CN201984509U - Multi-dielectric ultra-high-frequency (UHF) radio frequency identification (RFID) tag and antenna - Google Patents
Multi-dielectric ultra-high-frequency (UHF) radio frequency identification (RFID) tag and antenna Download PDFInfo
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- CN201984509U CN201984509U CN2011200303218U CN201120030321U CN201984509U CN 201984509 U CN201984509 U CN 201984509U CN 2011200303218 U CN2011200303218 U CN 2011200303218U CN 201120030321 U CN201120030321 U CN 201120030321U CN 201984509 U CN201984509 U CN 201984509U
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Abstract
The utility model relates to a multi-dielectric ultra-high-frequency (UHF) radio frequency identification (RFID) tag, which comprises an antenna and an integrated circuit (IC) chip. The multi-dielectric UHF RFID tag is characterized in that the antenna further comprises a dielectric substrate, a ground layer is arranged on one surface of the dielectric substrate, a radiation electrode layer is arranged on a corresponding surface, the radiation electrode layer is connected with the IC chip through a microstrip line or probe, the dielectric substrate comprises at least two dielectric layers, the dielectric constants of two adjacent dielectric layers are different and the dielectric layers are made of nonmetallic materials; each dielectric layer comprises an air layer, the air layer comprises a support and the air layer is connected with the ground layer or other dielectric layers through the support; and the dielectric layer can also be an epoxy board layer or a plastic layer. Since the dielectric layers with different dielectric constants are used for forming the dielectric substrate, losses are reduced and the performance of the antenna is improved. Since the air layer can be used as one dielectric layer and air has no dielectric loss, the performance of the antenna is further improved.
Description
Technical field
The utility model relates to the RFID(radio frequency identification) label, relate in particular to a kind of UHF(ultrahigh frequency, UHF-Ultra High Frequency) the RFID label.
Background technology
Radio-frequency recognition system is made of three parts such as read write line (Reader) and radio-frequency (RF) tag (RFID Tag) and operating systems usually.Attached to the have an agreement electronic data of form of the radio-frequency (RF) tag internal memory on the object to be identified, as the sign information of article to be identified.The electronic data that read write line can contactlessly be read in the label to be deposited or information write label, thus realize automatic identification and management to each type objects.Read write line and radio-frequency (RF) tag communication protocol by appointment adopts advanced radio-frequency technique mutual communication, and basic communication process is as follows: the label in (1) read write line reach receives the carrier energy that read write line sends, electrification reset; (2) label receives order that read write line the sends line operate of going forward side by side; (3) read write line sends and selects and take inventory order label is discerned, and selected single label carries out communication, and all the other labels temporarily are in dormant state; (4) label that is identified is carried out the visit order that read write line sends, and sends data message by the backscattered modulation mode to read write line, enters sleep state, after this no longer read write line is replied; (5) read write line continues search to remaining label, and repetition (3) (4) are waken single label respectively up and read, until identifying all labels.
At least include antenna and IC chip on each label.Store electronic data on the IC chip, and the performance of antenna there is critical effect to the working index of whole radio-frequency recognition system.The UHF_RFID label antenna of existing a kind of anti-metal is on a thin-medium substrate, enclose thin metal layer as ground plane in the one side of this substrate, the another side on opposite is made the metal patch of definite shape with photoetching corrosion or method of printing, the antenna that utilizes microstrip line or probe that the paster feed is constituted, above the metal patch of this substrate or side or bottom the IC chip is set, the IC chip is connected with metal patch and ground plane by microstrip line or probe etc.
The substrate of existing small-sized medium loaded antenna uses pottery or plastics, epoxy plate etc. more.Ceramic is functional, expensive but price all compares.Plastics, epoxy plate price comparison are cheap, but there is bigger dielectric loss in aerial radiation, influence the performance of antenna.And even existing substrate is made up of two layer medium, still if the reasonable words of Q value of use antenna then need to select for use medium somewhat expensive, as pottery, its cost is higher.If the cost of working medium is more cheap, as plastics, epoxy plate, but their loss tangent all greater than 0.01, its Q value inverse that is loss tangent then causes using plastics, epoxy plate poor as the antenna performance of medium thus.
Summary of the invention
The purpose of this utility model is to provide a kind of UHF_RFID label of multimedium structure, exists performance and antenna substrate material cost to have direct ratio with the substrate that solves antenna in the prior art, does not have relatively good technical problem of the ratio of performance to price.
A kind of UHF_RFID anti-metal tag of multimedium structure, comprise antenna and IC chip, it is characterized in that, described antenna further comprises dielectric substrate, the one side of dielectric substrate is provided with ground plane, the radiation electrode layer is set on its corresponding surface, described radiation electrode layer is connected with the RF port of IC chip by microstrip line or probe, described ground plane passes through one section metal level or directly is connected with the GND port of IC chip, described dielectric substrate comprises two layer medium layer at least, the specific inductive capacity of the dielectric layer of adjacent two layers is inequality, the medium of described dielectric layer is nonmetallic materials, comprises an air layer in the described dielectric layer at least, and each air layer comprises support, each air layer is connected with ground plane or other dielectric layer by support foundation, this one or the thickness sum of those air layers be not less than described dielectric substrate thickness 40%.
Described dielectric layer comprises the one or more combination of following material layers: the combination of epoxy flaggy, plastic layer, those layers.
Determine the composition and the corresponding thickness of dielectric according to following formula according to the effective dielectric constant after the combination
Described IC chip is arranged on top, side or the below of dielectric substrate.
Described those dielectric layers are to connect successively from top to bottom or from top to bottom.
Described dielectric layer also comprises the layer that specific inductive capacity is formed less than 2 material.
A kind of manufacture craft of UHF_RFID anti-metal tag of multimedium structure may further comprise the steps:
(1) effective dielectric constant after the affirmation combination;
(2) following formula is determined the number of plies, the dielectric of selecting for use and the corresponding thickness that dielectric substrate is formed, comprising at least one air layer, this one or the thickness sum of those air layers be not less than described dielectric substrate thickness 40%;
(3) one side with the dielectric substrate made is provided with ground plane, the radiation electrode layer is set on its corresponding surface, described radiation electrode layer is connected with the RF port of IC chip by microstrip line or probe, and described ground plane passes through one section metal level or directly is connected with the GND port of IC chip.
Described dielectric layer comprises the one or more combination of following material layers: the combination of epoxy flaggy, plastic layer, those layers.
Described dielectric layer also comprises the layer that specific inductive capacity is formed less than 2 material.
Compared with prior art, the utlity model has following advantage:
The utility model adopts the dielectric layer of differing dielectric constant as dielectric substrate, has reduced loss, has improved the performance of antenna.The most important thing is, the utility model is by being provided with air layer, and this one or the thickness sum of those air layers be not less than described dielectric substrate thickness 40%, this set just can so that dielectric substrate can adopt the low dielectric of price comparison come as a certain of dielectric substrate or certain which floor, after the important set stratification of the almost nil air layer of loss tangent as dielectric substrate is set, like this, the loss tangent of the dielectric substrate integral body that obtains is very low, and the Q value performance of antenna is fine thus.
Description of drawings
Fig. 1 is a kind of principle cross sectional representation of UHF_RFID label of multimedium structure;
Fig. 2 is the principle cross sectional representation of the UHF_RFID label of second kind of multimedium structure.
Embodiment
Embodiment 1
See also Fig. 1, it is a kind of principle cross sectional representation of UHF_RFID label of multimedium structure.It comprises antenna and IC chip 4.Antenna further comprises dielectric substrate 5, the one side of dielectric substrate 5 is provided with ground plane 1, radiation electrode layer 2 is set on its corresponding surface, radiation electrode layer 2 by microstrip line or probe 3 be connected with IC chip 4, (being meant that mainly described radiation electrode layer 2 is connected with the RF port of IC chip 4 by microstrip line or probe 3), described ground plane 1 passes through one section metal level or directly is connected with the GND port of IC chip 4, dielectric substrate 5 comprises two layer medium layer at least, the specific inductive capacity of the dielectric layer of adjacent two layers is inequality, and the medium of dielectric layer is nonmetallic materials.
In Fig. 1, dielectric substrate is made up of 4 layers of dielectric layer 51,52,53,54, and these 4 layers of dielectric layers 51,52,53,54 can connect from top to bottom or from top to bottom successively.This dielectric layer can be the dielectric layer that conventional media such as epoxy flaggy, plastic layer are made, also can be air layer, also can be the dielectric layer that foam, silica gel etc. also can be made up of the character of air, this class material is that specific inductive capacity is lower, dielectric loss is also lower, and the dielectric loss of the dielectric layer that those materials are formed is very low.That is to say that described dielectric layer also comprises the layer that specific inductive capacity is formed less than 2 material.
In this example, dielectric layer 53 gets final product air layer, and air layer 53 comprises support 531, could set up with ground plane 1 or other dielectric layer by support 531 to be connected.Do not have dielectric loss during air layer 53 transmission, therefore can improve the performance of antenna.This one or the thickness sum of those air layers be not less than described dielectric substrate thickness 40%.
We can define label sizes earlier when tag design, calculate the specific inductive capacity of required use by label sizes, select to use which kind of dielectric material by this specific inductive capacity.
It below is exactly the computing formula of the specific inductive capacity of a multimedium body.
Our experiments show that, when the thickness sum of those air layers be not less than described dielectric substrate thickness 40% the time, the effective dielectric constant after the combination will can satisfy the demand of existing small-sized medium loaded antenna performance in a predefined scope.
The IC chip can be arranged on top, side or the below of dielectric substrate.
Embodiment 2
See also Fig. 2, it is the principle cross sectional representation of the UHF_RFID label of second kind of multimedium structure.
Dielectric substrate can also can be that the multilayered medium layer is formed by two-layer.Such as, the epoxy flaggy connects air layer and forms one group, and dielectric substrate can comprise many groups 52,53,54,55,56.
Embodiment 3
The utility model provides a kind of antenna, comprise dielectric substrate, the one side of dielectric substrate is provided with ground plane, the radiation electrode layer is set on its corresponding surface, described radiation electrode layer is connected with exterior I C chip by microstrip line or probe, described dielectric substrate comprises two layer medium layer at least, and the specific inductive capacity of the dielectric layer of adjacent two layers is inequality, and the medium of described dielectric layer is nonmetallic materials.
Described dielectric layer comprises air layer, and described air layer comprises support, and described air layer is connected with ground plane or other dielectric layer by support foundation.
Described dielectric substrate comprises the multilayered medium layer.
Described dielectric layer can alternately occur for epoxy plate layer, plastic layer, air layer.
A kind of manufacture craft of UHF_RFID anti-metal tag of multimedium structure may further comprise the steps:
(1) effective dielectric constant after the affirmation combination;
(2) following formula is determined the number of plies, the dielectric of selecting for use and the corresponding thickness that dielectric substrate is formed, comprising at least one air layer, this one or the thickness sum of those air layers be not less than described dielectric substrate thickness 40%;
(3) one side with the dielectric substrate made is provided with ground plane, the radiation electrode layer is set on its corresponding surface, described radiation electrode layer is connected with the RF port of IC chip by microstrip line or probe, and described ground plane passes through one section metal level or directly is connected with the GND port of IC chip.
Described dielectric layer comprises the one or more combination of following material layers: the combination of epoxy flaggy, plastic layer, those layers.
Described dielectric layer also comprises the layer that specific inductive capacity is formed less than 2 material.
The utility model is by being provided with air layer, and this one or the thickness sum of those air layers be not less than described dielectric substrate thickness 40%, this set just can so that dielectric substrate can adopt the low dielectric of price comparison come as a certain of dielectric substrate or certain which floor, after the important set stratification of the almost nil air layer of loss tangent as dielectric substrate is set, like this, the loss tangent of the dielectric substrate integral body that obtains is very low, and the Q value performance of antenna is fine thus.
More than disclosed only be several specific embodiment of the present utility model, but the utility model is not limited thereto, any those skilled in the art can think variation, all should drop in the protection domain of the present utility model.
Claims (6)
1. the UHF_RFID anti-metal tag of a multimedium structure, comprise antenna and IC chip, it is characterized in that, described antenna further comprises dielectric substrate, the one side of dielectric substrate is provided with ground plane, the radiation electrode layer is set on its corresponding surface, described radiation electrode layer is connected with the RF port of IC chip by microstrip line or probe, described ground plane passes through one section metal level or directly is connected with the GND port of IC chip, described dielectric substrate comprises two layer medium layer at least, the specific inductive capacity of the dielectric layer of adjacent two layers is inequality, the medium of described dielectric layer is nonmetallic materials, comprises an air layer in the described dielectric layer at least, and each air layer comprises support, each air layer is connected with ground plane or other dielectric layer by support foundation, this one or the thickness sum of those air layers be not less than described dielectric substrate thickness 40%.
2. the UHF_RFID anti-metal tag of multimedium structure as claimed in claim 1 is characterized in that, described dielectric layer comprises the one or more combination of following material layers: the combination of epoxy flaggy, plastic layer, those layers.
3. the UHF_RFID anti-metal tag of multimedium structure as claimed in claim 2 is characterized in that, determines the composition and the corresponding thickness of dielectric according to following formula according to the effective dielectric constant after the combination
ε
iBe each dielectric specific inductive capacity separately, θ
iThe percent by volume of being occupied for each layer medium,
ε
EffBe the effective dielectric constant after the combination.
4. the UHF_RFID anti-metal tag of multimedium structure as claimed in claim 1 or 2 is characterized in that, described IC chip is arranged on top, side or the below of dielectric substrate.
5. the UHF_RFID anti-metal tag of multimedium structure as claimed in claim 1 or 2 is characterized in that, described those dielectric layers are to connect successively from top to bottom or from top to bottom.
6. the UHF_RFID anti-metal tag of multimedium structure as claimed in claim 1 is characterized in that, described dielectric layer also comprises the layer that specific inductive capacity is formed less than 2 material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200303218U CN201984509U (en) | 2010-12-24 | 2011-01-28 | Multi-dielectric ultra-high-frequency (UHF) radio frequency identification (RFID) tag and antenna |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020678412.8 | 2010-12-24 | ||
| CN201020678412 | 2010-12-24 | ||
| CN2011200303218U CN201984509U (en) | 2010-12-24 | 2011-01-28 | Multi-dielectric ultra-high-frequency (UHF) radio frequency identification (RFID) tag and antenna |
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| CN201984509U true CN201984509U (en) | 2011-09-21 |
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| CN2011200303218U Expired - Lifetime CN201984509U (en) | 2010-12-24 | 2011-01-28 | Multi-dielectric ultra-high-frequency (UHF) radio frequency identification (RFID) tag and antenna |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102567775A (en) * | 2010-12-24 | 2012-07-11 | 刘智佳 | UHF_RFID (Ultra High Frequency-Radio Frequency Identification) tag of multi-dielectric structure and antenna |
| CN103296433A (en) * | 2012-02-29 | 2013-09-11 | 深圳光启创新技术有限公司 | Metamaterial |
| CN108400435A (en) * | 2018-02-12 | 2018-08-14 | 上海矽杰微电子有限公司 | A kind of printed circuit board of millimeter wave micro-strip antenna |
| CN109159506A (en) * | 2018-07-27 | 2019-01-08 | 中国人民解放军陆军装甲兵学院 | A kind of flexibility UHF RFID anti-metal tag |
| TWI713260B (en) * | 2019-09-03 | 2020-12-11 | 國立高雄科技大學 | Frequency tunable tag antenna attaching to high dielectric constant material |
-
2011
- 2011-01-28 CN CN2011200303218U patent/CN201984509U/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102567775A (en) * | 2010-12-24 | 2012-07-11 | 刘智佳 | UHF_RFID (Ultra High Frequency-Radio Frequency Identification) tag of multi-dielectric structure and antenna |
| CN102567775B (en) * | 2010-12-24 | 2016-06-08 | 上海曜传信息科技有限公司 | The UHF_RFID label of a kind of multimedium structure and antenna |
| CN103296433A (en) * | 2012-02-29 | 2013-09-11 | 深圳光启创新技术有限公司 | Metamaterial |
| CN108400435A (en) * | 2018-02-12 | 2018-08-14 | 上海矽杰微电子有限公司 | A kind of printed circuit board of millimeter wave micro-strip antenna |
| CN108400435B (en) * | 2018-02-12 | 2020-11-03 | 浙江芯力微电子股份有限公司 | Printed circuit board of millimeter wave microstrip antenna |
| CN109159506A (en) * | 2018-07-27 | 2019-01-08 | 中国人民解放军陆军装甲兵学院 | A kind of flexibility UHF RFID anti-metal tag |
| CN109159506B (en) * | 2018-07-27 | 2020-11-24 | 中国人民解放军陆军装甲兵学院 | Flexible UHF RFID anti-metal label |
| TWI713260B (en) * | 2019-09-03 | 2020-12-11 | 國立高雄科技大學 | Frequency tunable tag antenna attaching to high dielectric constant material |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170609 Address after: 200336 room 21, building 641, 3 Tian Shan Road, Shanghai, Changning District, 403 Patentee after: Shanghai Fei Mdt InfoTech Ltd Address before: 210009, Jiangdong North Road, Gulou District, Nanjing, Jiangsu, Nanjing 297 Patentee before: Liu Zhijia |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110921 |
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| CX01 | Expiry of patent term |