the waste material area.
In the design process, according to the shape and the size of the waste material area, an antenna structure is selected, the antenna structure can be a ring structure, an inverted F structure, a PIFA structure and the like, the selected antenna structure is used as a design basis, the selected design area in the label area is subjected to whole or partial discretization design to form smaller fragments or grids, each fragment or grid is assigned, and a label structure meeting the design requirement is searched through a multi-objective optimization algorithm, wherein the assignment carried out on each fragment or grid can represent the metal existence state of each fragment or grid.
Meanwhile, a specific isolation structure is introduced between the circuit printing area and the waste material area, the coupling influence between circuits is isolated, the influence of the printed circuits on the label is reduced as far as possible, and the structure is suitable for different circuit structures.
The passive RFID tag for tracking and controlling the PCB production process has the following beneficial effects that: the device utilizes the waste area of the PCB to develop the label design, saves the cost and does not need a special manufacturing process. Meanwhile, the antenna structure optimally designs smaller fragments or a grid structure by utilizing a multi-objective optimization algorithm, so that the structure of the antenna can have the maximum transmission coefficient and the maximum gain. Meanwhile, the antenna structure is not only suitable for a single-layer PCB but also suitable for a multi-layer PCB. The special isolation structure is introduced between the circuit printing area and the label area, so that the label has universality for a PCB without a printed circuit and a PCB printed with different circuit structures, and the coupling between the circuit structure and the antenna structure can be reduced after the circuit structure is printed in the circuit printing area.
Drawings
Fig. 1 is a schematic diagram of a structure of a PCB board in a passive RFID tag for tracking and controlling a PCB production process according to the present invention.
Fig. 2 is a schematic diagram of a discrete method of a tag structure in a passive RFID tag for tracking and controlling a PCB production process according to the present invention.
Fig. 3a is a top view of a tag structure in a passive RFID tag for PCB production process tracking and control according to the present invention.
Fig. 3b is a side view of a tag structure in a passive RFID tag for PCB production process tracking and control in accordance with the present invention.
FIG. 4 is a schematic diagram of the transmission coefficient of tag energy in a passive RFID tag for PCB production process tracking and control according to the present invention.
Fig. 5a is a three-dimensional radiation pattern of a passive RFID tag for tracking and controlling a PCB production process according to the present invention when the tag is applied to a single-layer PCB.
Fig. 5b is a three-dimensional radiation pattern of a passive RFID tag for PCB production process tracking and control according to the present invention when the tag is applied to a multi-layer PCB.
Fig. 6a is a schematic structural diagram of an isolation structure in a passive RFID tag for PCB production process tracking and control according to the present invention.
FIG. 6b is a schematic diagram of the PCB current distribution after an isolation structure is introduced into a passive RFID tag for tracking and controlling the PCB production process.
FIG. 7a is a schematic diagram of the energy transmission coefficient of a passive RFID tag for PCB production process tracking and control after an isolation structure and a circuit are introduced into the tag.
Fig. 7b shows a three-dimensional radiation pattern of a passive RFID tag for PCB production tracking and control according to the present invention after isolation structures and circuits are introduced.
Illustration of the drawings: 1. a circuit printing area; 2. a waste zone; 3. a label area; 4. a ground structure; 5. an RFID chip; 6. a tag antenna; 7. a solid metal segment; 8. a blank section; 9. a dielectric layer; 10. and an isolation structure.
Detailed Description
The invention is further described below with reference to the drawings and specific preferred embodiments.
As shown in fig. 1, a PCB is generally divided into two large areas: a circuit printing area 1 and a waste area 2. The waste material area 2 is not printed with any circuit structure, is only used for assembly in the production process, has a small assembly occupied area, and is generally punched and assembled at corners, namely, most of the waste material area can be used. Thus, a label zone 3 may be provided within the waste zone 2.
In this embodiment, the selected length of the circuit board is 92mm, and the width of the circuit board is 46mm, and only the lowermost small area is selected as the label design area 3, and the size of the label design area is 6mm × 46mm, which only occupies about 6% of the area of the entire PCB.
As shown in fig. 2, the tag area 3 is configured as a rectangular structure, and includes a grounding structure 4, an RFID chip 5 and a tag antenna 6, the RFID chip 5 is welded on the PCB, one side of the RFID chip 5 is connected with the grounding structure 4, the other side is connected with the tag antenna 6, the tag antenna 6 is printed on the PCB, and the tag antenna is designed in a discretization manner.
In this embodiment, the tag antenna 6 selects an inverted-F structure as a basic structure of the tag, a radiation area of the tag antenna 6 is discretized by a small-sized line segment, in fig. 2, a solid line segment represents a solid metal segment, and a dashed line segment represents a blank segment, that is, the metal line does not exist, so that the radiation area can be represented by a matrix of "0" and "1". Where 0 represents a dashed line segment and 1 represents a solid line segment.
In the embodiment, a MOEA/D-GO algorithm is selected, and the optimization design is developed by using three-dimensional electromagnetic simulation software HFSS and Visual C.
The design objective function is:
wherein wiThe weight is represented by a weight that is,
denotes the gain, τ, of the tag in the + z direction at 915MHz frequencyiIndicating the energy transmission coefficient between the tag and the chip with/without the same type of tag around it. In this embodiment, a minimum optimization method is adopted, that is, a minimum objective function value is searched, an objective function 1 is used for searching a maximum gain, and objective functions 2 and 3 are used for respectively searching a maximum transmission coefficient when other tags are close to each other.
In this embodiment, an HFSS initial model of a tag is created by using a script file, an antenna area of the tag to be designed is divided into a mesh consisting of small-sized segments, materials of the segments can be modified in the script file, the materials of the segments are continuously optimized in an optimization program according to an optimization target and a result calculated under each set of segment parameters until the result calculated under a certain array of HFSS parameters meets the optimization target, and the set of results and the model parameters are output.
As shown in fig. 3, the tag antenna 6 structure obtained by the optimized design is shown in fig. 3 as a graph a and a graph b, and the grounding structure4 area size W1×L1The size of the radiation area of the tag antenna 6 is W, which is 9.5mm × 6mm2×L2The thickness of the PCB dielectric layer 9 is 30mm × 4.7mm, and D is 2 mm. And simulating the tag antenna 6 obtained by optimization, and verifying the optimization result.
As shown in fig. 4, the simulation result shows that the label obtains good performance when applied to both single-layer and multi-layer PCB boards. When the label is applied to a single-layer PCB, the energy transmission coefficient obtained at the planned working frequency of 915MHz is the highest; when the label is applied to a multilayer PCB, the transmission coefficient curve has slight deviation, but the transmission coefficient obtained at 915MHz is still larger than 0.9.
As shown in fig. 5, in order to obtain a three-dimensional radiation pattern when applied to a single-layer PCB and a multi-layer PCB, the mode change of the three-dimensional radiation pattern is small when a label is applied to the single-layer PCB and the multi-layer PCB, but the gain obtained when applied to the multi-layer PCB is significantly improved.
The simulation diagrams in fig. 4 and 5 are obtained when the circuit structure is not printed, and as shown in a diagram a in fig. 6, in this embodiment, a separation groove with a certain width is provided at the boundary between the circuit printing area 1 and the waste area 2 to realize the separation, the width of the groove is 1mm, and the distances from the groove to the label and the edge of the PCB are respectively 4.5mm and 3.5 mm.
After simulation, it can be confirmed that the output current of the tag chip is distributed on the PCB as shown in b of fig. 6, and the current is confined in the waste region 2. Fig. 7, panels a and b, show the transmission coefficient and three-dimensional radiation pattern of the tag after PCB slotting and circuit printing area introduction of the circuit structure. Compared with the case of not introducing a circuit structure, the transmission coefficient of the tag is hardly changed, the radiation pattern is changed to a certain extent, the directionality of the tag is slightly deteriorated, and the gain is hardly changed.
Further, the tag antenna 6 is directly designed on the PCB, when a circuit is printed, only metal of the antenna structure part is left, the tag antenna 6 is formed through etching, and the RFID chip 5 is fixed on the PCB through welding.
The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above-mentioned embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and embellishments within the scope of the invention may be made by those skilled in the art without departing from the principle of the invention.
Claims (4)
1. A passive RFID label for tracking and controlling a PCB production process is characterized in that: the RFID tag comprises an RFID chip (5) and a tag antenna (6), wherein the RFID chip (5) is welded on a PCB, one side of the RFID chip (5) is connected with a grounding structure (4), the other side of the RFID chip is connected with the tag antenna (6), the tag antenna (6) is printed on the PCB, and the tag antenna is designed in a discretization mode;
the PCB comprises a circuit printing area (1) and a waste material area (2), a circuit structure is printed in the circuit printing area (1), the circuit printing area (1) is arranged in the center of the PCB, the waste material area (2) is arranged on the periphery of the circuit printing area (1), a label area (3) is arranged in the waste material area (2), and the grounding structure (4), the RFID chip (5) and the label antenna (6) are all arranged in the label area (3);
an isolation structure (10) is arranged between the circuit printing area (1) and the label area (3), and the isolation structure (10) can reduce the influence of coupling between the label antenna (6) and the circuit structure;
the tag antenna (6) is of an inverted-F structure, the area where the tag antenna (6) is located is an antenna radiation area, the antenna radiation area is formed by arranging a plurality of small-size line segment matrixes, each small-size line segment is provided with an entity metal segment (7) or a blank segment, and the entity metal segments (7) are connected to form the tag antenna (6);
the shape of the tag antenna (6) in the antenna radiation area is obtained by designing an objective function and then optimizing the objective function through simulation software HFSS and Visual C, wherein the optimization aim is to improve gain and energy transmission coefficient;
the objective function is as follows:
wherein,w ithe weight is represented by a weight that is,
representing the gain of the tag in the + z direction at a frequency of 915MHz,
the energy transmission coefficient between the tag and the chip is shown when the same type of tag exists/does not exist around the tag, an objective function 1 is to search for the maximum gain, and objective functions 2 and 3 are to search for the maximum transmission coefficient when other tags are close to the tag or not, respectively.
2. A passive RFID tag for PCB production process tracking and control according to claim 1, wherein: the tag antenna (6) is printed on the surface of the dielectric layer (9), and the solid metal section (7) of the tag antenna (6) is formed by etching a metal coating on the surface of the PCB.
3. A passive RFID tag for PCB production process tracking and control according to claim 1, wherein: the PCB is a single-layer PCB or a multi-layer PCB.
4. A passive RFID tag for PCB production process tracking and control according to claim 1, wherein: the isolation structure (10) is a separation groove which is arranged at the junction of the circuit printing area (1) and the waste material area (2).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810736910.4A CN108985432B (en) | 2018-07-06 | 2018-07-06 | Passive RFID tag for tracking and controlling PCB production process |
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| CN201810736910.4A CN108985432B (en) | 2018-07-06 | 2018-07-06 | Passive RFID tag for tracking and controlling PCB production process |
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| CN108985432B true CN108985432B (en) | 2021-04-06 |
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| CN108985432A (en) | 2018-12-11 |
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Application publication date: 20181211 Assignee: Nanjing Shuyuan Xinhe Technology Co.,Ltd. Assignor: JINLING INSTITUTE OF TECHNOLOGY Contract record no.: X2022320000004 Denomination of invention: A passive RFID tag for PCB production process tracking and control Granted publication date: 20210406 License type: Common License Record date: 20220107 |
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