CN102567775B - The UHF_RFID label of a kind of multimedium structure and antenna - Google Patents

The UHF_RFID label of a kind of multimedium structure and antenna Download PDF

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CN102567775B
CN102567775B CN201110031208.6A CN201110031208A CN102567775B CN 102567775 B CN102567775 B CN 102567775B CN 201110031208 A CN201110031208 A CN 201110031208A CN 102567775 B CN102567775 B CN 102567775B
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dielectric substrate
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medium layer
uhf
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CN102567775A (en
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刘智佳
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Sai Phi information technology (Nantong) Co., Ltd.
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SHANGHAI XERAFY INFORMATION TECHNOLOGY Co Ltd
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Abstract

The UHF_RFID anti-metal tag of a kind of multimedium structure, comprise antenna and IC chip, described antenna comprises dielectric substrate further, the one side of dielectric substrate arranges ground connection layer, arranging radiation electrode layer on its corresponding surface, described radiation electrode layer is connected with IC chip by microstrip line or probe, and described dielectric substrate comprises at least two layer medium layer, the specific inductivity of the medium layer of adjacent two layers is not identical, and the medium of described medium layer is non-metallic material. Described medium layer comprises gas cloud, and described gas cloud comprises support, and described gas cloud is set up by support and is connected with ground connection layer or other medium layer. Described medium layer can also be epoxy plate layer, plastic layer. The present invention adopts the medium layer of differing dielectric constant as dielectric substrate, decrease loss, it is to increase the performance of antenna. The present invention can also adopt gas cloud as a wherein medium layer, and air does not have dielectric loss, thus more improves the performance of antenna.

Description

The UHF_RFID label of a kind of multimedium structure and antenna
Technical field
The present invention relates to RFID(radio frequency identification) label, particularly relate to a kind of UHF(ultra-high frequency, UHF-UltraHighFrequency) RFID label tag.
Background technology
Radio-frequency recognition system is made up of read write line (Reader) and three parts such as RF tag (RFIDTag) and operating system usually. The RF tag internal memory being attached on object to be identified is had an agreement the electronic data of form, as the identification information of article to be identified. Read write line can contactlessly read the electronic data deposited in label or information is write label, thus realizes the automatic identification to each type objects and management. Read write line adopts advanced radio-frequency technique to communicate mutually with RF tag according to the communication protocol of agreement, and basic communication process is as follows: the label in (1) read write line sphere of action receives the carrier wave energy that read write line sends, electrification reset; (2) label receives the order of read write line transmission and operates; (3) read write line sends and selects and take inventory order to be identified by label, and selected single label carries out communication, and all the other labels are temporarily in dormant state; (4) label being identified performs the visit order that read write line sends, and sends data information by backscattered modulation mode to read write line, enters sleep state, is hereafter no longer replied by read write line; (5) remaining label is continued search by read write line, and repetition (3) (4) are waken single label respectively up and read, until identifying all labels.
Each label at least includes antenna and IC chip. IC chip stores electronic data, and the working index of whole radio-frequency recognition system is had critical effect by the performance of antenna. The UHF_RFID label antenna of existing a kind of anti-metal is on a thin-medium substrate, one side at this substrate encloses thin metal layer as ground connection layer, the another side photoetching corrosion on opposite or the method for printing make the metal patch of a shaped, utilize the antenna that patch is formed by microstrip line or probe, above the metal patch of this substrate or side or bottom IC chip is set, IC chip is connected with metal patch and ground connection layer by microstrip line or probe etc.
The many use potteries of the substrate of existing small-sized coated by dielectric antenna or plastics, epoxy plate etc. Ceramic is functional, but price is all costly. Plastics, epoxy plate price comparison are cheap, but sky beta radiation exists bigger dielectric loss, affects the performance of antenna. And, even if existing substrate is made up of two layer medium, but if the Q value being used antenna is relatively good, then need to select medium somewhat expensive, such as pottery, its cost is higher. If the cost compare using medium is cheap, such as plastics, epoxy plate, but their loss tangent is all greater than 0.01, then its Q value is the inverse of loss tangent, thus causes using plastics, epoxy plate poor as the performance of antenna of medium.
Summary of the invention
It is an object of the invention to provide the UHF_RFID label of a kind of multimedium structure, there is performance and antenna substrate material cost exists direct ratio to solve the substrate of antenna in prior art, not there is the technical problem that the ratio of performance to price is better.
The UHF_RFID anti-metal tag of a kind of multimedium structure, comprise antenna and IC chip, it is characterized in that, described antenna comprises dielectric substrate further, the one side of dielectric substrate arranges ground connection layer, its corresponding surface arranges radiation electrode layer, described radiation electrode layer is connected with the RF port of IC chip by microstrip line or probe, described ground connection layer is by one section of metal level or is directly connected with the GND port of IC chip, described dielectric substrate comprises at least two layer medium layer, the specific inductivity of the medium layer of adjacent two layers is not identical, the medium of described medium layer is non-metallic material, described medium layer at least comprises a gas cloud, each gas cloud comprises support, each gas cloud is set up by support and is connected with ground connection layer or other medium layer, this one or the thickness sum of those gas clouds be not less than described dielectric substrate thickness 40%.
Described medium layer comprises the one or more combination of following material layers: the combination of epoxy plate layer, plastic layer, those layers.
The composition of dielectric and the thickness of correspondence is determined according to following formula according to the equivalent specific inductivity after combination
Described IC chip is arranged on the top of dielectric substrate, side or lower section.
Those medium layers described connect successively from top to bottom or from top to bottom.
Described medium layer also comprises the layer that specific inductivity is less than the material composition of 2.
A manufacture craft for the UHF_RFID anti-metal tag of multimedium structure, comprises the following steps:
(1) the equivalent specific inductivity after combination is confirmed;
(2) following formula determines the thickness of the number of plies, the dielectric selected and correspondence that dielectric substrate forms, comprising at least one gas cloud, this one or the thickness sum of those gas clouds be not less than described dielectric substrate thickness 40%;
(3) one side of the dielectric substrate made is arranged ground connection layer, its corresponding surface arranges radiation electrode layer, described radiation electrode layer is connected with the RF port of IC chip by microstrip line or probe, and described ground connection layer is by one section of metal level or is directly connected with the GND port of IC chip.
Described medium layer comprises the one or more combination of following material layers: the combination of epoxy plate layer, plastic layer, those layers.
Described medium layer also comprises the layer that specific inductivity is less than the material composition of 2.
Compared with prior art, the present invention has the following advantages:
The present invention adopts the medium layer of differing dielectric constant as dielectric substrate, decrease loss, it is to increase the performance of antenna.The most important thing is, the present invention is by arranging gas cloud, and this one or the thickness sum of those gas clouds be not less than described dielectric substrate thickness 40%, this kind is arranged just can so that dielectric substrate dielectric that price comparison can be adopted low be as a certain of dielectric substrate or certain which floor, rear the important set stratification of the almost nil gas cloud of loss tangent as dielectric substrate is set, like this, the loss tangent of the dielectric substrate entirety of acquisition is very low, and thus the Q value performance of antenna is fine.
Accompanying drawing explanation
Fig. 1 is the principle cross sectional representation of the UHF_RFID label of a kind of multimedium structure;
Fig. 2 is the principle cross sectional representation of the UHF_RFID label of the 2nd kind of multimedium structure.
Embodiment
Embodiment 1
Referring to Fig. 1, it is the principle cross sectional representation of the UHF_RFID label of a kind of multimedium structure. It comprises antenna and IC chip 4. Antenna comprises dielectric substrate 5 further, the one side of dielectric substrate 5 arranges ground connection layer 1, its corresponding surface arranges radiation electrode layer 2, radiation electrode layer 2 is connected with IC chip 4 by microstrip line or probe 3, (mainly referring to that described radiation electrode layer 2 is connected with the RF port of IC chip 4 by microstrip line or probe 3), described ground connection layer 1 by one section of metal level or is directly connected with the GND port of IC chip 4, dielectric substrate 5 comprises at least two layer medium layer, the specific inductivity of the medium layer of adjacent two layers is not identical, and the medium of medium layer is non-metallic material.
In FIG, dielectric substrate is made up of 4 layers of medium layer 51,52,53,54, and these 4 layers of medium layers 51,52,53,54 can connect from top to bottom or from top to bottom successively. This medium layer can be the medium layer that the conventional media such as epoxy plate layer, plastic layer are made, can also be gas cloud, the medium layer that can also be foam, silica gel etc. and also can be made up of the character of air, this kind of material is that specific inductivity is lower, dielectric loss also compares low, and the dielectric loss of the medium layer of those materials composition is very low. That is, described medium layer also comprises the layer that specific inductivity is less than the material composition of 2.
In this example, medium layer 53 gets final product gas cloud, and gas cloud 53 comprises support 531, could be set up by support 531 and be connected with ground connection layer 1 or other medium layer. Gas cloud 53 does not have dielectric loss when transmitting, and therefore can improve the performance of antenna. This one or the thickness sum of those gas clouds be not less than described dielectric substrate thickness 40%.
We are meeting elder generation definition tab size when tag design, calculates the required specific inductivity used by label sizes, by this specific inductivity carrys out which kind of dielectric material of choice for use.
It it is exactly below the calculation formula of the specific inductivity of a multimedium body.
,
Our experiments show that, when the thickness sum of those gas clouds be not less than described dielectric substrate thickness 40% time, the equivalent specific inductivity after combination will in a scope set in advance, it is possible to meet the demand of existing small-sized coated by dielectric performance of antenna.
IC chip can be arranged on the top of dielectric substrate, side or lower section.
Embodiment 2
Referring to Fig. 2, it is the principle cross sectional representation of the UHF_RFID label of the 2nd kind of multimedium structure.
Dielectric substrate can by two layers, it is also possible to be multilayered medium layer composition. Such as, epoxy plate layer connects gas cloud and forms one group, and dielectric substrate can comprise many groups 52,53,54,55,56.
Embodiment 3
The present invention provides a kind of antenna, comprise dielectric substrate, the one side of dielectric substrate arranges ground connection layer, its corresponding surface arranges radiation electrode layer, described radiation electrode layer is connected with exterior I C chip by microstrip line or probe, described dielectric substrate comprises at least two layer medium layer, and the specific inductivity of the medium layer of adjacent two layers is not identical, and the medium of described medium layer is non-metallic material.
Described medium layer comprises gas cloud, and described gas cloud comprises support, and described gas cloud is set up by support and is connected with ground connection layer or other medium layer.
Described dielectric substrate comprises multilayered medium layer.
Described medium layer can be the alternately appearance of epoxy plate layer, plastic layer, gas cloud.
A manufacture craft for the UHF_RFID anti-metal tag of multimedium structure, comprises the following steps:
(1) the equivalent specific inductivity after combination is confirmed;
(2) following formula determines the thickness of the number of plies, the dielectric selected and correspondence that dielectric substrate forms, comprising at least one gas cloud, this one or the thickness sum of those gas clouds be not less than described dielectric substrate thickness 40%;
(3) one side of the dielectric substrate made is arranged ground connection layer, its corresponding surface arranges radiation electrode layer, described radiation electrode layer is connected with the RF port of IC chip by microstrip line or probe, and described ground connection layer is by one section of metal level or is directly connected with the GND port of IC chip.
Described medium layer comprises the one or more combination of following material layers: the combination of epoxy plate layer, plastic layer, those layers.
Described medium layer also comprises the layer that specific inductivity is less than the material composition of 2.
The present invention is by arranging gas cloud, and this one or the thickness sum of those gas clouds be not less than described dielectric substrate thickness 40%, this kind is arranged just can so that dielectric substrate dielectric that price comparison can be adopted low be as a certain of dielectric substrate or certain which floor, rear the important set stratification of the almost nil gas cloud of loss tangent as dielectric substrate is set, like this, the loss tangent of the dielectric substrate entirety obtained is very low, and thus the Q value performance of antenna is fine.
Several specific embodiments being only the present invention disclosed in above, but the present invention is not limited thereto, the changes that any person skilled in the art can think of, all should drop in protection scope of the present invention.

Claims (6)

1. the UHF_RFID anti-metal tag of a multimedium structure, comprise antenna and IC chip, it is characterized in that, described antenna comprises dielectric substrate further, the one side of dielectric substrate arranges ground connection layer, its corresponding surface arranges radiation electrode layer, described radiation electrode layer is connected with the RF port of IC chip by microstrip line or probe, described ground connection layer is by one section of metal level or is directly connected with the GND port of IC chip, described dielectric substrate comprises at least two layer medium layer, the specific inductivity of the medium layer of adjacent two layers is not identical, the medium of described medium layer is non-metallic material, described medium layer comprises at least two gas clouds, each gas cloud comprises support, each gas cloud is set up by support and is connected with ground connection layer or other medium layer, the thickness sum of those gas clouds is not less than the 40% of the thickness of described dielectric substrate.
2. the UHF_RFID anti-metal tag of multimedium structure as claimed in claim 1, it is characterised in that, described medium layer comprises the one or more combination of following material layers: the combination of epoxy plate layer, plastic layer, those layers.
3. the UHF_RFID anti-metal tag of multimedium structure as claimed in claim 2, it is characterised in that, determine the composition of dielectric and the thickness of correspondence according to following formula according to the equivalent specific inductivity after combination
ϵ e f f - 1 = Σ i θ i ( ϵ i ) - 1 ( i = 1 , 2 , 3 ... ) ; Wherein, �� ��i=1
��iFor the respective specific inductivity of each dielectric; ��iFor the volume percent that each layer medium occupies;
��effFor the equivalent specific inductivity after combination.
4. the UHF_RFID anti-metal tag of multimedium structure as claimed in claim 1 or 2, it is characterised in that, described IC chip is arranged on the top of dielectric substrate, side or lower section.
5. the UHF_RFID anti-metal tag of multimedium structure as claimed in claim 1 or 2, it is characterised in that, those medium layers described connect successively from top to bottom or from top to bottom.
6. the UHF_RFID anti-metal tag of multimedium structure as claimed in claim 1, it is characterised in that, described medium layer also comprises the layer that specific inductivity is less than the material composition of 2.
CN201110031208.6A 2010-12-24 2011-01-28 The UHF_RFID label of a kind of multimedium structure and antenna Active CN102567775B (en)

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CN104868236A (en) * 2015-04-16 2015-08-26 深圳市华信天线技术有限公司 Load resistant microstrip antenna
CN106972235B (en) * 2017-05-10 2023-06-06 江苏明联电子科技有限公司 Anti-metal tag antenna

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CN101299486A (en) * 2008-06-18 2008-11-05 北京邮电大学 RFID reader-writer antenna capable of overlapping high-frequency and ultrahigh frequency as well as microwave frequency band
CN201435450Y (en) * 2009-06-30 2010-03-31 华南理工大学 Polarized reconfigurable radio frequency identification circularly polarized reader antenna
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CN101807739A (en) * 2009-02-13 2010-08-18 公安部第三研究所 Miniaturized and circularly polarized antenna for RFID (Radio Frequency Identification) management field
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CN101299486A (en) * 2008-06-18 2008-11-05 北京邮电大学 RFID reader-writer antenna capable of overlapping high-frequency and ultrahigh frequency as well as microwave frequency band
CN101807739A (en) * 2009-02-13 2010-08-18 公安部第三研究所 Miniaturized and circularly polarized antenna for RFID (Radio Frequency Identification) management field
CN101807749A (en) * 2009-02-13 2010-08-18 公安部第三研究所 Circularly polarized array antenna for RFID (Radio Frequency Identification) vehicle management field
CN201435450Y (en) * 2009-06-30 2010-03-31 华南理工大学 Polarized reconfigurable radio frequency identification circularly polarized reader antenna
CN101782608A (en) * 2009-11-11 2010-07-21 中国科学院自动化研究所 Radio frequency identification device (RFID) label response frequency standard test system and method
CN101916907A (en) * 2010-07-08 2010-12-15 西北工业大学 Ultrahigh frequency band near field RFID reader-writer antenna
CN201984509U (en) * 2010-12-24 2011-09-21 刘智佳 Multi-dielectric ultra-high-frequency (UHF) radio frequency identification (RFID) tag and antenna

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