CN102567775A - UHF_RFID (Ultra High Frequency-Radio Frequency Identification) tag of multi-dielectric structure and antenna - Google Patents
UHF_RFID (Ultra High Frequency-Radio Frequency Identification) tag of multi-dielectric structure and antenna Download PDFInfo
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- CN102567775A CN102567775A CN2011100312086A CN201110031208A CN102567775A CN 102567775 A CN102567775 A CN 102567775A CN 2011100312086 A CN2011100312086 A CN 2011100312086A CN 201110031208 A CN201110031208 A CN 201110031208A CN 102567775 A CN102567775 A CN 102567775A
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- 239000000758 substrate Substances 0.000 claims abstract description 55
- 239000002184 metal Substances 0.000 claims abstract description 26
- 230000005855 radiation Effects 0.000 claims abstract description 18
- 239000004593 Epoxy Substances 0.000 claims abstract description 13
- 229920003023 plastic Polymers 0.000 claims abstract description 12
- 239000004033 plastic Substances 0.000 claims abstract description 12
- 239000000523 sample Substances 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 17
- 230000001939 inductive effect Effects 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 2
- 239000007769 metal material Substances 0.000 abstract 1
- 229910052755 nonmetal Inorganic materials 0.000 abstract 1
- 230000006854 communication Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000013517 stratification Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
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Abstract
The invention discloses an UHF_RFID (Ultra High Frequency-Radio Frequency Identification) anti-metal tag of a multi-dielectric structure. The UHF_RFID anti-metal tag comprises an antenna and an IC (Integrated Circuit) chip, wherein the antenna further comprises a dielectric substrate; one face of the dielectric substrate is provided with a grounding layer, and a corresponding face of the dielectric substrate is provided with a radiation electrode layer; the radiation electrode layer is connected with the IC chip through a micro-strip or a probe; the dielectric substrate comprises at least two dielectric layers; two adjacent dielectric layers have different dielectric constants; and the dielectric layers are made of a non-metal material. Each dielectric layer comprises an air layer, wherein the air layer comprises a bracket and is connected with the grounding layer or other dielectric layers by constructing the bracket. The dielectric layers can also be epoxy plate layers or plastic layers. According to the UHF_RFID anti-metal tag, the dielectric layers with different dielectric constants are used as the dielectric substrate, so that the loss is reduced, and the performance of the antenna is improved. According to the UHF_RFID anti-metal tag, the air layer can also be used as one of the dielectric layers, and the air has no dielectric loss, so that the performance of the antenna is further improved.
Description
Technical field
The present invention relates to RFID (radio frequency identification) label, relate in particular to a kind of UHF (ultrahigh frequency, UHF-Ultra High Frequency) RFID label.
Background technology
Radio-frequency recognition system is made up of three parts such as read write line (Reader) and RF tag (RFID Tag) and operating systems usually.Attached to the have an agreement electronic data of form of the RF tag internal memory on the object to be identified, as the sign property information of article to be identified.The electronic data that read write line can contactlessly be read in the label and deposited perhaps writes label with information, thereby realizes automatic identification and management to each type objects.Read write line and RF tag communication protocol by appointment adopts advanced radio-frequency technique mutual communication, and basic communication process is following: the label in (1) read write line reach receives the carrier energy that read write line sends, electrification reset; (2) label receives order that read write line the sends line operate of going forward side by side; (3) read write line sends and selects and take inventory order label is discerned, and selected single label carries out communication, and all the other labels temporarily are in dormant state; (4) label that is identified is carried out the visit order that read write line sends, and sends data message through the backscattered modulation mode to read write line, gets into sleep state, after this no longer read write line is replied; (5) read write line continues search to remaining label, and repetition (3) (4) are waken single label respectively up and read, until identifying all labels.
At least include antenna and IC chip on each label.Store electronic data on the IC chip, and the performance of antenna there is critical effect to the working index of whole radio-frequency recognition system.The UHF_RFID label antenna of existing a kind of anti-metal is on a thin-medium substrate; Enclose thin metal layer as ground plane in the one side of this substrate; The another side on opposite is processed the metal patch of definite shape with photoetching corrosion or method of printing; The antenna that utilizes microstrip line or probe that the paster feed is constituted, above the metal patch of this substrate or side or bottom the IC chip is set, the IC chip is connected with metal patch and ground plane through microstrip line or probe etc.
The substrate of existing small-sized medium loaded antenna uses pottery or plastics, epoxy plate etc. more.Ceramic is functional, expensive but price all compares.Plastics, epoxy plate price comparison are cheap, but there is bigger dielectric loss in aerial radiation, influence the performance of antenna.And even existing substrate is made up of two layer medium, still if the reasonable words of Q value of use antenna then need select for use medium somewhat expensive, like pottery, its cost is higher.If the cost of working medium is more cheap, like plastics, epoxy plate, but their loss tangent all greater than 0.01, its Q value inverse that is loss tangent then causes using plastics, epoxy plate poor as the antenna performance of medium thus.
Summary of the invention
The object of the present invention is to provide a kind of UHF_RFID label of multimedium structure, exist performance and antenna substrate material cost to have direct ratio, do not have relatively good technical problem of the ratio of performance to price with the substrate that solves antenna in the prior art.
A kind of UHF_RFID anti-metal tag of multimedium structure comprises antenna and IC chip, it is characterized in that; Said antenna further comprises dielectric substrate, and the one side of dielectric substrate is provided with ground plane, and the radiation electrode layer is set on its corresponding surface; Said radiation electrode layer is connected with the RF port of IC chip through microstrip line or probe, and said ground plane passes through one section metal level or directly is connected with the GND port of IC chip, and said dielectric substrate comprises two layer medium layer at least; The specific inductive capacity of the dielectric layer of adjacent two layers is inequality; The medium of said dielectric layer is nonmetallic materials, comprises an air layer in the said dielectric layer at least, and each air layer comprises support; Each air layer is connected with ground plane or other dielectric layer through support foundation, this one or the thickness sum of those air layers be not less than said dielectric substrate thickness 40%.
Said dielectric layer comprises the one or more combination of following material layers: the combination of epoxy flaggy, plastic layer, those layers.
Confirm the composition and the corresponding thickness of dielectric according to following formula according to the effective dielectric constant after the combination
Said IC chip is arranged on top, side or the below of dielectric substrate.
Said those dielectric layers are to connect successively from top to bottom or from top to bottom.
Said dielectric layer also comprises the layer that specific inductive capacity is formed less than 2 material.
A kind of manufacture craft of UHF_RFID anti-metal tag of multimedium structure may further comprise the steps:
(1) effective dielectric constant after the affirmation combination;
(2) following formula is confirmed the number of plies, the dielectric of selecting for use and the corresponding thickness that dielectric substrate is formed, comprising at least one air layer, this one or the thickness sum of those air layers be not less than said dielectric substrate thickness 40%;
(3) one side with the dielectric substrate of making is provided with ground plane; The radiation electrode layer is set on its corresponding surface; Said radiation electrode layer is connected with the RF port of IC chip through microstrip line or probe, and said ground plane passes through one section metal level or directly is connected with the GND port of IC chip.
Said dielectric layer comprises the one or more combination of following material layers: the combination of epoxy flaggy, plastic layer, those layers.
Said dielectric layer also comprises the layer that specific inductive capacity is formed less than 2 material.
Compared with prior art, the present invention has the following advantages:
The present invention adopts the dielectric layer of differing dielectric constant as dielectric substrate, has reduced loss, has improved the performance of antenna.The most important thing is; The present invention is through being provided with air layer, and this one or the thickness sum of those air layers be not less than said dielectric substrate thickness 40%, this set just can so that dielectric substrate can adopt the low dielectric of price comparison come as a certain of dielectric substrate or certain which floor; After the important set stratification of the almost nil air layer of loss tangent as dielectric substrate is set; Like this, the loss tangent of the dielectric substrate of acquisition integral body is very low, and the Q value performance of antenna is fine thus.
Description of drawings
Fig. 1 is a kind of principle cross sectional representation of UHF_RFID label of multimedium structure;
Fig. 2 is the principle cross sectional representation of the UHF_RFID label of second kind of multimedium structure.
Embodiment
Embodiment 1
See also Fig. 1, it is a kind of principle cross sectional representation of UHF_RFID label of multimedium structure.It comprises antenna and IC chip 4.Antenna further comprises dielectric substrate 5; The one side of dielectric substrate 5 is provided with ground plane 1; Radiation electrode layer 2 is set on its corresponding surface; Radiation electrode layer 2 through microstrip line or probe 3 be connected with IC chip 4, (being meant that mainly said radiation electrode layer 2 is connected with the RF port of IC chip 4 through microstrip line or probe 3), said ground plane 1 passes through one section metal level or directly is connected with the GND port of IC chip 4, dielectric substrate 5 comprises two layer medium layer at least; The specific inductive capacity of the dielectric layer of adjacent two layers is inequality, and the medium of dielectric layer is nonmetallic materials.
In Fig. 1, dielectric substrate is made up of 4 layers of dielectric layer 51,52,53,54, and these 4 layers of dielectric layers 51,52,53,54 can connect from top to bottom or from top to bottom successively.This dielectric layer can be the dielectric layer that conventional media such as epoxy flaggy, plastic layer are made; Also can be air layer, also can be the dielectric layer that foam, silica gel etc. also can be made up of the character of air; This type material is that specific inductive capacity is lower; Dielectric loss is also lower, and the dielectric loss of the dielectric layer that those materials are formed is very low.That is to say that said dielectric layer also comprises the layer that specific inductive capacity is formed less than 2 material.
In this example, dielectric layer 53 gets final product air layer, and air layer 53 comprises support 531, could set up with ground plane 1 or other dielectric layer through support 531 to be connected.Do not have dielectric loss during air layer 53 transmission, therefore can improve the performance of antenna.This one or the thickness sum of those air layers be not less than said dielectric substrate thickness 40%.
We can define label sizes earlier when tag design, calculate the specific inductive capacity of required use by label sizes, select to use which kind of dielectric material by this specific inductive capacity.
It below is exactly the computing formula of the specific inductive capacity of a multimedium body.
Show through experiment, when the thickness sum of those air layers be not less than said dielectric substrate thickness 40% the time, the effective dielectric constant after the combination will can satisfy the demand of existing small-sized medium loaded antenna performance in a predefined scope.
The IC chip can be arranged on top, side or the below of dielectric substrate.
Embodiment 2
See also Fig. 2, it is the principle cross sectional representation of the UHF_RFID label of second kind of multimedium structure.
Dielectric substrate can also can be that the multilayered medium layer is formed by two-layer.Such as, the epoxy flaggy connects air layer and forms one group, and dielectric substrate can comprise many groups 52,53,54,55,56.
Embodiment 3
The present invention provides a kind of antenna; Comprise dielectric substrate, the one side of dielectric substrate is provided with ground plane, and the radiation electrode layer is set on its corresponding surface; Said radiation electrode layer is connected with exterior I C chip through microstrip line or probe; Said dielectric substrate comprises two layer medium layer at least, and the specific inductive capacity of the dielectric layer of adjacent two layers is inequality, and the medium of said dielectric layer is nonmetallic materials.
Said dielectric layer comprises air layer, and said air layer comprises support, and said air layer is connected with ground plane or other dielectric layer through support foundation.
Said dielectric substrate comprises the multilayered medium layer.
Said dielectric layer can alternately occur for epoxy plate layer, plastic layer, air layer.
A kind of manufacture craft of UHF_RFID anti-metal tag of multimedium structure may further comprise the steps:
(1) effective dielectric constant after the affirmation combination;
(2) following formula is confirmed the number of plies, the dielectric of selecting for use and the corresponding thickness that dielectric substrate is formed, comprising at least one air layer, this one or the thickness sum of those air layers be not less than said dielectric substrate thickness 40%;
(3) one side with the dielectric substrate of making is provided with ground plane; The radiation electrode layer is set on its corresponding surface; Said radiation electrode layer is connected with the RF port of IC chip through microstrip line or probe, and said ground plane passes through one section metal level or directly is connected with the GND port of IC chip.
Said dielectric layer comprises the one or more combination of following material layers: the combination of epoxy flaggy, plastic layer, those layers.
Said dielectric layer also comprises the layer that specific inductive capacity is formed less than 2 material.
The present invention is through being provided with air layer; And this one or the thickness sum of those air layers be not less than said dielectric substrate thickness 40%; This set just can so that dielectric substrate can adopt the low dielectric of price comparison come as a certain of dielectric substrate or certain which floor, after the important set stratification of the almost nil air layer of loss tangent as dielectric substrate is set, like this; The loss tangent of the dielectric substrate integral body that obtains is very low, and the Q value performance of antenna is fine thus.
More than disclosedly be merely several specific embodiment of the present invention, but the present invention is not limited thereto, any those skilled in the art can think variation, all should drop in protection scope of the present invention.
Claims (8)
1. the UHF_RFID anti-metal tag of a multimedium structure comprises antenna and IC chip, it is characterized in that; Said antenna further comprises dielectric substrate, and the one side of dielectric substrate is provided with ground plane, and the radiation electrode layer is set on its corresponding surface; Said radiation electrode layer is connected with the RF port of IC chip through microstrip line or probe, and said ground plane passes through one section metal level or directly is connected with the GND port of IC chip, and said dielectric substrate comprises two layer medium layer at least; The specific inductive capacity of the dielectric layer of adjacent two layers is inequality; The medium of said dielectric layer is nonmetallic materials, comprises an air layer in the said dielectric layer at least, and each air layer comprises support; Each air layer is connected with ground plane or other dielectric layer through support foundation, this one or the thickness sum of those air layers be not less than said dielectric substrate thickness 40%.
2. the UHF_RFID anti-metal tag of multimedium structure as claimed in claim 1 is characterized in that, said dielectric layer comprises the one or more combination of following material layers: the combination of epoxy flaggy, plastic layer, those layers.
3. the UHF_RFID anti-metal tag of multimedium structure as claimed in claim 2 is characterized in that, confirms the composition and the corresponding thickness of dielectric according to following formula according to the effective dielectric constant after the combination.
4. according to claim 1 or claim 2 the UHF_RFID anti-metal tag of multimedium structure is characterized in that said IC chip is arranged on top, side or the below of dielectric substrate.
5. according to claim 1 or claim 2 the UHF_RFID anti-metal tag of multimedium structure is characterized in that said those dielectric layers are to connect successively from top to bottom or from top to bottom.
6. the UHF_RFID anti-metal tag of multimedium structure as claimed in claim 1 is characterized in that, said dielectric layer also comprises the layer that specific inductive capacity is formed less than 2 material.
7. the manufacture craft of the UHF_RFID anti-metal tag of a multimedium structure is characterized in that, may further comprise the steps:
(1) effective dielectric constant after the affirmation combination;
(2) following formula is confirmed the number of plies, the dielectric of selecting for use and the corresponding thickness that dielectric substrate is formed, comprising at least one air layer, this one or the thickness sum of those air layers be not less than said dielectric substrate thickness 40%;
(3) one side with the dielectric substrate of making is provided with ground plane; The radiation electrode layer is set on its corresponding surface; Said radiation electrode layer is connected with the RF port of IC chip through microstrip line or probe, and said ground plane passes through one section metal level or directly is connected with the GND port of IC chip.
8. the manufacture craft of the UHF_RFID anti-metal tag of multimedium structure as claimed in claim 7 is characterized in that, said dielectric layer comprises the one or more combination of following material layers: the combination of epoxy flaggy, plastic layer, those layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110031208.6A CN102567775B (en) | 2010-12-24 | 2011-01-28 | The UHF_RFID label of a kind of multimedium structure and antenna |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201010604045.1 | 2010-12-24 | ||
| CN2010106040451 | 2010-12-24 | ||
| CN201010604045 | 2010-12-24 | ||
| CN201110031208.6A CN102567775B (en) | 2010-12-24 | 2011-01-28 | The UHF_RFID label of a kind of multimedium structure and antenna |
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| CN102567775A true CN102567775A (en) | 2012-07-11 |
| CN102567775B CN102567775B (en) | 2016-06-08 |
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| CN102567775B (en) | 2016-06-08 |
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